Lattice iCE40 Ultra User manual

iCE40 Ultra™ Mobile Development Platform User Guide
EB90 Version 1.1, June 2015

2
iCE40 Ultra Mobile Development Platform User Guide
Introduction
This platform is designed to develop and demonstrate various mobile applications using the iCE40 Ultra device.
The board is in the form factor of a bar phone featuring various sensors and connectivity to external mobile soft-
ware development platforms.
Kit Contents
The following items are included in the development kit:
•Main Board – The main board is mounted in lower plastic enclosures.
•Key Set – The key set includes keys A, B, C, and Custom. Key A is installed on the main unit by default.
• DragonBoard Interface Module
•Interconnecting Cables – The cables include USB mini-B cable, DragonBoard interface ribbon cable, and +5 V
supply flywire.
Variants
The unit is built in two variants with different sets of RGB LED and IR LED parts.
Variant A includes the following parts on the board:
• RGB LED used at D12: AEBMT-RGBZ by Advanced Optoelectronics Technology
• IR LED used at D7: SFH 4645 by Osram Opto Semiconductors
Variant B includes the following parts on the board:
• RGB LED used at D13: APTF1616SEEZGQBDC by Kingbright
• IR LED used at D7: VSMB2948SL by Vishay Semiconductor
The variants can be distinguished through the populated status of D12 and D13.
• Variant A: D12 is populated and D13 is not populated
• Variant B: D12 is not populated and D13 is populated

3
iCE40 Ultra Mobile Development Platform User Guide
Demo Board Architecture
Figure 1 shows the demo board architecture. The different I2C sensors are split up and wired on two separate I2C
buses as Pool A and Pool B. The other sensors that are not I2C are either wired separately or are connected
instead of Pool B and other resources on the board. Changes to connectivity are user controllable and achieved by
means of changing the keys – a method to replace using multiple jumpers to re-route wiring to different resources.
Figure 1. Block Diagram
MAX44008 (I2C)
RGB ALS
APP PROCESSOR (SPI)
(10 pin CONN)
3.3v
BMP180 (I2C)
Pressure
IR LED (TX)
HIGH POWER
WHITE LED
JUMPER SEL
POOL-B I2C
POOL-A I2C
POWER SUPPLIES
(from USB / Battery)
FT2232H
SPI CONFIG FLASH (SPI)
USB
CHEETAH CONN
LSM330DLC (I2C)
Accel. & Gyro
HALL SENSOR
THESE CONNECTIONS VIA INTERCONNECT
[40 pin FPC connector]
TMD27711 (I2C)
Proximity & ALS #2
Key-socket selection
FINGERPRINT SENSOR I2S MIC#2
SPI
Li-ion BatteryCHARGER
Key-socket selection
RGB LED
I2S MIC#1 SMA CONN
CURRENT MEASURE
CURRENT MEASURE
BLE Module
IR RX
LSM303DLHC (I2C)
Magentometer
SHT20 (I2C)
Humidity &Temp.
TMD27711 (I2C)
Proximity & ALS #1
POOL-B I2C
POOL-B I2C
3.3V
3.3V
SMA CONN
Operated together
Optional
CONFIG SPI & BANK 1
BANK 2
BANK 0
iCE5LP4KSWG36
SPI
UART

4
iCE40 Ultra Mobile Development Platform User Guide
Figure 2. Top View of Main Unit
BLE Module
External Power and
Charging Status Indicator
TMD2711 Proximity Sensor
FPC1080A Fingerprint Sensor
TMD2711 Proximity Sensor
SHT20 Humidity Sensor
ADMP441 I2S Mic
IR Rx (TSMP58000)
J15 (Jumper
Pool Header)
Power LED
Barcode LED
(Red)
iCE40 Ultra
RGB LED
CDONE LED
BMP180
Pressure Sensor
27 MHz
Oscillator
Power Switch
SMA Footprint
AP Connector
Jumper selection between
IR and White High Power LEDs
IR LED (Emitter)
MAX4408RGB ALS Sensor
High Power White LED
CRST Button
USB Port

5
iCE40 Ultra Mobile Development Platform User Guide
Figure 3. Bottom View of Main Unit
ADMP441 I2S Mic
M25P80
SPI Flash
LSM303DLHC
Magnetometer Sensor
Connector
Battery
Key Socket
LSM330DLC
Accelerometer and
Gyroscope Sensor
FTDI FT2232H
USB Port

6
iCE40 Ultra Mobile Development Platform User Guide
Features
• Supports BLE (Bluetooth Low Energy) module
• Supports OTA (Over-The-Air) configuration of FPGA
• Form factor similar to mobile phone
Sensor list
The following table lists the different sensors used on the board.
Table 1. Sensor List
Key-socket Arrangement
Three predefined keys and one user defined key is provided to allow the user to change the wiring of the board
between different sensor sets as described in Table 2. The table also denotes pin assignments to the iCE40 Ultra
FPGA on the board. While selecting and inserting a particular key of choice, ensure that you align the aligning
arrow on the key and on the main PCB. The keys are mechanically delicate, and hence, you must be careful while
inserting and removing the keys. Figure 4 shows the four keys and socket on the main board.
Number Sensor Function Interface Sensor Part Number Manufacturer
1 RGB LED (Variant 1) Direct AEBMT-RGBZ AOT
2 RGB LED (Variant 2) Direct APTF1616SEEZGQBDC Kingbright
3 High Current IR Tx LED
(Variant A)
Direct SFH4645 Osram Opto
4 High Current IR Tx LED
(Variant B)
Direct VSMB2948SL Vishay Semiconductor
5 High Current Visible LED Direct XBDA WT-00-0000-
00000LCE3
Cree Inc.
6 IR Rx Direct TSMP58000 Vishay Semiconductor
7 Proximity Sensor
(Two numbers)
I2C TMD27711 A MS-TA OS USA Inc
8 RGB Light Sensor I2C MAX44008 Maxim-IC
9 Temperature Sensor I2C BMP180 (integrated) Bosch
10 Barometric Pressure I2C BMP180 Bosch
11 Accelerometer I2C LSM330DLC ST Micro
12 Gyroscope I2C
13 Magnetometer I2C LSM303DLHC ST Micro
14 Humidity I2C SHT20 Sensirion
15 Hall Direct BU52051NV X-TR Rohm Semiconductor
16 Fingerprint SPI FPC1080A Fingerprints
17 MEMS Mic (Two numbers) I2S ADMP441 Invensense

7
iCE40 Ultra Mobile Development Platform User Guide
Figure 4. Key-socket Arrangement
Pin assignments iCE40 Ultra FPGA
Table 2 lists the complete pin assignments for the iCE40 Ultra FPGA for the different keys and other hard wired
peripherals on the board
Table 2. Pin Assignment
Pin
Number Pin Name Bank
Pin Assignment for
Default Key A
Pin Assignment for
Key B
Pin Assignment for
Key C
A4 VCCIO_0 Bank 0 3V3 3V3 3V3
B5 IOT_46B_G0 Bank 0 Not used / Optional ext
SMA clock
Not used / Optional ext
SMA clock
I2S_WS1 (Microphone 1
(DP R51))
A6 RGB2 Bank 0 BLED (RGB LED) BLED (RGB LED) I2S_CE1 (Microphone 1)
B6 RGB1 Bank 0 GLED (RGB LED) GLED (RGB LED) I2S_SCK1 (Microphone
1)
C6 RGB0 Bank 0 RLED (RGB LED) RLED (RGB LED) I2S_SD1 (Microphone 1)
A2 IRLED Bank 0 HPLED (IRLED or VLED) HPLED (IRLED or VLED HPLED (IRLED or VLED
A1 VSSIO_LED Bank 0 GNDGNDGND
C3 SPI_VCCIO1 Bank 1 3V3 3V3 3V3
D1 IOB_33B_SI_M
OSI_SPI1
Bank 1 ICE_SI/FLSH_MOSI ICE_SI/FLSH_MOSI ICE_SI/FLSH_MOSI
F2 IOB_32A_SO_
MISO_SPI1
Bank 1 ICE_SO/FLSH_MISO ICE_SO/FLSH_MISO ICE_SO/FLSH_MISO
E1 IOB_34A_SCK_
SCK_SPI1
Bank 1 FLSH_SCLK FLSH_SCLK FLSH_SCLK
F1 IOB_35B_SS_
MCSNO_SPI1
Bank 1 FLSH_CS FLSH_CS FLSH_CS
E4 IOB_12A_G4_C
DONE
Bank 1 CDONE CDONE CDONE
D3 CRESET_B Bank 1 CRESET CRESET CRESET
B2 IOB_31B Bank 1 HALL_OUT/BMP_XCLR HALL_OUT/BMP_XCLR HALL_OUT/BMP_XCLR
C1 IOB_30A Bank 1 PoolA_Sensor_SDA PoolA_Sensor_SDA PoolA_Sensor_SDA
E2 IOB_29B Bank 1 Pool_Sensor_SCL Pool_Sensor_SCL Pool_Sensor_SCL
D2 IOB_27B Bank 1 CLK_STNDBY#
(Osc. Standby)
CLK_STNDBY#
(Osc. Standby)
CLK_STNDBY#
(Osc. Standby)
B1 IOB_26A Bank 1 FP_RSTn
(Fingerprint reset)
FP_RSTn
(Fingerprint reset)
FP_RSTn (
Fingerprint reset)
E3 IOB_20A Bank 1 UART_TX (BLE) UART_TX (BLE) UART_TX (BLE)
Orient the direction of the key
using these arrows

8
iCE40 Ultra Mobile Development Platform User Guide
External Interfacing
The board can be interface to external systems by one of two methods:
• SPI based application processor interface via J16 (AP Conn)
• BLE wireless module
For DragonBoard based SPI based application processor interfacing, a DragonBoard interfacing module and a
connecting ribbon cable are required (provided). Figure 5 shows the interfacing module, connecting cable, and
method to power the module from the DragonBoard.
A BLE module provides a feature on the board for wireless interfacing using Bluetooth Low energy version 4.
F3 IOB_16A Bank 1 UART_RX (BLE) UART_RX (BLE) UART_RX (BLE)
B4 IOB_10A Bank 1 PROC_INTR PROC_INTR PROC_INTR
C2 IOB_25B_G3 Bank 1 PROC_CS PROC_CS PROC_CS
F4 IOB_11B_G5 Bank 1 CLK (27 MHz) CLK (27 MHz) CLK (27 MHz)
C4 VCCIO_2 Bank 2 3V3 3V3 3V3
E5 IOB_7B Bank 2 BAR_LED FP_INTR (Fingerprint) S_LR2 (Microphone 2)
F5 IOB_6A Bank 2 IR_IN(IR Rx) IR_IN(IR Rx) I2S_LR1
(Microphone 1)
D5 IOB_5B_MCSN
0_SPI2
Bank 2 Spare GPIO on Exp
Header p.16
FP_CS (Fingerprint) I2S_WS2
(Microphone 2)
D6 IOB_4A_SCK_
SPI2
Bank 2 PoolB_Sensor_SCL FP_SCK (Fingerprint) I2S_SD2
(Microphone 2)
E6 IOB_3B_G6_M
OSI_SPI2
Bank 2 PoolB_Sensor_SDA FP_MOSI (Fingerprint) ISS_SCK2
(Microphone 2)
F6 IOB_2A_MISO_
SPI2
Bank 2 Spare GPIO on Exp
Header p.20
FP_MISO (Fingerprint) I2S_CE2
(Microphone 2)
D4 VPP_2V5 Power 2V5 2V5 2V5
B3 VCCPLL Power 1V2 1V2 1V2
A5 VCC Power 1V2 1V2 1V2
C5 GND1 Power GNDGNDGND
A3 GND2 Power GNDGNDGND
Pin
Number Pin Name Bank
Pin Assignment for
Default Key A
Pin Assignment for
Key B
Pin Assignment for
Key C

9
iCE40 Ultra Mobile Development Platform User Guide
Figure 5. Data and 5 V Wiring from DragonBoard to DB Interface Module
Clocking
The board features an onboard 27 MHz oscillator. When an external clock is required, the SMA footprint can be
populated with a suitable SMA SMD connector (such as Molex part # 732511350). You must depopulate R51 on
the board.
Daisy Chain Interconnect / Expansion Connector
Daisy chain interconnect to the iCE FPGA by means of a connecting cable between two boards is possible via J10
on the main board. Refer to the schematics for the pin assignments of J10. All the pins of the FPGA are accessible
on this connector – and hence also forms a convenient way to tap into, or expand from any pin on the FPGA.
Basic Usage Procedures
Powering the Board
The board may be powered using one of three following methods:
• USB cable: USB A to mini B cable (supplied) connected to a PC may be used to power the board
• +5 V supplied to the DragonBoard interface module used to power the board through the provided ribbon cable.
The +5 V can be tapped from the DragonBoard as indicated in the Figure 5.
• Internal rechargeable battery not supplied with the kit. It must be procured separately. An example is the Nokia
BL-5C Lithium-ion battery shown in Figure 7.
Charging the Battery
The battery is charged when USB power is applied. Glowing of the green LED D3 (CHG) indicates the charging of
the battery. Glowing of the green LED D4 (EPW) indicates that an external charging power (USB) is applied. Glow-
ing D3 indicates that charging is in progress. If D3 does not glow and D4 (EPW) glows, it means that charging is
complete.

10
iCE40 Ultra Mobile Development Platform User Guide
Figure 6. USB Socket Located on the Lower Side
Figure 7. Nokia BL-5C Li-ion Battery Mounted Inside Back-cover of the Main Unit
Configuring the FPGA
The iCE40 Ultra can be configured using one of two methods:
• By programming the on-board SPI Flash U3 (ST Micro's M25P80)
• By directly configuring the FPGA using a processor to configure via iCE40 Ultra's SPI
Configuration by Programming SPI Flash
The SPI Flash (M25P80) can be programmed using the on-board FTDI's FT2232H (USB-SPI FIFO) via USB and
Lattice Diamond®Programmer.
To program the SPI Flash via USB and Lattice Diamond Programmer:
1. Apply a jumper to FLCS on jumper pool header J15.
2. Connect the USB cable to the demo board.
3. Download the bitstream in SPI Flash (M25P80) using Lattice Diamond Programmer. To download the bitstream:
a. Open Diamond Programmer version 3.2 or above and select Create a new blank project as shown in
Figure 8.

11
iCE40 Ultra Mobile Development Platform User Guide
Figure 8. Diamond Programmer Getting Started Dialog Box
b. The Diamond Programmer main interface opens, as shown in Figure 9.
Figure 9. Diamond Programmer Main Interface
c. Select iCE5LP in Device Family and iCE5LP4K in Device, as shown in Figure 10.

12
iCE40 Ultra Mobile Development Platform User Guide
Figure 10. Device Selection
d. Double-click Fast Program and choose the desired *.bin file.
e. In the Device properties dialog box, select the program to be used in programming the device and click
OK, as shown in Figure 11.
Figure 11. Device Properties Dialog Box

13
iCE40 Ultra Mobile Development Platform User Guide
e. Verify that the operation is completed successfully. In the main interface, INFO: Operation: successful
is displayed in the Output pane.
Figure 12. Verifying Operation
Alternatively, the SPI Flash can be programmed using Totalphase's Aardvark or Cheetah. Flash Center GUI flash
programming utility can be hooked up to the J29 (SPI PGM) header on the DragonBoard interfacing module.
To program the SPI Flash using Aardvark/Cheetah:
1. Apply a jumper on FLCS located on jumper pool header J15.
2. Ensure that the ribbon cable is connected between J16 (AP CONN) on main board and J26 (AP Interconnect)
on the DragonBoard interfacing module.
3. Remove shunt on J20 (PGM) header on the DragonBoard interfacing module.
4. Connect Aardvark / Cheetah to the J29 (SPI PGM) header on the DragonBoard interfacing module and its USB
to the PC/Laptop running the Flash Center GUI utility.
5. While operating the CRST button or applying the jumper on CRST of J15 (on the main board), use the Flash
Center GUI and appropriate bitmap to program the M25P80 SPI Flash.
6. After programming, remove the shunts on CRST and PGM.
Direct Configuration by a Processor (Processor Configuration)
The iCE40 Ultra FPGA can be configured directly without using an external SPI Flash. This can be done by the
application processor interfacing with the iCE40 Ultra SPI lines. While using this method appropriate software and
Android Application is required.
To configure the hardware:
1. Remove the jumper shunt on FLCS located on J15 (jumper pool header).
2. Apply a jumper shunt on FTRST located on J15 (jumper pool header).
3. Remove the jumper shunt on CRST located on J15 (jumper shunt header).

14
iCE40 Ultra Mobile Development Platform User Guide
4. Using the ribbon cable provided, connect the main PCB and the DragonBoard through the DragonBoard inter-
facing module.
5. Run the appropriate software / application to configure iCE40 Ultra directly from the DragonBoard processor.
Current Measurements
FPGA currents are measured by inserting ammeters in series with the respective current paths. This is achieved by
means of removing the jumper shunts on the pooled jumper header J15, and replacing those by ammeters. Note
the legends printed across each of the jumpers on the PCB and the corresponding wiring in the schematics around
region of J15 to make the desired measurements. Current measurements for the high power LED (IR or white) can
be done at J9 (LED selecting 3 pin jumper). Note that RGB LED current measurements on J15 (jumper pool
header) is for the common Anode limb of the LED and not individual RGB circuits; Thus appropriate drive must be
made to measure individual RG
Technical Support Assistance
Submit a technical support case via www.latticesemi.com/techsupport
Revision History
© 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as
listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of
their respective holders. The specifications and information herein are subject to change without notice.
Date Version Change Summary
June 2015 1.1 General update in multiple sections.
Updated Appendix A. Schematic Diagrams section.
Added Appendix B. Bill of Materials section.
June 2014 01.0 Initial release.

15
iCE40 Ultra Mobile Development Platform User Guide
Appendix A. Schematic Diagrams
Figure 13. Pool-A I2C Sensors
5
5
4
4
3
3
2 2
1
1
DD CC BB
A A
PRESSURE SENSOR
LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL
Notes: - Gyro and Accelerometer interfaces are both set to I2C - I2C address LSB for both Gyro and Accelerometer is '1'
- SPI for both Gyro and Accelerometer is disabled
R
O
SNESLLA
H
ROS
N
ESRETEM
O
REL
E
CCA&EP
O
C
S
O
R
YG
RGB ALS SENSOR
PROXIMITY SENSOR-2
iCE5LP Mobile Development Platform Rev B
DEFAULT VCCIO1 IS SET TO 3.3V
poolA_sensor_SCL
poolA_sensor_SDA
poolA_sensor_SDA poolA_sensor_SCL
poolA_sensor_SDA
poolA_sensor_SCL
Hall_out
poolA_sensor_SDA
poolA_sensor_SCL
VCCIO1
VCCIO1
VCCIO1
VCC3V3
VCCIO1
VCCIO1
VCCIO1
VCCIO1
poolA_sensor_SDA [Pg7] poolA_sensor_SCL [Pg7]
Hall_out [Pg7]
Title
veRrebmuNtnemucoDeziS
t
ee
h
S
:
e
taD of
04130-973-2
0
1 Pool-A I2C Sensors
B
210
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 Pool-A I2C Sensors
B
210
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 Pool-A I2C Sensors
B
210
Wednesday, April 22, 2015
R9 DNP
C25 0.1u
J14 ASCL
1
J13
ASDA
1
C79 1u
C57
1u
U18
MAX44008
VDD 1
GND 2
A0 3
INT
4
SCL
5
SDA
6
U22
BMP180
NC1 1
VDD
2
VDDIO
3
NC4 4
SCL 5
SDA 6
GND
7
R8 10k
U13
BU52051NVX
OUT 1
GND 2
NC
3
VDD
4
TPAD 5
C14
0.1u
U5
LSM330DLC
RES0 2
GND0 1
RES8 14
RES7 13
RES6 12
RES5 11
RES4 10
VDD0 7
CAP
15
DEN_G
16
DRDY_G/INT2_G
17
INT1_G
18
INT2_A
19
INT1_A
20
VDD_IO_0
21
CS_G
22
CS_A
23
SCL_A/G
24
VDD_IO_1
25
SDO_G
26
RES1 3 RES2 4
RES3 5
GND1 6
VDD1 8
VDD2 9
SDO_A
27
SDA_A/G
28
C56 1u
R42 4k7
R3310k
C11
10u
TMD27711
U16
VDD
1
GND
3
LEDA
4SCL 2
LEDK 5
LDR 6
INT 7
SDA 8
C16 10n
R41 4k7
C53
10u
C50
0.1u
C77
0.1u
C59 1u

16
iCE40 Ultra Mobile Development Platform User Guide
Figure 14. Pool-B I2C Sensors, IR Rx and Clocking
5
5
4
4
3
3
2
2
1
1
DD CC BB
A A
Humidity, Temperature Sensor
IR RX MODULE
CLOCK OSCILLATOR
LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL
PROXIMITY SENSOR-1COMPASS SENSOR
iCE5LP Mobile Development Platform Rev B
DEFAULT VCCIO2 IS SET TO 3.3V
poolB_sensor_SDA poolB_sensor_SCL
poolB_sensor_SCL
poolB_sensor_SDA
GND
poolB_sensor_SCL
poolB_sensor_SDA
VCCIO2
VCCIO2
VCCIO2
VCCIO2
VCC3V3
VCCIO2
VCCIO2
poolB_sensor_SDA [Pg7]
poolB_sensor_SCL [Pg7]
IR_IN [Pg7]
clk [Pg7]
clk_stndby# [Pg7]
Title
v
e
RrebmuN
tnemucoD
e
ziS
te
eh
S:e
taD of
04130-973-2
0
1 Pool-B I2C Sensors, IR Rx & Clocking
B
310
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 Pool-B I2C Sensors, IR Rx & Clocking
B
310
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 Pool-B I2C Sensors, IR Rx & Clocking
B
310
Wednesday, April 22, 2015
R2910k
ASFLMB-27.000MHZ-LC-T U21
GND
2
VDD
4STDBY# 1
OUT 3
R3 4k7
C5
1u
C55
1u
C76 0.1u
C1 0.1u
TMD27711
U15
VDD
1
GND
3
LEDA
4SCL 2
LEDK 5
LDR 6
INT 7
SDA 8
R5 4k7
C49 4.7u
C58 10u
U14
SHT20
SDA 1
VSS
2
NC1
3
NC2
4
VDD 5
SCL 6
PAD
7
C52 0.1u
U11
TSMP58000
VDD 3
OUT 1
GND 2
J2
BSCL
1
C6
0.1u
R43
10k
J1 BSDA
1
R22 100
C8 0.22u C15 4.7u
LSM303DLHC
U4
C1
6
RES1
10
RES2
11
SETP
12
SETC
13
SCL 2
SDA 3
INT2 4 INT1 5
DRDY 9
VDDIO 1
VDD 14
GND
7
NC
8
C51
1u

17
iCE40 Ultra Mobile Development Platform User Guide
Figure 15. Interconnects
5
5
4
4
3
3
2
2
1
1
DD CC BB
A A
To jumper pool Default: Shunt
Note position of pin#1 in reference board
SPI CONFIGURATION / FLASH
iCE5LP Mobile Development Platform Rev B LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL
SEEED BLE MODULE
AP INTERCONNECT
flsh_sclk
flsh_csproc_intr proc_cs
CRSTb
ice_SOice_SI
flsh_mosi ice_SI
flsh_miso
ice_SO
flsh_sclk
flsh_miso
UART_TX
UART_RX
DRGN5V
VCCIO1
VCC3V3
VCC3V3
VCC3V3
ice_SO [Pg4,7]
proc_cs [Pg7]
flsh_cs [Pg4,5,7]
ice_SI[Pg4,7]
flsh_sclk[Pg4,5,7] proc_intr
[Pg7]
CRSTb[Pg4,5,7]
flsh_miso [Pg5]
M25P80_CSn[Pg7]
flsh_mosi[Pg5]
UART_TX
[Pg7]
UART_RX
[Pg7]
CDONE [Pg5,7]
CRSTb[Pg4,5,7] ice_SI[Pg4,7] ice_SO[Pg4,7]
flsh_cs[Pg4,5,7]
flsh_sclk[Pg4,5,7]
SWCLK
[Pg7]
SWDIO[Pg7]
Title
v
e
RrebmuN
tnemucoDeziS
t
e
eh
S
:
e
taD of
04130-973-2
0
1 INTERCONNECTS
B
410
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 INTERCONNECTS
B
410
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 INTERCONNECTS
B
410
Wednesday, April 22, 2015
R2
10k
R13 0
R68
0
DNP
R12 0
R78
820
J16 AP INTERCONNECT
2 4
6 8
10
1 3
5 7 9
D14 RED
Manufacturer = Osram
PART_NUMBER = LS L29K-G1J2-1-Z
DNP
12
R37 0
R35
0
R6
10k
R67
0
DNP
R7
10k
J18
BLE PROG SEL
1 2
3
R76
0
DNP
R45
0
DNP
R48 0
DNP
M25P80
U3
SDI
5
SCK
6
WP
3
CS
1
SDO 2
HOLD 7
8
VCC
4
GND
R77
0
DNP
C9 0.1u
C17 0.1u
U30
SeeedBLE
GND
1
SWCLK
2
SWDIO
3
VCC
4
p12
6p13
5
p11
7
p9
9
p8
10
p7
11
p6
12
p5
13
p4
14
p3
15
p2
16
p1
17
p0
18
p29 20 p28 21 p25 22
p24 23 p23 24
p17 25
p18 26
GND 27
p10
8
p30 19
R4
10k
R75
0
DNP
R40
0

18
iCE40 Ultra Mobile Development Platform User Guide
Figure 16. USB Programming and Power
5
5
4
4
3
3
2
2
1
1
DD CC BB
A A
LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL iCE5LP Mobile Development Platform Rev B
FTDI PROGRAMMER
USB - POWER & PROGRAMMING
USB_DM
GND
FT_CRST
EP_CS
FT_CRST
GND
EP_DI
GND
EP_CLK
EP_CS
GND
FT_DI
FT_DI FT_SK
FT_SK
FT_CS
EP_DI
FT_DO
FT_CS
EP_CLK
GND
USB_DP
GND
FT_DO
GND
GND
USB_DP
USB_DM
FT_CDONE
FT_CDONE
VCC3V3
VCC3V3
VCC3V3
FTVCOR
VCC3V3
FTVCOR
VCC3V3
FTVCOR
FTVCOR
VCC3V3
VCC3V3
VCC3V3
USB5V
CRSTb[Pg4,7]
flsh_miso
[Pg4]
flsh_sclk[Pg4,7] flsh_cs[Pg4,7] flsh_mosi
[Pg4]
CDONE
[Pg4,7]
FTRSTn[Pg7]
Title
veR
r
eb
muN
t
ne
mucoD
e
z
i
S
te
eh
S:etaD of
04130-973-2
0
1 USB Programming & Power
B
510
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 USB Programming & Power
B
510
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 USB Programming & Power
B
510
Wednesday, April 22, 2015
R250C13
0.1u
C37
27p
C48
0.1u
C30 4.7u
C22 0.1u
C47
0.1u
Y1
12MHz
R210
R23 470
5V D- D+ ID G
USB PWR J5
1
2
3
4
S2
5
S1
S3
S4
R201k
R16 10
C23
27p
C21 10u
R11
10k
R260
C20 0.1u
L3
600 ohm, 500 mA
R280 R270
L1
600 ohm, 500 mA
R18
12k
93LC56BT-I/OT
U6
GND
2
VCC
6DO 1
DI 3
CLK 4
CS 5
C29 0.1u
L2 600 ohm, 500 mA
C18
47u
C19 0.1u
R24
0
U9 FT2232H
Gnd_1
1
OSCI
2
OSCO
3
VPHY
4
Gnd_7
5
REF
6
DM
7
DP
8
VPLL
9
AGnd
10
Gnd
11
VCORE_1
12
TEST
13
RESET#
14
Gnd_2
15
ADBUS0
16
ADBUS1
17
ADBUS2
18
ADBUS3
19
VCCIO
20
ADBUS4
21
ADBUS5
22
ADBUS6
23
ADBUS7
24
Gnd_3
25
ACBUS0
26
ACBUS1
27
ACBUS2
28
ACBUS3
29
ACBUS4
30
VCCIO_3
31
ACBUS5
32
ACBUS6 33 ACBUS7 34
Gnd_4 35
SUSPEND# 36
VCORE 37
BDBUS0 38 BDBUS1 39 BDBUS2 40 BDBUS3 41
VCCIO_2 42
BDBUS4 43 BDBUS5 44 BDBUS6 45 BDBUS7 46
Gnd_5 47
BCBUS0 48
VREGOUT 49
VREGIN 50
Gnd_6 51
BCBUS1 52
BCBUS2 53
BCBUS3 54
BCBUS4 55
VCCIO_1 56
BCBUS5 57
BCBUS6 58
BCBUS7 59
PWREN# 60
EEDATA 61
EECLK 62
EECS 63
VCORE_3 64
R102k2
C44
0.1u
C24
0.1u
R17 10
C38
0.1u
C43 4.7u

19
iCE40 Ultra Mobile Development Platform User Guide
Figure 17. I2S MIC, Fingerprint Sensors and Micro SD
5
5
4
4
3
3
2
2
1
1
DD CC BB
A A
LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL
FINGERPRINT SENSOR
I2S MICROPHONES - 2
iCE5LP Mobile Development Platform Rev B
FP_CS
I2S_SD1
I2S_SD2
VCCIO0
VCCIO2
VCC1V8
VCCIO2
VCCIO2 VCCIO2
I2S_LR1 [Pg7] I2S_WS1 [Pg7] I2S_SD1 [Pg7] I2S_SCK1 [Pg7]
I2S_CE1 [Pg7]
I2S_CE2 [Pg7]
FP_MISO [Pg7]
FP_CS [Pg7]
FP_INTR [Pg7] FP_SCK [Pg7] FP_MOSI [Pg7]
I2S_LR2 [Pg7] I2S_WS2 [Pg7] I2S_SD2 [Pg7] I2S_SCK2 [Pg7]
FP_RSTn[Pg7]
Title
veR
re
b
muN
tn
e
mucoD
e
z
i
S
te
eh
S:etaD of
04130-973-2
0
1 I2S MIC, FINGERPRINT SENSORS and MICRO SD
B
610
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 I2S MIC, FINGERPRINT SENSORS and MICRO SD
B
610
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 I2S MIC, FINGERPRINT SENSORS and MICRO SD
B
610
Wednesday, April 22, 2015
R62 10k
R66 100k
R73 100k R63
10k
D6
TVS/VAR
C66
0.1u
U19
ADMP441
SCK 1
SD 2
WS 3
LR 4
GND 5
GND1
6
VDD
7
CE
8
GND2
9
C60 0.1u
FPC1080A
U17
DR1
1
DR2
13
DR3
17
DR4
29
TXOUT1
20
TXOUT2
21
ANATEST1
8
ANATEST2
9
TEST4
10
TEST3
16
TEST2
15
TEST1
32
SPICLK 24
MISO 26 MOSI 25
CSN 6
RSTN 5
IRQ 4
VDD1 3
VDD2 19
VDDA 11
VDDIO 27
GND5 31
GND6 30
GND7 2
GND8 7
GND9 12
GND10 14
GND1
18
GND2
22
GND3
23
GND4
28
R30
100
C63 0.1u
R61 10k
U12
ADMP441
SCK 1
SD 2
WS 3
LR 4
GND 5
GND1
6
VDD
7
CE
8
GND2
9
C36 0.1u
R34 10k
C54 0.1u
C46
0.1u

20
iCE40 Ultra Mobile Development Platform User Guide
Figure 18. iCE5LP4KSWG36 FPGA and LEDs
5
5
4
4
3
3
2
2
1
1
DD CC BB
A A
500mA track
500mA track
500mA track500mA track
Default: Shunt 1,2 (for IR LED) All 500mA traces All 500mA traces
Note:
Place close
to DUT
LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL iCE5LP Mobile Development Platform Rev B
IR, RGB and HI-POWER LEDs
DAISY CHAIN INTERCONNECT
100mA track
De-populate when using SMA CLK
KEY & SOCKET HEADER
OPTIONAL SMA CLOCK
DNP
JUMPER POOL HEADER
100mA track100mA track
DONE CRST
ALTERNATE RGB LED
Note: Place close to DUT
Note:
Place close to DUT
500mA track 500mA track
CRSTb
VCC_A5
RLED
RGB_Anode
GLED BLED
IRLEDVLED
VLED HPLED IRLED
GPIO_B2
Hall_out
CDONE
SMA_CLK
GPIO_B5
BAR_LED
VCC_A5
VCCPLL_B3
VPP2V5_D4
SPIVCCIO1_C3 VCCIO0_A4
VCCIO2_C4
RGB_Anode
GPIO_A6 BLED GPIO_B6
GLED
GPIO_C6 RLED GPIO_D6
poolB_sensor_SCL
GPIO_D5
GPIO_E6 poolB_sensor_SDA
GPIO_E5 BAR_LED
GPIO_F6
GPIO_F5
IR_IN
flsh_cs
CRSTb
GPIO_E5 GPIO_B6
GPIO_B1
SPIVCCIO1_C3 VCCIO0_A4
GPIO_D6 GPIO_F5
poolA_sensor_SDA
proc_cs
VCC_A5
GPIO_B2 GPIO_E6 GPIO_A6
HPLED
UART_TX
GPIO_D2
flsh_cs
CRSTb
UART_RX VCCPLL_B3 GPIO_F6 GPIO_C6
ice_SO poolA_sensor_SCL proc_intr GPIO_D5
CDONE flsh_sclk
VCCIO2_C4 CLK_F4
ice_SI
GPIO_B5 VPP2V5_D4
GND GND
GPIO_D6
BLED
GLED
RGB_Anode
RLED
SPIVCCIO1_C3
GPIO_B1
VCCPLL_B3
GND
GND
VCCIO2_C4
GPIO_B6
HPLED
GPIO_C6
GPIO_B2
poolA_sensor_SCL
poolA_sensor_SDA
VPP2V5_D4
CDONE flsh_cs flsh_sclk ice_SO ice_SI
CRSTb
GPIO_E5 GPIO_F5 GPIO_D5
proc_cs proc_intr
GPIO_D6
GPIO_D2
GPIO_E6
CLK_F4
GPIO_F6 GPIO_B5 GPIO_A6
VCCIO0_A4
VCCIO1
VCC3V3HP
VCC3V3HP
VCCIO1
VCC1V2
VCC2V5
VCCIO1
VCCIO0
VCCIO2
VCC3V3HP
VCC3V3
flsh_cs
[Pg4,5]
Hall_out[Pg2]
CDONE[Pg4,5]
poolB_sensor_SDA[Pg3]
poolB_sensor_SCL[Pg3]
poolA_sensor_SDA[Pg2]
poolA_sensor_SCL[Pg2]
IR_IN[Pg3]
flsh_sclk[Pg4,5]
ice_SI
[Pg4]
proc_intr
[Pg4]
CRSTb[Pg4,5]
ice_SO
[Pg4]
proc_cs
[Pg4]
I2S_WS1 [Pg6]
FTRSTn [Pg5]
I2S_CE1
[Pg6]
I2S_SCK1 [Pg6]
I2S_SD1
[Pg6]
FP_SCK [Pg6]
I2S_SD2[Pg6] FP_CS [Pg6]
I2S_WS2 [Pg6]
FP_MOSI [Pg6]
I2S_SCK2[Pg6]
FP_INTR [Pg6]
I2S_LR2[Pg6]
FP_MISO [Pg6]
I2S_CE2[Pg6]
I2S_LR1 [Pg6]
M25P80_CSn [Pg4]
clk_stndby#[Pg3]
FP_RSTn[Pg6]
SWCLK
[Pg4]
SWDIO[Pg4]
UART_TXPg[4] UART_RX
Pg[4]
clk
Pg[3]
Title
veRreb
m
uNtne
m
uco
D
eziS
te
eh
S:etaD of
04130-973-2
0
1 iCE5LP4KSWG36 FPGA & LEDs
B
710
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 iCE5LP4KSWG36 FPGA & LEDs
B
710
Wednesday, April 22, 2015
Title
veRrebmuNtnemu
c
o
D
eziS
teehS
:etaD of
04130-973-2
0
1 iCE5LP4KSWG36 FPGA & LEDs
B
710
Wednesday, April 22, 2015
J7
KEY
2 4
6
8
10 12 14
16
18 20
22 24
26
28 30
1
3 5
7
9 11 13
15
17 19
21 23
25
27 29
3132
C70
10n
C71
10n
C65
10n
D5
VIS
1
K
2
A
3
3
J9
HP LED SEL
1
2 3
C72
1u
R38 2k2
C64
10n
C67
1u
C78
0.1u
J10
CON40A
1 2 34
5 6
7 8 910
11 12
13 14
15 16 17 18
19 20
21 22 23 24
25 26
27 28 29 30
31 32
33 34
35 36
37 38
39 40
J17
SMA
A1
Sh1 2 Sh2 3
Sh3
4
Sh4
5
C75
10n
R470
DNP
D8
BAR
D13
APTF1616SEEZGQBDC
A1
R
2
G
3B4
R44 100
C90
0.1u
J15
A3-20PA-2SV(71)
1 3
5 7
9
11 13
15 17 19
2 4
6 8
10 12 14 16
18 20
C62
1u
R14
150
R46 2k2
R740
R390
R49 10k
C61
0.1u
C69
0.1u
C73
0.1u
R51
0
C68
0.1u
Bank 0
Bank 2
CONFIG SPI & Bank 1
iCE5LP4KSWG36
iCE5LP4KSWG36
U20
IOB_2A_MISO_SPI2 F6
IOB_3B_G6_MOSI_SPI2 E6
IOB_4A_SCK_SPI2 D6
IOB_5B_MCSN0_SPI2 D5
IOB_6A F5
IOB_7B E5
IOB_29B
E2 IOB_30A
C1 IOB_31B
B2
IOB_32A_SO_MISO_SPI1
F2 IOB_33B_SI_MOSI_SPI1
D1
SPI_VCCIO1
C3
IOB_10A
B4
IOB_11B_G5
F4
CRESET_B
D3
IOB_16A
F3 IOB_20A
E3
IOB_25B_G3
C2
IOB_26A
B1 IOB_27B
D2
IOB_34A_SCK_SCK_SPI1
E1
IOB_35B_SS_MCSNO_SPI1
F1
VCCPLL B3
IOT_46B_G0 B5
RGB2 A6 RGB1 B6 RGB0 C6
GND2
A3
GND1
C5
VCC A5
VCCIO_0 A4 VCCIO_2 C4
VPP_2V5 D4
IOB_12A_G4_CDONE
E4
IRLED A2
VSSIO_LED A1
SW3
PB
D9
LED
C74
1u
D12
RGB
Green 1
Red
2
Anode
3Blue 4
D7
IR