Panasonic PAN1026A Owner's manual

PAN1026A
Bluetooth Basic Data Rate and Low Energy Module
Product Specification
Rev. 1.1
Wireless Modules



PAN1026A Bluetooth Module
Product Specification Rev. 1.1 Page 2
Overview
The PAN1026A is a Class 2 Bluetooth 4.2 Basic
Data Rate and Low Energy module for easy
implementation of Bluetooth functionality into
various electronic devices.
Features
•Bluetooth 4.2 Basic Data Rate (BR) and Low
Energy (LE)
•Embedded SPP profile
•Embedded GATT profile
•High-level API commands
•Bluetooth 4.2 (LE) embedded GATT profile with
high-level API commands, compatible with
Toshiba reference BLE profiles
•Operational temperature range -40 to +85 °C
•Operational voltage 2.7 V to 3.6 V +/- 10 %
•Power consumption Tx: 46 mA
•Dimensions 15.6 x 8.7 x 1.9 mm
•Output power 4 dBm
•-88 dBm sensitivity
•Integrated high speed crystal oscillator (26 MHz)
New Features
•Increased (2.5 x) BLE data transfer rates through
extended MTU size (64 bytes to 160 bytes)
•More complex BLE profiles possible through
extended GATT functionality
•Data base pool, number of services and
characteristics, data flow control
•Fast SPP classic connection/disconnection times
•Interlaced inquiry/page scan & extended inquiry
response
•Transmission (Tx) power control
•Improved PER (peak-error-rate) for BLE traffic
•Integration of BT 4.2 secure connecting feature
implementing ECDH technology
Bluetooth
•GAP support for SPP
•GAP Peripheral and Broadcast support for LE
•GATT server and client mode support for LE
•GAP Central and Observer not supported for LE
Interfaces
•UART, GPIO (10 input/output pins), wake-up
control pins
Block Diagram
Chip
antenna
Toshiba
TC35661
EEPROM
32 kbit
UART
GPIOs
Host wake up
Reset
32 kHz input
Wake up
Vcc 3.3 V
LPF
PAN1026A
Bluetooth 4.2 Module
Crystal
26 MHz

PAN1026A Bluetooth Module
Product Specification Rev. 1.1 Page 3
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
reserves the right to make changes as required at any time without notification. Please consult the most
recently issued Product Specification before initiating or completing a design.
© Panasonic Industrial Devices Europe GmbH 2017.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Product Specification does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation or
integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.

PAN1026A Bluetooth Module
Product Specification Rev. 1.1 Page 4
Table of Contents
1About This Document.........................................................................................................................5
1.1 Purpose and Audience ..............................................................................................................5
1.2 Revision History.........................................................................................................................5
1.3 Use of Symbols .........................................................................................................................5
1.4 Related Documents...................................................................................................................5
2Overview..............................................................................................................................................6
2.1 Block Diagram...........................................................................................................................7
2.2 Pin Configuration.......................................................................................................................8
2.3 UART Interface........................................................................................................................10
2.4 Bluetooth Features ..................................................................................................................10
3Detailed Description.........................................................................................................................11
3.1 Dimensions..............................................................................................................................11
3.2 Footprint ..................................................................................................................................12
3.3 Packaging................................................................................................................................13
3.4 Case Marking ..........................................................................................................................16
4Specification .....................................................................................................................................17
4.1 Default Test Conditions ...........................................................................................................17
4.2 Absolute Maximum Ratings.....................................................................................................17
4.3 Recommended Operating Conditions......................................................................................18
4.4 Current Consumption...............................................................................................................18
4.5 Bluetooth .................................................................................................................................19
4.6 Reliability Tests .......................................................................................................................19
4.7 Recommended Soldering Profile.............................................................................................20
5Cautions ............................................................................................................................................21
5.1 Design Notes...........................................................................................................................21
5.2 Installation Notes.....................................................................................................................21
5.3 Usage Condition Notes............................................................................................................22
5.4 Storage Notes..........................................................................................................................22
5.5 Safety Cautions .......................................................................................................................22
5.6 Other Cautions ........................................................................................................................23
5.7 Life Support Policy...................................................................................................................23
6Regulatory and Certification Information .......................................................................................24
6.1 Federal Communications Commission (FCC) for US ..............................................................24
6.2 Innovation, Science, and Economic Development (ISED) for Canada ....................................26
6.3 Japanese Radio Law Compliance...........................................................................................28
6.4 European Conformity According to RED (2014/53/EU)...........................................................29
6.5 RoHS and REACH Declaration ...............................................................................................29
7Appendix ...........................................................................................................................................30
7.1 Ordering Information................................................................................................................30
7.2 Contact Details........................................................................................................................31

PAN1026A Bluetooth Module
1 About This Document
Product Specification Rev. 1.1 Page 5
1 About This Document
1.1 Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN1026A module. It is intended for hardware design,
application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to
as “the PAN1026A” or “the module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
0.1
23.03.2017
1st preliminary version.
1.0
08.08.2017
1st release version.
1.1
05.12.2017
Added MIC ID to regulatory chapter
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product. Non-observance
can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates crossreferences within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4 Related Documents
Please refer to the Panasonic website for related documents 7.2.2 Product Information.

PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 1.1 Page 6
2 Overview
The PAN1026A is based on Toshiba´s single-chip TC35661 Bluetooth semiconductor device
with an embedded Toshiba Bluetooth SIG certified stack. The PAN1026A is a highly integrated
Dual Mode Bluetooth controller that delivers high-speed operation at ultra-low power
consumption. An embedded SPP (Serial Port Profile of Bluetooth Classic) and a GATT (Generic
Attribute Profile of Bluetooth LE) stack are integrated. The module significantly reduces external
component count and power consumption in applications requiring support of Bluetooth 4.2
standards. EDR (Enhanced Data Rate) or Central Mode are not supported. Details about iAP
integration can be provided on request. The integrated EEPROM has a Panasonic
MAC address and it can be used to store link keys.
The module allows for serving both legacy Bluetooth Classic and Bluetooth Low Energy
connections with rapid connection and disconnection, needed by a wide range of applications,
all at a small form factor. Compared to the PAN1026, the PAN1026A has additional features for
secure connections via Bluetooth LE and it is fully backwards compatible. Next to increased low
energy transfer speed, transmission power can also be controlled.
The PAN1026A module is manufactured in a small 15.6 x 8.7 x 1.9 mm SMD package with a
shielded case and it is qualified according to the Bluetooth 2.1 and 4.2 standards.
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
Further information on the variants and versions 7.1 Ordering Information.

PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 1.1 Page 7
2.1 Block Diagram
Total capacitor value: 6.7 µF +/-10 %
Total inductance: 2 NH +/-10 %
Total resistance: 220 KΩ +/-10 %
Chip
antenna
Toshiba
TC35661
EEPROM
32 kbit
UART
GPIOs
Host wake up
Reset
32 kHz input
Wake up
Vcc 3.3 V
LPF
PAN1026A
Bluetooth 4.2 Module
Crystal
26 MHz

PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 1.1 Page 8
2.2 Pin Configuration
Pin Assignment
Top View
Pin Functions
No
Pin Name
GPIO No
Pin Type
Description
A1
GND
Ground Pin
Connect to ground
A2
NC
NC
Not connected, leave open
A3
Reset
Digital Input
Reset, active low
A4
VCC
Power
analog/digital power supply connection
A5
VCC
Power
analog/digital power supply connection
A6
VCC
Power
analog/digital power supply connection
A7
GND
Ground Pin
Connect to ground
A8
NC
NC
Not connected
A9
GND
Ground Pin
Connect to ground
A11
GND
Ground Pin
Connect to ground
A12
GND
Ground Pin
Connect to ground
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4

PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 1.1 Page 9
No
Pin Name
GPIO No
Pin Type
Description
B1
NC
NC
Not connected, leave open
B2
BTS
GPIO 11
B3
BTA
GPIO 10
B4
NC
NC
Not connected, leave open
B5
NC
NC
Not connected, leave open
B6
NC
NC
Not connected, leave open
B7
NC
NC
Not connected, leave open
B8
NC
NC
Not connected, leave open
B9
NC
NC
Not connected, leave open
C1
CS0X
GPIO 17
C2
BTI
GPIO 13
C3
WIA
GPIO 12
C4
NC
NC
Not connected, leave open
C5
NC
NC
Not connected, leave open
C6
PCMCLK
GPIO 04
Digital I/O
PCM clock
C7
FSYNC
GPIO 05
Digital I/O
PCM synchronization
C8
GND
Ground Pin
Connect to ground
C9
GND
Ground Pin
Connect to ground
D1
CS1X
GPIO 18
D2
DIN
GPIO 16
D3
GPIO1
GPIO 01
Digital I/O
D4
GPIO0
Digital I/O
D5
NC
NC
Not connected, leave open
D6
PCMIN
GPIO 03
Digital Input
PCM In: Not supported
D7
GND
Ground Pin
Connect to ground
D8
GND
Ground Pin
Connect to ground
D9
ANT
RF-Signal
Antenna pin (not connected for standard version)
E1
SDA
GPIO 15
Digital I/O
I2C interface (only internal), connect to test pin
E2
SCL
GPIO 14
Digital I/O
I2C interface (only internal), connect to test pin
E3
GND
Ground Pin
Connect to ground
E4
USB
USB direct is not supported by the IC. Leave this
pin open.
E5
CLKREQ
Digital Output
Active high once crystal frequency is stable
E6
UART RXD
Digital Input
UART RXD

PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 1.1 Page 10
No
Pin Name
GPIO No
Pin Type
Description
E7
PCMOUT
GPIO 02
Digital Output
PCM Output: not supported
E8
GND
Ground Pin
Connect to ground
E9
GND
Ground Pin
Connect to ground
F1
GND
Ground Pin
Connect to ground
F2
EEPROM_WP
Digital Input
Internal EEPROM Write Protect (active high)
F3
GND
Ground Pin
Connect to ground
F4
GND
Ground Pin
Connect to ground
F5
UART CTS
Digital Input
UART CTS
F6
SLEEPCLK
Digital Input
Input clock for 32.768 KHz
F7
UARTTXD
Digital Output
UART TX
F8
UARTRTS
Digital Output
UART RTS
F9
GND
Ground Pin
Connect to ground
F11
GND
Ground Pin
Connect to ground
F12
GND
Ground Pin
Connect to ground
2.3 UART Interface
•Full-duplex 4-wire data transfer: RX, TX, RTS, CTS
•Programmable baud rate: 2 400 bps to 4.33 Mbps
•Default baud rate: 115 200 bps
•Data format: 8N1, LSB first
•Error detection: Character timeout, Overrun error, Framing error
2.4 Bluetooth Features
•Bluetooth 4.0 with SPP & GATT
•GAP support for SPP
•GATT server and client mode supported for LE
•Class 2 TX power w/o external PA (improved link robustness)
•Excellent link budget (up to 91 dB), enabling long-range applications
•GAP peripheral support for LE

PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.1 Page 11
3 Detailed Description
3.1 Dimensions
All dimensions are in millimeters.
No.
Item
Dimension
Tolerance
Remark
1
Width
8.70
± 0.20
2
Length
15.60
± 0.20
3
Height
1.80
± 0.20
With case

PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.1 Page 12
3.2 Footprint
The outer dimensions have a tolerance of 0.3 mm.
Top View
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4

PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.1 Page 13
3.3 Packaging
The product is a mass production status product and will be delivered in the package described
below.
3.3.1 Tape Dimensions
3.3.2 Packing in Tape
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
100730-PAN1720.vsd
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)

PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.1 Page 14
3.3.3 Component Direction
3.3.4 Reel Dimension

PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.1 Page 15
3.3.5 Package Label
Example
(1T)
(1P)
(2P)
(9D)
(Q)
(HW/SW)
Lot code
Customer order number, if applicable
Order number
Date code
Quantity
Hardware/software version
3.3.6 Total Package

PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.1 Page 16
3.4 Case Marking
Example
1
2
3
4
5
6
7
8
9
MIC ID
Brand name
Hardware/software version
Order number
FCC ID
Lot code
Engineering Sample marking, if applicable
Marking for Pin 1
2D barcode, for internal usage only

PAN1026A Bluetooth Module
4 Specification
Product Specification Rev. 1.1 Page 17
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1 Default Test Conditions
Temperature: 25 ± 10 °C
Humidity: 40 to 85 % RH
Supply Voltage: 3.3 V
4.2 Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
TSTOR
Storage
temperature
-40
+125
°C
VESD
ESD
robustness
All pads, according to human
body model (HBM), JEDEC
STD 22, method A114
1 000
V
According to charged device
model (CDM), JEDEC STD 22,
method C101
500
V
PRF
RF input level
+10
dBm
VDIG
Voltage on
any digital
pins
-0.3
VDD +
0.3
V

PAN1026A Bluetooth Module
4 Specification
Product Specification Rev. 1.1 Page 18
4.3 Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
TA
Ambient
operating
temperature
range
-40
+85
°C
VDD
3V3 Supply
voltage
2.7
3.3
3.6
V
4.4 Current Consumption
The current consumption depends on the user scenario and on the setup and
timing in the power modes.
Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated.
Parameter
Condition
Min.
Typ.
Max.
Units
Idle Current
After reset was pulled down.
7.8
mA
Connected
Peak Power
Sending DH5 packets. Max. output power.
62
mA
Connected
Peak Power
Sending DH3 packets. Max. output power.
61
mA
Connected
Peak Power
Sending DH1 packets. Max. output power.
55
mA
Sleep mode
activated
Sniff mode/not connected/BLE Advertising
2
mA

PAN1026A Bluetooth Module
4 Specification
Product Specification Rev. 1.1 Page 19
4.5 Bluetooth
Parameter
Condition
Min.
Typ.
Max.
Units
Operation
frequency
range
2 402
2 480
MHz
Channel
spacing
BT-Classic/BLE
1/2
MHz
Output Power
Maximum setting, measured at dual ended 50
ohm.
4
dBm
Sensitivity
-88
dBm
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
1
Spurious
emissions
Conducted measurement with a
50 Ω dual-ended load.
Complies with EN 300 328,
EN 300 440 class 2, FCC
CFR47, Part 15 and ARIB STD-
T-66.
<-30
dBm
4.6 Reliability Tests
The measurement should be done after the test device has been exposed to room temperature
and humidity for one hour.
No.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
•Freq.: 10~50 Hz; Amplitude: 1.5 mm;
20 min./cycle, 1 hrs. each of XYZ axis
•Freq.: 30~100 Hz, 6G; 20 min./cycle,
1 hrs. each of XYZ axis
2
Shock test
See above
Dropped onto hard wood from a height
of 50 cm for 3 times
3
Heat cycle test
See above
-40 °C for 30 min. and +85 °C for
30 min.; each temperature 300 cycles
4
Moisture test
See above
+60 °C, 90 % RH, 300 h
5
Low
temperature
test
See above
-40 °C, 300 h
6
High temp. test
See above
+85 °C, 300 h

PAN1026A Bluetooth Module
4 Specification
Product Specification Rev. 1.1 Page 20
4.7 Recommended Soldering Profile
•Reflow permissible cycle: 2
•Opposite side reflow is prohibited due to module weight
•More than 75 percent of the soldering area shall be coated by solder
•The soldering profiles should be adhered to in order to prevent electrical
or mechanical damage
•Soldering profile assumes lead-free soldering