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  9. Panasonic MA6X125 (MA125) User manual

Panasonic MA6X125 (MA125) User manual

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Switching Diodes
1
Publication date: March 2004 SKF00055BED
Note) *: Value for single diode
MA6X125 (MA125)
Silicon epitaxial planar type
For switching circuit
■Features
•Four isolated elements contained in one package, allowing high-
density mounting
■Absolute Maximum Ratings Ta=25°C
Unit: mm
Parameter Symbol Rating Unit
Reverse voltage VR40 V
Maximum peak reverse voltage VRM 40 V
Forward current *IF100 mA
Peak forward current *IFM 200 mA
Junction temperature Tj150 °C
Storage temperature Tstg −55 to +150 °C
Parameter Symbol Conditions Min Typ Max Unit
Forward voltage VFIF=100 mA 1.2 V
Reverse voltage VRIR=100 µA40V
Reverse current IRVR=40 V 100 nA
Terminal capacitance CtVR=0 V, f =1 MHz 5.0 pF
Reverse recovery time *3trr1 *1IF=10 mA, VR=6 V 150 ns
trr2 *2Irr =0.1 IR , RL=100 Ω9
■Electrical Characteristics Ta=25°C ±3°C
Marking Symbol: M2I
654
123
Bias Application Unit (N-50BU)
90%
Pulse Generator
(PG-10N)
Rs= 50 Ω
Wave Form Analyzer
(SAS-8130)
Ri= 50 Ω
tp= 2 µs
tr= 0.35 ns
δ = 0.05
IF= 10 mA
VR= 6 V
RL= 100 Ω
10%
Input Pulse Output Pulse
Irr = 0.1 IR
trtp
trr
VR
IF
t
t
A
Internal Connection
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Absolute frequency of input and output is 100 MHz.
3. *1: Between pins 1 and 6, Between pins 3 and 5
*2: Between pins 2 and 6, Between pins 3 and 4
*3: trr measurement circuit
Note) The part number in the parenthesis shows conventional part number.
1: Cathode 1
2: Anode 2
3: Cathode 3
Anode 4
4: Anode 3
5: Cathode 4
6: Anode 1
Cathode 2
EIAJ: SC-74 Mini6-G1 Package
2.90
1.9±0.1 0.16+0.10
–0.06
2.8+0.2
–0.3
1.1+0.3
–0.1
1.1
0 to 0.1 +0.2
–0.1 1.50
(0.65)
0.4±0.2
+0.25
–0.05
(0.95)
0.30+0.10
–0.05
0.50+0.10
–0.05
(0.95)
654
132
+0.20
–0.05
5˚
10˚
This product complies with the RoHS Directive (EU 2002/95/EC).
2
MA6X125
SKF00055BED
IFVFIFVFIRVR
IRVRVFTaVFTa
10 −2
0 0.2 0.4 0.6 0.8 1.0 1.2
10 −1
1
10
102
103
Forward voltage VF(V)
Forward current IF(mA)
Between pins 2 and 6, 3 and 4
Ta = 150°C
100°C
25°C
−20°C
10 −2
0 0.2 0.4 0.6 0.8 1.0 1.2
10 −1
1
10
102
103
Forward voltage VF(V)
Forward current IF(mA)
Between pins 1 and 6, 3 and 5
Ta= 150°C
100°C
25°C
−20°C
10 −4
0 102030405060
10 −3
10 −2
10 −1
1
10
Reverse voltage VR(V)
Reverse current IR(µA)
Ta= 100°C
25°C
Between pins 2 and 6, 3 and 4
IRTaIRTaCtVR
10
−4
0 102030405060
10
−3
10
−2
10
−1
1
10
Reverse voltage V
R
(V)
Reverse current I
R
(nA)
T
a
= 100°C
25°C
Between pins 1 and 6, 3 and 5
0
0.4
0.8
1.2
1.6
–40 0 40 80 120 160 200
Ambient temperature T
a
(°C)
Forward voltage V
F
(V)
I
F
= 100 mA
10 mA
3 mA
Between pins 2 and 6, 3 and 4
0
0.4
0.8
1.2
1.6
−40 0 40 80 120 160 200
Ambient temperature T
a
(°C)
Forward voltage V
F
(V)
I
F
= 100 mA
10 mA
3 mA
Between pins 1 and 6, 3 and 5
10 −4
–40 0 40 80 120 160 200
10 −3
10 −2
10 −1
1
10
Ambient temperature T
a
(°C)
Reverse current I
R
(nA)
Between pins 2 and 6, 3 and 4
VR= 40 V
6 V
1 V
10
−4
−40 0 40 80 120 160 200
10
−3
10
−2
10
−1
1
10
Ambient temperature T
a
(°C)
Reverse current I
R
(nA)
Between pins 1 and 6, 3 and 5
V
R
= 40 V
6 V
1 V
0
6.0
5.0
4.0
3.0
2.0
1.0
0102030405060
Reverse voltage VR(V)
Terminal capacitance Ct(pF)
f = 1 MHz
Ta= 25°C
Between pins 1 and 6, 3 and 5
Between pins 2 and 6, 3 and 4
This product complies with the RoHS Directive (EU 2002/95/EC).
MA6X125
3
SKF00055BED
IF(surge) tW
10
−1
1
10
10
2
10
3
10110
−1
Pulse width t
W
(ms)
Forward surge current I
F(surge)
(A)
t
W
Non repetitive
I
F(surge)
T
a
= 25°C
Between pins 1 and 6, 3 and 5
Between pins 2 and 6, 3 and 4
This product complies with the RoHS Directive (EU 2002/95/EC).
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.