NXP Semiconductors LEC-IMX8MM User manual

LEC-IMX8MM
03/04/2022

LEC-iMX8M Mini User’s Guide 0.6 SGET SMARC Rev 2.1
Page 2 copyright © 2022 ADLINK Technology Inc.
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products,
ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products
including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright
or other intellectual property right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory
compliance, including, without limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any.
ADLINK may make changes to specifications and product descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks of their respective
companies.
© Copyright 2017 ADLINK Technology, Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

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Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment
before handling/operating the equipment.
•Read these safety instructions carefully.
•Keep this manual for future reference.
•Read the specifications section of this manual for detailed information on the operating environment of this equipment.
•Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
•To avoid electrical shock and/or damage to equipment:
•Keep equipment away from water or liquid sources;
•Keep equipment away from high heat or high humidity;
•Keep equipment properly ventilated (do not block or cover ventilation openings);
•Make sure to use recommended voltage and power source settings;
•Always install and operate equipment near an easily accessible electrical socket outlet;
•Secure the power cord (do not place any object on/over the power cord);
•Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
•If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.
Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.
Revision History

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Revision
Description
Date (dd/mm/yyyy)
Author
0.6
Preliminary engineering version updated
05/04/2022
HP

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Table of Contents
Introduction........................................................................................................................................................................................................................................................................................................................ 8
1.1 The SMARC Formfactor .........................................................................................................................................................................................................................................................................................................................8
2. Specifications............................................................................................................................................................................................................................................................................................................... 9
2.1 Core System................................................................................................................................................................................................................................................................................................................................................9
2.2 Video........................................................................................................................................................................................................................................................................................................................................................... 10
2.3 Audio .......................................................................................................................................................................................................................................................................................................................................................... 10
2.4 Dual Ethernet........................................................................................................................................................................................................................................................................................................................................... 11
2.5 1216 M.2 LGA WIFI (optional).......................................................................................................................................................................................................................................................................................................... 11
2.6 Extension busses.................................................................................................................................................................................................................................................................................................................................... 11
2.7 System Storage ...................................................................................................................................................................................................................................................................................................................................... 13
2.8 Boot Modes ............................................................................................................................................................................................................................................................................................................................................. 13
2.9 Power.......................................................................................................................................................................................................................................................................................................................................................... 14
2.10 Mechanical and Environmental ....................................................................................................................................................................................................................................................................................................... 14
3. Block Diagram ...........................................................................................................................................................................................................................................................................................................15
4. Pinout and Signal Descriptions ..........................................................................................................................................................................................................................................................................16
4.1 Pin Summary ........................................................................................................................................................................................................................................................................................................................................... 16
4.2 Signal Terminology Descriptions.................................................................................................................................................................................................................................................................................................... 20
4.3 Signal Description by function......................................................................................................................................................................................................................................................................................................... 21
4.3.1 The First Display Interface ..................................................................................................................................................................................................................................................................................................... 21
4.3.2 MIPI Camera support (CSI1-4Lane) ................................................................................................................................................................................................................................................................................ 25
4.3.3 I2S (audio).................................................................................................................................................................................................................................................................................................................................... 26
4.3.4 USB ports...................................................................................................................................................................................................................................................................................................................................... 27
4.3.5 PCIe Ports..................................................................................................................................................................................................................................................................................................................................... 29
4.3.6 LAN ports ..................................................................................................................................................................................................................................................................................................................................... 30
4.3.7 SDIO................................................................................................................................................................................................................................................................................................................................................ 32
4.3.8 SPI & ESPI..................................................................................................................................................................................................................................................................................................................................... 33
4.3.9 SPI0 ................................................................................................................................................................................................................................................................................................................................................. 33
4.3.10 ESPI ................................................................................................................................................................................................................................................................................................................................................. 34
4.4 General Purpose I2C............................................................................................................................................................................................................................................................................................................................. 35
4.4.1 GPIO................................................................................................................................................................................................................................................................................................................................................ 36
4.4.2 UART............................................................................................................................................................................................................................................................................................................................................... 37
4.4.3 CAN bus........................................................................................................................................................................................................................................................................................................................................ 38
4.4.4 Miscellaneous............................................................................................................................................................................................................................................................................................................................. 38
4.4.5 Power and System Management ....................................................................................................................................................................................................................................................................................... 39

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4.4.6 Boot Select................................................................................................................................................................................................................................................................................................................................... 41
4.4.7 Power ............................................................................................................................................................................................................................................................................................................................................. 42
4.5 SMARC pin to controller mapping................................................................................................................................................................................................................................................................................................. 43
5. Software Support .....................................................................................................................................................................................................................................................................................................54
5.1.1 Uboot / Yocto............................................................................................................................................................................................................................................................................................................................. 54
5.1.2 Ubuntu (TBD)............................................................................................................................................................................................................................................................................................................................. 54
6. Mechanical..................................................................................................................................................................................................................................................................................................................55
7. Thermal Solutions....................................................................................................................................................................................................................................................................................................56

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List of Figures
Figure 1 –Module function diagram......................................................................................................................................................................................................................................................................15
Figure 2 –Module top/botom side pin numbering .........................................................................................................................................................................................................................................17

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Introduction
1.1 The SMARC Formfactor
The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer on Module definition targeting applications that require low
power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as
tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as
well. The Module power envelope is typically under 6W.
Two Module sizes are defined: 82 mm x 50 mm and 82 mm x 80 mm.
The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified
as a 321 pin connector, but 7 pins are lost to the key).
The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot
flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are
used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular
approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.
SMARC module and carrier specifications are available online at: https://www.sget.org/standards/smarc.html

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2. Specifications
2.1 Core System
SoC
NXP iMX 8M Series
•i.MX8M-Mini Quad 4 x Cortex-A53 at 1.6 - 1.8GHz, 1 x Cortex-M4F, GPU, VPU Decode/Encode
•i.MX8M-Mini QuadLite: 4 x Cortex-A53 at 1.6 - 1.8GHz, 1 x Cortex-M4F
available either as industrial (-40°C to +85°C) or commercial (0°C to +70°C) type"
L2 Cache
32 KB I-cache 32 KB D-cache (A53) 512 KB L2 Cache (ECC)
Memory
1 / 2 / 4GB LPDDR4 memory down
security
TPM 2.0 Device, ST Microelectronics ST33HTPH2X32AHD5 (optional)
•compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform
Specifications 1.03
•Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
•SP800-193 compliant for protection, detection and recovery requirements

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2.2 Video
LEC-iMX8M mini standard display support is consisting of single/dual channel 24-bit LVDS and a 4-lane DSI.
GPU Core:
Vivante GCNanoUltra
GPU/VPU Feature Support
•1080p60 VP9 Profile 0, 2 (10-bit)
•1080p60 HEVC/H.265 Decoder
•1080p60 AVC/H.264 Baseline, Main, High decoder
•1080p60 VP8 • 1080p60 AVC/H.264 Encoder
•1080p60 VP8 • TrustZone support
LVDS SN65DSI84ZXHR (optional)
LVDS single/dual channel 24-bit at max. 1920 ×1080 at 60 Hz over DSI to LVDS bridge
MIPI DSI
DSI 4 lanes at max. 1080p@60fps display output (multiplexed with LVDS signal)
Camera support
- Compatible with the MIPI Alliance Interface specification v2.1
- One MIPI-CSI2 camera input 4-lane
2.3 Audio
Supports I2S audio codec interface, audio ADC and DAC (located on carrier)

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2.4 Dual Ethernet
Primary LAN
Gigabit Ethernet controller with Energy Efficient Ethernet (EEE), Ethernet AVB, and IEEE 1588
Supports 10/100/1000-Mbps data transfer rates, both full-duplex and half-duplex "
Secondary LAN RTL9119i-CG (optional)
PCIe Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE), and IEEE 1588
Supports 10/100/1000-Mbps data transfer rates, both full-duplex and half-duplex
2.5 1216 M.2 LGA WIFI (optional)
LEC-IMX8MM can be equipped with an optional WIFI LGA module.
In case of non-populated part, the footprint is still there and visible
Only the Azurewave AW-CM276NF has been validated during DVT but other M.2 LGA modules could be compatible as well if they use the same
standard interfaces, following are the used interface
-SDIO0 (main WIFI interface)
-UART1 (main Bluetooth interface)
-PCM ( Bluetooth audio transfer interface )
AW-CM276F has been pre-certified by Azurewave for several countries and regions, Adlink can assist in final device certification if applicable
FCC ID: UAY-W8997-M1216
2.6 Extension busses
PCIe
One PCI Express GEN2 x1 interfaces

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USB
2x USB 2.0, (USB0, USB1) Optional a 4 port USB hub is available which brings out a total of 5 USB busses
UART
Four UART interface SER0, SER2 (Tx/Rx/CTS/RTS) and SER1, SER3(optional) (Tx/Rx)
7- or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd, or none)
Programmable baud rates up to 4 Mbps.
CAN bus (optional)
Supporting single CAN2.0B only or mixed CAN2.0B and CAN FB mode, data bit rate up to 8 Mbps via SPI to CAN adapter
SPI
2x SPI
I2S
1x I2S interface< CODEC located on the carrier
I2C
2x I2C interfaces
- Support for 7-bit and 10-bit address mode
- Software programmable clock frequency of 100 kbit/s in Standard-mode,
400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus
GPIO
13x GPIO with interrupt

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2.7 System Storage
SDIO
1x SDIO (4-bit) compatible up to version 3.0.
eMMC
Soldered on module 16 ~ 128GB (build option) either standard or -40+85C temp range
Compatible with eMMC specification 4.41, 4.51 and 5.0
2.8 Boot Modes
eMMC and SD-Card boot modes are supported

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2.9 Power
Supply Voltage
4.75 V –5.25 V
2.10 Mechanical and Environmental
Form Factor
SGET SMARC Specifications v2.1
Dimension
SMARC small size module, 82mm x 50mm
Operating Temperature
Standard: 0°C to +60°C
Rugged: -40°C to +85°C (optional)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I,
Condition A and Method 214A, Table 214-I, Condition D

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3. Block Diagram
Figure 1 –Module function diagram

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4. Pinout and Signal Descriptions
4.1 Pin Summary
The below table is a comprehensible list of all signal pins on the MXM 3 connector in the standard specification SMARC 2.1.
TOP Side
P1 P74 P75
Key
P156
BOTTOM Side
S156 S76 S75
Key
S1

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Figure 2 –Module top/botom side pin numbering
P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
S1
CSI1_TX+ / I2C_CAM1_CK
P1
SMB_ALERT_1V8#
S2
CSI1_TX- / I2C_CAM1_DAT
P2
GND
S3
GND
P3
CSI1_CK+
S4
RSVD
P4
CSI1_CK-
S5
CSI0_TX- / I2C_CAM0_CK
P5
GBE1_SDP
S6
CAM_MCK
P6
GBE0_SDP
S7
CSI0_TX+ / I2C_CAM0_DAT
P7
CSI1_RX0+
S8
CSI0_CK+
P8
CSI1_RX0-
S9
CSI0_CK-
P9
GND
S10
GND
P10
CSI1_RX1+
S11
CSI0_RX0+
P11
CSI1_RX1-
S12
CSI0_RX0-
P12
GND
S13
GND
P13
CSI1_RX2+
S14
CSI0_RX1+
P14
CSI1_RX2-
S15
CSI0_RX1-
P15
GND
S16
GND
P16
CSI1_RX3+
S17
GBE1_MDI0+
P17
CSI1_RX3-
S18
GBE1_MDI0-
P18
GND
S19
GBE1_LINK100#
P19
GBE0_MDI3-
S20
GBE1_MDI1+
P20
GBE0_MDI3+
S21
GBE1_MDI1-
P21
GBE0_LINK100#
S22
GBE1_LINK1000#
P22
GBE0_LINK1000#
S23
GBE1_MDI2+
P23
GBE0_MDI2-
S24
GBE1_MDI2-
P24
GBE0_MDI2+
S25
GND
P25
GBE0_LINK_ACT#
S26
GBE1_MDI3+
P26
GBE0_MDI1-
S27
GBE1_MDI3-
P27
GBE0_MDI1+
S28
GBE1_CTREF
P28
GBE0_CTREF
S29
PCIE_D_TX+ / SERDES_1_TX+
P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P29
GBE0_MDI0-
S30
PCIE_D_TX- / SERDES_1_TX-
P30
GBE0_MDI0+
S31
GBE1_LINK_ACT#
P31
SPI0_CS1
S32
PCIE_D_RX+ / SERDES_1_RX+
P32
GND
S33
PCIE_D_RX- / SERDES_1_RX-
P33
SDIO_WP
S34
GND
P34
SDIO_CMD
S35
USB4+
P35
SDIO_CD#
S36
USB4-
P36
SDIO_CK
S37
USB3_VBUS_DET
P37
SDIO_PWR_EN
S38
AUDIO_MCK
P38
GND
S39
I2S0_LRCK
P39
SDIO_D0
S40
I2S0_SDOUT
P40
SDIO_D1
S41
I2S0_SDIN
P41
SDIO_D2
S42
I2S0_CK
P42
SDIO_D3
S43
ESPI_ALERT0#
P43
SPI0_CS0#
S44
ESPI_ALERT1#
P44
SPI0_CK
S45
MDIO_CLK
P45
SPI0_DIN
S46
MDIO_DAT
P46
SPI0_DO
S47
GND
P47
GND
S48
I2C_GP_CK
P48
SATA_TX+
S49
I2C_GP_DAT
P49
SATA_TX-
S50
HDA_SYNC / I2S2_LRCK
P50
GND
S51
HDA_SDO / I2S2_SDOUT
P51
SATA_RX+
S52
HDA_SDI / I2S2_SDIN
P52
SATA_RX-
S53
HDA_CK / I2S2_CK
P53
GND
S54
SATA_ACT#
P54
ESPI_CS0# / SPI1_CS0#
S55
USB5_EN_OC
P55
ESPI_CS1# / SPI1_CS1#
S56
ESPI_IO_2
P56
ESPI_CK / SPI1_CK
S57
ESPI_IO_3
P57
ESPI_IO_1 / SPI1_DIN
S58
ESPI_RESET#

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P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P58
ESPI_IO_0 / SPI1_DO
S59
USB5+
P59
GND
S60
USB5-
P60
USB0+
S61
GND
P61
USB0-
S62
USB3_SSTX+
P62
USB0_EN_OC#
S63
USB3_SSTX-
P63
USB0_VBUS_DET
S64
GND
P64
USB0_OTG_ID
S65
USB3_SSRX+
P65
USB1+
S66
USB3_SSRX-
P66
USB1-
S67
GND
P67
USB1_EN_OC#
S68
USB3+
P68
GND
S69
USB3-
P69
USB2+
S70
GND
P70
USB2-
S71
USB2_SSTX+
P71
USB2_EN_OC#
S72
USB2_SSTX-
P72
RSVD
S73
GND
P73
RSVD
S74
USB2_SSRX+
P74
USB3_EN_OC#
S75
USB2_SSRX-
Key
Key
P75
PCIE_A_RST#
S76
PCIE_B_RST#
P76
USB4_EN_OC#
S77
PCIE_C_RST#
P77
PCIE_B_CKREQ#
S78
PCIE_C_RX+ / SERDES_2_RX+
P78
PCIE_A_CKREQ#
S79
PCIE_C_RX- / SERDES_2_RX-
P79
GND
S80
GND
P80
PCIE_C_REFCK+
S81
PCIE_C_TX+ / SERDES_2_TX+
P81
PCIE_C_REFCK-
S82
PCIE_C_TX- / SERDES_2_TX-
P82
GND
S83
GND
P83
PCIE_A_REFCK+
S84
PCIE_B_REFCK+
P84
PCIE_A_REFCK-
S85
PCIE_B_REFCK-
P85
GND
S86
GND
P86
PCIE_A_RX+
S87
PCIE_B_RX+
P87
PCIE_A_RX-
S88
PCIE_B_RX-
P88
GND
S89
GND
P89
PCIE_A_TX+
S90
PCIE_B_TX+
P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P90
PCIE_A_TX-
S91
PCIE_B_TX-
P91
GND
S92
GND
P92
HDMI_D2+ / DP1_LANE0+
S93
DP0_LANE0+
P93
HDMI_D2- / DP1_LANE0-
S94
DP0_LANE0-
P94
GND
S95
DP0_AUX_SEL
P95
HDMI_D1+ / DP1_LANE1+
S96
DP0_LANE1+
P96
HDMI_D1- / DP1_LANE1-
S97
DP0_LANE1-
P97
GND
S98
DP0_HPD
P98
HDMI_D0+ / DP1_LANE2+
S99
DP0_LANE2+
P99
HDMI_D0- / DP1_LANE2-
S100
DP0_LANE2-
P100
GND
S101
GND
P101
HDMI_CK+ / DP1_LANE3+
S102
DP0_LANE3+
P102
HDMI_CK- / DP1_LANE3-
S103
DP0_LANE3-
P103
GND
S104
USB3_OTG_ID
P104
HDMI_HPD / DP1_HPD
S105
DP0_AUX+
P105
HDMI_CTRL_CK / DP1_AUX+
S106
DP0_AUX-
P106
HDMI_CTRL_DAT / DP1_AUX-
S107
LCD1_BKLT_EN
P107
DP1_AUX_SEL
S108
LVDS1_CK+/eDP1_AUX+/ DSI1_CLK+
P108
GPIO0 / CAM0_PWR#
S109
LVDS1_CK- / eDP1_AUX- / DSI1_CLK-
P109
GPIO1 / CAM1_PWR#
S110
GND
P110
GPIO2 / CAM0_RST#
S111
LVDS1_0+ / eDP1_TX0+ / DSI1_D0+
P111
GPIO3 / CAM1_RST#
S112
LVDS1_0- / eDP1_TX0- / DSI1_D0-
P112
GPIO4 / HDA_RST#
S113
eDP1_HPD / DSI1_TE
P113
GPIO5 / PWM_OUT
S114
LVDS1_1+ / eDP1_TX1+ / DSI1_D1+
P114
GPIO6 / TACHIN
S115
LVDS1_1- / eDP1_TX1- / DSI1_D1-
P115
GPIO7
S116
LCD1_VDD_EN
P116
GPIO8
S117
LVDS1_2+ / eDP1_TX2+ / DSI1_D2+
P117
GPIO9
S118
LVDS1_2- / eDP1_TX2- / DSI1_D2-
P118
GPIO10
S119
GND
P119
GPIO11
S120
LVDS1_3+ / eDP1_TX3+ / DSI1_D3+
P120
GND
S121
LVDS1_3- / eDP1_TX3- / DSI1_D3-
P121
I2C_PM_CK
S122
LCD1_BKLT_PWM
P122
I2C_PM_DAT
S123
GPIO13
P123
BOOT_SEL0#
S124
GND
P124
BOOT_SEL1#
S125
LVDS0_0+ / eDP0_TX0+ / DSI0_D0+

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P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P125
BOOT_SEL2#
S126
LVDS0_0- / eDP0_TX0- / DSI0_D0-
P126
RESET_OUT#
S127
LCD0_BKLT_EN
P127
RESET_IN#
S128
LVDS0_1+ / eDP0_TX1+ / DSI0_D1+
P128
POWER_BTN#
S129
LVDS0_1- / eDP0_TX1- / DSI0_D1-
P129
SER0_TX
S130
GND
P130
SER0_RX
S131
LVDS0_2+/eDP0_TX2+/ DSI0_D2+
P131
SER0_RTS#
S132
LVDS0_2- / eDP0_TX2- / DSI0_D2-
P132
SER0_CTS#
S133
LCD0_VDD_EN
P133
GND
S134
LVDS0_CK+/eDP0_AUX/ DSI0_CLK+
P134
SER1_TX
S135
LVDS0_CK-/eDP0_AUX- / DSI0_CLK-
P135
SER1_RX
S136
GND
P136
SER2_TX
S137
LVDS0_3+ / eDP0_TX3+ / DSI0_D3+
P137
SER2_RX
S138
LVDS0_3- / eDP0_TX3- / DSI0_D3-
P138
SER2_RTS#
S139
I2C_LCD_CK
P139
SER2_CTS#
S140
I2C_LCD_DAT
P140
SER3_TX
S141
LCD0_BKLT_PWM
P141
SER3_RX
S142
GPIO12
P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P142
GND
S143
GND
P143
CAN0_TX
S144
eDP0_HPD / DSI0_TE
P144
CAN0_RX
S145
WDT_TIME_OUT#
P145
CAN1_TX
S146
PCIE_WAKE#
P146
CAN1_RX
S147
VDD_RTC
P147
VDD_IN
S148
LID#
P148
VDD_IN
S149
SLEEP#
P149
VDD_IN
S150
VIN_PWR_BAD#
P150
VDD_IN
S151
CHARGING#
P151
VDD_IN
S152
CHARGER_PRSNT#
P152
VDD_IN
S153
CARRIER_STBY#
P153
VDD_IN
S154
CARRIER_PWR_ON
P154
VDD_IN
S155
FORCE_RECOV#
P155
VDD_IN
S156
BATLOW#
P156
VDD_IN
S157
TEST#
S158
GND
Note :DSI0 is pinshared with LVDS0

LEC-iMX8M Mini User’s Guide 0.6 SGET SMARC Rev 2.1
Page 20 copyright © 2022 ADLINK Technology Inc.
4.2 Signal Terminology Descriptions
Meaning of the terms used for signal description tables
Term
Description
I
Input to the module
O
Output from the module
O OD
Open drain output from the module
I OD
Open drain input to the module, with mandatory PU (pull up) on module
OD
Open drain
I/O
Bi-directional Input/Output
PU
PU (pull-up) resistor on module
PD
PD (pull-down) resistor on module
VDD_IN
Main power source from carrier to module
CMOS
Logic input or output
GBE MDI
Differential analog signaling for Gigabit Media Dependent Interface
LVDS DP
Low Voltage Differential Signal for DisplayPort interface
LVDS D-PHY
Low Voltage Differential Signal for MIPI CSI-2 cameras and DSI displays
LVDS M-PHY
Low Voltage Differential Signal for MIPI CSI-3 cameras
LVDS LCD
Low Voltage Differential Signal for LCD displays
LVDS PCIE
Low Voltage Differential Signal for PCIe
LVDS SATA
Low Voltage Differential Signal for SATA
TMDS HDMI
Transition Minimized Differential Signal for HDMI displays
USB
DC coupled differential signaling for traditional (non-Superspeed) USB signals
USB SS
Differential signal for SuperSpeed USB signals
USB VBUS 5V
5V tolerant input for USB VBUS detection
3.3V
3.3V Power Domain: Active while CARRIER_PWRON is high and CARRIER_SBY# is NOT active (i.e. both signals are high)
1.8V
1.8V Power Domain: Active while CARRIER_PWRON is high and CARRIER_SBY# is NOT active (i.e. both signals are high)
3.3Vsb
3.3V Power Domain: Active while CARRIER_PWRON is high (regardless of CARRIER_SBY#)
1.8Vsb
1.8V Power Domain: Active while CARRIER_PWRON is high (regardless of CARRIER_SBY#)