MSI Hetis 865G User manual

Hetis 800Series
MS-6415 (V1.X)Barebone
G52-64151X1

ii
ThisdevicecomplieswithPart 15ofthe FCCRules.Operation issubject tothe
followingtwoconditions:
(1)thisdevicemaynotcauseharmful interference,and
(2)thisdevicemust acceptanyinterferencereceived,includinginterferencethatmay
causeundesiredoperation.
Micro-StarInternational
Hetis800
FCC-BRadio Frequency Interference Statement
Thisequipment hasbeen testedand
found tocomplywiththelimitsfora
class Bdigitaldevice,pursuantto
part15 of the FCCrules. Theselimits
aredesignedtoprovidereasonable
protectionagainstharmfulinterferencein aresidentialinstallation.Thisequipment
generates,usesand canradiateradiofrequencyenergyand,if notinstalled and
usedin accordancewiththeinstructionmanual,maycauseharmful interferenceto
radiocommunications.However,thereisno guaranteethatinterferencewill not
occurinaparticularinstallation.Ifthisequipmentdoescauseharmfulinterferenceto
radio ortelevisionreception,whichcanbedeterminedbyturning theequipmentoff
andon, theuserisencouraged totrytocorrect theinterferencebyone ormoreof the
measureslistedbelow.
=Reorientorrelocatethe receiving antenna.
=Increasetheseparationbetweentheequipmentandreceiver.
=Connectheequipmentintoanoutletonacircuitdifferentfromthattowhichthe
receiverisconnected.
=Consultthedealeroran experiencedradio/televisiontechnicianforhelp.
Notice1
Thechangesormodificationsnotexpresslyapprovedbythepartyresponsiblefor
compliancecould void theuser sauthoritytooperatetheequipment.
Notice2
Shielded interfacecablesandA.C.powercord,if any,mustbeusedin orderto
complywiththeemissionlimits.
VOIRLANOTICED INSTALLATIONAVANT DERACCORDERAURESEAU.

iii
CopyrightNotice
The materialin thisdocumentistheintellectualpropertyof MICRO-STAR
INTERNATIONAL.Wetakeeverycarein thepreparationof thisdocument, butno
guaranteeisgivenastothe correctness of itscontents.Ourproductsareunder
continualimprovementand wereservetherighttomakechangeswithoutnotice.
Trademarks
All trademarksarethepropertiesof theirrespectiveowners.
Intel®andPentium®areregistered trademarks ofIntel Corporation.
PS/2andOS®/2areregistered trademarksofInternationalBusiness Machines
Corporation.
Windows®95/98/2000/NT/XP areregistered trademarks ofMicrosoft Corporation.
Netware®isaregistered trademarkof Novell,Inc.
Award®isaregisteredtrademarkof PhoenixTechnologiesLtd.
AMI®isaregisteredtrademarkofAmericanMegatrendsInc.
U.S. PatentNumbers.
4,631,603;4,819,098;4,907,093;5,315,448;and6,516,132.
ThisproductincorporatescopyrightprotectiontechnologythatisprotectedbyU.S.
patentsandotherintellectual propertyrights.Useofthiscopyrightprotection technol-
ogymustbeauthorized byMacrovision,and isintendedforhomeand otherlimited
viewing usesonlyunless otherwiseauthorizedbyMacrovision.Reverseengineering
ordisassemblyisprohibited.
RevisionHistory
Revision Revision History Date
v1.0 Firstrelease May2006

iv
1. Alwaysread the safetyinstructions carefully.
2. KeepthisUser sManualfor futurereference.
3. Keepthisequipmentawayfromhumidity.
4. Laythisequipment onareliableflat surfacebeforesetting it up.
5. Theopeningsontheenclosurearefor air convectionhenceprotectsthe
equipmentfromoverheating.DONOTCOVERTHEOPENINGS.
6. Makesurethevoltage of thepowersourceand adjust properly115/230V
beforeconnecting theequipment tothe power inlet.
7. Placethe power cordsuchawaythat peoplecannot steponit. Donot
placeanythingover thepowercord.
8. AlwaysUnplug thePower Cordbeforeinserting any add-oncardor module.
9. All cautionsand warningsontheequipment shouldbenoted.
10. Never pourany liquidintotheopening that coulddamageorcauseelectrical
shock.
11. If any of the following situationsarises,get theequipmentcheckedby a
servicepersonnel:
- Thepower cordor plug isdamaged.
-Liquidhaspenetratedintotheequipment.
- Theequipment hasbeenexposedtomoisture.
- Theequipment hasnot workwell oryoucannot getit workaccording to
User sManual.
-The equipmenthasdroppedanddamaged.
- Theequipment hasobvioussign of breakage.
12. DONOTLEAVETHISEQUIPMENTINANENVIRONMENTUNCONDITIONED,
STORAGETEMPERATUREABOVE400 C(1020F),ITMAYDAMAGETHE
EQUIPMENT.
SafetyInstructions
CAUTION:Dangerofexplosionifbatteryisincorrectlyreplaced.
Replaceonlywiththesameorequivalenttyperecommendedbythe
manufacturer.

v
Warning:
1. For everychangesinpowercordˇ¦susage,pleaseuseanapprovedpower
cordwithconditiongreaterorequaltoH05VV-F,3G,0.75mm2.
2.Internalpart ishazardousmoving parts,pleasekeepfingersand other
bodypartsaway.
3.Forpluggableequipment,thesocket-outletshallbeinstallednearthe
equipmentand shall beeasilyaccessible.
4.Donot disabletheprotective earthpinfromthe plug,theequipment must
beconnectedtoanearthedmainssocket-outlet.

vi
WEEE Statement

vii

viii

ix
CONTENTS
Chapter1. GettingStarted...................................................................................1-1
MainboardSpecifications..............................................................................1-2
SystemConfiguration....................................................................................1-4
Thermal Solution...........................................................................................1-9
Chapter2. Introducing Mainboard......................................................................2-1
MainboardLayout.......................................................................................2-2
CPU(CentralProcessingUnit)......................................................................2-4
Memory.........................................................................................................2-8
IntroductiontoDDR2SDRAM...............................................................2-8
DIMM ModuleCombination...................................................................2-9
Installing DDR2Modules.......................................................................2-9
PowerSupply...............................................................................................2-10
ATX20-Pin Connector:ATX1...............................................................2-10
ATX12VPowerConnector: JPW1.....................................................2-10
FrontPanel....................................................................................................2-11
AudioPorts......................................................................................2-11
USBPorts.......................................................................................2-11
IEEE1394 Port(ForStandardVersion)...........................................2-11
RearPanel..................................................................................................2-12
Connectors..............................................................................................2-12
IDEConnector: IDE1........................................................................2-14
CardReaderConnector:CR1............................................................2-14
SerialATAIIConnectors: SATA1/SATA2............................................2-15
FanPowerConnectors: CPU_F1/CPU_F2..........................................2-15
Front PanelConnector:JFP1.............................................................2-16
CD-in Connector:J4............................................................................2-16
RCAout Connector:J3(ForStandardVersion).................................2-17
Internal SpeakerConnector: CON1.....................................................2-17
Jumper.......................................................................................................2-18
ClearCMOSJumper:JBAT1............................................................2-18
Slot.............................................................................................................2-19
PCIExpressSlot: PCI_E1(ForRiserCardUseOnly)........................2-19
Chapter3.BIOSSetup............................................................................................3-1
EnteringSetup...........................................................................................3-2
Getting Help........................................................................................3-3
GeneralHelp<F1>...............................................................................3-3

x
TheMainMenu............................................................................................3-4
StandardCMOSFeatures...........................................................................3-5
AdvancedBIOSFeatures...........................................................................3-9
AdvancedChipset Features.......................................................................3-11
IntegratedPeripherals................................................................................3-12
PowerManagement Setup.........................................................................3-14
PNP/PCI Configurations..............................................................................3-16
PCHealthStatus.........................................................................................3-17
LoadFail-Safe/OptimizedDefaults.............................................................3-18
Set Supervisor/UserPassword................................................................3-19
Chapter4.System Assembly..............................................................................4-1
Overview.....................................................................................................4-2
InstallationTools...................................................................................4-2
Screws.................................................................................................4-2
CheckingtheItems...............................................................................4-3
Installation Procedures................................................................................4-4
1. RemovingCover..............................................................................4-4
2. Installing HDD...................................................................................4-5
3.Installing OpticalDrive.....................................................................4-6
4. Installing CardReader(Optional).....................................................4-7
5. Installing MemoryModules...............................................................4-8
6.Installing CPU...................................................................................4-9
7. Installing CPUCooler.......................................................................4-10
8.Restoring ChassisCover..................................................................4-11
9. InstallingFootstand.........................................................................4-12
AppendixA.VIAVT1617AAudio.........................................................................A-1
InstallingtheAudioDriver............................................................................A-2
InstallationforWindows98SE/ME/2000/XP........................................A-2
SoftwareConfiguration...............................................................................A-4
Speaker...............................................................................................A-4
Mixer....................................................................................................A-5
Recording.............................................................................................A-5
SPDIF...................................................................................................A-6
SpeakerTest.......................................................................................A-6
Information...........................................................................................A-7
HardwareSetup........................................................................................A-8

Getting Started
Chapter1
Congratulationsforpurchasing Hetis800(MS-6415)
barebone. Midas bareboneisyourbestSlimPCchoice.
Withthefantasticappearanceandsmallformfactor,it
caneasilybesetanywhere.Thefeaturepacked plat-
formalsogivesyouanexcitingPCexperience.

MS-6415Barebone
1-2
ProcessorSupport
-Intel®Pemtium4ExtremeEdition,Pentium4,PentiumD,proces-
sorsintheLGA775 package.
-SupportsIntel05A and05Bprocessors
-Supports3/4pinCPUFanPin-HeaderwithFanSpeedControl.
-SupportsEISTTechnology
-SupportsHyper-Threading (HT)Technology
-SupportsIntelDualCoreTechnologyto800 MHzand up
(ForthelatestinformationaboutCPU,pleasevisit http://www.msi.
com.tw/program/products/slim_pc/slm/pro_slm_cpu_support.php)
SupportedFSB
-1066/800/533MHz
Chipset
-NorthBridge:VIA®P4M800Prochipset
-SouthBridge: VIA®VT8237R+chipset
MemorySupport
-DDRII 400/533SDRAM(2GBMax)
-2DDRIIDIMMs(240pin/1.8V)
LAN
-SupportsEthernetLAN10/100byVIA®VT6103LG
IEEE 1394 (ForStandardVersion)
-ChipintegratedbyVIA®VT6307
-Transferrateisup to400Mbps
Audio
-ChipintegratedbyVIA®VT1617AG
-Flexible5.1-channelaudio
-CompliantwithAC97Spec
IDE
-1IDEport byVIA®VT8237R+
-SupportsUltraDMA66/100/133 mode
-SupportsPIO,BusMasteroperationmode
SATA
-2SATAportsbyVIA®VT8237R+(LiteVersion sMB hasonlyone
SATA)
-SupportsSATAdevices
-Supportsstorageanddatatransfersatupto150MB/s
MainboardSpecifications

1-3
Getting Started
Connectors
BackPanel
-1PS/2mouseport
-1PS/2keyboardport
-2serialports
-USB 2.0 ports (2/4portsforLite/StandardVersion)
-1LANjack (10/100)byBoardcomVIA®VT6103LG
-3audiojacks
-1VGAout
-1IEEE1394 port(6-pins)(ForStandardVersion)
-1S-Videoout(ForStandardVersion)
-1AVout(ForStandardVersion)
-1DVIout(ForStandardVersion)
FrontPanel
-2audiojacks(Mic-Inx1,Headphoneoutx1)
-2USB ports
-1IEEE 1394 ports(4-pins)(ForStandardVersion)
On-BoardPinheaders
-1CD Audioinput
-1USB pinheader(ForCardReaderModule)
-1frontpanelpinheader
Slots
-1PCIExpressx16slot(OnlyforPCI RiserCarduse)
FormFactor
-Proprietary(33.4cmX 19.0cm)
Mounting
-8mounting holes

MS-6415Barebone
1-4
FrontView
1.Mic-in(pink), 5.HDD LED
Headphone-out(green) 6. OpticalDriveEject/Close Button
2.2xUSB2.0Ports 7. Optical Drive (optional)
3. 4-pin IEEE 1394Port 8.CardReaderDrive(optional)
4.PowerButton &PowerLED
StandardVersion:
(1)WithDVI,S-Video,RCAout,1394 on RearSide.
(2)4USB2.0portson RearSide.
(3)WithInternal SpeakerinfrontofChassis.
SystemConfiguration
2typessystemofHetis800:StandardVersion &Lite
Version.

1-5
Getting Started
RearView
1.VoltageSelector 11.Mic-in
2.PowerJack 12.PowerOn/OffSwitch
3.Ventilation Hole 13.SupportBracketSpring
4. 4xUSB2.0Ports 14.RJ-45LANJack
5.PS/2Mouse 15. 6-pinIEEE1394Port
6.PS/2Keyboard 16.Expansion Slots
7.SerialPorts 17.Line-out
8.DVIPort 18.Line-in
9. VGAPort 19.RCAout
10.S-Videoout

MS-6415Barebone
1-6
FrontView
1.Mic-in(pink), 4.HDD LED
Headphone-out(green) 5. OpticalDriveEject/Close Button
2.2xUSB2.0Ports 6. Optical Drive (optional)
3.PowerButton &PowerLED 7.CardReaderDrive(optional)
LiteVersion:
(1)WithoutDVI, S-Video,RCAout,1394onRearSide.
(2)Only2USB2.0portson RearSide.
(3)WithoutInternalSpeakerinfrontofChassis.
(4)Without1394 (4-pins)inthefrontside.

1-7
Getting Started
RearView
1.VoltageSelector 9.PowerOn/Off Switch
2.PowerJac 10.SupportBracketSpring
3.Ventilation Hole 11. RJ-45LANJack
4. 2xUSB2.0Ports 12.Expansion Slots
5.PS/2Mouse 13.VGAPort
6.PS/2Keyboard 14.Line-out
7.SerialPorts 15.Line-in
8. Mic-in

MS-6415Barebone
1-8
ChassisDesign
†Dimension: 330mm(D)x320mm(W)x94mm (H)
†Minimizedscrewstructure
†Detachablebayhousing
†Multiple ventilationholes
1.CPUFanVentilationHole 4.PowerSupplyVentilationHole
2.SystemVentilation Hole 5.SystemVentilation Hole
3.System FanVentilation Hole6.Release Button ofFrontI/ODoor

1-9
Getting Started
Topreventthesystemfromoverheating,wehaveadopted aspecially
designedCPUcoolerandmultipleventilationholesforbettercoolingeffects.
Thespeciallydesigned CPUcoolersupportsIntel®LGA775-Prescott™
and PentiumD™.Thefollwing figuresillustratehowthesystemfaneffec-
tivelyexhaustshotairthroughmultipleventilationholes.
AirFlow Direction
ThermalSolution
CPUFan:Therare2typesofCPUFan
AirIn
1. Standard (withCopper)2.Lite(withoutCopper)
AirOut AirOut

MS-6415Barebone
1-10
Power
Supply
Power
SupplyFan
Ventilation
Hole
System
Fan
Ventilation
Hole
frontpanel