Quectel SC606T Series Supplement

SC606T Series
Hardware Design
Smart Module Series
Version: 1.0
Date: 2021-03-16
Status: Released

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information. All information supplied herein is subject to change without prior notice.
Disclaimer
While Quectel has made efforts to ensure that the functions and features under development are free
from errors, it is possible that these functions and features could contain errors, inaccuracies and
omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind,
implied or express, with respect to the use of features and functions under development. To the maximum
extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with
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may have been foreseeable.
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Copyright
The information contained here is proprietary technical information of Quectel. Transmitting, reproducing,
disseminating and editing this document as well as using the content without permission are forbidden.
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or registration of a utility model or design.
Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supportsit. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2021-01-25
Dorian MENG/
Mike ZENG
Creation of the document
1.0
2021-03-16
Dorian MENG/
Mike ZENG
First official release

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Contents
Safety Information.......................................................................................................................................3
About the Document...................................................................................................................................4
Contents.......................................................................................................................................................5
Table Index...................................................................................................................................................8
Figure Index...............................................................................................................................................10
1Introduction........................................................................................................................................12
2Product Concept................................................................................................................................15
2.1. General Description..................................................................................................................15
2.2. Key Features.............................................................................................................................17
2.3. Functional Diagram...................................................................................................................20
2.4. Evaluation Board.......................................................................................................................21
3Application Interfaces .......................................................................................................................22
3.1. General Description..................................................................................................................22
3.2. Pin Assignment .........................................................................................................................23
3.3. Pin Description..........................................................................................................................24
3.4. Power Supply............................................................................................................................37
3.4.1. Power Supply Pins.........................................................................................................37
3.4.2. Decrease Voltage Drop..................................................................................................37
3.4.3. Reference Design for Power Supply..............................................................................38
3.5. Turn-On and Turn-Off Timing....................................................................................................39
3.5.1. Turn On Module .............................................................................................................39
3.5.2. Turn Off Module .............................................................................................................41
3.6. VRTC Interface .........................................................................................................................41
3.7. Power Output............................................................................................................................42
3.8. USB Interface............................................................................................................................43
3.9. UART Interfaces........................................................................................................................46
3.10. (U)SIM Interfaces......................................................................................................................48
3.11. SD Card Interface .....................................................................................................................50
3.12. GPIO Interfaces........................................................................................................................52
3.13. I2C Interfaces............................................................................................................................53
3.14. SPI Interfaces............................................................................................................................53
3.15. ADC Interface............................................................................................................................54
3.16. LCM Interfaces..........................................................................................................................54
3.17. Touch Panel Interfaces .............................................................................................................58
3.18. Camera Interfaces.....................................................................................................................59
3.18.1. Design Considerations...................................................................................................63
3.19. Sensor Interfaces......................................................................................................................66
3.20. Audio Interfaces........................................................................................................................66

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3.20.1. Reference Design for Microphone Interfaces................................................................68
3.20.2. Reference Design for Earpiece Interface.......................................................................69
3.20.3. Reference Design for Headphone Interface..................................................................69
3.20.4. Reference Design for Loudspeaker Interface................................................................70
3.20.5. Design Considerations...................................................................................................70
3.21. Emergency Download Interface................................................................................................70
4Wi-Fi and BT.......................................................................................................................................72
4.1. Wi-Fi Function Overview...........................................................................................................72
4.1.1. Wi-Fi Performance.........................................................................................................72
4.2. BT Function Overview...............................................................................................................74
4.2.1. BT Performance.............................................................................................................75
5GNSS...................................................................................................................................................76
5.1. GNSS Performance..................................................................................................................76
5.2. GNSS Design Guidelines..........................................................................................................76
6Antenna Interfaces.............................................................................................................................78
6.1. Main and Rx-diversityAntenna Interfaces................................................................................78
6.1.1. Reference Design for Main and Rx-diversity Antenna Interfaces..................................81
6.1.2. Reference Designs for RF Layouts................................................................................82
6.2. Wi-Fi/BT and FM Antenna Interfaces........................................................................................83
6.3. GNSS Antenna Interface...........................................................................................................84
6.3.1. Reference Design for PassiveAntenna.........................................................................85
6.3.2. Reference Design for Active Antenna............................................................................86
6.4. Antenna Installation...................................................................................................................86
6.4.1. Antenna Requirements ..................................................................................................86
6.4.2. Recommended RF Connector for Antenna Installation.................................................87
7Reliability, Electrical and Radio Characteristics............................................................................90
7.1. Absolute Maximum Ratings......................................................................................................90
7.2. Operating Power.......................................................................................................................90
7.3. Operating and Storage Temperatures ......................................................................................91
7.4. Current Consumption................................................................................................................91
7.5. RF Output Power ......................................................................................................................96
7.6. RF Receiving Sensitivity...........................................................................................................99
7.7. Electrostatic Discharge...........................................................................................................102
8Mechanical Dimensions..................................................................................................................103
8.1. Mechanical Dimensions of the Module...................................................................................103
8.2. Recommended Footprint ........................................................................................................105
8.3. Top and Bottom Views of the Module.....................................................................................106
9Storage, Manufacturing and Packaging........................................................................................107
9.1. Storage....................................................................................................................................107
9.2. Manufacturing and Soldering..................................................................................................108
9.3. Packaging................................................................................................................................109

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10 Appendix A References...................................................................................................................111
11 Appendix B GPRS Coding Schemes.............................................................................................116
12 Appendix C GPRS Multi-slot Classes............................................................................................117
13 Appendix D EDGE Modulation and Coding Schemes.................................................................119

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Table Index
Table 1: Frequency Bands, CA Combinations and GNSS Types of SC606T-EM.....................................15
Table 2: Frequency Bands, CA Combinations and GNSS Types of SC606T-NAD...................................16
Table 3: Frequency Bands, CA Combinations and GNSS Types of SC606T-JP ......................................16
Table 4: Frequency Bands of SC606T-WF................................................................................................17
Table 5: Key Features................................................................................................................................17
Table 6: I/O Parameters Definition.............................................................................................................24
Table 7: Pin Description .............................................................................................................................24
Table 8: Power Description ........................................................................................................................42
Table 9: Pin Definition of USB Interface.....................................................................................................43
Table 10: USB Trace Length Inside the Module ........................................................................................46
Table 11: Pin Definition of UART Interfaces...............................................................................................46
Table 12: Pin Definition of (U)SIM Interfaces.............................................................................................48
Table 13: Pin Definition of SD Card Interface............................................................................................50
Table 14: SD Card Signal Trace Length Inside the Module.......................................................................51
Table 15: Pin Definition of GPIO Interfaces...............................................................................................52
Table 16: Pin Definition of I2C Interfaces...................................................................................................53
Table 17: Pin Definition of SPI Interfaces...................................................................................................54
Table 18: Pin Definition of ADC Interface...................................................................................................54
Table 19: Pin Definition of LCM Interfaces.................................................................................................55
Table 20: Pin Definition of Touch Panel Interfaces ....................................................................................58
Table 21: Pin Definition of Camera Interfaces ...........................................................................................59
Table 22: MIPI Trace Length Inside the Module ........................................................................................64
Table 23: Pin Definition of Sensor Interfaces.............................................................................................66
Table 24: Pin Definition of Audio Interfaces...............................................................................................67
Table 25: Wi-Fi Transmitting Performance.................................................................................................72
Table 26: Wi-Fi Receiving Performance.....................................................................................................73
Table 27: BT Data Rate and Versions........................................................................................................75
Table 28: BT Transmitting and Receiving Performance.............................................................................75
Table 29: GNSS Performance....................................................................................................................76
Table 30: Pin Definition of Main and Rx-diversity Antenna Interfaces.......................................................78
Table 31: SC606T-JP Operating Frequencies...........................................................................................78
Table 32: SC606T-EM Operating Frequencies..........................................................................................79
Table 33: SC606T-NAD Operating Frequencies........................................................................................80
Table 34: Pin Definition of Wi-Fi/BT and FM Antenna Interfaces...............................................................83
Table 35: Wi-Fi/BT and FM Frequency......................................................................................................84
Table 36: Pin Definition of GNSSAntenna.................................................................................................85
Table 37: GNSS Frequency .......................................................................................................................85
Table 38: Antenna Requirements...............................................................................................................86
Table 39: Absolute Maximum Ratings........................................................................................................90
Table 40: Operating Power.........................................................................................................................90
Table 41: Operating and Storage Temperatures........................................................................................91

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Table 42: SC606T-JP Current Consumption..............................................................................................91
Table 43: SC606T-EM Current Consumption ............................................................................................93
Table 44: SC606T-JP RF Output Power....................................................................................................97
Table 45: SC606T-EM RF Output Power...................................................................................................97
Table 46: SC606T-NAD RF Output Power.................................................................................................98
Table 47: SC606T-JP RF Receiving Sensitivity.........................................................................................99
Table 48: SC606T-EM RF Receiving Sensitivity......................................................................................100
Table 49: SC606T-NAD RF Receiving Sensitivity....................................................................................101
Table 50: ESD Characteristics (Temperature: 25 °C, Humidity: 45 %)....................................................102
Table 51: Recommended Thermal Profile Parameters............................................................................109
Table 52: Reel Packaging ........................................................................................................................ 110
Table 53: Related Documents...................................................................................................................111
Table 54: Terms and Abbreviations...........................................................................................................111
Table 55: Description of Different Coding Schemes................................................................................ 116
Table 56: GPRS Multi-slot Classes.......................................................................................................... 117
Table 57: EDGE Modulation and Coding Schemes................................................................................. 119

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Figure Index
Figure 1: Functional Diagram.....................................................................................................................21
Figure 2: Pin Assignment (Perspective View)............................................................................................23
Figure 3: Voltage Drop Sample..................................................................................................................38
Figure 4: Star Structure of Power Supply..................................................................................................38
Figure 5: Reference Design for Power Supply ..........................................................................................39
Figure 6: Turn On Module Using Driving Circuit........................................................................................39
Figure 7: Turn On Module Using Button ....................................................................................................40
Figure 8: Power-up Timing.........................................................................................................................40
Figure 9: Power-off Timing.........................................................................................................................41
Figure 10: RTC Powered by Coin Cell.......................................................................................................41
Figure 11: USB 2.0 Interface Reference Design........................................................................................44
Figure 12: USB Type-C Interface Reference Design.................................................................................45
Figure 13: Reference Design for Level Translator Chip (for UART5)........................................................47
Figure 14: RS-232 Level Match Circuit (for UART5) .................................................................................47
Figure 15: Reference Design for (U)SIM Interface with an 8-pin (U)SIM Card Connector.......................49
Figure 16: Reference Design for (U)SIM Interface with a 6-pin (U)SIM Card Connector.........................49
Figure 17: Reference Design for SD Card Interface..................................................................................51
Figure 18: Reference Design for LCM0 Interface......................................................................................56
Figure 19: Reference Design for LCM1 Interface......................................................................................57
Figure 20: Reference Design for LCM External Backlight Driver..............................................................58
Figure 21: Reference Design for Touch Panel Interface............................................................................59
Figure 22: Reference Design for Dual Camera Application.......................................................................62
Figure 23: Reference Design for Triple Camera Application .....................................................................63
Figure 24: Reference Design for Analog ECM-type Microphone ..............................................................68
Figure 25: Reference Design for MEMS-type Microphone........................................................................68
Figure 26: Reference Design for Earpiece Interface .................................................................................69
Figure 27: Reference Design for Headphone Interface with Normally Open Jack....................................69
Figure 28: Reference Design for Loudspeaker Interface...........................................................................70
Figure 29: Reference Design for USB_BOOT...........................................................................................71
Figure 30: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces.................................81
Figure 31: Microstrip Design on a 2-layer PCB .........................................................................................82
Figure 32: Coplanar Waveguide Design on a 2-layer PCB.......................................................................82
Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)....................82
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)....................83
Figure 35: Reference Circuit Design for Wi-Fi/BTAntenna Interface........................................................84
Figure 36: Reference Circuit Design for FM Antenna Interface.................................................................84
Figure 37: Reference Design for GNSS Passive Antenna ........................................................................85
Figure 38: Reference Design for GNSS Active Antenna ...........................................................................86
Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm)............................................................88
Figure 40: Mechanicals of U.FL-LP Connectors........................................................................................88
Figure 41: Form Factor of Mated Connectors (Unit: mm)..........................................................................89

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Figure 42: Top and Side Dimensions (Unit: mm).....................................................................................103
Figure 43: Bottom Dimensions (Perspective View) .................................................................................104
Figure 44: Recommended Footprint (Perspective View).........................................................................105
Figure 45: Top and Bottom Views............................................................................................................106
Figure 46: Recommended Reflow Soldering Thermal Profile .................................................................108
Figure 47: Tape Dimensions .................................................................................................................... 110
Figure 48: Reel Dimensions..................................................................................................................... 110

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1Introduction
This document provides information on the functional features, interface specifications, as well as
electrical and mechanical details of the SC606T series modules (SC606T-EM, SC606T-NAD, SC606T-JP,
and SC606T-WF). Consult this document to learn about the air and hardware interfaces and external
application reference designs among other related information of the series modules.
This document, coupled with application notes and user guides, makes it easy to design applications with
the module.
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based
timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion
Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s
body and must not transmit simultaneously with any other antenna or transmitter.
3. A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR2021SC606TNAD
4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
radiation, maximum antenna
gain (including cable loss)
must not exceed: Operating
Band
FCC Max Antenna Gain（dBi）
IC Max Antenna Gain（dBi）
WCDMA BAND 2
8.00
8.00
WCDMA BAND 4
5.00
5.00
WCDMA BAND 5
9.42
8.26
LTE BAND 2
8.00
8.00
LTE BAND 4
5.00
5.00
LTE BAND 5
9.41
8.25
LTE BAND 7
8.00
8.00
LTE BAND 12
8.70
7.76
LTE BAND 13
9.16
8.09
LTE BAND 14
9.23
8.13
LTE BAND 17
8.74
7.79

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LTE BAND 25
8.00
8.00
LTE BAND 26(814-824)
9.36
N/A
LTE BAND 26(824-849)
9.41
8.25
LTE BAND 41
8.00
8.00
LTE BAND 66
5.00
5.00
LTE BAND 71
7.15
7.62
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining
to the OEM the labeling requirements, options and OEM user manual instructions that are required (see
next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC
ID: XMR2021SC606TNAD” or “Contains FCC ID: XMR2021SC606TNAD”must be used. The host OEM
user manual must also contain clear instructions on how end users can find and/or access the module
and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user
that changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment. In cases where the manual is provided only in a form other
than paper, such as on a computer disk or over the Internet, the information required by this section may
be included in the manual in that alternative form, provided the user can reasonably be expected to have
the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously
authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without

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a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring
that the after the module is installed and operational the host continues to be compliant with the Part 15B
unintentional radiator requirements.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
IC Statement
IRSS-GEN
"This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions: (1) This device may not cause interference; and (2) This device must accept any
interference, including interference that may cause undesired operation of the device." or "Le présent
appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement."
Déclaration sur l'exposition aux rayonnements RF
L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm
de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre
antenne ou un autre émetteur.
The host product shall be properly labeled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host product; otherwise, the host product must be labeled
to display the Innovation, Science and Economic Development Canada certification number for the
module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:
“Contains IC: 10224A-21SC606TNAD” or “where: 10224A-21SC606TNAD is the module’s certification
number”.
Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.
L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module
doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte
doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement
économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la
même signification, comme suit:
"Contient IC: 10224A-21SC606TNAD " ou "où: 10224A-21SC606TNAD est le numéro de certification du
module".

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2Product Concept
2.1. General Description
SC606T is a series of smart modules applicable to Linux operating system and provides industrial-grade
performance. Their general features are listed below:
⚫Support LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE,
GPRS and GSM;
⚫Support short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and BT 4.2 LE;
⚫Integrate GPS/GLONASS/BeiDou satellite positioning systems;
⚫Support multiple audio and video codecs;
⚫With the built-in high-performance AdrenoTM506 graphics processing unit;
⚫Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces.
The series comes in SC606T-EM, SC606T-NAD, SC606T-JP, and SC606T-WF models.
The following tables show the frequency bands, CA combinations, as well as the Wi-Fi, Bluetooth, and
GNSS frequency bands supported by each model.
Table 1: Frequency Bands, CA Combinations and GNSS Types of SC606T-EM
Mode
Details
LTE-FDD
B1/B2/B3/B4/B5/B7/B8/B20/B28A/B28B
LTE-TDD
B38/B40/B41
Intra-band 2CA (DL)
1A-1A, 1C, 2A-2A, 2C, 3A-3A, 3C, 4A-4A, 5A-5A, 5B, 7A-7A,
7C, 38C, 39C, 40C, 41A-41A, 41C
WCDMA
B1/B2/B4/B5/B8
GSM
850/900/1800/1900 MHz
Wi-Fi 802.11a/b/g/n/ac
2402–2482 MHz; 5180–5825 MHz
BT 4.2 LE
2402–2480 MHz

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Table 2: Frequency Bands, CA Combinations and GNSS Types of SC606T-NAD
Table 3: Frequency Bands, CA Combinations and GNSS Types of SC606T-JP
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Mode
Details
LTE-FDD
B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71
LTE-TDD
B41
Intra-band 2CA (DL)
2A-2A, 2C, 4A-4A, 5A-5A, 5B, 7A-7A,7C, 66A-66A, 66B, 66C,
41A-41A, 41C
WCDMA
B2/B4/B5
GSM
-
Wi-Fi 802.11a/b/g/n/ac
2402–2482 MHz; 5180–5825 MHz
BT 4.2 LE
2402–2480 MHz
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Mode
Details
LTE-FDD
B1/B3/B5/B8/B11/B18/B19/B21/B26/B28A/B28B
LTE-TDD
B41
Intra-band 2CA (DL)
1A-1A, 1C, 3A-3A, 3C, 5A-5A, 5B, 41A-41A, 41C
WCDMA
B1/B6/B8/B19
GSM
-
Wi-Fi 802.11a/b/g/n/ac
2402–2482 MHz; 5180–5825 MHz
BT 4.2 LE
2402–2480 MHz
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz

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Table 4: Frequency Bands of SC606T-WF
SC606T series module is an SMD-type module, which can be embedded into applications through its 323
pins (152 LCC and 171 LGApins). With a compact profile of 43.0 mm × 44.0 mm × 2.85 mm, the module
can meet almost all requirements for M2M applications such as smart metering, smart home, security,
wireless POS, mobile computing devices, PDA phone and tablet PC.
2.2. Key Features
Table 5: Key Features
Features
Details
Application Processor
Octa-core ARM Cortex-A53 64-bit CPU @ 2.0 GHz (high performance)
⚫One quad-core with 1 MB L2 cache
⚫One quad-core with 512 KB L2 cache
Modem system
Hexagon DSP V56 core, up to 850 MHz
768 KB L2 caches
GPU
AdrenoTM 506 with 64-bit addressing, designed for 650 MHz
Memory
16 GB eMMC + 2 GB LPDDR3 (default)
32 GB eMMC + 3 GB LPDDR3 (optional)
64 GB eMMC + 4 GB LPDDR3 (optional)
Operating System
Linux OS
Power Supply
VBAT Supply Voltage: 3.55–4.4 V
Typical: 3.8 V
Mode
Details
LTE-FDD
-
LTE-TDD
-
WCDMA
-
GSM
-
Wi-Fi 802.11a/b/g/n/ac
2402–2482 MHz; 5180–5825 MHz
BT 4.2 LE
2402–2480 MHz
GNSS
-

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Transmitting Power
Class 4 (33 dBm ±2 dB) for GSM850
Class 4 (33 dBm ±2 dB) for EGSM900
Class 1 (30 dBm ±2 dB) for DCS1800
Class 1 (30 dBm ±2 dB) for PCS1900
Class E2 (27 dBm ±3 dB) for GSM850 8-PSK
Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK
Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK
Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK
Class 3 (24 dBm +1/-3 dB) for WCDMAbands
Class 3 (23 dBm ±2 dB) for LTE-FDD bands
Class 3 (23 dBm ±2 dB) for LTE-TDD bands
LTE Features
Support 3GPP Rel-10 Cat 6 and Cat 4
Support 1.4 to 20 MHz RF bandwidths
Support Multiuser MIMO in DL direction
⚫Cat 6 FDD: Max 300 Mbps (DL)/Max 50 Mbps (UL)
⚫Cat 6 TDD: Max 265 Mbps (DL)/Max 30 Mbps (UL)
⚫Cat 4 FDD: Max 150 Mbps (DL)/Max 50 Mbps (UL)
⚫Cat 4 TDD: Max 130 Mbps (DL)/Max 30 Mbps (UL)
UMTS Features
Support 3GPP Rel-9
DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA
Support QPSK, 16QAM and 64QAM modulation
⚫DC-HSDPA: Max. 42 Mbps (DL)
⚫DC-HSUPA: Max. 11.2 Mbps (UL)
⚫WCDMA: Max. 384 kbps (DL)/Max. 384 kbps (UL)
GSM Features
R99
CSD: 9.6 kbps, 14.4 kbps
GPRS
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max. 107 kbps (DL), 85.6 kbps (UL)
EDGE
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme)
Downlink coding schemes: MCS 1-9
Uplink coding schemes: MCS 1-9
Max. 296 kbps (DL), 236.8 kbps (UL)
WLAN Features
2.4/5 GHz, 802.11a/b/g/n/ac, maximally up to 433 Mbps
Support AP and STA modes
Bluetooth Features
BT 4.2 LE
GNSS Features
GPS/GLONASS/BeiDou
SMS
Text and PDU mode
Point-to-point MO and MT

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SMS cell broadcast
LCM Interfaces
Support two groups of 4-lane MIPI_DSI
Support dual LCDs
Support WUXGAup to 1200 (RGB) × 1920 @ 60 fps
Camera Interfaces
Support three groups of 4-lane MIPI_CSI, up to 2.1 Gbps per lane
Support 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-lane + 4-lane +
2-lane + 1-lane)
Up to 24 MP with dual ISP
Video Codec
Video encoding and decoding: up to 4 K @ 30 fps, up to 1080 P @ 60 fps
Wi-Fi Video: encoding up to 1080 P @ 30 fps; decoding up to 1080 P @ 60 fps
Audio Interfaces
Audio Input
Three analog microphone inputs
Audio Output
Class AB stereo headphone output
Class AB earpiece differential output
Class D speaker differential amplifier output
Audio Codec
Support G711, QCELP, EVRC, EVRC-B, EVRC-WB, AMR-NB, AMR-WB,
GSM-EFR, GSM-FR, GSM-HR
USB Interface
Support USB 3.0 or 2.0, with transmission rates up to 5 Gbps on USB 3.0 and
480 Mbps on USB 2.0
Support USB OTG
Used for AT command communication, data transmission, software debugging
and firmware upgrade
UART Interfaces
Three UART Interfaces: UART5, UART4, and UART2
⚫UART5: 4-wire UART interface with hardware flow control (RTS/CTS),
baud rate up to 4 Mbps
⚫UART4: 2-wire UART interface
⚫UART2: 2-wire UART interface used for debugging
SD Card Interface
Support SD 3.0
Support SD card hot-plug
(U)SIM Interfaces
Two (U)SIM interfaces
Support USIM/SIM card: 1.8/2.95 V
Support Dual SIM Dual Standby by default
I2C Interfaces
Five I2C interfaces, used for peripherals such as TP, camera and sensor
ADC Interface
One general-purpose ADC interface
Support up to 15-bit ADC resolution
SPI Interfaces
Two SPI interfaces, only support master mode
⚫One SPI interface used for peripheral device
⚫One SPI interface used for sensor application, such as fingerprint sensor
Real Time Clock
Supported