Panasonic TY-FB7HD User manual

1 Safety Precautions 2
1.1. General Guidelines 2
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 3
3 About lead free solder (PbF) 4
4 Connection 5
5 Circuit Board Layout 7
5.1. HI-Board 7
©2004 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TY-FB7HD
6 Block and Schematic Diagram 9
6.1. Schematic Diagram Notes 9
6.2. HI-Board Block Diagram 10
6.3. HI-Board (1 of 2) Schematic Diagram 11
6.4. HI-Board (2 of 2) Schematic Diagram 12
7 Replacement Parts List 13
7.1. Replacement Parts List Notes 13
7.2. Replacement Parts List 14
BNC HD-SDI Terminal Board
CONTENTS
Page Page
ORDER NO. ITD0410045C0
D10

1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MWand 5.2MW.
When the exposed metal does not have a return path to the chassis, the reading must be .
Figure 1
1.1.2. Leakage Current Hot Check (See Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milli amp. In case a measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.
2
TY-FB7HD

2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
3
TY-FB7HD

3 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
4
TY-FB7HD

4 Connection
5
TY-FB7HD

6
TY-FB7HD

5 Circuit Board Layout
5.1. HI-Board
ABCDEFGH I
1
2
3
4
5
6
TY-FB7HD
HI-BOARD TXNHA10TNS
TY-FB7HD
HI-BOARD TXNHA10TNS
HI-BOARD (FOIL SIDE)
TXNHA10TNS
HI-BOARD (COMPONENT SIDE)
TXNHA10TNS
SW301
H300
HS
TNPA3396
SDI THROU
SDI INPUT
1
JK301 JK302
SLOT 1 2 3
R418
L301
L302
R423
R424
R427
R447 C301
C302
C308
C502
C506
C313
C314
C315
C316
C317
C318
C319
C321
C322 C323
C324
C325
C326
C327
C328
C329
R301
R302 R303
C330
R309
C332
C333
C334
C528
C336
R502
C337
R503
C338
R504
C339
R505
R506
R312
R313
R507
R316
R317
C340
R318
C341
R319
R320
R321
R322
R327
C350
R328 R329
C353
R331
C360
C361
R356
R357
R364
R365
R368
R373
R374
R377
R378
C403
C404
C406
C408 C409
C410
C411
C412
C413
C422
D401D402
D403D404
IC405
PbF
ORDER NO.
14
58
B1
B2
A1
A2
A40
A39
B39
B40
1
28
29
56
TNPA3396 HS
CR NO.3
SDI INPUT SDI THROU
HD VD
LOCK
1
D_ERR
4:M_SD/HD
3:AUTO/MANU
2:S352_CHK 1:LVDS_CLK
A
A
R419
R420
R421
Z301
R422
R425
R426
R428
R429
R431
R432
R433
R434
R436
TP301 TP302
R440
R441
R442
R443
R444
R445
R446
JK301JK302
C305
Q301
C306
C501
C503
C310
C504
C311
C505
C312
C507
C508
C510
SW301
C511
C512
C513
C320
C514
C515
C516
C517
C519
D303
D304
C520
R304
C521
R305
C522
R306
C523
R307 R308
C331
C525
C526
IC302
C527
IC303
IC304
C335
C529
IC305
R501
IC306
IC307
R310
R311
C530
R314
C531
R315
IC501
C532
IC502
C533
IC503
IC310
C534
C535
C536
C537 C538
C347
R323
R324
R325
VR301
R326
C351
C352
C354
C355
R330
R332 R333
R334 R335 R336 R337 R338 R339 R340 R341 R342 R343 R344 R345
TP401
R346
TP402
R347 R348 R349
R350
R351
R352
R353 R354
R355
R360
R361
R362
R363
R366
R367
R369
FL301
FL302
FL303
FL304
FL305
FL306
FL307
R370
FL308
FL309
R371
R372
R375R376
H300
H301
H302
C402
C405
C407
C414 C415
C416
C417
C421
C423 C424
C425 C426
C427
C428
C429
C430 C431
IC402
IC403
IC404
R415
R416
R417
PbF
SEE REVERSE FOR ORDER NO.
1
2
3
4
ON
1
4
58
+
+
1
89
16
1
4
5 8
+
1
20 21 40
41 60
61
80
14
5
8
1
4
5
8
1
4
5
8
1
3
45
13
45
13
45
A1
A2
B1
B2
A39
A40
B39
B40
18
110
1
3
4
5
1
36
37
72
73
108
109
144
1
45
8
1
4
5
8
Par s Loca ion
Hl-BOARD
IC
IC3302 F-4
IC3303 F-4
IC3304 G-3
IC3305 F-3
IC3306 G-3
IC3307 F-4
IC3310 G-2
IC3402 G-2
IC3403 F-3
IC3404 G-2
IC3405 C-2
TP3301 G-4
TP3302 G-2
TP3401 F-2
TP3401 F-2
Q3301 G-4
TRANSISTOR
TP
IC3501 H-1
IC3502 H-3
IC3503 H-4
TY-FB7HD
7

TY-FB7HD
8

6 Block and Schematic Diagram
6.1. Schematic Diagram Notes
TY-FB7HD
9

6.2. HI-Board Block Diagram
CS TDI TDO TCK
F V H F H V
CS TDO TDI TCK
SW3301
1234
SDI INPUT
JK3301 EQUALIZER
4
SERIAL IN
IC3302
1213
SERIAL
DATA[2]
68
21
2423
8
IC330
OUTPUT DRIVER
BUF SERIAL
DATA[2]
SDI OUTPUT
JK3302
SERIAL OUT
3
Z3301
VCO
2 28 29 30 34 35 36
DESERIALIZER
IC3304
MODE SW
IC3402
RESET
4
2
5
M_SD/HD
S352_CHK
AUTO/MANU
2
IC3306
LOCK
2
5
6
2
5
6
DATA ERROR
IC3305
31
S2P[0-19]
20bit data bus
Y[10],Pb/Pr[10]
38
63
69
P_CLK( 5MHz)
LVDS_CLK
14 21 86 12 13 25 24
56
33
16
3
142
FPGA
IC3403
S2P[0-19]
DATA ERROR
PLL LOCK
IC3404
FPGA CONFIG ROM
1
2
5
6
NCS
DATA
ASDI
DCLK
10638 91
H3302
12
Y[0- ]
134
119
Pb[0- ]
126
10
Pr[0- ]
113
1 0229302 28
104
103
15
2
14
50
28
Pr[0- ]
56
4
Pb[0- ]
24
Y[0- ]
2
3
S2P[0-19]
LVDS
IC3405
1
31 32
ERR
INIT
VD
HD HD
VD
PWRDWN P_CLK
IC3406
5
8
6
SLOT CONFIG ROM
A22
B24
B25
682
H3301
B23
B1240
B1139
B1438
3 B15
B842
41 B9
B546
45 B6
B248
4 B3
H3300
TXA0
TXA1
TXB1
TXB0
TXC1
TXC0
TXD1
TXD0
TXCLK1
TXCLK0
STBY+5V
IIC DAT
IIC SCL
SRQ
B19
A19
+5V
+5V
B1
A1
+3.3V
+3.3V
14
AVR 3.3V
IC3503
5
IC3502
1
AVR 1.8V
5
4
IC3501
1
AVR 1.5V
5
4
+1.5V
+3.3V
+3.3V
+1.8V
TY-FB HD
HI-Board Block Diagram
TY-FB HD
HI-Board Block Diagram
TY-FB7HD
10