Panasonic INDUSTRY PAN9028 Quick setup guide

Wireless Connectivity
PAN9028
Wi-Fi Dual Band 2.4 GHz/5 GHz and Bluetooth®Module
Module Integration Guide
Rev. 1.0

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PAN9028 Bluetooth/Wi-Fi Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 2 of 34
Overview
The PAN9028 is a 2.4 GHz/5 GHz ISM band Wi-Fi
and Bluetooth radio module, which includes a
wireless radio and a power management IC for
easy integration of Wi-Fi and Bluetooth connectivity
into various electronic devices.
Features
•Dual band 2.4 GHz/5 GHz 802.11 a/b/g/n/ac
Wi-Fi and Bluetooth combo module
•The hardware is capable of WPA3 and supports
802.11i security standards through AES and
CCMP
•802.11e Quality of Service is supported for
multimedia application
•IEEE 802.11ac (Wave 2), 1×1 spatial stream with
data rates up to 433 Mbps (MCS9, 80 MHz
channel bandwidth)
•IEEE 802.11ac MU-MIMO beamformee
•Bluetooth 5.2 (includes Low Energy)
•Dual simultaneous and independent WLAN and
Bluetooth operation
•Dynamic Rapid Channel Switching (DRCS1) for
simultaneous operation in 2.4 GHz and 5 GHz
bands
•Indoor location and navigation with
IEEE 802.11mc
•Coexistence interface for arbitration of co-located
WLAN, Bluetooth, or mobile wireless system
(e.g. LTE or ZigBee®)
•Generic interfaces include SDIO 3.0 and high
speed UART for host processor connection
•Software driver Linux®
Characteristics
•Surface Mount Type (SMT):
24 mm × 12 mm × 2.8 mm
•NXP®88W8987 WLAN 2.4 GHz/5 GHz and
Bluetooth single-chip solution inside
•Single power supply: 3.3 V with NXP
PM823 Power Management IC (optional)
•Tx power: 16 dBm at 802.11b
•Rx sensitivity: -97 dBm at 802.11b DSSS 1 Mbps
•IEEE 802.11ac 20 MHz, 40 MHz, 80 MHz
channel bandwidth
•Long and Short Guard Interval support
•Current consumption Wi-Fi typical 320 mA (at Tx)
and 70 mA (at Rx)
•SDIO 1 bit or 4 bit
•Wide temperature range of -30 °C to 85 °C
Block Diagram
1
This feature is not supported on any NXP driver package and currently not part of FP91 (MCUXpresso SDK)
and FP92 (Yocto BSP). For further information please contact us 9.1 Contact Us.
Chip
Antenna


SPDT
NXPâ
88W8987
Radio SoC
UART
GPIOs
PDN

VDD +3.3 V

BPF
RF Pad

PAN9028
Wi-Fi and BluetoothâRadio Module
IEEE 802.11 a/b/g/n/ac
Bluetooth 5.2 (BR, Low Energy, and EDR)

DPX
SPDT
PCM Interface
SDIO Interface
Sleep Clock
RF SW 
Crystal
26 MHz

VIO/VIOSD
COEX

PMIC
NXPâPM823
(optional)

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PAN9028 Bluetooth/Wi-Fi Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 3 of 34
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time
without notification. Please consult the most recently issued Module Integration Guide before initiating or
completing a design.
© Panasonic Industrial Devices Europe GmbH 2022.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Module Integration Guide does not lodge the claim to be complete and free of mistakes.
If this document is marked as preliminary, please be aware that its final content is not yet concluded and
the use of it is at your own risk.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Module Integration Guide and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
•The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
•Deviation or lapse in function of the Engineering Sample,
•Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.
The information contained herein is presented only as guidance for Product use. No responsibility is
assumed by Panasonic for any infringement of patents or any other intellectual property rights of third
parties that may result from the use of Product. No license to any intellectual property right is granted by
this document, whether express or implied, by estoppel or otherwise.
Description of hardware, software, and other information in this document is only intended to illustrate the
functionality of the referred Panasonic product. It should not be construed as guaranteeing specific
functionality of the product as described or suitable for a particular application.
Any provided (source) code shall not be used or incorporated into any products or systems whose
manufacture, use or sale is prohibited under any applicable laws or regulations.
Any outlined or referenced (source) code within this document is provided on an “as is” basis without any
right to technical support or updates and without warranty of any kind on a free of charge basis according
to § 516 German Civil Law (BGB) including without limitation, any warranties or conditions of title, non
infringement, merchantability, or fitness for a particular purpose. Customer acknowledges that (source)
code may bear defects and errors.

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PAN9028 Bluetooth/Wi-Fi Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 4 of 34
The third-party tools mentioned in this document are offered by independent third-party providers who are
solely responsible for these products. Panasonic has no responsibility whatsoever for the performance,
product descriptions, specifications, referenced content, or any and all claims or representations of these
third-party providers. Panasonic makes no warranty whatsoever, neither express nor implied, with respect
to the goods, the referenced contents, or any and all claims or representations of the third-party providers.
To the maximum extent allowable by Law Panasonic assumes no liability whatsoever including without
limitation, indirect, consequential, special, or incidental damages or loss, including without limitation loss of
profits, loss of opportunities, business interruption, and loss of data.

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PAN9028 Bluetooth/Wi-Fi Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 5 of 34
Table of Contents
1About This Document.........................................................................................................................6
1.1 Purpose and Audience ..............................................................................................................6
1.2 Revision History.........................................................................................................................6
1.3 Use of Symbols .........................................................................................................................6
1.4 Related Documents...................................................................................................................7
2Overview..............................................................................................................................................8
3PAN9028 Module.................................................................................................................................9
3.1 Block Diagram...........................................................................................................................9
3.2 Land Pattern............................................................................................................................10
3.3 Footprint ..................................................................................................................................11
3.4 Solder Mask.............................................................................................................................12
3.5 Placement................................................................................................................................12
4Power Supply....................................................................................................................................14
4.1 General Guidances..................................................................................................................14
4.2 ENWF940[x]A1EF ...................................................................................................................14
4.3 ENWF940[x]A2EF ...................................................................................................................15
5RF Path..............................................................................................................................................18
5.1 External Antenna.....................................................................................................................18
5.2 RF Trace..................................................................................................................................18
6mSDIO Adapter .................................................................................................................................21
6.1 Functional Blocks ....................................................................................................................21
6.2 Resistor Jumper Configuration ................................................................................................21
6.3 Part Placement........................................................................................................................22
7Reference Design..............................................................................................................................23
7.1 Schematic................................................................................................................................23
7.2 PCB Layout .............................................................................................................................23
8Regulatory and Certification Information .......................................................................................26
8.1 Federal Communications Commission (FCC) for US ..............................................................26
8.2 Innovation, Science, and Economic Development (ISED) for Canada ....................................29
8.3 European Conformity According to RED (2014/53/EU)...........................................................33
9Contact Details..................................................................................................................................34
9.1 Contact Us...............................................................................................................................34
9.2 Product Information .................................................................................................................34

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PAN9028 Bluetooth/Wi-Fi Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 6 of 34
1 About This Document
1.1 Purpose and Audience
This Module Integration Guide is intended to support the easy integration of the PAN9028 into a
product and to ensure the compliance with regulatory requirements.
This guide gives an overview about the hardware design requirements by providing a reference
design, which is the evaluation board of the PAN9028.
It is intended for hardware design, application, and Original Equipment Manufacturers (OEM)
engineers.
The product is referred to as “PAN9028” and “module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
1.0
2022-05-13
First version
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
Tip
Indicates useful information designed to facilitate working with the software.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
✓
Requirement
Indicates a requirement that must be met before the corresponding tasks can be
completed.
➔
Result
Indicates the result of a task or the result of a series of tasks.
This font
GUI text
Indicates fixed terms and text of the graphical user interface.
Example:
Click Save.

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PAN9028 Bluetooth/Wi-Fi Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 7 of 34
Symbol
Description
Menu > Menu item
Path
Indicates a path, e.g. to access a dialog.
Example:
In the menu, select File > Setup page.
This font
File names
Indicates file names displayed on the screen or to be selected by the user.
Examples:
pan1760.c contains the actual module initialization.
This font
Messages, user input, code
Indicates messages, information, and code displayed on the screen or to be
entered by the user.
Examples:
The message Failed to save your data is displayed.
Enter the value Product 123.
Copy firmware binaries to firmware library:
$> cd ${TOP}/…
$> …
Key
Key
Indicates a key on the keyboard.
Example:
Press F10 .
1.4 Related Documents
For related documents please refer to the Panasonic website 9.2 Product Information.


PAN9028 Bluetooth/Wi-Fi Module 2 Overview
Module Integration Guide Rev. 1.0 Page 8 of 34
2 Overview
The PAN9028 is a dual band 2.4 GHz and 5 GHz 802.11 a/b/g/n/ac Wi-Fi radio module with
integrated Bluetooth BR/EDR/Low Energy (LE), specifically designed for highly integrated and
cost-effective applications. The simultaneous and independent operation of the two standards
enables very high data rates (802.11ac) and low-power operation (Bluetooth LE). Integrated
power management, a fast dual-core CPU, 802.11i security standard support, and high-speed
data interfaces deliver the performance for the speed, reliability, and quality requirements of
next generation products. Tx power calibration data, Wi-Fi, and Bluetooth system parameters
are pre-stored on the One Time Programmable memory of the PAN9028 during production at
Panasonic. This simplifies passing the certification process for PAN9028 customers.
Furthermore, the module reduces design, test, and calibration effort resulting in reduced time-
to-market compared to discrete solutions.
Integrating Wi-Fi and Bluetooth wireless connectivity allows high throughput applications for
industrial devices and appliances. The combination of Wi-Fi and Bluetooth provides the highest
flexibility for connectivity.
This Module Integration Guide applies to the PAN9028 WLAN/Bluetooth combo module and the
PAN9028 mSDIO Adapter development platform.
This document is structured into two main parts:
•The hardware integration of the PAN9028 module.
•The PAN9028 mSDIO Adapter as an example for the module integration.
For related documents please refer to 9.2 Product Information.


PAN9028 Bluetooth/Wi-Fi Module 3 PAN9028 Module
Module Integration Guide Rev. 1.0 Page 9 of 34
3 PAN9028 Module
3.1 Block Diagram
For Module Variant ENWF940[x]A1EF:
For Module Variant ENWF940[x]A2EF:
Chip
Antenna


SPDT
NXPâ
88W8987
Radio SoC
UART
GPIOs
PDN

VDD +3.3 V

BPF
RF Pad

PAN9028
Wi-Fi and BluetoothâRadio Module
IEEE 802.11 a/b/g/n/ac
Bluetooth 5.2 (BR, Low Energy, and EDR)

DPX
SPDT
PCM Interface
SDIO Interface
Sleep Clock
RF SW 
Crystal
26 MHz

VIO/VIOSD
COEX

PMIC
NXPâPM823
(optional)
Chip
Antenna


SPDT
UART
GPIOs
PDN

VDD +1.1 V

BPF
RF Pad

PAN9028
Wi-Fi and BluetoothâRadio Module
IEEE 802.11 a/b/g/n/ac
Bluetooth 5.2 (BR, Low Energy, and EDR)

DPX
SPDT
PCM Interface
SDIO Interface
Sleep Clock
RF SW 
Crystal
26 MHz

VIO/VIOSD
COEX
VDD +1.8 V

VDD +2.2 V

VDD +3.3 V

NXPâ
88W8987
Radio SoC


PAN9028 Bluetooth/Wi-Fi Module 3 PAN9028 Module
Module Integration Guide Rev. 1.0 Page 10 of 34
3.2 Land Pattern
For Module Variant ENWF940[x]A1EF: Top View
For Module Variant ENWF940[x]A2EF: Top View
1 2 3 4 5 6 7 8 9 10 11 12
G
VOUT
2.2V
VOUT
2.2V VIO VOUT
1.8V SD_CLK SD_CMD SD_DAT0 SD_DAT1 SD_DAT2 SD_DAT3 GND RF G
FGND VDD 3.3V VDD 3.3V VIO_SD GPIO GPIO GPIO GPIO GPIO GPIO GND GND F
EGPIO
SLEEP
CLOCKIN
GND GND E
DPG2
CONFIG
HOST[0]
GND GND D
CPGLDO
CONFIG
AUTO REF
DET
GND GND C
BPG1 GPIO
DNC GPIO PDN UART UART UART GPIO GPIO RF_SW1 GND B
AGND EN PMIC
VOUT
1.1 V GPIO DNC UART UART UART DNC GPIO RF_SW2 GND A
1 2 3 4 5 6 7 8 9 10 11 12
EP 1
EP 2
EP 1
EP 2
1 2 3 4 5 6 7 8 9 10 11 12
G
VDD
2.2V
VDD
2.2V VIO VDD
1.8V SD_CLK SD_CMD SD_DAT0 SD_DAT1 SD_DAT2 SD_DAT3 GND RF G
FGND
VDD
3.3V
VDD
3.3V VIO_SD GPIO GPIO GPIO GPIO GPIO GPIO GND GND F
EGPIO
SLEEP
CLOCKIN
GND GND E
DDNC
CONFIG
HOST[0]
GND GND D
CDNC
CONFIG
AUTO REF
DET
GND GND C
BDNC GPIO
DNC GPIO PDN UART UART UART GPIO GPIO RF_SW1 GND B
AGND DNC
VDD
1.1 V GPIO DNC UART UART UART DNC GPIO RF_SW2 GND A
1 2 3 4 5 6 7 8 9 10 11 12
EP 1
EP 2
EP 1
EP 2

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PAN9028 Bluetooth/Wi-Fi Module 3 PAN9028 Module
Module Integration Guide Rev. 1.0 Page 11 of 34
3.3 Footprint
The outer dimensions have a tolerance of ±0.35 mm.
Top View

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PAN9028 Bluetooth/Wi-Fi Module 3 PAN9028 Module
Module Integration Guide Rev. 1.0 Page 12 of 34
3.4 Solder Mask
It is recommended to use the following layout for the soldering mask to reduce voids on the
thermal pads. Use the dimensions:
✓The Resist Mask should be 50 µm bigger than the pad size (3.3 Footprint).
✓The Solder Mask should be 50 µm smaller than the pad size (3.3 Footprint); they are
separated in two semi circles with 300 µm distance and a shifting about 150 µm.
Layout
3.5 Placement
Antenna “Keep out Area”
Do not place any ground plane under the marked restricted antenna area in
any layer! This would be affecting the performance of the chip antenna in a
critical manner.
Impact of Placement on the Antenna Radiation Pattern
The placement of the module, surrounding material, and customer
components has an impact on the radiation pattern of the antenna.
The recommendation for the ground plane is based on a FR4 4-Layer PCB.
The following requirements must be met:
✓Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
✓Keep this product away from other high frequency circuits.


PAN9028 Bluetooth/Wi-Fi Module 3 PAN9028 Module
Module Integration Guide Rev. 1.0 Page 13 of 34
The antenna requires a cutout area of 8 mm × 5 mm under the PAN9028 module. This “Keep
out Area” shall be located in every layer under the module antenna. Note for example the “Keep
out Area” in all four layers of the PAN9028 evaluation board.
It is recommended to verify the perfect position of the module in the target application before
fixing the design.
Antenna Placement Recommendation
All dimensions are in millimeters.
Use a ground plane in the area surrounding the module wherever possible.
It is recommended to place the module:
•In the center (horizontal) of mother PCB.
•At the edge (horizontal) of mother PCB.
Top View
24.00
Min. 15.00
8.00
5.00
„Keep out Area“
Min. 15.00 12.00
Min. 40.00
1.00
3.00
PAN9028


PAN9028 Bluetooth/Wi-Fi Module 4 Power Supply
Module Integration Guide Rev. 1.0 Page 14 of 34
4 Power Supply
4.1 General Guidances
The following conditions must be met:
✓The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example
a ferrite in series connection and a bypass capacitor to ground of at least 47 µF directly at
the module).
✓The supply voltage must not be exceedingly high or reversed. It must not carry noise and/or
spikes.
4.2 ENWF940[x]A1EF
ENWF940[x]A1EF: The power supply pins VOUT1V1, VOUT1V8,and
VOUT2V2 are only for internal purpose. Do not use them to power external
curcuits.
Power Configuration Example with 3.3 V Host Operation
Power Configuration Example with 3.3 V Host Operation



PAN9028
VDD3V3
VDD3V3
VOUT1V8
VIO
VIOSD
VDD 3.3 V



PAN9028
VDD3V3
VDD3V3
VOUT1V8
VIO
VIOSD
VDD 3.3 V
1.8 V


PAN9028 Bluetooth/Wi-Fi Module 4 Power Supply
Module Integration Guide Rev. 1.0 Page 15 of 34
4.3 ENWF940[x]A2EF
Follow the correct power-up sequence of module which is specified in
“PAN9028 Product Specification” 9.2 Product Information.
Power Configuration Example with 3.3 V Host Operation (PMIC)
Using the PAN9028 with VIO = 3.3 V and VIO SD = 3.3 V voltage levels disable
the high-speed interfaces, and only SDIO 2.0 and slow UART speed are
available.
To enable high-speed interfaces SDIO 3.0 and High-speed UART, use
VIO = 1.8 V and VIO SD = 1.8 V voltage levels.



PAN9028
VIO/VIO SD

VIO RF
88PG823
PMIC
Enable
VDD 3.3 V 3.3 V
3.3 V
VDD 2.2 V
2.2 V
VDD 1.8 V
1.8 V
VDD 3.3 V
or Host GPIO
VIN
1.1 V VDD 1.1 V

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PAN9028 Bluetooth/Wi-Fi Module 4 Power Supply
Module Integration Guide Rev. 1.0 Page 16 of 34
Power Configuration Example with 3.3 V Host Operation (Discrete)
Using the PAN9028 with VIO = 3.3 V and VIO SD = 3.3 V voltage levels disable
the high-speed interfaces, and only SDIO 2.0 and slow UART speed are
available.
To enable high-speed interfaces SDIO 3.0 and High-speed UART, use
VIO = 1.8 V and VIO SD = 1.8 V voltage levels.
Power Configuration Example with 1.8 V Host Operation (PMIC)
PAN9028
VIO/VIO SD

VIO RF
VDD 2.2 V
VDD 1.8 V
VDD 1.1 V
3.3 V
2.2 V
1.8 V
DC
DC
DC
DC
LDO
Step-up
Step-down
VDD 1.8 V 3.3 V
1.8 V
3.3 V
3.3 V
2.2 V
2.2 V
Dual
LDO
1.8 V
1.8 V
1.1 V
X
PAN9028
VIO RF
88PG823
PMIC
Enable
VDD 3.3 V 3.3 V
VDD 2.2 V
2.2 V
VDD 1.8 V
1.8 V
VDD 3.3 V
or Host GPIO
VIN
1.1 V VDD 1.1 V
1.8 V VIO / VIO SD



PAN9028 Bluetooth/Wi-Fi Module 4 Power Supply
Module Integration Guide Rev. 1.0 Page 17 of 34
Power Configuration Example with 1.8 V Host Operation (Discrete)
PAN9028
VIO/VIO SD

VIO RF
VDD 2.2 V
VDD 1.8 V
VDD 1.1 V
3.3 V
2.2 V
1.8 V
DC
DC
DC
DC
LDO
Step-up
Step-down
VDD 1.8 V 1.8 V
1.8 V
3.3 V
3.3 V
2.2 V
2.2 V
Dual
LDO
1.8 V
1.8 V
1.1 V


PAN9028 Bluetooth/Wi-Fi Module 5 RF Path
Module Integration Guide Rev. 1.0 Page 18 of 34
5 RF Path
5.1 External Antenna
Antenna Warning
The PAN9028 is tested with a standard U.FL connector and with the antenna
listed in the “PAN9028 Product Specification”. When integrated into the OEM’s
product, these fixed antennas require installation preventing end users from
replacing them with non-approved antennas.
Any antenna not listed in the “PAN9028 Product Specification” must be tested
to comply with FCC Section 15.203 for unique antenna connectors and with
Section 15.247 for emissions.
The PAN9028 module has a 50 ohm RF pin (SMD pad). Connect an external antenna directly or
via a connector (e.g. U.FL) with RF trace to this RF pin. This RF trace shall be matched to
50 ohm 5.2 RF Trace.
5.2 RF Trace
Ensure that the RF trace impedance is nearly 50 ohm. It is recommended to use a Coplanar
Waveguide with Ground (CPWG) design. The impedance is related to the trace width, the
distances of the trace to the ground layers and the material of the PCB.
The following design recommendation shall be met:
✓Trace impedance of 50 ohm
✓Trace length shall not exceed 2 cm
✓Via fence around the trace
✓Crossing no other lines (power supply, interfaces, or clock traces)


PAN9028 Bluetooth/Wi-Fi Module 5 RF Path
Module Integration Guide Rev. 1.0 Page 19 of 34
Example 1: 50 ohm Coplanar Waveguide with Ground on mSDIO Adapter
Trace width
W = 180 µm
Trace distance to ground
S = 150 µm
Substrate thickness
H = 80 µm
Effective permittivity
𝜀𝑟 = 3.9
Loss tangent
tan 𝛿 = 0.015
SS
W
H


PAN9028 Bluetooth/Wi-Fi Module 5 RF Path
Module Integration Guide Rev. 1.0 Page 20 of 34
Example 2: 50 ohm Coplanar Waveguide with Ground and Micro Vias
Trace width
W = 300 µm
Trace distance to ground
S = 300 µm
Substrate thickness
H = 160 µm
Effective permittivity
𝜀𝑟 = 4.2
Loss tangent
tan 𝛿 = 0.006