Kontron COMe-mTT10 User manual

COMe-mTT10
Document Revision 120
www.kontron.com

» Table of Contents «
1User Information..................................................................................5
1.1 About This Document.................................................................................................................... 5
1.2 Co yright Notice.......................................................................................................................... 5
1.3 Trademarks................................................................................................................................. 5
1.4 Standards................................................................................................................................... 5
1.5 Warranty.................................................................................................................................... 6
1.6 Technical Su ort.........................................................................................................................6
2Introduction........................................................................................7
2.1 Product Descri tion......................................................................................................................7
2.2 Naming clarification..................................................................................................................... 7
2.3 Understanding COM Ex ress® Functionality.......................................................................................7
2.4 COM Ex ress® Documentation......................................................................................................... 8
2.5 COM Ex ress® Benefits.................................................................................................................. 8
3Product S ecification............................................................................9
3.1 Modules & Accessories................................................................................................................... 9
3.2 Functional S ecification............................................................................................................... 11
3.3 Block Diagram............................................................................................................................ 15
3.4 Electrical S ecification................................................................................................................ 16
3.4.1 Su ly Voltage........................................................................................................................... 16
3.4.2 Power Su ly Rise Time................................................................................................................16
3.4.3 Su ly Voltage Ri le.................................................................................................................. 16
3.4.4 Power Consum tion..................................................................................................................... 16
3.4.5 ATX Mode.................................................................................................................................. 17
3.4.6 Single Su ly Mode.....................................................................................................................17
3.5 Power Control............................................................................................................................ 18
3.6 Environmental S ecification.........................................................................................................19
3.6.1 Tem erature S ecification............................................................................................................19
3.6.2 Humidity................................................................................................................................... 19
3.7 Standards and Certifications.........................................................................................................20
3.8 MTBF........................................................................................................................................ 22
3.9 Mechanical S ecification.............................................................................................................. 23
3.9.1 Module Dimension...................................................................................................................... 23
3.9.2 Height on To ............................................................................................................................ 23
3.9.3 Height on Bottom....................................................................................................................... 23
3.9.4 Mechanical Drawing....................................................................................................................23
3.10 Thermal Management.................................................................................................................. 24
3.11 Heats reader............................................................................................................................. 24
4Features and Interfaces.......................................................................25
4.1 Onboard SSD.............................................................................................................................. 25
4.2 S5 Eco Mode.............................................................................................................................. 26
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COMe-mTT10 /
4.3 LPC.......................................................................................................................................... 27
4.4 Serial Peri heral Interface (SPI)....................................................................................................28
4.5 SPI boot.................................................................................................................................... 28
4.6 M.A.R.S.................................................................................................................................... 29
4.7 UART........................................................................................................................................ 30
4.8 CAN......................................................................................................................................... 31
4.9 Fast I2C.................................................................................................................................... 32
4.10 KeAPI....................................................................................................................................... 33
4.11 EAPI, JIDA & PLD Driver................................................................................................................ 34
4.12 K-Station 2................................................................................................................................ 35
4.13 GPIO - General Pur ose In ut and Out ut.........................................................................................36
4.14 Dual Staged Watchdog Timer......................................................................................................... 37
4.15 S eedste Technology................................................................................................................. 38
4.16 C-States.................................................................................................................................... 39
4.17 Hy er Threading......................................................................................................................... 40
4.18 ACPI Sus end Modes and Resume Events..........................................................................................41
4.19 USB......................................................................................................................................... 42
4.20 SDIO........................................................................................................................................ 43
5System Resources...............................................................................45
5.1 Interru t Request (IRQ) Lines........................................................................................................ 45
5.1.1 In 8259 PIC mode........................................................................................................................ 45
5.1.2 In APIC mode............................................................................................................................. 46
5.2 Memory Area.............................................................................................................................. 47
5.3 I/O Address Ma ......................................................................................................................... 47
5.4 Peri heral Com onent Interconnect (PCI) Devices.............................................................................48
5.5 I2C Bus..................................................................................................................................... 48
5.6 JILI I2C Bus............................................................................................................................... 49
5.7 SDVO I2C Bus............................................................................................................................. 49
5.8 System Management (SM) Bus....................................................................................................... 49
5.9 Pinout List................................................................................................................................ 50
5.9.1 General Signal Descri tion............................................................................................................50
5.9.2 Connector X1A Row A...................................................................................................................51
5.9.3 Connector X1A Row B................................................................................................................... 53
6BIOS O eration...................................................................................55
6.1 Determining the BIOS Version....................................................................................................... 55
6.2 BIOS U date.............................................................................................................................. 55
6.3 Setu Guide............................................................................................................................... 57
6.3.1 Start AMI® A tio Setu Utility.......................................................................................................57
6.4 BIOS Setu ................................................................................................................................ 59
6.4.1 Main........................................................................................................................................ 59
6.4.2 Advanced.................................................................................................................................. 64
6.4.3 Chi set..................................................................................................................................... 90
6.4.4 Boot........................................................................................................................................ 97
6.4.5 Security.................................................................................................................................... 99
6.4.6 Save & Exit............................................................................................................................... 100
4

COMe-mTT10 / User Information
1 User Information
1.1 About This Document
This document rovides information about roducts from Kontron Euro e GmbH and/or its subsidiaries. No warranty of
suitability, ur ose, or fitness is im lied. While every attem t has been made to ensure that the information in this
document is accurate, the information contained within is su lied “as-is” and is subject to change without notice.
For the circuits, descri tions and tables indicated, Kontron assumes no res onsibility as far as atents or other rights of
third arties are concerned.
1.2 Copyright Notice
Co yright © 2003-2012 Kontron Euro e GmbH
All rights reserved. No art of this document may be re roduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or com uter language, in any form or by any means (electronic, mechanical, hotoco ying,
recording, or otherwise), without the ex ress written ermission of Kontron Euro e GmbH.
DIMM-PC®, PISA®, ETX®, ETXex ress®, microETXex ress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Euro e GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of com onents used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Cor .
» Microsoft is a registered trademark of Microsoft Cor .
» Intel is a registered trademark of Intel Cor .
» All other roducts and trademarks mentioned in this manual are trademarks of their res ective owners.
1.4 Standards
Kontron Euro e GmbH is certified to ISO 9000 standards.
5

COMe-mTT10 / User Information
1.5 arranty
This Kontron Euro e GmbH roduct is warranted against defects in material and workmanshi for the warranty eriod
from the date of shi ment. During the warranty eriod, Kontron Euro e GmbH will at its discretion decide to re air or
re lace defective roducts.
Within the warranty eriod, the re air of roducts is free of charge as long as warranty conditions are observed.
The warranty does not a ly to defects resulting from im ro er or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, o eration outside of the roduct’s environmental s ecifications or im ro er
installation or maintenance.
Kontron Euro e GmbH will not be res onsible for any defects or damages to other roducts not su lied by Kontron
Euro e GmbH that are caused by a faulty Kontron Euro e GmbH roduct.
1.6 Technical Support
Technicians and engineers from Kontron Euro e GmbH and/or its subsidiaries are available for technical su ort. We are
committed to making our roduct easy to use and will hel you use our roducts in your systems.
Please consult our Web site at htt ://www.kontron.com/su ort for the latest roduct documentation, utilities, drivers
and su ort contacts. Consult our customer section htt ://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Su ort Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board su lier for technical su ort.
6

COMe-mTT10 / Introduction
2 Introduction
2.1 Product Description
The credit card size (55mm x 84 mm) COM Ex ress® mini SFF COM, COMe-mTT10, featuring an Intel® Atom™ rocessor
E6xx and is designed according to the PICMG COM Ex ress® R.2.0 in-out Ty e 10 s ecification. The COMe-mTTi10 family is
designed with industrial-grade com onents that are fully functional even at the extended tem erature range (E2) from
-40 to +85°C, s ecial build versions for commercial tem erature are available as well. With its memory onboard, a robust
micro-SD Card socket or o tional a SATA Flash memory, it is ideal for use in harsh environments and thus com lements the
existing ortfolio erfectly.
2.2 Naming clarification
COM Ex ress® defines a Com uter-On-Module, or COM, with all com onents necessary for a bootable host com uter,
ackaged as a su er com onent.
» COMe-bXX# modules are Kontron's COM Ex ress® modules in basic form factor (125mm x 95mm), formerly known
as ETXex ress®
» COMe-cXX# modules are Kontron's COM Ex ress® modules in com act form factor (95mm x 95mm), formerly known
as microETXex ress®
» COMe-mXX# modules are Kontron's COM Ex ress® modules in mini form factor (55mm x 84mm), formerly known as
nanoETXex ress
The roduct names for Kontron COM Ex ress® Com uter-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=com act, m=mini), the ca ital letters for the CPU and Chi set Codenames ( ) and
the in-out ty e (#) followed by the CPU Name.
2.3 Understanding COM Express® Functionality
All Kontron COM Ex ress® basic and com act modules contain two 220 in connectors; each of it has two rows called Row
A & B on rimary connector and Row C & D on secondary connector. COM Ex ress® Com uter-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out ty e:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio 1x 1x 1x 1x
Gbit Ethernet 1x 1x 1x 1x
Serial ATA 4x 4x 4x 4x
Parallel ATA - - 1x -
PCI - - 1x -
PCI Express x1 6x 6x 6x 8x
PCI Express x16 (PEG) - - 1x 1x
USB Client 1x 1x - -
USB 2.0 8x 8x 8x 8x
USB 3.0 - 2x - 4x
VGA 1x - 1x 1x
LVDS Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI) 1x o tional 1x 3x shared with PEG 3x
LPC 1x 1x 1x 1x
External SMB 1x 1x 1x 1x
External I2C 1x 1x 1x 1x
GPIO 8x 8x 8x 8x
SDIO 1x o tional 1x o tional - -
UART (2-wire COM) - 2x - 2x
FAN PWM out - 1x - 1x
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COMe-mTT10 / Introduction
2.4 COM Express® Documentation
This roduct manual serves as one of three rinci al references for a COM Ex ress® design. It documents the
s ecifications and features of COMe-mTT10. Additional references are are available from your Kontron Su ort or from
PICMG®:
» The COM Ex ress® S ecification defines the COM Ex ress® module form factor, in-out, and signals. This document
is available from the PIGMG website by filling out the order form.
» The COM Ex ress® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum
flexibility to accommodate a wide range of COM Ex ress® modules.
Some of the information contained within this roduct manual a lies only to certain
roduct revisions (CE: xxx). If certain information a lies to s ecific roduct revisions (CE:
xxx) it will be stated. Please check the roduct revision of your module to see if this
information is a licable.
2.5 COM Express® Benefits
COM Ex ress® modules are very com act, highly integrated com uters. All Kontron COM Ex ress® modules feature a
standardized form factor and a standardized connector layout that carry a s ecified set of signals. Each COM is based on
the COM Ex ress® s ecification. This standardization allows designers to create a single-system baseboard that can
acce t resent and future COM Ex ress® modules.
The baseboard designer can o timize exactly how each of these functions im lements hysically. Designers can lace
connectors recisely where needed for the a lication on a baseboard designed to o timally fit a system’s ackaging.
A single baseboard design can use a range of COM Ex ress® modules with different size and in-out. This flexibility can
differentiate roducts at various rice/ erformance oints, or to design future roof systems that have a built-in u grade
ath. The modularity of a COM Ex ress® solution also ensures against obsolescence as com uter technology evolves. A
ro erly designed COM Ex ress® baseboard can work with several successive generations of COM Ex ress® modules.
A COM Ex ress® baseboard design has many advantages of a custom, com uter-board design but delivers better
obsolescence rotection, greatly reduced engineering effort, and faster time to market.
8

COMe-mTT10 / Product S ecification
3 Product Specification
3.1 Modules & Accessories
The COM Ex ress® mini sized Com uter-on-Module COMe-mTT10 (NTC1) follows in-out Ty e 10 and is com atible to
PICMG s ecification COM.0 Rev 2.0. The COMe-mTT10, based on Intel's Queens Bay latform, is available in different
variants to cover the demand of different erformance, rice and ower:
Commercial grade modules (0°C to 60°C operating), COMe-mTTc10
Product Number Product Name Processor PCH and Features
34004-1000-16-1 COMe-mTTc10 E680 1GB/mSD Intel® Atom™ E680 EG20T, 3xPCIe, 1GB DDR2, microSD socket
34004-1000-13-1 COMe-mTTc10 E660 1GB/mSD Intel® Atom™ E660 EG20T, 3xPCIe, 1GB DDR2, microSD socket
34004-1000-10-1 COMe-mTTc10 E640 512MB/mSD Intel® Atom™ E640 EG20T, 3xPCIe, 1GB DDR2, microSD socket
34004-5100-06-1 COMe-mTTc10 E620 512MB/mSD Intel® Atom™ E620 EG20T, 3xPCIe, 512MB DDR2, microSD socket
Industrial grade modules (E2, -40°C to 85°C operating), COMe-mTTi10
Product Number Product Name Processor PCH and Features
34003-1040-16-1 COMe-mTTi10 E680T 1GB/4GB Intel® Atom™ E680T EG20T, 3xPCIe, 1GB DDR2, 4GB SATA SLC SSD
34003-1040-13-1 COMe-mTTi10 E660T 1GB/4GB Intel® Atom™ E660T EG20T, 3xPCIe, 1GB DDR2, 4GB SATA SLC SSD
34003-1040-10-1 COMe-mTTi10 E640T 1GB/4GB Intel® Atom™ E640T EG20T, 3xPCIe, 1GB DDR2, 4GB SATA SLC SSD
34003-1000-16-1 COMe-mTTi10 E680T 1GB/mSD Intel® Atom™ E680T EG20T, 3xPCIe, 1GB DDR2, microSD socket
34003-1000-13-1 COMe-mTTi10 E660T 1GB/mSD Intel® Atom™ E660T EG20T, 3xPCIe, 1GB DDR2, microSD socket
34003-1000-10-1 COMe-mTTi10 E640T 1GB/mSD Intel® Atom™ E640T EG20T, 3xPCIe, 1GB DDR2, microSD socket
34003-5100-06-1 COMe-mTTi10 E620T 512MB/mSD Intel® Atom™ E620T EG20T, 3xPCIe, 512MB DDR2, microSD socket
Possible memory and onboard Flash configurations 3400x-MMFF-xx-x:
» MM = 51: 512MB DDR2 Memory (4 x 1Gb chi s on bottom)
» MM = 10: 1024MB DDR2 Memory (8 x 1Gb chi s)
» MM = 20: 2048MB DDR2 Memory (8 x 2Gb chi s)
» FF = 00: microSD Card onboard
» FF = 20: 2GB onboard SATA SSD
» FF = 40: 4GB onboard SATA SSD
» FF = 80: 8GB onboard SATA SSD
» FF = 16: 16GB onboard SATA SSD
» FF = 32: 32GB onboard SATA SSD
Please contact your local sales for customized Memory/Flash combinations
9

COMe-mTT10 / Product S ecification
Accessories
Product Number Carrier Boards
34101-0000-00-1 COM Ex ress® Eval Carrier Ty e 10
34104-0000-00-0 COM Ex ress® Reference Carrier-i Ty e 10
Product Number Cooling & Mounting
34003-0000-99-0 HSP COMe-mTT10 thread (11mm)
34003-0000-99-1 HSP COMe-mTT10 through (11mm)
34003-0000-99-2 HSP COMe-mTT10 slim thread (6.5mm)
34003-0000-99-3 HSP COMe-mTT10 slim though (6.5mm)
34003-0000-99-0CO1 HSK COMe-mTT10 slim assive thread
34099-0000-99-0 COMe mini Active Uni Cooler (for CPUs u to 10W)
34099-0000-99-1 COMe mini Passive Uni Cooler (for CPUs u to 5W)
34099-0000-99-2 COMe mini Passive Uni Cooler Slim (for CPUs u to 3-5W)
34017-0000-00-0 COMe mMount KIT 5/8mm 1set
Product Number Adapter & Cables
9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)
9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter)
34120-0000-00-2 ADA-COMe-T10-T2
10

COMe-mTT10 / Product S ecification
3.2 Functional Specification
Processor
The Intel® ATOM™ (Tunnel Creek) CPU family su orts:
» Intel® Hy er-Threading Technology
» Intel® Virtualization Technology (VT-x)
» Idle States
» Enhanced Intel S eedSte ® Technology
» Thermal Monitoring Technologies
» Execute Disable Bit
CPU specifications
Processor Cores / Threads CPU Clock L2 Cache VT-x HTT EIST Max TDP
Intel® Atom™ E620T/E620 1 / 2 600MHz 512KB Yes Yes Yes 3.3W
Intel® Atom™ E640T/E640 1 / 2 1000MHz 512KB Yes Yes Yes 3.6W
Intel® Atom™ E660T/E660 1 / 2 1300MHz 512KB Yes Yes Yes 3.6W
Intel® Atom™ E680T/E680 1 / 2 1600MHz 512KB Yes Yes Yes 4.5W
Memory
Sockets memory down
Memory Type DDR2-800
Maximum Size 2GB
Technology Single Channel (32bit)
Graphics Core
The integrated Intel® GMA 600 based on PowerVR SGX535 core su orts:
Graphics Core Render Clock 400MHz (E680/E660 CPU)
320MHz (E640/E620 CPU)
Execution Units / Pixel Pipelines 4
Max Graphics Memory 759MB
GF Memory Bandwidth (GB/s) 4.2
GF Memory Technology DVMT
API (Direct /OpenGL) 9.0L / 2.1
Shader Model 3.0
Hardware accelerated Video H.264,MPEG2/4,VC1,WMV9, DivX
Independent/Simultaneous Displays 2
Display Port -
HDCP support -
Monitor output
CRT max Resolution -
TV out: -
LVDS
LVDS Bits/Pixel 1x18 / 1x24
LVDS Bits/Pixel with dithering -
LVDS max Resolution: 1280x768, 80MHz
PWM Backlight Control: YES
Supported Panel Data: EDID
11

COMe-mTT10 / Product S ecification
Display Interfaces
Discrete Graphics -
Digital Display Interface DDI1 SDVOB
Digital Display Interface DDI2 -
Digital Display Interface DDI3 -
Maximum Resolution on DDI 1920x1080
Platform Controller Hub
The 90nm Intel Platform Controller Hub EG20T (To cliff) su orts:
» PCI Ex ress Revision 1.0
» USB 2.0
» USB Client
» SDIO 2.0
» SATA 3Gb/s
Storage
onboard SSD 2 to 8GB SLC, 2 to 32GB MLC (SATA)
SD Card support 1x SD 2.0 shared with GPIO, 1x onboard microSD-Card socket
IDE Interface -
Serial-ATA u to 2x SATA 3Gb/s
SATA AHCI AHCI 1.1 with NCQ and Port Multi lier
SATA RAID -
When the o tional SATA onboard drive is used only 1 SATA interface (SATA 0) is available
Connectivity
USB 6x USB 2.0
USB Client 1x USB Client (USB #7)
PCI -
PCI External Masters -
PCI Express 3x PCIe x1 Gen1
Max PCI Express 4x PCIe x1 without To cliff
PCI Express x2/x4 configuration -
Ethernet 10/100/1000 Mbit
Ethernet controller Broadcom BCM54610
Ethernet
The Broadcom BCM54610 ethernet su orts:
» Jumbo ackets u to 10KB
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
12

COMe-mTT10 / Product S ecification
Misc Interfaces and Features
Audio HD Audio
Onboard Hardware Monitor WINBOND W83L771W or o tional LM87
Trusted Platform Module* Infineon TPM 1.2 SLB9635TT o tional
Miscellaneous 1x CAN o tional / 2x UART
*The TPM O tion is only valid for commercial tem erature grade modules
Kontron Features
External I2C Bus Fast I2C, MultiMaster ca able
M.A.R.S. support YES
Embedded API PICMG EAPI / JIDA32 / KEAPI
Custom BIOS Settings / Flash Backup YES
Watchdog support Dual Staged
Additional features
» All solid ca acitors (POSCAP). No tantalum ca acitors used.
» O timized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates u to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
Singly Supply Support YES
Supply Voltage 4.75 - 14V
ACPI ACPI 3.0
S-States S0, S3, S4, S5
S5 Eco Mode YES
Misc Power Management DPST 3.2
Power Consumption and Performance
Full Load Power Consumption 5.2 - 7.5W
Kontron Performance Index 735 - 1592
Kontron Performance/Watt 140 - 212
Detailed Power Consum tion measurements in all states and bechmarks for CPU, Gra hics
and Memory erformance are available in A lication Note KEMAP054 at EMD Customer
Section.
Real Time Clock
The E6xx CPU integrated RTC s ecifies a battery current u to 24µA. To secure a common longevity for external backu
batteries Intel recommends to use following ty es in combination with E6xx.
Battery Type Capacity Typ. RTC current Worst Case Battery Life*
Panasonic Lithium CR2032 225 mAh 24µA 1.1 yrs
Panasonic Lithium CR2450 620 mAh 24µA 2.9 yrs
Panasonic Lithium CR2477 1000 mAh 24µA 4.8 yrs
*RTC Battery life assuming CPU in S5 state 24/7 for 365 days.
13

COMe-mTT10 / Product S ecification
Supported Operating Systems
The COMe-mTT10 currently su orts:
» Microsoft Windows 7
» Microsoft Windows Embedded Standard 7 (WES7)
» Microsoft Windows Embedded Com act 7 (WEC7)
» Microsoft Windows embedded CE 6.0
» Microsoft Windows XP
» Microsoft Windows XPembedded
» Linux
» WindRiver VxWorks 6.8 / 6.9
14

COMe-mTT10 / Product S ecification
3.3 Block Diagram
15

COMe-mTT10 / Product S ecification
3.4 Electrical Specification
3.4.1 Supply Voltage
Following su ly voltage is s ecified at the COM Ex ress® connector:
VCC: 4.75 - 14V
Standby: 5V DC +/- 5%
RTC: 2.5V - 3.3V
- 5V Standby voltage is not mandatory for o eration.
- Extended Tem erature (E1) variants are validated for 12V su ly only
3.4.2 Power Supply Rise Time
» The in ut voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ram of each DC in ut voltage from 10% to 90% of its final set- oint
following the ATX s ecification
3.4.3 Supply Voltage Ripple
» Maximum 100 mV eak to eak 0 – 20 MHz
3.4.4 Power Consumption
The maximum Power Consum tion of the different COMe-mTT10 variants is 5.2 - 7.5W (100% CPU load on all cores; 90°C
CPU tem erature). Further information with detailed measurements are available in A lication Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.
16

COMe-mTT10 / Product S ecification
3.4.5 ATX Mode
By connecting an ATX ower su ly with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and owering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 14V in ATX Mode. On Com uter-on-Modules su orting a
wide range in ut down to 4.75V the in ut voltage shall always be higher than 5V Standby (VCC > 5VSB).
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0V x 0V
S5 high low 5V high 0V
S5 S0 →PWRBTN Event low high →5V high low →0 V VCC →
S0 high high 5V low VCC
3.4.6 Single Supply Mode
In single su ly mode (or automatic ower on after ower loss) without 5V Standby the module will start automatically
when VCC ower is connected and Power Good in ut is o en or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 14V.
To ower on the module from S5 state ress the ower button or reconnect VCC. Sus end/Standby States are not
su orted in Single Su ly Mode.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 →high o en / high x connecting VCC
S5 high o en / high x VCC
S5 S0 →PWRBTN Event o en / high x reconnecting VCC
Signals marked with “x” are not im ortant for the s ecific ower state. There is no
difference if connected or o en.
All ground ins have to be tied to the ground lane of the carrier board.
17

COMe-mTT10 / Product S ecification
3.5 Power Control
Power Supply
The COMe-mTT10 su orts a ower in ut from 4.75 - 14V. The su ly voltage is a lied through the VCC ins (VCC) of the
module connector.
Power Button (PWRBTN#)
The ower button (Pin B12) is available through the module connector described in the inout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, ty ical 400ms) at low level (Power Button Event).
Pressing the ower button for at least 4seconds will turn off ower to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-mTT10 rovides an external in ut for a ower-good signal (Pin B24). The im lementation of this subsystem
com lies with the COM Ex ress® S ecification. PWR_OK is internally ulled u to 3.3V and must be high level to ower on
the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the inout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chi set and active Management Engine does not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager resent and SMB_ALERT# (Pin B15) connected the module always owers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.
18

COMe-mTT10 / Product S ecification
3.6 Environmental Specification
3.6.1 Temperature Specification
General Specification Operating Non-operating
Commercial grade 0°C to +60°C -30°C to +85°C
Extended (E1) -25°C to +75°C -30°C to +85°C
Industrial grade (E2) -40°C to +85°C -40°C to +85°C
Standard modules are available for commercial grade tem erature range. Please see
cha ter Product S ecification for available variants for extended or industrial tem erate
grade
With Kontron heatspreader plate assembly
The o erating tem erature defines two requirements:
» the maximum ambient tem erature with ambient being the air surrounding the module.
» the maximum measurable tem erature on any s ot on the heats reader's surface
Without Kontron heatspreader plate assembly
The o erating tem erature is the maximum measurable tem erature on any s ot on the module's surface.
3.6.2 Humidity
» O erating: 10% to 90% (non condensing)
» Non o erating: 5% to 95% (non condensing)
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COMe-mTT10 / Product S ecification
3.7 Standards and Certifications
RoHS
The COMe-mTT10 is com liant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances
(RoHS) in electrical and electronic equi ment.
CE marking
The COMe-mTT10 is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950
Component Recognition UL 60950-1
The COM Express® mini form factor Com uter-on-Modules are Recognized by Underwriters Laboratories Inc.
Re resentative sam les of this com onent have been evaluated by UL and meet a licable UL requirements.
UL Listings:
» NWGQ2.E304278
» NWGQ8.E304278
WEEE Directive
WEEE Directive 2002/96/EC is not a licable for Com uter-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Com uter-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or su ort for further details.
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