Panasonic KX-TG5671S User manual

© 2006 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG5671S
KX-TG5672B
KX-TG5673B
KX-TGA560S
KX-TGA560B
5.8 GHz Digital Cordless Answering
System
Silver Version
Black Version
(for U.S.A.)
Telephone Equipment
ORDER NO. KM40601971CE
F12

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to Recognize that Pb Free Solder is Used 5
2 FOR SERVICE TECHNICIANS 6
3 CAUTION 6
4 OPERATING INSTRUCTIONS 7
4.1. Battery 7
4.2. Location of Controls 9
4.3. Displays 11
4.4. Settings 13
4.5. Troubleshooting 18
5 DISASSEMBLY INSTRUCTIONS 22
5.1. Base Unit 22
5.2. Handset 23
5.3. Charger Unit 24
6 HOW TO REPLACE THE HANDSET LCD 25
7 TROUBLESHOOTING GUIDE 26
7.1. Check Power 27
7.2. Error Message Table 27
7.3. Check Record 28
7.4. Check Playback 29
7.5. Check Sp-phone Transmission 29
7.6. Check Sp-phone Reception 30
7.7. Check Battery Charge 30
7.8. Check Link 31
7.9. Check the RF part 32
7.10. Check Handset Transmission 39
7.11. Check Handset Reception 39
7.12. Check Caller ID 39
8 ADJUSTMENT AND TEST MODE 40
8.1. Test Mode Flow Chart for Base Unit 40
8.2. Test Mode Flow Chart for Handset 44
8.3. X501 (Base Unit), X201 (Handset) Check 48
8.4. Adjust Battery Low Detector Voltage (Handset) 48
8.5. Base Unit Reference Drawing 49
8.6. Handset Reference Drawing 50
8.7. Frequency Table 51
8.8. How to Clear User Setting 53
9 DESCRIPTION 54
9.1. Frequency 54
9.2. FHSS (Frequency Hopping Spread Spectrum) 54
9.3. Signal Flowchart in the Whole System 56
10 EXPLANATION OF LINK DATA COMMUNICATION 57
10.1. Calling 57
10.2. To Terminate Communication 57
10.3. Ringing 57
11 BLOCK DIAGRAM (BASE UNIT_MAIN) 58
12 CIRCUIT OPERATION (BASE UNIT_MAIN) 59
12.1. DSP (Digital Speech/Signal Processing: IC501) 59
12.2. Flash Memory (IC601) 59
12.3. Power Supply Circuit 60
12.4. Reset Circuit 62
12.5. Telephone Line Interface 63
12.6. Auto Disconnect Circuit 64
12.7. Parallel Connection Detect Circuit 65
12.8. Calling Line Identification (Caller ID)/Call Waiting Caller ID
66
13 BLOCK DIAGRAM (BASE UNIT_RF PART) 68
14 BLOCK DIAGRAM (HANDSET_RF PART) 69
15 CIRCUIT OPERATION (RF PART) 70
15.1. Power Supply Circuit 71
15.2. 2.4GHz Mod/Demod Circuit 72
15.3. 5.8GHz Converter Circuit 73
15.4. 5.8GHz PA (Power Amplifier), 5.8GHz LNA (Low Noise
Amplifier) and Antenna Switch Circuit 74
16 BLOCK DIAGRAM (HANDSET) 75
17 CIRCUIT OPERATION (HANDSET) 76
17.1. Construction 76
17.2. Power Supply Circuit 77
17.3. Charge Circuit 78
17.4. Ringer and Handset SP-Phone 78
17.5. Sending Signal 79
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page Page
2
KX-TG5671S / KX-TG5672B / KX-TG5673B / KX-TGA560S / KX-TGA560B

17.6. Reception Signal 79
18 CIRCUIT OPERATION (CHARGER UNIT) 80
19 SIGNAL ROUTE 81
20 CPU DATA (BASE UNIT) 83
20.1. IC501 83
21 CPU DATA (HANDSET) 84
21.1. IC201 84
22 EXPLANATION OF IC TERMINALS (RF PART) 85
22.1. IC701 85
22.2. IC801 86
22.3. IC851 87
23 HOW TO REPLACE THE FLAT PACKAGE IC 88
23.1. PREPARATION 88
23.2. FLAT PACKAGE IC REMOVAL PROCEDURE 88
23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 89
23.4. BRIDGE MODIFICATION PROCEDURE 89
24 CABINET AND ELECTRICAL PARTS (BASE UNIT) 90
25 CABINET AND ELECTRICAL PARTS (HANDSET) 91
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT) 92
27 ACCESSORIES AND PACKING MATERIALS 93
27.1. KX-TG5671S 93
27.2. KX-TG5672B 94
27.3. KX-TG5673B 95
27.4. KX-TGA560B 96
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
97
28.1. Base Unit 97
28.2. Handset 97
29 REPLACEMENT PARTS LIST 98
29.1. Base Unit 98
29.2. Handset 100
29.3. Charger Unit 103
29.4. Accessories and Packing Materials 103
29.5. Fixtures and Tools 103
30 FOR SCHEMATIC DIAGRAM 105
30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN))
105
30.2. Handset (SCHEMATIC DIAGRAM (HANDSET_MAIN))
105
30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
105
31 SCHEMATIC DIAGRAM (BASE UNIT_MAIN) 106
32 SCHEMATIC DIAGRAM (BASE UNIT_RF PART) 108
33 SCHEMATIC DIAGRAM (BASE UNIT_OPERATION) 110
34 SCHEMATIC DIAGRAM (HANDSET_MAIN) 112
35 SCHEMATIC DIAGRAM (HANDSET_RF PART) 114
36 SCHEMATIC DIAGRAM (CHARGER UNIT) 116
37 CIRCUIT BOARD (BASE UNIT_MAIN) 117
37.1. Component View 117
37.2. Flow Solder Side View 118
38 CIRCUIT BOARD (BASE UNIT_OPERATION) 119
38.1. Component View 119
38.2. Flow Solder Side View 120
39 CIRCUIT BOARD (BASE UNIT_RF PART) 121
40 CIRCUIT BOARD (HANDSET_MAIN) 123
40.1. Component View 123
40.2. Flow Solder Side View 124
41 CIRCUIT BOARD (HANDSET_RF PART) 125
42 CIRCUIT BOARD (CHARGER UNIT) 126
42.1. Component View 126
42.2. Flow Solder Side View 126
3
KX-TG5671S / KX-TG5672B / KX-TG5673B / KX-TGA560S / KX-TGA560B

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• • •
• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
• • •
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• • •
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• • •
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TG5671S / KX-TG5672B / KX-TG5673B / KX-TGA560S / KX-TGA560B

1.2. How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
IC201
IC241
PbF
IC801
IC701
IC851
1
4
8
5
125
114
2815
26
50
51 75
76
100
IC246
Marked
(Component View)
Note:
The location of the “PbF”mark is subject to change without notice.
5
KX-TG5671S / KX-TG5672B / KX-TG5673B / KX-TGA560S / KX-TGA560B

2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer´s Instructions.
6
KX-TG5671S / KX-TG5672B / KX-TG5673B / KX-TGA560S / KX-TGA560B

4 OPERATING INSTRUCTIONS
4.1. Battery
4.1.1. Battery Installation/Replacement
4.1.2. Battery Charge
Note for service:
The battery strength may not be indicated correctly if the battery is disconnected and connected again, even after it is fully
charged. In that case, by recharging the battery as mentioned above, you will get a correct indication of the battery strength.
7
KX-TG5671S / KX-TG5672B / KX-TG5673B / KX-TGA560S / KX-TGA560B

4.1.3. Battery Level
4.1.4. Panasonic Battery Performance
8
KX-TG5671S / KX-TG5672B / KX-TG5673B / KX-TGA560S / KX-TGA560B

4.2. Location of Controls
4.2.1. Base Unit
9
KX-TG5671S / KX-TG5672B / KX-TG5673B / KX-TGA560S / KX-TGA560B

4.2.2. Handset
10
KX-TG5671S / KX-TG5672B / KX-TG5673B / KX-TGA560S / KX-TGA560B