Lattice MachXO3D Breakout Board User manual

MachXO3D Breakout Board
User Guide
FPGA-UG-02084-0.90
July 2019

MachXO3D Breakout Board
User Guide
© 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
2 FPGA-UG-02084-0.90
Disclaimers
Lattice makes no warranty, representation, or guarantee regarding the accuracy of information contained in this document or the suitability of its
products for any particular purpose. All information herein is provided AS IS and with all faults, and all risk associated with such information is entirely
with Buyer. Buyer shall not rely on any data and performance specifications or parameters provided herein. Products sold by Lattice have been
subject to limited testing and it is the Buyer's responsibility to independently determine the suitability of any products and to test and verify the
same. No Lattice products should be used in conjunction with mission- or safety-critical or any other application in which the failure of Lattice’s
product could create a situation where personal injury, death, severe property or environmental damage may occur. The information provided in this
document is proprietary to Lattice Semiconductor, and Lattice reserves the right to make any changes to the information in this document or to any
products at any time without notice.

MachXO3D Breakout Board
User Guide
© 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-UG-02084-0.90 3
Contents
Acronyms in This Document.................................................................................................................................................5
1. Introduction..................................................................................................................................................................6
2. Features........................................................................................................................................................................7
3. Storage and Handling ...................................................................................................................................................9
4. Software Requirements..............................................................................................................................................10
5. MachXO3D Device ......................................................................................................................................................11
6. Demonstration Design................................................................................................................................................12
6.1. Running the Demonstration Design ..................................................................................................................12
6.2. Download Demo Designs ..................................................................................................................................13
6.3. Programming a Demo Design with the Lattice Diamond Programmer.............................................................14
7. MachXO3D Breakout Board........................................................................................................................................15
7.1. Overview ...........................................................................................................................................................15
7.2. Subsystems........................................................................................................................................................16
7.2.1. Clock Sources ................................................................................................................................................16
7.2.2. Expansion Header Landings ..........................................................................................................................16
7.2.3. MachXO3D FPGA ..........................................................................................................................................22
7.2.4. Programming Interface Circuits....................................................................................................................22
7.2.5. LEDs...............................................................................................................................................................23
7.2.6. Power Supply ................................................................................................................................................23
7.2.7. Test Points ....................................................................................................................................................23
7.2.8. USB Programming and Debug Interface .......................................................................................................23
7.3. Board Modifications..........................................................................................................................................24
7.3.1. Bypassing the USB Programming Interface ..................................................................................................24
7.3.2. Applying External Power...............................................................................................................................24
7.3.3. Measuring Bank and Core Power .................................................................................................................24
7.4. Mechanical Specifications.................................................................................................................................24
7.5. Environmental Requirements ...........................................................................................................................24
8. Troubleshooting .........................................................................................................................................................25
8.1. LEDs Do Not Flash .............................................................................................................................................25
8.2. USB Cable Not Detected ...................................................................................................................................25
8.3. Determine the Source of a Pre-programmed Device........................................................................................25
9. Ordering Information .................................................................................................................................................26
Schematics................................................................................................................................................27
Bill of Materials.........................................................................................................................................35
References..........................................................................................................................................................................37
Lattice Semiconductor Documents.................................................................................................................................37
Revision History ..................................................................................................................................................................38

MachXO3D Breakout Board
User Guide
© 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
4 FPGA-UG-02084-0.90
Figures
Figure 2.1. MachXO3D Breakout Board, Top Side ................................................................................................................7
Figure 2.2. MachXO3D Breakout Board, Bottom Side ..........................................................................................................8
Figure 6.1.Demonstration Design Block Diagram ...............................................................................................................12
Figure 7.1. MachXO3D-9400HC Block Diagram ..................................................................................................................15
Figure 7.2. J3/J4 Header Landing Callout............................................................................................................................21
Figure 7.3. J6/J8 Header Landing Callout............................................................................................................................21
Figure 7.4. J1 Header Landing and LED Array Callout.........................................................................................................22
Figure A.1. Block Diagram...................................................................................................................................................27
Figure A.2. USB to JTAG Interface.......................................................................................................................................28
Figure A.3. Power Regulators .............................................................................................................................................29
Figure A.4. Bank0 I/O..........................................................................................................................................................30
Figure A.5. Bank1 I/O..........................................................................................................................................................31
Figure A.6. Bank2 I/O..........................................................................................................................................................32
Figure A.7. Bank3, 4, 5 I/O ..................................................................................................................................................33
Figure A.8. Power Decoupling and LEDs .............................................................................................................................34
Tables
Table 6.1. DIP Switch Setting and LED Behavior .................................................................................................................12
Table 7.1. MachXO3D Breakout Board Components and Interfaces..................................................................................16
Table 7.2. Expansion Connector Reference ........................................................................................................................16
Table 7.3. Expansion Header Pin Information for Bank 0 (J3) ............................................................................................17
Table 7.4. Expansion Header Pin Information for Bank 1 (J4) ............................................................................................18
Table 7.5. Expansion Header Pin Information for Bank 2 (J6) ............................................................................................19
Table 7.6. Expansion Header Pin Information for Bank 3/4/5 (J8) .....................................................................................20
Table 7.7. MachXO3D FPGA Interface Reference...............................................................................................................22
Table 7.8. USB/JTAG Interface Reference...........................................................................................................................22
Table 7.9. JTAG Programming Pin Information...................................................................................................................22
Table 7.10. SPI Programming Pin Information....................................................................................................................23
Table 7.11. I2 Programming Pin Information......................................................................................................................23
Table 7.12. Power and User LEDs Reference ......................................................................................................................23
Table 7.13. USB Interface Reference ..................................................................................................................................23
Table B.1. MachXO3D Breakout Board Bill of Materials.....................................................................................................35

MachXO3D Breakout Board
User Guide
© 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-UG-02084-0.90 5
Acronyms in This Document
A list of acronyms used in this document.
Acronym
Definition
DIP
Dual in-line Package
ESB
Embedded Security Block
FPGA
Field Programmable Gate Array
FTDI
Future Technology Devices International
I2C
Inter-Integrated Circuit
LED
Light Emitting Diode
LUT
Look Up Table
PCB
Printed Circuit Board
RoHS
Restriction of Hazardous Substances Directive
SPI
Serial Peripheral Interface
USB
Universal Serial Bus
WDT
Watchdog Timer
DNI
Do Not Install

MachXO3D Breakout Board
User Guide
© 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
6 FPGA-UG-02084-0.90
1. Introduction
This user guide describes how to start using the MachXO3D™Breakout Board, hereinafter referred to as the Board. It is
an easy-to-use platform for evaluating and designing with the MachXO3D device, a secure control PLD from Lattice
Semiconductor. Along with the Board and accessories, a preloaded demonstration design is included. You may also
reprogram the onboard MachXO3D device to review your own custom designs.
The MachXO3D Breakout Board currently features a Flash-based MachXO3D-9400HC device in a 256-ball 0.8 mm pitch
caBGA package. The Board includes a serial Flash memory for demonstrating external SPI boot-up. The external Flash
memory also supports one of the dual-boot modes in addition to on chip dual-boot configuration memory. For more
details regarding the supported dual-boot mode, refer to MachXO3D Programming and Configuration Usage Guide
(FPGA-TN-02069).
See also the Ordering Information section for more information.
Note: Static electricity can severely shorten the lifespan of electronic components. See the Storage and Handling
section of this document for handling and storage tips.

MachXO3D Breakout Board
User Guide
© 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-UG-02084-0.90 7
2. Features
The MachXO3D Breakout Kit includes:
MachXO3D Breakout Board –The Board is a 3” × 3” form factor that features the following onboard components
and circuits:
MachXO3D FPGA – Flash-based LCMXO3D-9400HC-5BG256C
USB mini-B connector for power and programming
16 Mb Serial Flash Memory (Machronix MX25V1635) for external SPI boot up support
Eight LEDs
Four-position DIP switch
Momentary push button switch
40-hole prototype area
Four 2 × 20 expansion header landings for general I/O, JTAG, and external power
1 × 8 expansion header landing for JTAG
1 × 6 expansion header landing for SPI/I2C
3.3 V and 1.2 V supply rails
Preloaded Demo –The Board includes a preloaded counter design that highlights use of the embedded MachXO3D
oscillator and programmable I/O configured for LED drive.
USB Connector Cable –The Board is powered from the USB mini-B socket when connected to a host PC. The USB
channel also provides a programming interface to the MachXO3D JTAG port.
Lattice Development Kits and Boards Web Page –Visit www.latticesemi.com/boards, and look for the MachXO3D
Breakout Board for the latest documentation including this guide and other downloads supporting this board. This
user guide includes demo operation, programming instructions, top-level functional descriptions of the MachXO3D
Breakout Board, descriptions of the on-board connectors, and a complete set of schematics.
Figure 2.1 and Figure 2.2 show the top side and bottom side of the MachXO3D Breakout board.
Two 2 x 20 Header
Landings (J3, J4)
Two 2 x 20 Header
Landings (J6, J8)
JTAG Header
Landing (J1)
SPI/I2C Header
Landing (J7)
MachXO3D PLD
(U5)
USB Mini-B
Socket (J2)
Power LED,
Blue (D1)
FTDI USB to
UART/FIFO IC (U1)
Push Button
Switch (SW1)
4-Position DIP
Switch (SW2)
4 x 10 40-Hole
Prototype array
LED array
(D9 -D2)
Figure 2.1. MachXO3D Breakout Board, Top Side

MachXO3D Breakout Board
User Guide
© 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
8 FPGA-UG-02084-0.90
SPIFlash Boot
Memory (U6)
Figure 2.2. MachXO3D Breakout Board, Bottom Side

MachXO3D Breakout Board
User Guide
© 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
FPGA-UG-02084-0.90 9
3. Storage and Handling
Static electricity can shorten the lifespan of electronic components. Follow the tips below to prevent damage that
could occur from electrostatic discharge:
Use anti-static precautions such as operating on an anti-static mat and wearing an anti-static wristband.
Store the evaluation board in the packaging provided.
Touch a metal USB housing to equalize voltage potential between you and the Board.

MachXO3D Breakout Board
User Guide
© 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
10 FPGA-UG-02084-0.90
4. Software Requirements
Before you begin developing new designs for the MachXO3D Breakout Board, install the Lattice Diamond® design
software. For detailed information on the Diamond software, visit www.latticesemi.com/diamond.
Diamond software includes the Lattice Diamond Programmer for programming your own content to the MachXO3D
FPGA. Lattice Diamond Programmer is also available as a stand-alone installation at www.latticesemi.com/programmer
Note: To communicate with the Board, FTDI Chip USB hardware drivers are required. It can be installed as an option
within the Diamond or Diamond Programmer installation.