Quectel EG91 Series Supplement

EG91 Series
Hardware Design
LTE Standard Module Series
Version: 2.1
Date: 2021-11-05
Status: Released

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Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or

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metal powders.

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About the Document
Revision History
Version Date Author Description
1.0 2017-03-22 Barret XIONG/
Rex WANG Initial
1.1 2018-01-23 Barret XIONG/
Rex WANG
1. Added band B28A.
2. Updated the description of UMTS and GSM
features in Table 2.
3. Updated the functional diagram in Figure 1.
4. Updated module operating frequencies in
Table 21.
5. Updated current consumption in Table 26.
6. Updated RF output power in Table 27.
7. Updated the conducted RF receiving
sensitivity in Table 28.
8. Updated the GPRS multi-slot classes in
Table 33.
9. Added thermal consideration in Chapter 5.8
10. Added a GND pad in each of the four corners
of the module’s footprint in Chapter 6.2.
11. Updated storage information in Chapter 7.1.
12. Added packaging information in Chapter 7.3.
1.2 2018-03-14 Barret XIONG/
Rex WANG
1. Added the description of EG91-NA.
2. Updated the functional diagram in Figure 1.
3. Updated pin assignment in Figure 2.
4. Updated GNSS function in Table 1.
5. Updated GNSS Features in Table 2.
6. Updated reference circuit of USB interface
in Figure 21.
7. Added description of GNSS receiver in
Chapter 4.
8. Updated pin definition of RF antenna in
Table 21.

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9. Updated module operating frequencies in
Table 22.
10. Added description of GNSS antenna
interface in Chapter 5.2.
11. Updated antenna requirements in Table 25.
12. Updated RF output power in Table 32.
1.3 2019-02-03 Barret XIONG/
Rex WANG
1. Added new variants EG91-NS, EG91-V,
EG91-EC and related contents.
2. Opened pin 24 as ADC0 and added related
contents.
3. Updated functional diagram (Figure 1)
4. Updated pin assignment (Figure 2)
5. Updated GNSS features (Table 2)
6. Added USB_BOOT interface information
(Chapter 3.18)
7. Updated storage information (Chapter 8.1)
8. Updated module operating frequencies
(Table 23)
9. Updated antenna requirements (Table 26)
10. Added current consumption of EG91-NS,
EG91-V and EG91-EC (Table 32, 33 and 34)
11. Added conducted RF receiving sensitivity of
EG91-NS, EG91-V and EG91-EC (Table 40,
41 and 42)
1.4 2019-03-29 Barret XIONG/
Rex WANG
1. Modified module name EG91-EC to
EG91-EX, and EG91-V to EG91-VX
2. Added newly supported 9.x of Android USB
serial driver (Table 2)
3. Modified the reflow temperature range as .
238ºC to 245ºC (Chapter 8.2)
1.5 2019-05-24 Barret XIONG/
Rex WANG
1. Updated comment of RF antenna (Table 4)
2. Updated EG91-EX current consumption
(Table 36)
3. Updated EG91-EX conducted RF receiving
sensitivity (Table 44)
1.6 2019-07-05 Barret XIONG/
Rex WANG
1. Updated supported protocols (Table 2).
2. Updated timing of turning on module (Figure
12).
3. DFOTA is developed.
4. Updated description of USB_BOOT
interface and timing sequence for entering
emergency download mode (Chapter 3.18
and Figure 29).

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1.7 2019-08-09 Barret XIONG/
Rex WANG
1. Added ThreadX variant EG91-NAX and
updated related contents (Table 1 and 4,
Chapter 2.2, 2.3, 3.2 and 5).
2. Added related notes of SPI interface not
supported on ThreadX modules (Chapter
3.1, 3.3 and 3.13).
3. Added current consumption of EG91-NAX
(Table 37).
4. Updated EG91-NA conducted RF receiving
sensitivity (Table 41).
5. Updated EG91-NS conducted RF receiving
sensitivity (Table 42).
6. Added EG91-NAX conducted RF receiving
sensitivity (Table 45).
1.8 2019-11-07 Barret XIONG/
Rex WANG
1. Removed related information of ThreadX
OS.
2. Updated the supported USB serial drivers
(Table 2)
3. Updated the notes for GNSS performance
(Chapter 4.2).
4. Updated the AT command be used to disable
the receive diversity (Chapter 5.1.3).
5. Updated the current consumption of
LTE-FDD B13 (Table 43).
1.9 2020-10-21 Barret XIONG/
Rex WANG
1. Removed related information of EG91-NS
module according to product promotion
strategy.
2. Added EG91-AUX and related information
(Table 1, 39 and 48).
3. Added EG91-NAXD and related information
(Table 1, 37 and 47).
4. Updated pin assignment (Top View) (Figure
2)
5. Updated the AT command for the operation
of ANT_MAIN and ANT_DIV (Chapter
5.1.3).
6. Added EG91-EX/-NA/-VX/-NAX/-NAXD/-AUX
bottom dimensons (Figure 43).
7. Added the note about the standard that the
package warpage level of the module
conforms to (Chapter 7.1).
8. Updated top view of the module (Figure 45).
9. Added EG91-EX/-NA/-VX/-NAX/-NAXD/-AUX
bottom view (Figure 47).

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10. Updated module storage information
(Chapter 8.1).
11. Updated the cooling down slope of reflow
soldering thermal profile;
Added a note to clarify the precautions if a
conformal coating is necessary for the module
(Chapter 8.2).
2.0 2021-07-01 Barret XIONG/
Rex WANG
1. Added the related information of EG91-NAL
in the whole document.
2. Added the note of BOOT_CONFIG (Chapter
3.3&3.7.1)
2.1
2021-07-28 Barret XIONG/
Rex WANG
1. Updated supported USB serial drivers for
Linux (Table 2).
2. Updated EG91-E bottom dimensions (top
view) (Figure 42).
3. Updated EG91-AUX/-EX/-NA/-NAL/-NAX/
-NAXD/-VX bottom dimensions (top view)
(Figure 43).
2021-11-05 Lark YU/
Frank WANG Added the sub-module of EG91-NAXDL.

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Contents
Safety Information...................................................................................................................................................... 3
About the Document..................................................................................................................................................5
Contents........................................................................................................................................................................9
Table Index................................................................................................................................................................. 11
Figure Index............................................................................................................................................................... 13
1 Introduction....................................................................................................................................................... 15
2 Product Concept...............................................................................................................................................17
2.1. General Description..............................................................................................................................17
2.2. Key Features......................................................................................................................................... 18
2.3. Functional Diagram.............................................................................................................................. 21
2.4. Evaluation Board...................................................................................................................................22
3 Application Interfaces.....................................................................................................................................23
3.1. General Description..............................................................................................................................23
3.2. Pin Assignment..................................................................................................................................... 24
3.3. Pin Description...................................................................................................................................... 25
3.4. Operating Modes.................................................................................................................................. 32
3.5. Power Saving........................................................................................................................................ 32
3.5.1. Sleep Mode................................................................................................................................. 32
3.5.2. Airplane Mode.............................................................................................................................35
3.6. Power Supply........................................................................................................................................ 36
3.6.1. Power Supply Pins.....................................................................................................................36
3.6.2. Decrease Voltage Drop............................................................................................................. 36
3.6.3. Reference Design for Power Supply.......................................................................................38
3.6.4. Monitor the Power Supply.........................................................................................................38
3.7. Power-on/off Scenarios....................................................................................................................... 38
3.7.1. Turn on Module Using the PWRKEY......................................................................................38
3.7.2. Turn off Module...........................................................................................................................40
3.8. Reset the Module..................................................................................................................................42
3.9. (U)SIM Interfaces..................................................................................................................................43
3.10. USB Interface........................................................................................................................................ 46
3.11. UART Interfaces................................................................................................................................... 47
3.12. PCM and I2C Interfaces...................................................................................................................... 49
3.13. SPI Interface.......................................................................................................................................... 52
3.14. Network Status Indication....................................................................................................................53
3.15. STATUS................................................................................................................................................. 54
3.16. ADC Interface........................................................................................................................................54
3.17. Behaviors of RI......................................................................................................................................55
3.18. USB_BOOT Interface.......................................................................................................................... 56
4 GNSS Receiver..................................................................................................................................................58

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4.1. General Description..............................................................................................................................58
4.2. GNSS Performance..............................................................................................................................58
4.3. Layout Guidelines................................................................................................................................. 59
5 Antenna Interfaces...........................................................................................................................................60
5.1. Main/Rx-diversity Antenna Interfaces............................................................................................... 60
5.1.1. Pin Definition............................................................................................................................... 60
5.1.2. Operating Frequency.................................................................................................................61
5.1.3. Reference Design of RF Antenna Interface...........................................................................62
5.2. GNSS Antenna Interface.....................................................................................................................63
5.3. Reference Design of RF Layout.........................................................................................................64
5.4. Antenna Installation..............................................................................................................................66
5.4.1. Antenna Requirement................................................................................................................66
5.4.2. Recommended RF Connector for Antenna Installation.......................................................67
6 Reliability,Radio and Electrical Characteristics..................................................................................... 69
6.1. Absolute Maximum Ratings................................................................................................................ 69
6.2. Power Supply Ratings..........................................................................................................................69
6.3. Operating and Storage Temperatures.............................................................................................. 70
6.4. Current Consumption...........................................................................................................................70
6.5. RF Output Power.................................................................................................................................. 83
6.6. RF Receiving Sensitivity......................................................................................................................84
6.7. Electrostatic Discharge........................................................................................................................ 88
6.8. Thermal Consideration........................................................................................................................ 89
7 Mechanical Dimensions................................................................................................................................. 92
7.1. Mechanical Dimensions of the Module............................................................................................. 92
7.2. Recommended Footprint.....................................................................................................................95
7.3. Top and Bottom Views of the Module............................................................................................... 96
8 Storage, Manufacturing and Packaging.................................................................................................... 98
8.1. Storage................................................................................................................................................... 98
8.2. Manufacturing and Soldering..............................................................................................................99
8.3. Packaging............................................................................................................................................ 100
9 Appendix References....................................................................................................................................103

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Table Index
Table 1: Frequency Bands of EG91 Series Module............................................................................................ 18
Table 2: Key Features of EG91 Series Module.................................................................................................... 19
Table 3: Definition of I/O Parameters..................................................................................................................... 25
Table 4: Pin Description............................................................................................................................................26
Table 5: Overview of Operating Modes..................................................................................................................32
Table 6: Pin Definition of VBAT and GND............................................................................................................. 36
Table 7: Pin Definition of PWRKEY........................................................................................................................ 39
Table 8: Pin Definition of RESET_N.......................................................................................................................42
Table 9: Pin Definition of (U)SIM Interfaces.......................................................................................................... 43
Table 10: Pin Definition of USB Interface.............................................................................................................. 46
Table 11: Pin Definition of Main UART Interfaces................................................................................................ 47
Table 12: Pin Definition of Debug UART Interface...............................................................................................48
Table 13: Pin Definition of PCM and I2C Interfaces............................................................................................ 51
Table 14: Pin Definition of SPI Interface................................................................................................................52
Table 15: Pin Definition of Network Status Indicator........................................................................................... 53
Table 16: Working State of Network Status Indicator..........................................................................................53
Table 17: Pin Definition of STATUS........................................................................................................................54
Table 18: Pin Definition of ADC Interface.............................................................................................................. 54
Table 19: Characteristics of ADC Interface........................................................................................................... 55
Table 20: Default Behaviors of RI........................................................................................................................... 55
Table 21: Pin Definition of USB_BOOT Interface.................................................................................................56
Table 22: GNSS Performance................................................................................................................................. 58
Table 23: Pin Definition of RF Antenna.................................................................................................................. 60
Table 24: Module Operating Frequencies............................................................................................................. 61
Table 25: Pin Definition of GNSS Antenna Interface........................................................................................... 63
Table 26: GNSS Frequency..................................................................................................................................... 63
Table 27: Antenna Requirements............................................................................................................................66
Table 28: Absolute Maximum Ratings....................................................................................................................69
Table 29: Power Supply Ratings.............................................................................................................................69
Table 30: Operating and Storage Temperatures.................................................................................................. 70
Table 31: EG91-AUX Current Consumption......................................................................................................... 70
Table 32: EG91-E Current Consumption...............................................................................................................74
Table 33: EG91-EX Current Consumption............................................................................................................ 75
Table 34: EG91-NA Current Consumption............................................................................................................ 77
Table 35: EG91-NAL Current Consumption..........................................................................................................79
Table 36: EG91-NAX Current Consumption......................................................................................................... 79
Table 37: EG91-NAXD Current Consumption...................................................................................................... 80
Table 38: EG91-NAXDL Current Consumption.................................................................................................... 81
Table 39: EG91-VX Current Consumption............................................................................................................ 82
Table 40: GNSS Current Consumption of EG91 Series Module.......................................................................83
Table 41: RF Output Power......................................................................................................................................83
Table 42: EG91-AUX Conducted RF Receiving Sensitivity............................................................................... 84

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Table 43: EG91-E Conducted RF Receiving Sensitivity..................................................................................... 85
Table 44: EG91-EX Conducted RF Receiving Sensitivity.................................................................................. 85
Table 45: EG91-NA Conducted RF Receiving Sensitivity.................................................................................. 86
Table 46: EG91-NAL Conducted RF Receiving Sensitivity................................................................................ 86
Table 47: EG91-NAX Conducted RF Receiving Sensitivity............................................................................... 87
Table 48: EG91-NAXD Conducted RF Receiving Sensitivity.............................................................................87
Table 49: EG91-NAXDL Conducted RF Receiving Sensitivity.......................................................................... 88
Table 50: EG91-VX Conducted RF Receiving Sensitivity.................................................................................. 88
Table 51: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 45 %)........................... 89
Table 52: Recommended Thermal Profile Parameters.....................................................................................100
Table 53: Related Documents............................................................................................................................... 103
Table 54: Terms and Abbreviations...................................................................................................................... 103

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Figure Index
Figure 1: Functional Diagram ................................................................................................................................ 22
Figure 2: Pin Assignment (Top View)..................................................................................................................... 24
Figure 3: Sleep Mode Application via UART.........................................................................................................33
Figure 4: Sleep Mode Application with USB Remote Wakeup.......................................................................... 33
Figure 5: Sleep Mode Application with RI..............................................................................................................34
Figure 6: Sleep Mode Application without Suspend Function........................................................................... 35
Figure 7: Power Supply Limits during Burst Transmission.................................................................................37
Figure 8: Star Structure of Power Supply..............................................................................................................37
Figure 9: Reference Circuit of Power Supply....................................................................................................... 38
Figure 10: Turn on the Module Using Driving Circuit.......................................................................................... 39
Figure 11: Turn on the Module Using A Button.....................................................................................................39
Figure 12: Power-up Timing.....................................................................................................................................40
Figure 13: Power-down Timing............................................................................................................................... 41
Figure 14: Reference Circuit of RESET_N by Using Driving Circuit................................................................ 42
Figure 15: Reference Circuit of RESET_N by Using A Button...........................................................................42
Figure 16: Timing of Resetting the Module........................................................................................................... 43
Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector............................. 44
Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector............................... 45
Figure 19: Reference Circuit of USB Interface..................................................................................................... 46
Figure 20: Reference Circuit with Translator Chip...............................................................................................48
Figure 21: Reference Circuit with Transistor Circuit............................................................................................49
Figure 22: Primary Mode Timing.............................................................................................................................50
Figure 23: Auxiliary Mode Timing............................................................................................................................50
Figure 24: Reference Circuit of PCM Application with Audio Codec................................................................ 51
Figure 25: Reference Circuit of SPI Interface with Peripherals......................................................................... 52
Figure 26: Reference Circuit of Network Status Indication................................................................................ 53
Figure 27: Reference Circuit of STATUS...............................................................................................................54
Figure 28: Reference Circuit of USB_BOOT Interface....................................................................................... 56
Figure 29: Emergency Download Mode Timing................................................................................................... 57
Figure 30: Reference Circuit of RF Antenna Interface........................................................................................62
Figure 31: Reference Circuit of GNSS Antenna...................................................................................................63
Figure 32: Microstrip Design on a 2-layer PCB....................................................................................................64
Figure 33: Coplanar Waveguide Design on a 2-layer PCB................................................................................64
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground).......................65
Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).......................65
Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm)................................................................... 67
Figure 37: Mechanicals of U.FL-LP Connectors.................................................................................................. 67
Figure 38: Space Factor of Mated Connector (Unit: mm).................................................................................. 68
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)................................................90
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)............................90
Figure 41: Module Top and Side Dimensions.......................................................................................................92

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Figure 42: EG91-E Bottom Dimensions (Top View)............................................................................................ 93
Figure 43: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom Dimensions (Top View)................ 94
Figure 44: Recommended Footprint (Top View).................................................................................................. 95
Figure 45: Top View of the Module......................................................................................................................... 96
Figure 46: EG91-E Bottom View.............................................................................................................................96
Figure 47: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom View.................................................97
Figure 48: Recommended Reflow Soldering Thermal Profile........................................................................... 99
Figure 49: Tape Dimensions..................................................................................................................................101
Figure 50: Reel Dimensions.................................................................................................................................. 101
Figure 51: Tape and Reel Directions....................................................................................................................102

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1Introduction
This document defines the EG91 series module and describes its air interface and hardware interface
which are connected with your applications.
This document can help you quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EG91 series module. With application note and
user guide, you can use EG91 series module to design and set up mobile applications easily.
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based
timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion
Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s
body and must not transmit simultaneously with any other antenna or transmitter.
3. A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR2021EG91NAXDL
4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
❒LTE Band 2 :≤8.500dBi
❒LTE Band 4:≤5.500dBi
❒LTE Band 5 :≤9.908dBi
❒LTE Band 12 :≤9.197 dBi
❒LTE Band 13:≤9.656dBi
❒LTE Band 25:≤8.000dBi
❒LTE Band 26(Part 22):≤9.408dBi
❒LTE Band 26(Part 90):≤9.361dBi
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and conditions that
must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating configurations,
including portable configurations with respect to 2.1093 and different antenna configurations.

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For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently
affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling
requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling
requirements, options and OEM user manual instructions that are required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when
installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used
methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent
label referring to the enclosed module: “Contains Transmitter Module FCC ID: XMR2021EG91NAXDL” or
“Contains FCC ID: XMR2021EG91NAXDL” must be used. The host OEM user manual must also contain clear
instructions on how end users can find and/or access the module and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that
changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as
on a computer disk or over the Internet, the information required by this section may be included in the manual in
that alternative form, provided the user can reasonably be expected to have the capability to access information in
that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the
equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as
an unintentional radiator under the Supplier’s Declaration of Conformity procedure without a transmitter certified
module and a module is added, the host manufacturer is responsible for ensuring that the after the module is
installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove
this RF module in the user’s manual of the end product which integrates this module. The end user manual shall
include all required regulatory information/warning as show in this manual.
IC Statement
IRSS-GEN
"This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two
conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including
interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR
d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux
conditions suivantes :
1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement."
Déclaration sur l'exposition aux rayonnements RF

LTE Standard Module Series
EG91_Series_Hardware_Design 17 / 105
L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toutes
les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre
émetteur.
The host product shall be properly labeled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible
at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation,
Science and Economic Development Canada certification number for the module, preceded by the word “Contains”
or similar wording expressing the same meaning, as follows:
“Contains IC: 10224A-21EG91NAXDL” or “where: 10224A-21EG91NAXDL is the module’s certification
number”.
Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.
L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module doit être
clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte doit porter une
étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement économique Canada pour le
module, précédé du mot «Contient» ou d'un libellé semblable exprimant la même signification, comme suit:
"Contient IC: 10224A-21EG91NAXDL " ou "où: 10224A-21EG91NAXDL est le numéro de certification du
module".
❒LTE Band 2 :≤8.500dBi
❒LTE Band 4:≤5.500dBi
❒LTE Band 5 :≤6.600dBi
❒LTE Band 12 :≤6.110dBi
❒LTE Band 13:≤6.44 dBi
❒LTE Band 25:≤8.000dBi
❒LTE Band 26:≤6.06dBi
2Product Concept
2.1. General Description
EG91 series module is an embedded 4G wireless communication module with receive diversity. It
supports LTE-FDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD,
DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice
functionality 1to meet your specific application demands. The following table shows the frequency bands
1EG91 series module contains Data + Voice version and Data-only version. Data + Voice version supports voice and
data functions, while Data-only version only supports data function.

LTE Standard Module Series
EG91_Series_Hardware_Design 18 / 105
of EG91 series module.
Table 1: Frequency Bands of EG91 Series Module
With a compact profile of 29.0 mm × 25.0 mm × 2.3 mm, EG91 series module can meet almost all
requirements for M2M applications such as automotive, smart metering, tracking system, security, router,
wireless POS, mobile computing device, PDA phone, tablet PC, etc.
EG91 series module is an SMD type module which can be embedded into applications through its 106
LGA pins.
EG91 series module is integrated with internet service protocols like TCP, UDP and PPP. Extended AT
commands have been developed for you to use these internet service protocols easily.
2.2. Key Features
2GNSS function is optional.
3EG91-AUX does not support Rx-diversity.
Module LTE Bands
(with Rx-diversity)
WCDMA
(with Rx-diversity) GSM GNSS 2
EG91-AUX 3
FDD:
B1/B2/B3/B4/B5/B7/B8/
B28/B66
B1/B2/B5/B8 850/900/1800/
1900 MHz
GPS,
GLONASS,
BeiDou,
Galileo,
QZSS
EG91-E FDD:
B1/B3/B7/B8/B20/B28A B1/B8 900/1800 MHz -
EG91-EX FDD:B1/B3/B7/B8/B20/B28 B1/B8 900/1800 MHz
GPS,
GLONASS,
BeiDou,
Galileo,
QZSS
EG91-NA FDD: B2/B4/B5/B12/B13 B2/B4/B5 -
EG91-NAL FDD: B2/B4/B5/B12/B13 - -
EG91-NAX FDD:
B2/B4/B5/B12/B13/B25/B26 B2/B4/B5 -
EG91-NAXD FDD:
B2/B4/B5/B12/B13/B25/B26 B2/B4/B5 -
EG91-NAXDL FDD:
B2/B4/B5/B12/B13/B25/B26 - -
EG91-VX FDD: B4/B13 - -

LTE Standard Module Series
EG91_Series_Hardware_Design 19 / 105
The following table describes the detailed features of EG91 series module.
Table 2: Key Features of EG91 Series Module
Feature Details
Power Supply
Supply voltage: 3.3–4.3 V
Typical supply voltage: 3.8 V
Transmitting Power
Class 4 (33 dBm ±2 dB) for GSM850
Class 4 (33 dBm ±2 dB) for EGSM900
Class 1 (30 dBm ±2 dB) for DCS1800
Class 1 (30 dBm ±2 dB) for PCS1900
Class E2 (27 dBm ±3 dB) for GSM850 8-PSK
Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK
Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK
Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK
Class 3 (24 dBm +1/-3 dB) for WCDMA bands
Class 3 (23 dBm ±2 dB) for LTE-FDD bands
LTE Features
Support up to non-CA Cat 1 FDD
Support 1.4/3/5/10/15/20 MHz RF bandwidth
LTE-FDD: Max. 10 Mbps (DL), Max. 5 Mbps (UL)
UMTS Features
Support 3GPP Rel-8 DC-HSDPA, HSPA+, HSDPA, HSUPA and
WCDMA
Support QPSK, 16QAM and 64QAM modulation
DC-HSDPA: Max. 42 Mbps (DL)
HSUPA: Max. 5.76 Mbps (UL)
WCDMA: Max. 384 kbps (DL), Max. 384 kbps (UL)
GSM Features
R99:
CSD: 9.6 kbps
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max. 107 kbps (DL), Max. 85.6 kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: MCS 1-9
Uplink coding schemes: MCS 1-9
Max. 296 kbps (DL)/Max. 236.8 kbps (UL)
Internet Protocol Features
Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/
NITZ/MMS/SMTP/SSL/MQTT/FILE/CMUX/SMTPS protocols
Support PAP and CHAP protocols for PPP connections