Nokia NSE-3 SERIES User manual

Technical Documentation
Programs After Market Services (PAMS)
Last Update 11/97
SERVICE
MANUAL
[NMP Part No.0275341]
NSE–3 SERIES
CELLULAR
PHONES

Technical Documentation
Programs After Market Services (PAMS)
Last Update 11/97
NSE–3 SERIES DIGITAL CELLULAR PHONES
SERVICE MANUAL
OVERALL CONTENTS
NSE–3 Series Core Transceiver booklet comprising
Chapter 1: Foreword
Chapter 2: General Information
Chapter 3: System Module
Chapter 4: UI Module
Appendices to Transceiver booklet covering a specific variant
Appendix 1: Transceiver NSE–3NX
Booklets comprising
Service Software Instructions
Tuning Instructions
Service Tools
Disassembly/Troubleshooting Instructions
Handsfree Unit HFU–2
Non–serviceable Accessories
Installation Instructions CARK–64
Installation Instructions CARK–91

NSE–3 SeriesTransceivers
PAMS Technical Documentation
Original 11/97
Chapter 1
Foreword

PAMS
Technical Documentation
NSE–3
Foreword
Page 1 – 2
Original 11/97
IMPORTANT
This document is intended for use by qualified service personnel only.
Company Policy
Ourpolicyisofcontinuousdevelopment;detailsofalltechnicalmodifications
will be included with service bulletins.
While every endeavour has been made to ensure the accuracy of this
document, some errors may exist. If any errors are found by the reader,
NOKIA MOBILE PHONES Ltd should be notified in writing.
Please state:
Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)
Page(s) and/or Figure(s) in error
Please send to: Nokia Mobile Phones Ltd
PAMS Technical Documentation
PO Box 86
FIN–24101 SALO
Finland

PAMS
Technical Documentation
NSE–3
Foreword
Page 1 – 3
Original 11/97
Warnings and Cautions
Please refer to the phone’s user guide for instructions relating to
operation, care and maintenance including important safety information.
Note also the following:
Warnings:
1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES
FITTED WITH ELECTRONIC ENGINE MANAGEMENT
SYSTEMS AND ANTI–SKID BRAKING SYSTEMS. UNDER
CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN
AFFECT THEIR OPERATION. IF NECESSARY, CONSULT
THE VEHICLE DEALER/MANUFACTURER TO DETERMINE
THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO
RF ENERGY.
2. THE HANDPORTABLE TELEPHONE MUST NOT BE
OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY
EXPLOSIVE ATMOSPHERES EG PETROL STATIONS
(SERVICE STATIONS), BLASTING AREAS ETC.
3. OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT,
INCLUDING CELLULAR TELEPHONES, MAY INTERFERE
WITH THE FUNCTIONALITY OF INADEQUATELY
PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN
OR THE MANUFACTURER OF THE MEDICAL DEVICE IF
YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC
EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.
Cautions:
1. Servicing and alignment must be undertaken by qualified
personnel only.
2. Ensure all work is carried out at an anti–static workstation and
that an anti–static wrist strap is worn.
3. Ensure solder, wire, or foreign matter does not enter the
telephone as damage may result.
4. Use only approved components as specified in the parts list.
5. Ensure all components, modules screws and insulators are
correctly re–fitted after servicing and alignment. Ensure all
cables and wires are repositioned correctly.

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Technical Documentation
NSE–3
Foreword
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NSE–3 Series Transceivers
PAMS Technical Documentation
Original 11/97
Chapter 3
System Module

PAMS
Technical Documentation
NSE–3
System Module
Original 11/97
Page 3 – 2
CONTENTS
Transceiver NSE–3 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interconnection Diagram 3 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Module 3 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External and Internal Connectors 3 – 7. . . . . . . . . . . . . . . . . . . . .
System Connector Contacts 3 – 8. . . . . . . . . . . . . . . . . . . . . . .
RF Connector Contacts 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Voltages and Power Consumtion 3 – 9. . . . . . . . . . . .
Functional Description 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband Module 3 – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram 3 – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Summary 3 – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bottom Connector External Contacts 3 – 12. . . . . . . . . . . . . . .
Bottom Connector Signals 3 – 12. . . . . . . . . . . . . . . . . . . . . . . .
Battery Connector 3 – 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM Card Connector 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Microphone 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Infrared Module Connections 3 – 15. . . . . . . . . . . . . . . . . . . . . .
RTC Backup Battery 3 – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Buzzer 3 – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 3 – 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution 3 – 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery charging 3 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Startup Charging 3 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery Overvoltage Protection 3 – 19. . . . . . . . . . . . . . . . . . . .
Battery Removal During Charging 3 – 20. . . . . . . . . . . . . . . . . .
Different PWM Frequencies ( 1Hz and 32 Hz) 3 – 21. . . . . . .
Battery Identification 3 – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery Temperature 3 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage Regulators 3 – 23. . . . . . . . . . . . . . . . . . . . . . . .
Switched Mode Supply VSIM 3 – 25. . . . . . . . . . . . . . . . . . . . . .
Power Up 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power up with a charger 3 – 26. . . . . . . . . . . . . . . . . . . . . . . . . .
Power Up With The Power Switch (PWRONX) 3 – 26. . . . . . .
Power Up by RTC 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Up by IBI 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acting Dead 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Active Mode 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sleep Mode 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charging 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Off 3 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog 3 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Audio control 3 – 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Audio Connections 3 – 30. . . . . . . . . . . . . . . . . . . . . . .
Analog Audio Accessory Detection 3 – 31. . . . . . . . . . . . . . . . .
Headset Detection 3 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Audio Connections 3 – 32. . . . . . . . . . . . . . . . . . . . . . . .
4–wire PCM Serial Interface 3 – 32. . . . . . . . . . . . . . . . . . . . . . .
Alert Signal Generation 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Control 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MAD2 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memories 3 – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Program Memory 3 – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SRAM Memory 3 – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EEPROM Memory 3 – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MCU Memory Map 3 – 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Programming 3 – 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COBBA–GJ 3 – 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Infrared Transceiver Module 3 – 45. . . . . . . . . . . . . . . . . . . . . . .
Real Time Clock 3 – 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RTC backup battery charging 3 – 46. . . . . . . . . . . . . . . . . . . . . .
Vibra Alerting Device 3 – 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IBI Accessories 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phone Power–on by IBI 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . .
IBI power–on by phone 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Module 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Ratings 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Frequency Plan 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution Diagram 3 – 49. . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Regulators 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control Signals 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Frequency synthesizers 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver 3 – 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter 3 – 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AGC strategy 3 – 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AFC function 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver blocks 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RX interstage filter 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1st mixer in CRFU_1a 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1st IF–filter 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Technical Documentation
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System Module
Original 11/97
Page 3 – 4
Transmitter Blocks 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TX interstage filter 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power amplifier MMIC 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synthesizer blocks 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VHF VCO and low pass filter 3 – 57. . . . . . . . . . . . . . . . . . . . . . . .
UHF PLL 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UHF PLL block in PLUSSA 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . .
UHF VCO module 3 – 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UHF local signal input in CRFU_1a 3 – 58. . . . . . . . . . . . . . . . . . .
Connections 3 – 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF connector and antenna switch 3 – 58. . . . . . . . . . . . . . . . . . . .
Timings 3 – 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synthesizer control timing 3 – 61. . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter power switching timing diagram 3 – 63. . . . . . . . . . .
Synthesizer clocking 3 – 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram of Baseband Blocks 3 – 64. . . . . . . . . . . . . . . . . . .
Parts list of UP8T (EDMS Issue 11.10) 3 – 65
Schematic Diagrams:
Block Diagram of System/RF Blocks 3/A3–1. . . . . . . . . . . . . . . . . . . . . .
Circuit Diagram of Baseband (Version 12 Edit 8) 3/A3–2. . . . . . . . . .
Circuit Diagram of Power Supply (Version 14 Edit 41) 3/A3–3. . . . . .
Circuit Diagram of SIM Connectors (Version 14 Edit 9) 3/A3–4. . . . . .
Circuit Diagram of CPU Block (Version 14 Edit 23) 3/A3–5. . . . . . . . .
Circuit Diagram of Audio (Version 14 Edit 27) 3/A3–6. . . . . . . . . . . . .
Circuit Diagram of IR Module (Version 14 Edit 21) 3/A3–7. . . . . . . . . .
Circuit Diagram of RF Block (Version 14 Edit 26) 3/A3–8. . . . . . . . . . .
Layout Diagram of UPT8T (Version 14) 3/A3–9. . . . . . . . . . . . . . . . . . .

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Technical Documentation
NSE–3
System Module
Page 3 – 5
Original 11/97
Transceiver NSE–3
Introduction
The NSE–3 is a radio transceiver unit designed for the GSM network. It is a
GSM phase 2 power class 4 transceiver providing 15 power levels with a
maximum output power of 2 W. The transceiver is a true 3 V transceiver.
The transceiver consists of System/RF module (UP8T), User interface
module (UE4) and assembly parts.
The transceiver has full graphic display and two soft key based user inter-
face.
The antenna is a fixed helix. External antenna connection is provided by
rear RF connector
Functional Description
There are five different operation modes:
– power off mode
– idle mode
– active mode
– charge mode
– local mode
In the power off mode only the circuits needed for power up are supplied.
In the idle mode circuits are powered down and only sleep clock is run-
ning.
In the active mode all the circuits are supplied with power although some
parts might be in the idle state part of the time.
The charge mode is effective in parallel with all previous modes. The
charge mode itself consists of two different states, i.e. the charge and the
maintenance mode.
The local mode is used for alignment and testing.

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System Module
Original 11/97
Page 3 – 6
Interconnection Diagram
Module
User Interface
UE4
Module
System/RF
UP8
Keypad Display
SIM Battery
System
RF
Connector
Connector
Charger
Antenna
2
3 + 36
Earpiece
IR Link
2
1
6
10 9
2
4
28
2
Mic

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Technical Documentation
NSE–3
System Module
Page 3 – 7
Original 11/97
System Module
External and Internal Connectors
Rubber boot
Microphone
Solderable element,
2 pcs
Cable/Cradle connector,
guiding/fixing hole, 3 pcs
Contact 1
DC–jack
Contact 2
Contact 9
Contacts
3...8
Microphone port

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System Module
Original 11/97
Page 3 – 8
System Connector Contacts
Con-
tact Line Sym-
bol
Parameter Mini-
mum Typical / Nomi-
nal
Maxi-
mum Unit / Notes
1 VIN Charger input volt-
age
Charger input cur-
rent
7.1
720
7.24
320
8.4
800
7.6
370
9.3
850
16.0
420
V/ Unloaded ACP–9 Charger
mA/ Supply current
V/ Unloaded ACP–7 Charger
mA/ Supply current
DC–
JACK L_GND Charger ground input 000V/ Supply ground
DC–
JACK VIN Charger input volt- age
Charger input cur-
rent
7.1
720
7.24
320
8.4
800
7.6
370
9.3
850
16.0
420
V/ Unloaded ACP–9 Charger
mA/ Supply current
V/ Unloaded ACP–7 Charger
mA/ Supply current
DC–
JACK CHRG CTRL Output high volt- age
PWM frequency
output low voltage
2.0
0
32 2.8
0.5
V/ Charger control (PWM)
high
Hz /PWM frequency for
charger
V
2 CHRG
CTRL Output high volt- age
PWM frequency
2.0 32 2.8 V/ Charger control (PWM)
high
Hz /PWM frequency for
charger
Mic
ports Acoustic signal N/A N/A N/A Microphone sound ports
3 XMIC Input signal volt-
age 60 1 Vpp mVrms
4 SGND Signal ground 0 0 mVrms
5 XEAR Output signal volt-
age 80 1 Vpp mVrms
6 MBUS I/O low voltage
I/O high voltage 0 2.0 0.8 2.8 Serial bidirectional control
bus.
Baud rate 9600 Bit/s
7 FBUS_
RX Input low voltage
Input high voltage 0 2.0 0.8 2.8 V/ Fbus receive. V/ Serial Data, Baud rate
9.6k–230.4kBit/s
8 FBUS_
TX Output low voltage
Output high volt-
age
0
2.0 0.8 2.8 V/ Fbus transmit. V/ Serial Data, Baud rate
9.6k–230.4kBit/s
9 L_GND Charger ground
input 000V/ Supply ground

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RF Connector Contacts
Con-
tact Line Symbol Parameter Mini- mum Typical / Nomi-
nal
Maxi-
mum Unit / Notes
1 EXT_ANT pExternal antenna connec-
2 GND Im edance 50ohm tor,
0 V DC
Supply Voltages and Power Consumtion
Connector Line Symbol Minimum Typical /
Nominal Maximum/ Peak Unit / Notes
Charging VIN 7.1 8.4 9.3 V/ Travel charger,
ACP–9
Charging VIN 7.25 7.6 16.0 V/ Travel charger.
ACP–7
Charging I / VIN 720 800 850 mA/ Travel char-
ger, ACP–9
Charging I / VIN 320 370 420 mA/ Travel char-
ger, ACP–7
Functional Description
The transceiver electronics consist of the Radio Module ie. RF + System
blocks, the UI PCB, the display module and audio components. The key-
pad and the display module are connected to the Radio Module with a
connectors. System blocks and RF blocks are interconnected with PCB
wiring. The Transceiver is connected to accessories via a bottom system
connector with charging and accessory control.
The System blocks provide the MCU, DSP and Logic control functions in
MAD ASIC, external memories, audio processing and RF control hard-
ware in COBBA ASIC. Power supply circuitry CCONT ASIC delivers oper-
ating voltages both for the System and the RF blocks.
The RF block is designed for a handportable phone which operates in the
GSM system. The purpose of the RF block is to receive and demodulate
the radio frequency signal from the base station and to transmit a modu-
lated RF signal to the base station. The PLUSSA ASIC is used for VHF
and PLL functions. The CRFU ASIC is used at the front end.

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Technical Documentation
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System Module
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Baseband Module
Block Diagram
CCONT
UI
SIM
MAD
SYSCON
CHAPS
COBBA
BATTERY
PA SUPPLY
RF SUPPLIES
BB SUPPLY
TX/RX SIGNALS
BASEBAND
VBAT
+
MEMORIES
COBBA SUPPLY
AUDIOLINES
IR
32kHz
CLK
13MHz
CLK
SLEEP CLOCK
SYSTEM CLOCK
Technical Summary
The baseband module consists of four asics, CHAPS, CCONT, COBBA–
GJ and MAD2, which take care of the baseband functions of NSE–3.
The baseband is running from a 2.8V power rail, which is supplied by a
power controlling asic. In the CCONT asic there are 6 individually con-
trolled regulator outputs for RF–section and two outputs for the base-
band. In addition there is one +5V power supply output (V5V) for flash
programming voltage and other purposes where a higher voltage is need-
ed. The CCONT contains also a SIM interface, which supports both 3V
and 5V SIM–cards. A real time clock function is integrated into the
CCONT, which utilizes the same 32kHz clock supply as the sleep clock. A
backup power supply is provided for the RTC, which keeps the real time
clock running when the main battery is removed. The backup power sup-
ply is a rechargable polyacene battery. The backup time with this battery
is minimum of ten minutes.

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The interface between the baseband and the RF section is handled by a
specific asic. The COBBA asic provides A/D and D/A conversion of the
in–phase and quadrature receive and transmit signal paths and also A/D
and D/A conversions of received and transmitted audio signals to and
from the UI section. The COBBA supplies the analog TXC and AFC sig-
nals to rf section according to the MAD DSP digital control and converts
analog AGC into digital signal for the DSP. Data transmission between the
COBBA and the MAD is implemented using a parallel connection for high
speed signalling and a serial connection for PCM coded audio signals.
Digital speech processing is handled by the MAD asic. The COBBA asic
is a dual voltage circuit, the digital parts are running from the baseband
supply VBB and the analog parts are running from the analog supply
VCOBBA.
The baseband supports three external microphone inputs and two exter-
nal earphone outputs. The inputs can be taken from an internal micro-
phone, a headset microphone or from an external microphone signal
source. The microphone signals from different sources are connected to
separate inputs at the COBBA asic.
The output for the internal earphone is a dual ended type output capable
of driving a dynamic type speaker. Input and output signal source selec-
tion and gain control is performed inside the COBBA asic according to
control messages from the MAD. Keypad tones, DTMF, and other audio
tones are generated and encoded by the MAD and transmitted to the
COBBA for decoding. A buzzer and an external vibra alert control signals
are generated by the MAD with separate PWM outputs.
EMC shieding is implemented using a metallized plastic B–cover with a
conductive rubber seal on the ribs. On the other side the engine is
shielded with a frame having a conductive rubber on the inner walls,
which makes a contact to a ground ring of the engine board and a
ground plane of the UI–board. Heat generated by the circuitry will be con-
ducted out via the PCB ground planes.

PAMS
Technical Documentation
NSE–3
System Module
Original 11/97
Page 3 – 12
Bottom Connector External Contacts
Contact Line Symbol Function
1 VIN Charger input voltage
DC–jack
side contact
(DC–plug ring)
L_GND Charger ground
DC–jack
center pin VIN Charger input voltage
DC–jack
side contact
(DC–plug jacket)
CHRG_CTRL Charger control output (from phone)
2 CHRG_CTRL Charger control output (from phone)
Microphone
acoustic ports Acoustic signal (to phone)
3 XMIC Accessory microphone signal input (to phone)
4 SGND Accessory signal ground
5 XEAR Accessory earphone signal output (from phone)
6 MBUS MBUS, bidirectional serial data i/o
7 FBUS_RX FBUS, unidirectional serial data input (to phone)
8 FBUS_TX FBUS, unidirectional serial data output (from phone)
9 L_GND Charger ground
Bottom Connector Signals
Pin Name Min Typ Max Unit Notes
1,3 VIN 7.25
3.25
320
7.6
3.6
370
7.95
16.9
3.95
420
V
V
V
mA
Unloaded ACP–7 Charger (5kohms
load)
Peak output voltage (5kohms load)
Loaded output voltage (10ohms load)
Supply current
7.1
3.25
720
8.4
3.6
800
9.3
3.95
850
V
V
mA
Unloaded ACP–9 Charger
Loaded output voltage (10ohms load)
Supply current
2 L_GND 0 0 V Supply ground
4,5 CHRG_ 0 0.5 V Charger control PWM low
CTRL 2.0 2.85 V Charger control PWM high
32 Hz PWM frequency for a fast charger
1 99 % PWM duty cycle
6 MICP N/A see section Internal microphone
7 MICN N/A see section Internal microphone

PAMS
Technical Documentation
NSE–3
System Module
Page 3 – 13
Original 11/97
NotesUnitMaxTypMinNamePin
8 XMIC 2.0 2.2 kΩInput AC impedance
1 Vpp Maximum signal level
1.47 1.55 V Mute (output DC level)
2.5 2.85 V Unmute (output DC level)
100 600 µABias current
58 490 mV Maximum signal level
HMIC 0 3.2 29.3 mV Microphone signal
Connected to COBBA MIC3P input
9 SGND 47 ΩOutput AC impedance (ref. GND)
10 µFSeries output capacitance
380 ΩResistance to phone ground
10 XEAR 47 ΩOutput AC impedance (ref. GND)
10 µFSeries output capacitance
16 300 ΩLoad AC impedance to SGND (Head-
set)
4.7 10 kΩLoad AC impedance to SGND (Acces-
sory)
1.0 Vpp Maximum output level (no load)
22 626 mV Output signal level
10 kΩLoad DC resistance to SGND (Acces-
sory)
16 1500 ΩLoad DC resistance to SGND (Head-
set)
2.8 V DC voltage (47k pull–up to VBB)
HEAR 28 626 mV Earphone signal (HF– HFCM)
Connected to COBBA HF output
11 MBUS 0 logic low 0.8 V Serial bidirectional control bus.
2.0 logic high 2.85 Baud rate 9600 Bit/s
Phone has a 4k7 pullup resistor
12 FBUS_RX 0 logic low 0.8 V Fbus receive. Serial Data
2.0 logic high 2.85 Baud rate 9.6k–230.4kBit/s
Phone has a 220k pulldown resistor
13 FBUS_TX 0 logic low 0.5 V Fbus transmit. Serial Data
2.0 logic high 2.85 Baud rate 9.6k–230.4kBit/s
Phone has a 47k pullup resistor
14 GND 0 0.3 V Supply ground

PAMS
Technical Documentation
NSE–3
System Module
Original 11/97
Page 3 – 14
Battery Connector
Pin Name Min Typ Max Unit Notes
1 BVOLT 3.0 3.6 4.5 V Battery voltage
5.0
5.3 Maximum voltage in call state with charger Maximum voltage in idle state with charger
2 BSI 0 2.85 V Battery size indication
Phone has 100kohm pull up resistor.
SIM Card removal detection
(Treshold is 2.4V@VBB=2.8V)
2.2 18 kohm Battery indication resistor (Ni battery)
20 22 24 kohm Battery indication resistor (service battery)
27 51 kohm Battery indication resistor (4.1V Lithium
battery)
68 91 kohm Battery indication resistor (4.2V Lithium bat-
tery)
3 BTEMP 0 1.4 V Battery temperature indication
Phone has a 100k (+–5%) pullup resistor,
Battery package has a NTC pulldown resis-
tor:
47k+–5%@+25C , B=4050+–3%
2.1
510 3 20 V ms Phone power up by battery (input) Power up pulse width
1.9
90 100 2.85 200 V ms Battery power up by phone (output) Power up pulse width
0 1 kohm Local mode initialization (in production)
20 22 25 kHz PWM control to VIBRA BATTERY
4 BGND 0 0 V Battery ground