Panasonic KX-T7603X User manual

ORDERNO. KMS0303669C8
Add on KeyModule
KX-T7603X
(for Asia, MiddleNearEast, Africa, Oceania, LatinAmerica, Russia,
Europe)
2003 PanasonicCommunicationsCo., Ltd. All rights reserved.
Unauthorizedcopying and distribution isaviolation oflaw.

IMPORTANT INFORMATIONABOUT LEAD FREE, (PbF),
SOLDERING
Ifleadfree solderwas usedinthe manufacture of this productthe printedcircuitboards will be
markedPbF.
Standardleaded, (Pb), soldercanbe usedas usual on boards without the PbF mark.
Whenthis mark does appearplease readand followthe special instructions describedinthis
manual on the use of PbF and howitmight be permissible to use Pbsolderduring service and
repairwork.
1. ABOUTLEADFREE SOLDER(PbF:Pbfree)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthatcontains lead.
We will use PbF whendiscussing the leadfree solderusedinourmanufacturing process which
is made from Tin, (Sn), Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggestusing the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solderhas amelting pointthat is50° ~70° F, (30° ~40°C)
higherthanPbsolder. Please use asoldering iron with
temperaturecontrol and adjust itto700° ±20° F, (370° ±10°C). In
case ofusing high temperaturesoldering iron, please becareful
nottoheat too long.
-PbF solderwill tend tosplashifitisheatedmuchhigherthanits
melting point, approximately1100°F, (600°C).
-Ifyou must use Pbsolderon aPCB manufacturedusing PbF
solder, removeas muchoftheoriginal PbF solderas possibleand
besurethat anyremaining ismeltedprior toapplying thePb
solder.
-Whenapplying PbF soldertodoublelayeredboards, please check
thecomponentsidefor excess whichmayflowontotheopposite
side(See figure, below).

1.1. SUGGESTEDPbF SOLDER
There are several types of PbF solderavailable commercially. While this productis
manufacturedusing Tin, Silver, and Copper,
(Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+Cu), orTin, Zinc, and Bismuth, (Sn+Zn+Bi).
Please check the manufac
turer’s specific instructions forthe melting points of theirproducts and anyprecautions for
using theirproductwith other
materials.
The following leadfree (PbF) solderwire sizes are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
1.2. HOWTO RECOGNIZE THATPbFREE SOLDERIS USED
PbF is stampedto showthatPbfree solderis used. (See the figure below.)
2. FORSERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Covertheplasticparts boxes withaluminum foil.
2. Ground thesoldering irons.
3. Use aconductivemat on theworktable.
4. DonottouchICor LSI pinswithbarefingers.
3. SPECIFICATIONS

Jacks: TELJack
Dimensions: Low
Angle:
High
Angle:
255 (D)mm [Operate]×47 (W)mm ×94 (H)mm
206 (D)mm [Operate]×47 (W)mm ×178 (H)mm
213 (D)mm [Base]
Weight: 210g
Design and specifications are subjectto change without notice.
4. INSTALLING
ForKX-T7633 / KX-T7636
The Add-on KeyModule has 12 CObuttons. These buttons are usedto seize anoutside line,
make a call using One-touchDialing, oraccess certainfeatures.

1Openthe cover.
2Attachthe KX-T7603 to your
telephone with screws.
3 Insertthe flatcable into the
connector.

4 Close the cover.
5. DISASSEMBLY INSTRUCTIONS
1. Remove TwoScrews (A).
2. Remove the ConnectPlate.
3. Remove Screw(A).
4. Remove the Bottom Cabinetand Top Cabinet
(Base).

5. Remove TwoScrews (A).
6. Remove the Bottom Cabinet(Oper).
7. Remove the MainBoardfrom the Top Cabinet.
6. HOWTO REPLACE AFLATPACKAGE IC
6.1. PREPARATION
-PbF (:Pbfree) Solder
-Soldering Iron
TipTemperatureof700°F±20°F(370°C±10°C)
Note:Werecommend a30 to40 Watt soldering iron. Anexpert
maybeabletouse a60 to80 Watt iron wheresomeonewithless
experience couldoverheat and damagethePCB foil.
-Flux
RecommendedFlux:SpecificGravity0.82.
TypeRMA(lowerresidue, non-cleaning type)
Note:See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().

6.2. PROCEDURE
1. Tack theflat pack ICtothePCB bytemporarilysoldering two
diagonallyopposite pinsinthecorrect positionson thePCB.
Be certaineachpinis locatedoverthe correctpadon the PCB.
2. Applyfluxtoall ofthepinson theIC.
3. Being careful tonotunsolderthetack points, slidethesoldering
iron along thetipsofthepinswhilefeeding enough soldertothe
tipsothat itflowsunderthepinsas theyareheated.
6.3. REMOVING SOLDERFROMBETWEENPINS
1. Add asmall amountofsoldertothebridgedpins.
2. Withahotiron, use asweeping motion along theflat partofthe
pintodrawthesolderfrom betweentheadjacentpads.

7. TROUBLESHOOTINGGUIDE
CROSS REFERENCE:
WAVEFORM ()
8. BLOCK DIAGRAM
9. CIRCUITOPERATIONS

9.1. LEDCIRCUITAND KEY INPUTCIRCUIT
CircuitOperation:
Adrive pulse wave, as inFig.1, is output byIC1. Thatsignal goes through the drive digital
transistorand connects the keybutton and LED cathode. Bypressing the key, the drive pulse
wave is input to Pin9~Pin11. Inorderto light the appropriate LED, the LED control portis turned
ON. ThatresultLED is litbythe pulse Driver.
10. ICDATA