Kontron SMARC-sAMX8X User manual


USER GUIDE
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SMARC-sAMX8X
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
SMARC
-SAMX8X - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this manual may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the manual or any product characteristics
set out in the manual. Kontron assumes no responsibility or liability for the use of the described product(s), conveys
no license or title under any patent, copyright or mask work rights to these products and makes no representations
or warranties that these products are free from patent, copyright or mask work right infringement unless otherwise
specified. Applications that are described in this manual are for illustration purposes only. Kontron makes no
representation or warranty that such application will be suitable for the specified use without further testing or
modification. Kontron expressly informs the user that this manual only contains a general description of processes
and instructions which may not be applicable in every individual case. In cases of doubt, please contact Kontron.
This manual is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this manual is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this manual only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2020 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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Revision History
Revision Brief Description of Changes Date of Issue Author
1.0 Initial Issue 2020-January-08 hjs
1.1 Chapter 6.1 updated 2020-April-01 hjs
Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR RESALE
FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR COMMUNICATION SYSTEMS FOR
AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE SUPPORT OR LIFE SUSTAINING APPLICATIONS,
WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE
PERFORMANCE, OR IN WHICH THE FAILURE OF PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR
SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless
otherwise stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities
and cannot therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or
for resale as device in High Risk Applications. All application and safety related information in this document
(including application descriptions, suggested safety measures, suggested Kontron products, and other materials) is
provided for reference only.
Handling and operation of the product is permitted only for trained personnel within a work
place that is access controlled. Please follow the “General Safety Instructions for IT
Equipment” supplied with the system.

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Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths
into a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace
of mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.

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Symbols
The following symbols may be used in this manual
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
NOTICE indicates a property damage message.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60 V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your material.
Please refer also to the "High-Voltage Safety Instructions" portion below in this section.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
This symbol indicates general information about the product and the user manual.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is
not guaranteed, it is important for the user to be electrically discharged before touching the product with his/her
hands or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not
placed on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage
the batteries or conductive circuits on the product.

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General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes
or modifications to the product, that are not explicitly approved by Kontron and described in this User Guide or
received from Kontron’s Technical Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version,
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present User Guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements where possible. Many of the
components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capable of being recycled.
Final disposition of this product after its service life must be accomplished in accordance with applicable country,
state, or local laws or regulations.
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE

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Table of Contents
Symbols .................................................................................................................................................................................................................6
Table of Contents ...............................................................................................................................................................................................9
List of Tables......................................................................................................................................................................................................10
List of Figures ....................................................................................................................................................................................................10
1/ Introduction...........................................................................................................................................................................................11
2/ Description............................................................................................................................................................................................12
2.1. SMARC™ Computer-on-Modules........................................................................................................................................................12
2.2. Main characteristics................................................................................................................................................................................13
2.3. Product Variants and Accessories......................................................................................................................................................13
2.4. SMARC-sAMX8X Feature Set ...............................................................................................................................................................14
3/ System Specifications.......................................................................................................................................................................15
3.1. Component Main Data.............................................................................................................................................................................15
3.2. Environmental Conditions .....................................................................................................................................................................16
3.3. Functional Block Diagram......................................................................................................................................................................18
4/ Board and Connectors ......................................................................................................................................................................19
4.1.1. Connectors ...............................................................................................................................................................................................19
4.2. Mainboard view and I/O locations .....................................................................................................................................................19
4.3. Bottom Side...............................................................................................................................................................................................20
4.4. Mechanical Drawings .............................................................................................................................................................................21
4.5. Thermal Considerations........................................................................................................................................................................22
5/ Pin Definitions.....................................................................................................................................................................................23
5.1. Processor Support ...................................................................................................................................................................................23
5.2. System Memory Support ......................................................................................................................................................................23
5.3. eMMC Flash Memory..............................................................................................................................................................................24
5.4. SMARC Connector....................................................................................................................................................................................24
5.5. Pinout of SMARC sAMX8X Connector ............................................................................................................................................... 25
5.5.1. Pinout of SMARC sAMX8X Topside Connector............................................................................................................................ 25
5.5.2. Pinout of SMARC sAMX8X Bottom Side Connector...................................................................................................................28
6/ Installation...........................................................................................................................................................................................34
6.1. Boot Process..............................................................................................................................................................................................34
6.2. PCIe Switch options ................................................................................................................................................................................34
6.3. Configurable Watchdog......................................................................................................................................................................... 35
6.4. RTC Current Consumption....................................................................................................................................................................36
6.5. UART Interfaces .......................................................................................................................................................................................36
6.6. Power Control........................................................................................................................................................................................... 37
6.6.1. Power Supply......................................................................................................................................................................................... 37
6.6.2. Power Button (POWER_BTN#)........................................................................................................................................................ 37
6.6.3. Power Bad Signal (VIN_POWER_BAD#)....................................................................................................................................... 37
6.6.4. Reset Button (RESET_IN#) ............................................................................................................................................................... 37
7/ Bootloader Operation.......................................................................................................................................................................38
7.1. Copyrights and Licensing of U-Boot ..................................................................................................................................................38
7.2. Bootloader Quickstart............................................................................................................................................................................38
7.3. Bootloader Commands..........................................................................................................................................................................39
7.4. Kontron Bootloader Command Extensions ....................................................................................................................................39
7.4.1. kboardinfo - Kontron Board Information......................................................................................................................................40
7.4.2. md5sum – MD5 Message Digest ....................................................................................................................................................40
7.4.3. Watchdog – CPU Watchdog Control...............................................................................................................................................41
7.5. Bootloader Environment........................................................................................................................................................................41

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7.6. Bootloader Environment Update .......................................................................................................................................................42
7.7. Kontron Bootloader Environment Extensions ...............................................................................................................................42
7.8. Bootloader Mass Storage Support....................................................................................................................................................43
7.8.1. QSPI flash ................................................................................................................................................................................................43
7.8.2. SD Card and eMMC Devices..............................................................................................................................................................43
7.8.3. USB Storage Device.............................................................................................................................................................................43
7.9. Bootloader File System Support.........................................................................................................................................................44
7.9.1. EXT4 File System Write Support......................................................................................................................................................44
7.10. Bootloader Network Support.............................................................................................................................................................44
7.11. Bootloader Boot Source Support.......................................................................................................................................................45
7.12. Bootloader Boot Counter.....................................................................................................................................................................45
7.13. Bootloader Update ................................................................................................................................................................................45
8/ Technical Support .............................................................................................................................................................................47
8.1. Warranty.....................................................................................................................................................................................................47
8.2. Returning Defective Merchandise .....................................................................................................................................................47
List of Acronyms..............................................................................................................................................................................................49
About Kontron ..................................................................................................................................................................................................50
List of Tables
Table 1: Product Variants of SMARC-sAMX8X........................................................................................................................................13
Table 2: SMARC-sAMX8X Feature Set.......................................................................................................................................................14
Table 3: Component Main Data....................................................................................................................................................................15
Table 4: Environmental Conditions ............................................................................................................................................................17
Table 5: Connectors of SMARC-sAMX8X..................................................................................................................................................19
Table 6: Processor Support..........................................................................................................................................................................23
Table 7: Memory Options.............................................................................................................................................................................. 23
Table 8: Pinout of SMARC sAMX8X Topside Connector ..................................................................................................................... 25
Table 9: Pinout of SMARC sAMX8X Bottom Side Connector .............................................................................................................28
Table 10: Mapping of SMARC SER interfaces to i.MX8X UARTs ....................................................................................................... 36
Table 11: Bootloader Command Extensions............................................................................................................................................ 39
Table 12: Standard Environment Variables.............................................................................................................................................42
Table 13: Bootloader Environment Extensions .....................................................................................................................................42
Table 14: Environment Variables for "boot_sel" ...................................................................................................................................45
List of Figures
Figure 1: Half-size Card with SMARC interface.......................................................................................................................................12
Figure 2: Block Diagram..................................................................................................................................................................................18
Figure 3: Top View............................................................................................................................................................................................19
Figure 4: Bottom Side from SMARC-sAMX8X ........................................................................................................................................20
Figure 5: Dimensions of SMARC-sAMX8X................................................................................................................................................21
Figure 6: Thickness from side view ............................................................................................................................................................21
Figure 7: Heatspreader Top View with screw holes ............................................................................................................................22
Figure 8: Heatspreader Bottom View .......................................................................................................................................................22
Figure 9: Processor Block Diagram (Source: NXP) ...............................................................................................................................23
Figure 10: 314-pin SMARC Connector,.......................................................................................................................................................24
Figure 11: PCI Switch Configuration............................................................................................................................................................ 35

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1/ Introduction
This manual describes the Smart Mobility ARChitecture (SMARC) sAMX8X (SMX8) board. The Advanced RISC
Machines (ARM) based module is equipped with the NXP i.MX8X processors 8DualX, 8DualXPlus, 8QuadXPlus. The
dual or quad core SoC shall be the successor of the SMARC-sAMX7i module and there be as versatile as the existing
module and provide similar characteristics with better price/performance/power/lifetime ratio.
The use of this Users Guide implies a basic knowledge of PC hard- and software. This manual is focussed on
describing the special features and is not intended to be a standard PC textbook. New users are recommended to
study the short installation procedure stated in the following chapter before switching on the power.
All configuration and setup of the CPU board is either done automatically or manually by the user via the BIOS setup
menus.
Latest revision of this manual, datasheet, BIOS, drivers and BSP’s (Board Support Packages) can be downloaded
from Kontron Web Page.

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2/ Description
The SMARC-sAMX8X is a SMARC half-size module using the NXPs i.MX8X processor with either dual or quad core
ARM. It is designed on the latest SMARC 2.0 specification. The SMARC-sAMX8X is a highly integrated, embedded
computer board.
Figure 1: Half-size Card with SMARC interface
2.1. SMARC™ Computer-on-Modules
The SMARC™ standard was developed especially for new modules with ARM- and SoC-processors. Boards with this
interfaces are characterized by the extremely flat form factor. The SMARC or MXM 3.0 connector comes with 314
pins and a construction height of just 4.3 millimeters. The connector is also available in a shock- and vibration-
resistant version for rough environmental conditions.
Furthermore, the standard integrates dedicated interfaces for the latest ARM, x86 and SoC processors like LVDS,
Gigabit Ethernet and HDMI support. In addition, dedicated camera interfaces are being incorporated into a COM
standard. OEMs profit from minimized design effort and low Bill of Material (BoM) costs. SMARC™ defines two
different module sizes in order to offer a high level of flexibility regarding different mechanical requirements.

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2.2. Main characteristics
Main characteristics of the SMARC-sAMX8X are:
Dual/Quad-Core Cortex A-35 with additional M4 Core on SMARC short size form factor
Based on i.MX8X Series from NXP – three Pin compatible, scalable SKUs (2x dual, one quadcore; 1.5 W to 5.5 W
target TDP)
Up to 3 GB LPDDR4 memory down
four shader GPU and Multiformat VPU with H.265 support
LVDS support (via MIPI-DSI)
HDMI via parallel display
DP (via MIPI-DSI)
1x Gigabit Ethernet with internal MAC and PHY and 1x GB via PCIe controller, WOL support
Support for Audio and common features (SPI, I2C, SMB etc.)
Optional eMMC flash onboard
Full industrial grade temp. range E2 (-40°C up to +85°C) for standard SKUs, commercial version possible
APPROTECT (security chip) support on request, more information under
https://www.kontron.de/products/solutions/security/approtect.html
2.3. Product Variants and Accessories
Following variants are planned:
Table 1: Product Variants of SMARC-sAMX8X
Product Number Product Name Configuration
51010-3008-12-4+ SMARC-sAMX8X quad X+
3G/8S all features
SMARC with NXP i.MX8X, quadX+ 1.2 GHz; 3 GB
LPDDR4, 8 GB eMMC pSLC, LVDS, DP, HDMI, 2x
LAN, 3x PCIe
51010-1508-12-2+ SMARC-sAMX8X dual X+
1.2GHz 1.5G/8S all features
SMARC with NXP i.MX8X, dualX+ 1.2 GHz; 1.5 GB
LPDDR4, 8 GB eMMC pSLC, LVDS, DP, HDMI, 2x
LAN, 3x PCIe
51010-1004-12-2 SMARC-sAMX8X dual X
1G/4S LVDS only 1 x PCIe
SMARC with NXP i.MX8X, dualX 1.2 GHz; 1 GB
LPDDR4, 4 GB eMMC pSLC, LVDS only, 1x PCIe
Following accessories are available:
SMARC 2.0 Evaluation Carrier
SMARC Starter Kit

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2.4. SMARC-sAMX8X Feature Set
Table 2: SMARC-sAMX8X Feature Set
SMARC™ Feature
specification
SMARC™
Specification
Maximum Number
Possible
SMARC-sAMX8X
Feature support
Description
LVDS Display
support
1 1x 2 x MIPI-DSI/LVDS Combo PHY*
CSI Camera
support
2 1x 1 x MIPI CSI with option 2 lanes or 4
lanes
USB Interface 6 x USB 2.0
with 2 x USB 3.0
included
5x USB 2.0 via
USB Hub
1x USB 3.0
1x USB2 OTG with
PHY
1x USB OTG ports, 5x USB host ports +
1x with internal WIBU key
option/APPROTECT)
PCIe Interface 4 1x 4-Port/4-Lane Interface 128-LQFP
GbE Interface 2 2x GbE 1x GB Ethernet + 1GB Ethernet optional
via PCIe controller
SDIO Interface 1 1x
SPI Interface 2 2x 2x Quad/1x Octal SPI
I2S Interface 2 1x option Default leads to SMARC connector.
I2C Interface 5 3x External Fast I2C_GP from Embedded
Controller or CPU I2C_PM for Power
Management
CAN 2 2x Option: SER2 RTC/CTS shared with
CAN0
UART 4x Option: SER2 RTC/CTS shared with
CAN0
GPIOs 12x GPIOs

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3/ System Specifications
3.1. Component Main Data
The table below summarizes the features of the motherboard.
Table 3: Component Main Data
SMARC-sAMX8X
Form factor Short size Smart Mobility ARChitecture (SMARC) Hardware with 82 mm x 50 mm, max.
thickness 6
mm
Processor NXP i.MX8X 19mm x 19mm BGA package with 609 balls in 0.8 mm and 0.65mm pitch
(industrial version). Used processor types are i.MX 8 QuadXPlus, i.MX 8 DualXPlus and i.MX
8 DualX.
Memory LPDDR4 @ 1200 MHz (no ECC)
Boot Flash 8 MB to 256 MB SPI NOR flash

Bootloader/BIOS U-Boot Bootloader, Flash for Bootloader connected on SPI0.
embedded
Multimedia Card
(eMMC)
2 to 32 GB pseudo Single Level Cell (pSLC)
4 to 128 GB MLC (Multi-level Cell)
EEPROM Type: 24C32, 4k x 8 (32 kbit)
Connected at I2C_GP bus at address 0x50 (7-bit)
Display 18/24-bit LVDS RGB (True Color)
Resolution: up to 1920x1080 Pixel from MIPI-DSI
Single/Dual Channel
Onboard Controllers
Ethernet Controller 1x GBE PHY DP83867IR, second ETH controller I210 optionally with PCIe switch
Watchdog Timer CPU internal watchdog, configurable timeout counter with timeout periods from 0.5 to 128
seconds
USB HUB USB HUB USB2517i for 5x USB 2.0 ports on SMARC Con.
PCI Switch PCIe packet switch PI7C9X2G404SL
Display bridge MIPI DSI to LVDS Flatlink SN65DSI84ZQER
Real Time Clock
(RTC)
High accuracy (+/-3%), low power, RV-8803
System
Management
Controller
No dedicated System Management Controller on module System settings can be arranged
in U-Boot environment variables
Storage 2 to 128 GB eMMC 5.0 Flash (option)
H/W Status
Monitor
Voltage monitoring
Security APPROTECT Key optional
Power
management
Clock Control Module (CCM)
General Power Controller (GPC)
System Reset Controller (SRC)
Operating System
Support
Linux Yocto, other Operating Systems only on customer request
Interfaces via Smarc I/O

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I2C External Fast I2C_GP from Embedded Controller or CPU I2C_PM for Power Management
LAN, USB 1x Gb-Ethernet + 1x Gb-Ethernet optional via PCIe controller,
1x USB 3.0 OTG on USB#3, 1x USB 3.0 on USB#2, 5x USB 2.0 xHCI, via USB Hub
PCIe Konfiguration 1 (default)
PCIe Switch and LAN Controller
2x PCIe at SMARC connector via PCIe SW (PCIeA + PCIeB)
1x PCIe to LAN Controller via PCIe SW
Second Ethernet on ETH1
Konfiguration 2 (economic)
Without PCIe Switch and LAN Controller
1x PCIe A on SMARC connector directly from i.MX8 CPU
No ETH1
Konfiguration 3 (dual LAN, no PCIe)
Without PCIe Switch and with LAN Controller
No PCIe at SMARC connectors
LAN Controller directly connected to PCIe from CPU
Konfiguration 4 (PCIe, no 2nd LAN)
PCIe Switch and without LAN Controller
3x PCIe at SMARC connector via PCIe SW (PCIe A, PCIeB, PCIeC)
No ETH1
Audio Default Audio support via HDMI
Carrier board Audio with external I2S Codec
Display Dual channel LVDS 1/2x18/24bit (openLDI and VESA) up to 1920x1200 from MIPI-DSI
Camera MIPI CSI camera support default: 2lane interface, option to switch to 4 lane interface
SD-Card 1x SDIO
Serial Peripheral
Interface (SPI)
2 x SPI interface on defined pins for external Boot and general purpose devices
SER 4x serial ports with full function according to SMARC 2.0. SER2 handshake lines are either
CAN0 or SER2 handshake, via BOM option and configuration.
GPIO 6x General Purpose Inputs/Outputs (GPIO)
Other Connectivity Keypad, 2x CAN
Power
Input Voltage Wide range VCC 3.0 V to 5.25 V
Power Supply
Limits
Voltage Ripple maximum 200mV peak to peak at 0 to 20 MHz 0.1 to 20ms rise time from
input voltage ≤10% to nominal VCC inrush current peak limit. G3/S5 to S0 acc. SFX Design
Guide
Power Features Module shall power on automatically in single supply operation when VCC is
connected (Uboot setting)
Module shall be possibly reconfigured to start after PowerButton, when VCC is
connected
Security
HAB, SRTC, SJTAG, TrustZone®
AES256, RSA4096, SHA-256
3DES, ARC4, MD-5
Flashless SHE, ECC
Tamper, Inline Enc Engine
3.2. Environmental Conditions

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Table 4: Environmental Conditions
Operating 0°C to 60°C (on request for cost optimization)
-40°C to 85°C (by design)
Storage -40°C to +85°C
Relative Humidity non-condensing 10 % to 93 % at 40°C acc. to IEC 60068-2-78
Electromagnetic
Compatibility
(EMC)
According to EN55022 (Class B), EN61000-6-2 and EN61000-6-4
CE EN 62368-1:2014 - Safety for audio/video and information technology equipment
UL Component Recognition to UL60950-1 - Information Technology Equipment Including
Electrical Business Equipment
REACH REACH compliant (Regulation (EC) No 1907/2006)
WEEE WEEE compliant (Directive 2012/19/EU)
Shock and
Vibration
Shock & Vibration according to
IEC/EN60068-2-27 (Non-operating shock test – half-sinusoidal, 11 ms, 15 g) and
IEC/EN60068-2-6 (Non-operating vibration – sinusoidal, 10 Hz – 4000 Hz, +/- 0.15
mm, 2 g)
Theoretical MTBF estimated 10 years at 40°C
RoHS II Compliance The product is RoHS II compliant (Directive 2011/65/EU)

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3.3. Functional Block Diagram
The block diagram shows all available interfaces on the sAMX8X module.
Figure 2: Block Diagram

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4/ Board and Connectors
4.1.1. Connectors
Table 5: Connectors of SMARC-sAMX8X
Connector Function Remark
SMARC Central Interface Mating connector: SMARC 2.0
(MXM3)
4.2. Mainboard view and I/O locations
Figure 3: Top View
1. LPDD4 memory
2. Freescale Processor
3. embedded MultiMedia Card (eMMC)
4. SMARC Interface
5. GbE 1 on PCIe (optional)
6. PCIe switch
1
4
3
5
2
6

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4.3. Bottom Side
Figure 4: Bottom Side from SMARC-sAMX8X
7. Parallel to HDMI controller
8. SPI Flash
7
8