Quectel EC200T Series Supplement

EC200T-AU Series
Hardware Design
LTE Standard Module Series
Version: 1.1
Date: 2020-08-10
Status: Released
www.quectel.com

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About the Document
Revision History
Version Date Author Description
1.0 2019-09-12
Jaye SANG/
Niko WU Initial
1.1 2020-08-10
Jaye SANG/
Owen WEI
1. Added related information of EC200T-AU.
2. Deleted B5 of EC200T-EU.
3. Updated the storage of SMS (Table 2)
4. Updated the pin assignment diagram (Figure 2).
5. Updated the pin description (Table 5).
6. Added the note of connecting between RTS and
CTS pins between module and MCU for hardware
flow control (Chapter 3.10).
7. Updated the comments of SD card interface pins
(Chapter 3.12).
8. The AT command used for configuring MAIN_RI
behavior (Chapter 3.17).
9. Updated the electrostatics discharge
characteristics (25 ºC, 45% Relative Humidity) of
VBAT, GND pins and all antenna interfaces (Table
41).
10. Updated the description of module storage
(Chapter 7.1)
11. Update the description of manufacturing and
soldering (Chapter 7.2).

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Contents
About the Document................................................................................................................................ 2
Contents.................................................................................................................................................... 3
Table Index ............................................................................................................................................... 5
Figure Index.............................................................................................................................................. 7
1Introduction....................................................................................................................................... 9
1.1.Safety Information................................................................................................................. 12
2Product Concept ............................................................................................................................. 14
2.1.General Description .............................................................................................................. 14
2.2.Key Features......................................................................................................................... 15
2.3.Functional Diagram ............................................................................................................... 18
2.4.Evaluation Board................................................................................................................... 18
3Application Interfaces..................................................................................................................... 19
3.1.General Description .............................................................................................................. 19
3.2.Pin Assignment ..................................................................................................................... 20
3.3.Pin Description...................................................................................................................... 21
3.4.Operating Modes .................................................................................................................. 29
3.5.Power Saving........................................................................................................................ 29
3.5.1.Sleep Mode.................................................................................................................. 29
3.5.1.1.UART Application............................................................................................... 30
3.5.1.2.USB Application with USB Remote Wakeup Function ....................................... 30
3.5.1.3.USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function. 31
3.5.1.4.USB Application without USB Suspend Function............................................... 32
3.5.2.Airplane Mode.............................................................................................................. 32
3.6.Power Supply........................................................................................................................ 33
3.6.1.Power Supply Pins....................................................................................................... 33
3.6.2.Decrease Voltage Drop................................................................................................ 33
3.6.3.Reference Design for Power Supply............................................................................ 34
3.7.Power-on/off/Reset Scenarios .............................................................................................. 35
3.7.1.Turn on Module Using the PWRKEY ........................................................................... 35
3.7.2.Turn off Module............................................................................................................ 37
3.7.2.1.Turn off Module Using the PWRKEY Pin ........................................................... 38
3.7.2.2.Turn off Module Using AT Command ................................................................. 38
3.7.3.Reset the Module......................................................................................................... 38
3.8.(U)SIM Interface.................................................................................................................... 40
3.9.USB Interface........................................................................................................................ 43
3.10.UART Interfaces.................................................................................................................... 44
3.11.PCM and I2C Interfaces........................................................................................................ 47
3.12.SD Card Interface ................................................................................................................. 49
3.13.WLAN Interface*①................................................................................................................ 51
3.14.ADC Interfaces...................................................................................................................... 52
3.15.Network Status Indication...................................................................................................... 53
3.16.STATUS ................................................................................................................................ 54

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3.17.Behaviors of the MAIN_RI..................................................................................................... 55
3.18.FORCE_USB_BOOT Interface ............................................................................................. 55
4Antenna Interfaces.......................................................................................................................... 58
4.1.Main/Rx-diversity Antenna Interfaces.................................................................................... 58
4.1.1.Pin Definition................................................................................................................ 58
4.1.2.Operating Frequency ................................................................................................... 58
4.1.3.Reference Design of RF Antenna Interface ................................................................. 61
4.1.4.Reference Design of RF Layout................................................................................... 61
4.2.Antenna Installation............................................................................................................... 63
4.2.1.Antenna Requirement.................................................................................................. 63
4.2.2.Recommended RF Connector for Antenna Installation................................................ 64
5Electrical, Reliability and Radio Characteristics.......................................................................... 66
5.1.Absolute Maximum Ratings .................................................................................................. 66
5.2.Power Supply Ratings........................................................................................................... 67
5.3.Operating and Storage Temperatures ................................................................................... 67
5.4.Current Consumption............................................................................................................ 68
5.5.RF Output Power .................................................................................................................. 79
5.6.RF Receiving Sensitivity ....................................................................................................... 81
5.7.Electrostatic Discharge ......................................................................................................... 83
6Mechanical Dimensions.................................................................................................................. 85
6.1.Mechanical Dimensions of the Module.................................................................................. 85
6.2.Recommended Footprint....................................................................................................... 87
6.3.Design Effect Drawings of the Module .................................................................................. 88
7Storage, Manufacturing and Packaging........................................................................................ 89
7.1.Storage.................................................................................................................................. 89
7.2.Manufacturing and Soldering ................................................................................................ 90
7.3.Packaging ............................................................................................................................. 92
8Appendix A References.................................................................................................................. 94
9Appendix B GPRS Coding Schemes............................................................................................. 98
10Appendix C GPRS Multi-slot Classes............................................................................................ 99
11Appendix D EDGE Modulation and Coding Schemes................................................................ 101

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Table Index
Table 1: Frequency Bands of EC200T-CN Module.................................................................................. 14
Table 2: Frequency Bands of EC200T-EU Module .................................................................................. 14
Table 3: Frequency Bands of EC200T-AU* Module................................................................................. 15
Table 4: Key Features of EC200T series Module .................................................................................... 15
Table 5: I/O Parameters Definition........................................................................................................... 21
Table 6: Pin Description........................................................................................................................... 21
Table 7: Overview of Operating Modes ................................................................................................... 29
Table 8: Power Supply and GND Pins..................................................................................................... 33
Table 9: Pin Description of PWRKEY ...................................................................................................... 35
Table 10: Pin Description of RESET_N ................................................................................................... 39
Table 11: Pin Definition of (U)SIM Interface............................................................................................. 40
Table 12: Pin Description of USB Interface ............................................................................................. 43
Table 13: Pin Definition of Main UART Interface ..................................................................................... 44
Table 14: Pin Definition of Debug UART Interface................................................................................... 45
Table 15: Logic Levels of Digital I/O ........................................................................................................ 45
Table 16: Pin Definition of PCM and I2C Interfaces................................................................................. 48
Table 17: Pin Definition of SD Card Interface .......................................................................................... 49
Table 18: Pin Definition of WLAN Interface ............................................................................................. 51
Table 19: Pin Definition of ADC Interfaces............................................................................................... 52
Table 20: Characteristic of the ADC......................................................................................................... 52
Table 21: Pin Definition of Network Connection Status/Activity Indication ............................................... 53
Table 22: Working State of Network Connection Status/Activity Indication .............................................. 53
Table 23: Pin Definition of STATUS ......................................................................................................... 54
Table 24: Behaviors of the MAIN_RI ....................................................................................................... 55
Table 25: Pin Definition of FORCE_USB_BOOT Interface...................................................................... 56
Table 26: Pin Definition of RF Antennas .................................................................................................. 58
Table 27: EC200T-CN Operating Frequencies ........................................................................................ 58
Table 28: EC200T-EU Operating Frequencies ........................................................................................ 59
Table 29: EC200T-AU* Operating Frequencies ....................................................................................... 60
Table 30: Antenna Requirements ............................................................................................................ 63
Table 31: Absolute Maximum Ratings ..................................................................................................... 66
Table 32: The Module Power Supply Ratings.......................................................................................... 67
Table 33: Operating and Storage Temperatures ...................................................................................... 67
Table 34: EC200T-CN Current Consumption .......................................................................................... 68
Table 35：EC200T-EU Current Consumption ......................................................................................... 71
Table 36：EC200T-AU Current Consumption ......................................................................................... 75
Table 37: EC200T-CN RF Output Power................................................................................................. 79
Table 38: EC200T-EU RF Output Power ................................................................................................. 80
Table 39: EC200T-AU* RF Output Power................................................................................................ 80

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Table 40: EC200T-CN Conducted RF Receiving Sensitivity.................................................................... 81
Table 41: EC200T-EU Conducted RF Receiving Sensitivity.................................................................... 82
Table 42: EC200T-AU* Conducted RF Receiving Sensitivity .................................................................. 82
Table 43: Electrostatics Discharge Characteristics (25 ºC, 45% Relative Humidity)................................ 84
Table 44: Recommended Thermal Profile Parameters............................................................................ 91
Table 45: Related Documents ................................................................................................................. 94
Table 46: Terms and Abbreviations.......................................................................................................... 94
Table 47: Description of Different Coding Schemes ................................................................................ 98
Table 48: GPRS Multi-slot Classes.......................................................................................................... 99
Table 49: EDGE Modulation and Coding Schemes............................................................................... 101

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Figure Index
Figure 2: EC200T Series Module Pin Assignment (Top View)................................................................. 20
Figure 3: Sleep Mode Application via UART............................................................................................ 30
Figure 4: Sleep Mode Application with USB Remote Wakeup................................................................. 31
Figure 5: Sleep Mode Application with MAIN_RI..................................................................................... 31
Figure 6: Sleep Mode Application without Suspend Function.................................................................. 32
Figure 7: Power Supply Limits during Burst Transmission ...................................................................... 34
Figure 8: Star Structure of Power Supply ................................................................................................ 34
Figure 9: Reference Circuit of Power Supply .......................................................................................... 35
Figure 10: Reference Circuit of Turing on the Module Using Driving Circuit............................................ 36
Figure 11: Reference Circuit of Turing on the Module Using Keystroke .................................................. 36
Figure 12: Timing of Turning on Module .................................................................................................. 37
Figure 13: Timing of Turning off Module .................................................................................................. 38
Figure 14: Reference Circuit of Resetting the Module by Using Driving Circuit....................................... 39
Figure 15: Reference Circuit of Resetting the Module by Using Keystroke ............................................. 39
Figure 16: Timing of Resetting Module.................................................................................................... 40
Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector......................... 41
Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector........................... 42
Figure 19: Reference Circuit of USB Application ..................................................................................... 43
Figure 20: Reference Circuit with Translator Chip................................................................................... 46
Figure 21: Reference Circuit with Transistor Circuit ................................................................................ 46
Figure 22: Primary Mode Timing ............................................................................................................. 47
Figure 23: Reference Circuit of PCM Application with Audio Codec........................................................ 48
Figure 24: Reference Circuit of SD Card Interface .................................................................................. 50
Figure 25: Reference Circuit of Network Status Indication ...................................................................... 54
Figure 26: Reference Circuits of STATUS ............................................................................................... 54
Figure 27: Reference Circuit of FORCE_USB_BOOT Interface.............................................................. 56
Figure 28: Timing Sequence for Entering Emergency Download Mode .................................................. 56
Figure 29: Reference Circuit of RF Antenna Interface............................................................................. 61
Figure 30: Microstrip Design on a 2-layer PCB ....................................................................................... 62
Figure 31: Coplanar Waveguide Design on a 2-layer PCB...................................................................... 62
Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 62
Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 63
Figure 34: Dimensions of U.FL-R-SMT Connector (Unit: mm) ................................................................ 64
Figure 35: Mechanicals of U.FL-LP Connectors...................................................................................... 65
Figure 36: Space Factor of Mated Connector (Unit: mm) ........................................................................ 65
Figure 37: Module Top and Side Dimensions .......................................................................................... 85
Figure 38: Module Bottom Dimensions (Bottom View) ............................................................................ 86
Figure 39: Recommended Footprint (Top View) ...................................................................................... 87
Figure 40: Top View of the Module .......................................................................................................... 88
Figure 41: Bottom View of the Module .................................................................................................... 88
Figure 42: Recommended Reflow Soldering Thermal Profile.................................................................. 90

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Figure 43: Tape Specifications................................................................................................................. 92
Figure 44: Reel Specifications................................................................................................................. 92
Figure 45: Tape and Reel Directions ....................................................................................................... 93

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1Introduction
This document defines the EC200T series module and describes its air interface and hardware interfaces
which are connected with your applications.
This document can help you quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EC200T series module. Associated with
application note and user guide, you can use EC200T series module to design and set up wireless
applications easily.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based time-
averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements
of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body
and must not transmit simultaneously with any other antenna or transmitter.
3.A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR202011EC200TAU.
4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
❒GSM850 :≤8.571dBi
❒GSM1900 :≤10.03dBi
❒ LTE Band2/25:≤11.000dBi

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❒ WCDMA Band II/LTE Band2/ LTE Band 7 :≤8.000dBi
❒ WCDMA Band IV/ LTE Band 4 / LTE Band 66:≤5.000dBi
❒ WCDMA Band V / LTE Band 5:≤9.541dBi
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions
explaining to the OEM the labeling requirements, options and OEM user manual instructions that are
required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC
ID: XMR202011EC200TAU” or “Contains FCC ID: XMR202011EC200TAU” must be used. The host
OEM user manual must also contain clear instructions on how end users can find and/or access the
module and the FCC ID.

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The final host / module combination may also need to be evaluated against the FCC Part 15B criteria
for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the
user that changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment. In cases where the manual is provided only in
a form other than paper, such as on a computer disk or over the Internet, the information required by
this section may be included in the manual in that alternative form, provided the user can reasonably be
expected to have the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.

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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating EC200T series module. Manufacturers of the
cellular terminal should notify users and operating personnel of the following safety information by
incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft. 
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergent help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.

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In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as mobile phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders.

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2Product Concept
2.1. General Description
EC200T is a series of LTE-FDD, LTE-TDD, WCDMA and GSM wireless communication module with
receive diversity, which provides data connectivity on LTE-FDD, LTE-TDD, HSDPA, HSUPA, HSPA+,
WCDMA, EDGE and GPRS networks. It also provides voice functionality for your specific applications.
EC200T series contains 3 variants: EC200T-CN, EC200T-EU and EC200T-AU*. You can choose a
dedicated type based on the region or operator. The following table shows the frequency bands of
EC200T series module.
Table 1: Frequency Bands of EC200T-CN Module
Table 2: Frequency Bands of EC200T-EU Module
Network Type Bands
LTE-FDD (with Rx-diversity)1) B1/B3/B5/B8
LTE-TDD (with Rx-diversity)1) B34/B38/B39/B40/B41
WCDMA B1/B5/B8
GSM 900/1800MHz
Network Type Bands
LTE-FDD (with Rx-diversity)1) B1/B3/B7/B8/B20/B28
LTE-TDD (with Rx-diversity)1) B38/B40/B41
WCDMA B1/B8
GSM 900/1800MHz

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Table 3: Frequency Bands of EC200T-AU*Module
With a compact profile of 29.0 mm × 32.0 mm × 2.4 mm, EC200T series can meet almost all requirements
for M2M applications such as automotive, metering, tracking system, security, router, wireless POS,
mobile computing device, PDA phone, tablet PC, etc.
EC200T series is an SMD type module which can be embedded into applications through its 144-pin pads,
including 80 LCC signal pads and 64 LGA pads.
1. 1) Rx-diversity is optional.
2. “*” means under development.
2.2. Key Features
The following table describes the detailed features of EC200T series module.
Table 4: Key Features of EC200T series Module
Feature Details
Power Supply Supply voltage: 3.4–4.5 V
Typical supply voltage: 3.8 V
Transmitting Power
Class 4 (33 dBm ±2 dB) for EGSM900/GSM850
Class 1 (30 dBm ±2 dB) for DCS1800/PCS1900
Class E2 (27 dBm ±3 dB) for EGSM900/850 8-PSK
Class E2 (26 dBm ±3 dB) for DCS1800/PCS1900 8-PSK
Class 3 (24 dBm +1/-3 dB) for WCDMA bands
Class 3 (23 dBm ±2 dB) for LTE-FDD bands
Class 3 (23 dBm ±2 dB) for LTE-TDD bands
Network Type Bands
LTE-FDD (with Rx-diversity)1) B1/B2/B3/B4/B5/B7/B8/B28/B66
LTE-TDD (with Rx-diversity)1) B40
WCDMA B1/B2/B4/B5/B8
GSM 850/900/1800/1900 MHz
NOTES

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LTE Features
Supports up to non-CA Cat 4 FDD and TDD
Supports 1.4/3/5/10/15/20 MHz RF bandwidth
Supports MIMO in DL direction
FDD: Max. 150 Mbps (DL), Max. 50 Mbps (UL)
TDD: Max. 130 Mbps (DL), Max. 30 Mbps (UL)
UMTS Features
Supports 3GPP R7 HSDPA, HSUPA, HSPA+ and WCDMA
Supports QPSK, 16-QAM modulation
HSPA+: Max. 21 Mbps (DL)
HSUPA: Max. 5.76 Mbps (UL)
WCDMA: Max. 384 kbps (DL), Max. 384 kbps (UL)
GSM Features
GPRS:
Supports GPRS multi-slot class 12
Coding scheme: CS-1/CS-2/CS-3/CS-4
Max. 85.6 kbps (DL), Max. 85.6 kbps (UL)
EDGE:
Supports EDGE multi-slot class 12
Supports GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: MCS 1-9
Uplink coding schemes: MCS 1-9
Max. 236.8 Kbps (DL), Max. 236.8 Kbps (UL)
Internet Protocol
Features
Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CMUX/HTTPS/FTPS/
SSL/FILE/MQTT/MMS/SMTP*/SMTPS* protocols
Supports PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connection
SMS
Text and PDU mode
Point-to-point MO and MT
SMS cell broadcast
SMS storage: ME&SM
(U)SIM Interface Supports USIM/SIM card: 1.8 V, 3.0 V
Audio Features
Supports one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
WCDMA: AMR/AMR-WB
Supports echo cancellation and noise suppression
PCM Interface
Used for audio function with external codec
Supports 16-bit linear data format
Supports short frame synchronization
Supports master and slave modes
USB Interface
Compliant with USB 2.0 specification (slave only); the data transfer rate can
reach up to 480 Mbps
Used for AT command communication, data transmission, software
debugging, firmware upgrade

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Supports USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1–4.14,
Android 4.x/5.x/6.x/7.x/8.x/9.x, etc.
UART Interfaces
Main UART:
Used for AT command communication and data transmission
Baud rates reach up to 1 Mbps, 115200 bps by default
Supports RTS and CTS hardware flow control
Debug UART:
Used for the output of partial logs
115200 bps baud rate
SD Card Interface Supports SD 3.0 protocol
WLAN Interface* Supports SDIO 3.0 interface for WLAN
Rx-diversity Supports LTE Rx-diversity
AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Network Indication NET_MODE and NET_STATUS used to indicate the network connectivity
status
Antenna Interfaces
Main antenna interface (ANT_MAIN) and Rx-diversity antenna interface
(ANT_DIV)
50Ωimpedance
Physical Characteristics Size: (29.0 ±0.15) mm × (32.0 ±0.15) mm × (2.4 ±0.2) mm
Weight: approx. 4.4 g
Temperature Range
Operation temperature range: -35 °C to +75 °C1)
Extended temperature range: -40 °C to +85 °C2)
Storage temperature range: -40 °C to +90 °C
Firmware Upgrade USB interface or FOTA
RoHS All hardware components are fully compliant with EU RoHS directive
1. 1) Within operating temperature range, the module is 3GPP compliant.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain
functions such as voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to
the normal operating temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
NOTES

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2.3. Functional Diagram
The following figure shows a block diagram of EC200T series and illustrates the major functional parts.
Power management
Baseband
Flash
Radio frequency
Peripheral interfaces
2.4. Evaluation Board
In order to help you develop applications with EC200T series, Quectel provides an evaluation board
(UMTS & LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control
or test the module. For more details, see document [4].

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3Application Interfaces
3.1. General Description
EC200T series is equipped with 80 LCC pins plus 64 LGA pins that can be connected to cellular
application platform. The subsequent chapters will provide detailed descriptions of the following
interfaces.
Power supply
(U)SIM interface
USB interface
UART interfaces
PCM and I2C interfaces
SD card interface
WLAN interface*
ADC interfaces
Status indication
FORCE_USB_BOOT interface
“*” means under development.
NOTE