Panasonic PAN1326C Guide

PAN1326C Bluetooth
Basic Data Rate and Low Energy Module
Design Guide
Rev. 1.0
Wireless Modules
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PAN1326C Bluetooth Module
Design Guide Rev. 1.0 Page 2
Overview
Panasonic’s new PAN1326C is a Host Controlled
Interface (HCI) Bluetooth RF module that brings
Texas Instrument’s seventh generation Bluetooth
core integrated circuit, the CC2564, to an easy-to-
use module format. The PAN1326C is Bluetooth-4.2-
compliant and it offers best-in-class RF performance
with about twice the range of other Bluetooth Low
Energy solutions. Panasonic’s tiny footprint
technology has produced a module of only
85.5 mm². The module is designed to accommodate
PCBs pad pitch of 1.3 mm and as few as two layers
for easy implementation and manufacturing. The
module has been designed to be 100 % pin-
compatible with previous generations of Texas
Instruments-based Bluetooth HCI modules.
Features
•Bluetooth 4.2 Basic Data Rate (BR) and Low
Energy (LE)
•Dimensions 15.6 x 8.7 x 1.9 mm
•Integrated high speed crystal oscillator (26 MHz)
Bluetooth
•Scatternet and piconets simultaneously
•Synchronous Connection Oriented (SCO) links on
the same piconet
•Support for All Voice Air-Coding - Continuously
Variable Slope Delta (CVSD), A-law, µ-law,
modified Subband Coding (mSBC), and
transparent (uncoded)
•Assisted mode for HFP 1.6 Wideband Speech
(WBS) profile or A2DP profile to reduce host
processing and power
•Support of multiple Bluetooth profiles with
enhanced QoS
•Multiple sniff instances tightly coupled to achieve
minimum power consumption
•Independent buffering for Low Energy allows large
numbers of multiple connections without affecting
BR or EDR performance
•Built-in coexistence and prioritization handling for
BR, EDR, and Low Energy
•Capabilities of link layer topology Scatternet - can
act concurrently as peripheral and central
•Network support for up to 10 devices
•Time line optimization algorithms to achieve
maximum channel utilization
Characteristics
•Bluetooth 4.2
•Receiver sensitivity -93 dBm
•Output power 12 dBm
•Power supply 1.7 to 4.8 V
•Power consumption Tx 40 mA
•Power consumption Rx 20 mA
•Sleep mode 135 µA
•Operating temperature range -45 ºC to +85 ºC

PAN1326C Bluetooth Module
Design Guide Rev. 1.0 Page 3
Table of Contents
1About This Document.........................................................................................................................4
1.1 Purpose and Audience ..............................................................................................................4
1.2 Revision History.........................................................................................................................4
1.3Use of Symbols .........................................................................................................................4
1.4 Related Documents ...................................................................................................................4
2PAN1326C............................................................................................................................................5
2.1 PAN1326C Block Diagram ........................................................................................................5
2.2 PAN1326C Placement Recommendations ................................................................................5
3PAN1326C Breakout Board................................................................................................................6
3.1 PAN1326C Breakout Board Component Placement .................................................................6
3.2 PAN1326C Breakout Board Schematic .....................................................................................7
4EM Adapter BoosterPack ...................................................................................................................8
5MSP432 Launchpad ............................................................................................................................9
6Appendix ...........................................................................................................................................10
6.1 Ordering Information................................................................................................................10
6.2 Contact Details ........................................................................................................................10
6.3 Product Information .................................................................................................................10
7Life Support Policy ...........................................................................................................................12

PAN1326C Bluetooth Module
1 About This Document
Design Guide Rev. 1.0 Page 4
1 About This Document
1.1 Purpose and Audience
This Design Guide applies to the Bluetooth development platform PAN1326C Experimenter Kit.
The intention is to enable our customers to easily and fast integrate our module PAN1326C in
their product. This guide describes the Hardware and gives useful hints.
1.2 Revision History
Revision
Date
Modifications/Remarks
1.0
14.11.2017
1st version.
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product. Non-observance
can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates crossreferences within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4 Related Documents
Please refer to the Panasonic website for related documents 6.3 Product Information
For further information refer to the Ti WIKI for CC256x CC256x WIKI

PAN1326C Bluetooth Module
2 PAN1326C
Design Guide Rev. 1.0 Page 5
2 PAN1326C
2.1 PAN1326C Block Diagram
2.2 PAN1326C Placement Recommendations
Chip
Antenna
Texas Instruments
CC256x
BT-HCI Chip
UART
GPIOs
Audio PCM/I2C
Reset
32 kHz input
Vcc 3.3 V
LPF
PAN132x
Bluetooth 4.2 Module
Crystal
26 MHz
Top View
8.7
15.6
Restricted Area
No copper any layer
5.00
3.00
Min. 15mm
Min. 15mm
Dimensions are in mm.
Use a Ground plane in the
area surrounding the
PAN1326C module wherever
possible.
Min. 40mm
If possible place PAN1326C in the
center of mother PCB.
Place PAN1326C at the edge of
mother PCB.
PAN1326C WITH ANTENNA
PLACEMENT

PAN1326C Bluetooth Module
3 PAN1326C Breakout Board
Design Guide Rev. 1.0 Page 6
3 PAN1326C Breakout Board
3.1 PAN1326C Breakout Board Component Placement

PAN1326C Bluetooth Module
3 PAN1326C Breakout Board
Design Guide Rev. 1.0 Page 7
3.2 PAN1326C Breakout Board Schematic

PAN1326C Bluetooth Module
4 EM Adapter BoosterPack
Design Guide Rev. 1.0 Page 8
4 EM Adapter BoosterPack
Note: If you purchase the adapter board directly via Texas Instruments or a related distributor,
the crystal oscillator next to C7 is not equipped. Please be aware, that in this case you are
missing the 32 kHz slow clock and have to solder it on the board.

PAN1326C Bluetooth Module
5 MSP432 Launchpad
Design Guide Rev. 1.0 Page 9
5 MSP432 Launchpad
The installation and tools are described in the Quick Start Guide for the MSP432 Launch Pad
on the TI Wiki page Getting Started Guide for MSP432 + CC2564C

PAN1326C Bluetooth Module
6 Appendix
Design Guide Rev. 1.0 Page 10
6 Appendix
6.1 Ordering Information
Variants and Versions
Order Number
Brand Name
Description
MOQ1
ENW89819AYKF
Experimenter Kit
1x PAN1326C Breakout Board,
1x Texas Instruments MSP430 Launchpad,
1x Texas Instruments Boost/CCEMAdapter
1
ENW89819AXKF
1326C Breakout Board
1x PAN1326C Breakout Board
1
6.2 Contact Details
6.2.1 Contact Us
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: [email protected]onic.com
For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to
find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
6.3 Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
1
Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces,
fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution
channels.

PAN1326C Bluetooth Module
6 Appendix
Design Guide Rev. 1.0 Page 11
http://www.panasonic.com/rfmodules

PAN1326C Bluetooth Module
7 Life Support Policy
Design Guide Rev. 1.0 Page 12
7 Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.