Kontron COMe-mSP1 User manual

COMe-mSP1
Document Revision 160
www.kontron.com

» Table of Contents «
1User Information..................................................................................6
1.1 About This Document.................................................................................................................... 6
1.2 Co yright Notice.......................................................................................................................... 6
1.3 Trademarks................................................................................................................................. 6
1.4 Standards................................................................................................................................... 6
1.5 Warranty.................................................................................................................................... 7
1.6 Technical Su ort.........................................................................................................................7
2Introduction........................................................................................8
2.1 Product Descri tion......................................................................................................................8
2.2 Naming clarification..................................................................................................................... 8
2.3 Understanding COM Ex ress® Functionality.......................................................................................9
2.4 COM Ex ress® Documentation.......................................................................................................10
2.5 COM Ex ress® Benefits................................................................................................................ 10
3Product S ecification...........................................................................11
3.1 Modules & Accessories................................................................................................................. 11
3.2 Functional S ecification............................................................................................................... 13
3.3 Block Diagram............................................................................................................................ 17
3.4 Electrical S ecification................................................................................................................18
3.4.1 Su ly Voltage........................................................................................................................... 18
3.4.2 Power Su ly Rise Time................................................................................................................ 18
3.4.3 Su ly Voltage Ri le..................................................................................................................18
3.4.4 Power Consum tion..................................................................................................................... 18
3.4.5 ATX Mode.................................................................................................................................. 19
3.4.6 Single Su ly Mode..................................................................................................................... 19
3.5 Power Control............................................................................................................................20
3.6 Environmental S ecification......................................................................................................... 21
3.6.1 Tem erature S ecification............................................................................................................ 21
3.6.2 Humidity................................................................................................................................... 21
3.7 Standards and Certifications.........................................................................................................22
3.8 MTBF........................................................................................................................................ 24
3.9 Mechanical S ecification.............................................................................................................. 25
3.9.1 Module Dimension...................................................................................................................... 25
3.9.2 Height on To ............................................................................................................................ 25
3.9.3 Height on Bottom....................................................................................................................... 25
3.9.4 Mechanical Drawing....................................................................................................................25
3.10 Thermal Management.................................................................................................................. 26
3.11 Heats reader............................................................................................................................. 26
4Features and Interfaces.......................................................................27
4.1 Onboard SSD.............................................................................................................................. 27
4.2 LPC.......................................................................................................................................... 28
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COMe-mSP1 /
4.3 LPC boot................................................................................................................................... 29
4.4 M.A.R.S.................................................................................................................................... 30
4.5 Fast I2C & SMBus........................................................................................................................31
4.6 JIDA16 and JIDA32..................................................................................................................... 32
4.7 K-Station 1................................................................................................................................ 33
4.8 K-Station & API Resources............................................................................................................ 34
4.8.1 I2C.......................................................................................................................................... 34
4.8.2 Storage.................................................................................................................................... 34
4.8.3 GPIO........................................................................................................................................ 34
4.8.4 Hardware Monitor....................................................................................................................... 34
4.9 GPIO - General Pur ose In ut and Out ut.........................................................................................35
4.10 Watchdog Timer.......................................................................................................................... 36
4.11 Flash Backu Feature...................................................................................................................37
4.12 S eedste Technology................................................................................................................. 39
4.13 C-States.................................................................................................................................... 40
4.14 Hy er Threading......................................................................................................................... 41
4.15 ACPI Sus end Modes and Resume Events..........................................................................................42
4.16 USB......................................................................................................................................... 43
4.17 SDIO........................................................................................................................................ 44
4.18 Gra hics Interface...................................................................................................................... 45
4.19 LPC Bus..................................................................................................................................... 47
5System Resources...............................................................................49
5.1 Interru t Request (IRQ) Lines........................................................................................................ 49
5.1.1 In 8259 PIC Mode........................................................................................................................ 49
5.1.2 In APIC mode............................................................................................................................. 50
5.2 Memory Area.............................................................................................................................. 51
5.3 I/O Address Ma ......................................................................................................................... 51
5.4 Peri heral Com onent Interconnect (PCI) Devices.............................................................................52
5.5 Internal I2C Bus......................................................................................................................... 52
5.6 JILI I2C Bus............................................................................................................................... 52
5.7 SDVO I2C Bus............................................................................................................................. 52
5.8 System Management (SM) Bus....................................................................................................... 52
5.9 Pinout List................................................................................................................................ 53
5.9.1 General Signal Descri tion............................................................................................................53
5.9.2 Connector X1A Row A................................................................................................................... 54
5.9.3 Connector X1A Row B................................................................................................................... 56
5.9.4 SDVO Connector J1801 (o tional)...................................................................................................58
5.9.5 XDP Connector J1400 (o tional)....................................................................................................59
6BIOS O eration...................................................................................60
6.1 Determining the BIOS Version....................................................................................................... 60
6.2 BIOS U date.............................................................................................................................. 60
6.3 Setu Guide............................................................................................................................... 61
6.3.1 Start AMI® BIOS Setu Utility........................................................................................................61
6.4 BIOS Setu ................................................................................................................................ 63
6.4.1 Main Menu................................................................................................................................ 63
6.4.2 Module Info............................................................................................................................... 67
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COMe-mSP1 /
6.4.3 Advanced Menu.......................................................................................................................... 71
6.4.4 Advanced PCI/PnP Settings........................................................................................................... 91
6.4.5 Boot........................................................................................................................................ 91
6.4.6 Security.................................................................................................................................... 94
6.4.7 Advanced Chi set Settings............................................................................................................94
6.4.8 Exit Menu.................................................................................................................................. 99
5

COMe-mSP1 / User Information
1 User Information
1.1 About This Document
This document rovides information about roducts from Kontron Euro e GmbH and/or its subsidiaries. No warranty of
suitability, ur ose, or fitness is im lied. While every attem t has been made to ensure that the information in this
document is accurate, the information contained within is su lied “as-is” and is subject to change without notice.
For the circuits, descri tions and tables indicated, Kontron assumes no res onsibility as far as atents or other rights of
third arties are concerned.
1.2 Copyright Notice
Co yright © 2003-2012 Kontron Euro e GmbH
All rights reserved. No art of this document may be re roduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or com uter language, in any form or by any means (electronic, mechanical, hotoco ying,
recording, or otherwise), without the ex ress written ermission of Kontron Euro e GmbH.
DIMM-PC®, PISA®, ETX®, ETXex ress®, microETXex ress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Euro e GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of com onents used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Cor .
» Microsoft is a registered trademark of Microsoft Cor .
» Intel is a registered trademark of Intel Cor .
» All other roducts and trademarks mentioned in this manual are trademarks of their res ective owners.
1.4 Standards
Kontron Euro e GmbH is certified to ISO 9000 standards.
6

COMe-mSP1 / User Information
1.5 arranty
This Kontron Euro e GmbH roduct is warranted against defects in material and workmanshi for the warranty eriod
from the date of shi ment. During the warranty eriod, Kontron Euro e GmbH will at its discretion decide to re air or
re lace defective roducts.
Within the warranty eriod, the re air of roducts is free of charge as long as warranty conditions are observed.
The warranty does not a ly to defects resulting from im ro er or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, o eration outside of the roduct’s environmental s ecifications or im ro er
installation or maintenance.
Kontron Euro e GmbH will not be res onsible for any defects or damages to other roducts not su lied by Kontron
Euro e GmbH that are caused by a faulty Kontron Euro e GmbH roduct.
1.6 Technical Support
Technicians and engineers from Kontron Euro e GmbH and/or its subsidiaries are available for technical su ort. We are
committed to making our roduct easy to use and will hel you use our roducts in your systems.
Please consult our Web site at htt ://www.kontron.com/su ort for the latest roduct documentation, utilities, drivers
and su ort contacts. Consult our customer section htt ://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Su ort Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board su lier for technical su ort.
7

COMe-mSP1 / Introduction
2 Introduction
2.1 Product Description
This credit card sized COM Ex ress® mini module is com atible to COM Ex ress® in-out Ty e 1. On 55 mm x 84 mm
foot rint COMe-mSP1 is a erfect fit for the next generation of low ower, ultra-mobile a lications that require energy
saving x86 rocessor erformance, high-end gra hics, PCI Ex ress and Serial ATA combined with longer battery life. These
include handheld devices for medical or multi-media a lications, small mobile data systems and a host of new
a lications that have not reviously been ossible due to size or ower consum tion limitations.
The Kontron COM Ex ress® mini COM, COMe-mSP1, is based on the highly-efficient Intel® Atom™ Z5xx rocessor series
and Intel® System Controller Hub single chi that combines the memory controller, gra hic engine and I/O in a single,
s ace saving chi set design. With only one tenth of the Thermal Design Power and one seventh the size of ULV rocessors
at an identical erformance, the COMe-mSP1 COM offers an un recedented ower consum tion / erformance ratio for
x86-based ultra-mobile designs.
The COMe-mSP1 with Flash and memory on-board su ort 1 PCI Ex ress x1 (o t. 2 x1 if no onboard LAN), Serial ATA, High
Definition Audio, LVDS and o tional SDVO. 10/100/1000 Gigabit Ethernet is designed in onboard for high connectivity
and 8x USB rovides fast and sufficient interfaces for external eri herals.
All above mentioned requirements are su orted by COM Ex ress® mini - small ower - low size - high erformance.
2.2 Naming clarification
COM Ex ress® defines a Com uter-On-Module, or COM, with all com onents necessary for a bootable host com uter,
ackaged as a su er com onent.
» COMe-bXX# modules are Kontron's COM Ex ress® modules in basic form factor (125mm x 95mm), formerly known
as ETXex ress®
» COMe-cXX# modules are Kontron's COM Ex ress® modules in com act form factor (95mm x 95mm), formerly known
as microETXex ress®
» COMe-mXX# modules are Kontron's COM Ex ress® modules in mini form factor (55mm x 84mm), formerly known as
nanoETXex ress
The roduct names for Kontron COM Ex ress® Com uter-on-Modules consist of a short form of the industry standard
(COMe-), the form factor ( =basic, c=com act, m=mini), the ca ital letters for the CPU and Chi set Codenames (XX) and
the in-out ty e (#) followed by the CPU Name.
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COMe-mSP1 / Introduction
2.3 Understanding COM Express® Functionality
All Kontron COM Ex ress® basic and com act modules contain two 220 in connectors; each of it has two rows called Row
A & B on rimary connector and Row C & D on secondary connector. COM Ex ress® Com uter-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out ty e:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio 1x 1x 1x 1x
G it Ethernet 1x 1x 1x 1x
Serial ATA 4x 4x 4x 4x
Parallel ATA - - 1x -
PCI - - 1x -
PCI Express x1 6x 6x 6x 8x
PCI Express x16 (PEG) - - 1x 1x
USB Client 1x 1x - -
USB 2.0 8x 8x 8x 8x
USB 3.0 - 2x - 4x
VGA 1x - 1x 1x
LVDS Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI) 1x o tional 1x 3x shared with PEG 3x
LPC 1x 1x 1x 1x
External SMB 1x 1x 1x 1x
External I2C 1x 1x 1x 1x
GPIO 8x 8x 8x 8x
SDIO 1x o tional 1x o tional - -
UART (2-wire COM) - 2x - 2x
FAN PWM out - 1x - 1x
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COMe-mSP1 / Introduction
2.4 COM Express® Documentation
This roduct manual serves as one of three rinci al references for a COM Ex ress® design. It documents the
s ecifications and features of COMe-mSP1. Additional references are are available from your Kontron Su ort or from
PICMG®:
» The COM Ex ress® S ecification defines the COM Ex ress® module form factor, in-out, and signals. This document
is available from the PIGMG website by filling out the order form.
» The COM Ex ress® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum
flexibility to accommodate a wide range of COM Ex ress® modules.
Some of the information contained within this roduct manual a lies only to certain
roduct revisions (CE: xxx). If certain information a lies to s ecific roduct revisions (CE:
xxx) it will be stated. Please check the roduct revision of your module to see if this
information is a licable.
2.5 COM Express® Benefits
COM Ex ress® modules are very com act, highly integrated com uters. All Kontron COM Ex ress® modules feature a
standardized form factor and a standardized connector layout that carry a s ecified set of signals. Each COM is based on
the COM Ex ress® s ecification. This standardization allows designers to create a single-system baseboard that can
acce t resent and future COM Ex ress® modules.
The baseboard designer can o timize exactly how each of these functions im lements hysically. Designers can lace
connectors recisely where needed for the a lication on a baseboard designed to o timally fit a system’s ackaging.
A single baseboard design can use a range of COM Ex ress® modules with different size and in-out. This flexibility can
differentiate roducts at various rice/ erformance oints, or to design future roof systems that have a built-in u grade
ath. The modularity of a COM Ex ress® solution also ensures against obsolescence as com uter technology evolves. A
ro erly designed COM Ex ress® baseboard can work with several successive generations of COM Ex ress® modules.
A COM Ex ress® baseboard design has many advantages of a custom, com uter-board design but delivers better
obsolescence rotection, greatly reduced engineering effort, and faster time to market.
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COMe-mSP1 / Product S ecification
3 Product Specification
3.1 Modules & Accessories
The COM Ex ress® mini sized Com uter-on-Module COMe-mSP1 (NOW1) follows in-out Ty e 1 and is com atible to PICMG
s ecification COM.0 Rev 1.0. The COMe-mSP1, based on Intel's eMenlow latform, is available in different variants to
cover the demand of different erformance, rice and ower:
Commercial grade modules (0°C to 60°C operating)
Product Num er Product Name Processor SCH and Features
34001-2040-16-1 COMe-mSP1 Z530 2GB/4GB Intel® Atom™ Z530 US15W, 1xPCIe, 2GB DDR2, 4GB SSD
34001-1040-16-1 COMe-mSP1 Z530 1GB/4GB Intel® Atom™ Z530 US15W, 1xPCIe, 1GB DDR2, 4GB SSD
34001-5120-16-1 COMe-mSP1 Z530 512MB/2GB Intel® Atom™ Z530 US15W, 1xPCIe, 512MB DDR2, 2GB SSD
34001-1020-11-1 COMe-mSP1 Z510 1GB/2GB Intel® Atom™ Z510 US15W, 1xPCIe, 1GB DDR2, 2GB SSD
34001-5151-11-1 COMe-mSP1 Z530 512/512MB Intel® Atom™ Z510 US15W, 1xPCIe, 512MB DDR2, 512MB SSD
Extended temperature modules (E1, -25°C to 75°C operating)
Product Num er Product Name Processor SCH and Features
34001-1040-16-1EXT COMe-mSP1 Z530 1GB/4GB E1 Intel® Atom™ Z530 US15W, 1xPCIe, LAN, 1GB DDR2, 4GB SSD
34001-5120-16-1EXT COMe-mSP1 Z530 512/2GB E1 Intel® Atom™ Z530 US15W, 1xPCIe, LAN, 512MB DDR2, 2GB SSD
34001-5151-11-1EXT COMe-mSP1 Z510 512/512M E1 Intel® Atom™ Z510 US15W, 1xPCIe, LAN, 512MB DDR2, 512MB SSD
Possible memory and onboard Flash configurations 34001-MMFF-xx-x:
» MM = 51: 512MB DDR2 Memory (4 x 1Gb chi s on bottom)
» MM = 10: 1024MB DDR2 Memory (8 x 1Gb chi s)
» MM = 20: 2048MB DDR2 Memory (8 x 2Gb chi s)
» FF = 00: without PATA SSD
» FF = 51: 512MB onboard PATA SSD
» FF = 10: 1GB onboard PATA SSD
» FF = 20: 2GB onboard PATA SSD
» FF = 40: 4GB onboard PATA SSD
Please contact your local sales for customized Memory and Flash variants or modules with
2xPCIe (no-LAN version)
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COMe-mSP1 / Product S ecification
Accessories
Product Num er Carrier Boards
34101-0000-00-1 COM Ex ress® Eval Carrier Ty e 10
34100-0000-00-0 COM Ex ress® Reference Carrier HMI Ty e 1
Product Num er Cooling & Mounting
34001-0000-99-0 HSP COMe-mSP1 thread
34001-0000-99-1 HSP COMe-mSP1 through
34001-0000-99-2 HSP COMe-mSP1 slim thread
34001-0000-99-0CO1 HSK COMe-mSP1 slim assive thread
34099-0000-99-0 COMe mini Active Uni Cooler (for CPUs u to 10W)
34099-0000-99-1 COMe mini Passive Uni Cooler (for CPUs u to 5W)
34099-0000-99-2 COMe mini Passive Uni Cooler Slim (for CPUs u to 3-5W)
34017-0000-00-0 COMe mMount KIT 5/8mm 1set
Product Num er Adapter & Ca les
9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)
9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter)
34120-0000-00-2 ADA-COMe-T10-T2
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COMe-mSP1 / Product S ecification
3.2 Functional Specification
Processor
The Intel® ATOM™ (Silverthorne) CPU family su orts:
» Intel® Hy er-Threading Technology
» Intel® Virtualization Technology (VT-x)
» Idle States
» Enhanced Intel S eedSte ® Technology
» Intel® Demand Based Switching
» Thermal Monitoring Technologies
» Execute Disable Bit
CPU specifications
Processor Cores / Threads CPU Clock L2 Cache Bus Speed VT-x HTT EIST Max TDP
Intel® Atom™ Z510 1 / 1 1100MHz 512KB 400MHz No No Yes 2.0W
Intel® Atom™ Z530 1 / 2 1600MHz 512KB 533MHz YES YES Yes 2.2W
Memory
Sockets memory down
Memory Type DDR2-533
Maximum Size 2GB
Technology Single Channel (64bit)
The total amount of memory available on the module is used for main memory and gra hics memory. The Unified Memory
Architecture (UMA) manages how the system shares memory between the gra hics controller and the rocessor. The
maximum su orted memory configuration is 8 x 2Gbit (2GB). Usually modules are equi ed with 8 x 1Gbit (1GB) or 4 x
1Gbit (512MB mounted on bottom side of the PCB).
8 memory chi s are only su orted on hardware revision CE 4.x.x or newer. Former
hardware revisions su orts u to 4x2Gbit (1GB) system memory.
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COMe-mSP1 / Product S ecification
Graphics Core
The integrated Intel® GMA 500 based on PowerVR SGX535 core su orts:
Graphics Core Render Clock 200MHz, ,
Execution Units / Pixel Pipelines 4
Max Graphics Memory 352MB
GFX Memory Bandwidth (GB/s) 4.2
GFX Memory Technology DVMT
API (DirectX/OpenGL) 9.0c / 2.0
Shader Model 3.0
Hardware accelerated Video H.264,MPEG2/4,VC1,WMV9
Independent/Simultaneous Displays 2 (with SDVO o tion)
Display Port -
HDCP support -
Monitor output
CRT max Resolution -
TV out: -
LVDS
LVDS Bits/Pixel 1x18 / 1x24
LVDS Bits/Pixel with dithering -
LVDS max Resolution: 1366x768, 112MHz
PWM Backlight Control: YES
Supported Panel Data: JILI2/JILI3/EDID/DID
Display Interfaces
Discrete Graphics -
Digital Display Interface DDI1 SDVOB o tional
Digital Display Interface DDI2 -
Digital Display Interface DDI3 -
Maximum Resolution on DDI 1600x1200
Chipset
The 130nm Intel System Controller Hub Poulsbo su orts:
» PCI Ex ress Revision 1.0
» USB 2.0
» USB Client
» SDIO 1.0
Storage
on oard SSD 512MB to 8GB SLC (PATA)
SD Card support SD 1.1 shared with GPIO
IDE Interface -
Serial-ATA 1x SATA 1.5GB/s
SATA AHCI -
SATA RAID -
When using a hard disk on SATA #0 as rimary device for the o erating system the boot
order should be changed according the usage. Wrong boot order may cause roblems
writing the MBR during OS installation.
14

COMe-mSP1 / Product S ecification
Connectivity
USB 8x USB 2.0
USB Client 1x USB Client (USB #7)
PCI -
PCI External Masters -
PCI Express 1x PCIe x1 Gen1
Max PCI Express 2x PCIe x1 without LAN
PCI Express x2/x4 configuration -
Ethernet 10/100/1000 Mbit
Ethernet controller Intel® 82574L (Hartwell)
Ex ress Card Hot- lug is not su orted by US15W SCH
Ethernet
The Intel® 82574L (Hartwell) ethernet su orts:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Audio HD Audio
On oard Hardware Monitor WINBOND W83L771W
Trusted Platform Module Infineon TPM 1.2 SLB9635TT o tional
Miscellaneous -
TPM is only available on customized variants and requires BIOS NOW1R118 or newer. With
TPM o tion booting from external LPC FWH is not su orted
Kontron Features
External I2C Bus Fast I2C
M.A.R.S. support YES
Em edded API JIDA16 / JIDA32
Custom BIOS Settings / Flash Backup YES
Watchdog support Single Staged
Power Features
Singly Supply Support YES
Supply Voltage 4.75 - 14V
ACPI ACPI 3.0
S-States S0, S3, S4, S5
S5 Eco Mode -
Misc Power Management -
15

COMe-mSP1 / Product S ecification
Power Consumption and Performance
Full Load Power Consumption 4.9 - 6.2W
Kontron Performance Index 1108 - 1687
Kontron Performance/Watt 225 - 273
Detailed Power Consum tion measurements in all states and bechmarks for CPU, Gra hics
and Memory erformance are available in A lication Note KEMAP054 at EMD Customer
Section.
Supported Operating Systems
The COMe-mSP1 su orts:
» Microsoft Windows XP x86
» Microsoft Windows 7 x86
» Microsoft Windows Embedded Standard 7
» Microsoft Windows CE 6.0
» Microsoft Windows XP embedded
» Linux
» WindRiver VxWorks
» QNX Neutrino
16

COMe-mSP1 / Product S ecification
3.3 Block Diagram
17

COMe-mSP1 / Product S ecification
3.4 Electrical Specification
3.4.1 Supply Voltage
Following su ly voltage is s ecified at the COM Ex ress® connector:
VCC: 4.75 - 14V
Stand y: 5V DC +/- 5%
RTC: 2.5V - 3.3V
- 5V Standby voltage is not mandatory for o eration.
- Extended Tem erature (E1) variants are validated for 12V su ly only
3.4.2 Power Supply Rise Time
» The in ut voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ram of each DC in ut voltage from 10% to 90% of its final set- oint
following the ATX s ecification
3.4.3 Supply Voltage Ripple
» Maximum 100 mV eak to eak 0 – 20 MHz
3.4.4 Power Consumption
The maximum Power Consum tion of the different COMe-mSP1 variants is 4.9 - 6.2W (100% CPU load on all cores; 90°C
CPU tem erature). Further information with detailed measurements are available in A lication Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.
18

COMe-mSP1 / Product S ecification
3.4.5 ATX Mode
By connecting an ATX ower su ly with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and owering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 14V in ATX Mode. On Com uter-on-Modules su orting a
wide range in ut down to 4.75V the in ut voltage shall always be higher than 5V Standby (VCC > 5VSB).
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0V x 0V
S5 high low 5V high 0V
S5 S0 →PWRBTN Event low high →5V high low →0 V VCC →
S0 high high 5V low VCC
3.4.6 Single Supply Mode
In single su ly mode (or automatic ower on after ower loss) without 5V Standby the module will start automatically
when VCC ower is connected and Power Good in ut is o en or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 14V.
To ower on the module from S5 state ress the ower button or reconnect VCC. Sus end/Standby States are not
su orted in Single Su ly Mode.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 →high o en / high x connecting VCC
S5 high o en / high x VCC
S5 S0 →PWRBTN Event o en / high x reconnecting VCC
Signals marked with “x” are not im ortant for the s ecific ower state. There is no
difference if connected or o en.
All ground ins have to be tied to the ground lane of the carrier board.
19

COMe-mSP1 / Product S ecification
3.5 Power Control
Power Supply
The COMe-mSP1 su orts a ower in ut from 4.75 - 14V. The su ly voltage is a lied through the VCC ins (VCC) of the
module connector.
Power Button (PWRBTN#)
The ower button (Pin B12) is available through the module connector described in the inout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, ty ical 400ms) at low level (Power Button Event).
Pressing the ower button for at least 4seconds will turn off ower to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-mSP1 rovides an external in ut for a ower-good signal (Pin B24). The im lementation of this subsystem
com lies with the COM Ex ress® S ecification. PWR_OK is internally ulled u to 3.3V and must be high level to ower on
the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the inout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chi set and active Management Engine does not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager resent and SMB_ALERT# (Pin B15) connected the module always owers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.
20