Quectel LTE-A Series Supplement

EG060V-EA
Hardware Design
LTE-A Module Series
Version: 1.0
Date: 2020-09-15
Status: Released
www.quectel.com

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Copyright
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Transmitting, reproducing, disseminating and editing this document as well as using the content without
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the event of a patent grant or registration of a utility model or design.
Copyright © Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved.

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About the Document
Revision History
Version
Date
Author
Description
1.0
2020-09-15
King MA/
Benjamin CHAI
Initial

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Contents
About the Document...................................................................................................................................1
Contents.......................................................................................................................................................4
Table Index...................................................................................................................................................6
Figure Index.................................................................................................................................................7
1Introduction..........................................................................................................................................9
1.1. Safety Information....................................................................................................................10
2Product Concept................................................................................................................................11
2.1. General Description.................................................................................................................11
2.2. Key Features ...........................................................................................................................12
2.3. Functional Diagram .................................................................................................................14
2.4. Evaluation Board .....................................................................................................................15
3Application Interfaces .......................................................................................................................16
3.1. General Description.................................................................................................................16
3.2. Pin Assignment........................................................................................................................17
3.3. Pin Description.........................................................................................................................18
3.4. Operating Modes.....................................................................................................................26
3.5. Power Saving...........................................................................................................................27
3.5.1. Sleep Mode....................................................................................................................27
3.5.1.1. Set Sleep Mode via UART...................................................................................28
3.5.1.2. Set Sleep Mode via USB with Suspend/Resume and Remote Wakeup.............28
3.5.1.3. Set Sleep Mode via USB with Suspend/Resume and RI Function.....................29
3.5.1.4. Set Sleep Mode via USB without USB Suspend Function..................................30
3.5.2. Airplane Mode................................................................................................................30
3.6. Power Supply...........................................................................................................................31
3.6.1. Power Supply Pins.........................................................................................................31
3.6.2. Decrease Voltage Drop..................................................................................................32
3.6.3. Reference Design of Power Supply...............................................................................33
3.6.4. Monitor Power Supply....................................................................................................34
3.7. Turn on/off ...............................................................................................................................34
3.7.1. Turn on the Module with PWRKEY................................................................................34
3.7.2. Turn off the Module........................................................................................................36
3.7.2.1. Turn off the Module with PWRKEY .....................................................................36
3.7.2.2. Turn off the Module with AT Command...............................................................36
3.8. Reset the Module.....................................................................................................................37
3.9. (U)SIM Interface ......................................................................................................................38
3.10. USB Interface ..........................................................................................................................40
3.11. UART Interfaces......................................................................................................................42
3.12. PCM and I2C Interfaces..........................................................................................................44
3.13. ADC Interfaces ........................................................................................................................46
3.14. Network Indication Interface....................................................................................................47

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3.15. Module Status Indication Interface..........................................................................................48
3.16. RI Behaviors............................................................................................................................49
3.17. PCIe Interface* ........................................................................................................................50
3.18. WLAN Control Interface*.........................................................................................................51
3.19. SD Card Interface*...................................................................................................................52
3.20. SPI Interface............................................................................................................................54
3.21. USB_BOOT Interface..............................................................................................................55
4Antenna Interfaces.............................................................................................................................57
4.1. Main/Rx-diversity Antenna Interface .......................................................................................57
4.1.1. Pin Definition..................................................................................................................57
4.1.2. Operating Frequency .....................................................................................................57
4.1.3. Reference Design of RF Antenna Interface...................................................................58
4.1.4. Reference Design of RF Layout.....................................................................................59
4.2. Antenna Installation.................................................................................................................61
4.2.1. Antenna Requirement....................................................................................................61
4.2.2. Recommended RF Connector for Antenna Installation.................................................61
5Electrical, Reliability and Radio Characteristics............................................................................63
5.1. Absolute Maximum Ratings.....................................................................................................63
5.2. Power Supply Ratings.............................................................................................................64
5.3. Operation and Storage Temperatures ....................................................................................64
5.4. Current Consumption ..............................................................................................................65
5.5. RF Output Power.....................................................................................................................67
5.6. RF Receiving Sensitivity..........................................................................................................68
5.7. Electrostatic Discharge............................................................................................................68
5.8. Thermal Consideration............................................................................................................69
6Mechanical Dimensions....................................................................................................................72
6.1. Mechanical Dimensions of the Module....................................................................................72
6.2. Recommended Footprint.........................................................................................................74
6.3. Renderings of the Module .......................................................................................................75
7Storage, Manufacturing and Packaging..........................................................................................76
7.1. Storage ....................................................................................................................................76
7.2. Manufacturing and Soldering ..................................................................................................77
7.3. Packaging................................................................................................................................79
8Appendix References........................................................................................................................80

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Table Index
Table 1: Frequency Bands of EG060V-EA Module................................................................................... 11
Table 2: Key Features of EG060V-EA Module..........................................................................................12
Table 3: I/O Parameters Definition.............................................................................................................18
Table 4: Pin Description............................................................................................................................. 18
Table 5: Overview of Operating Modes.....................................................................................................26
Table 6: VBAT and GND Pins.................................................................................................................... 31
Table 7: Pin Definition of PWRKEY........................................................................................................... 34
Table 8: Pin Definition of RESET_N..........................................................................................................37
Table 9: Pin Definition of (U)SIM Interface................................................................................................ 38
Table 10: Pin Definition of USB Interface..................................................................................................40
Table 11: Pin Definition of the Main UART Interface................................................................................. 42
Table 12: Pin Definition of the Debug UART Interface.............................................................................. 42
Table 13: Logic Level Parameters of Digital I/O........................................................................................ 43
Table 14: Pin Definition of PCM and I2C Interfaces.................................................................................. 45
Table 15: Pin Definition of ADC Interfaces................................................................................................47
Table 16: Parameters of ADC Interfaces................................................................................................... 47
Table 17: Pin Definition of Network Mode/Status Indication Pins ............................................................. 47
Table 18: Working State of Network Mode/Status Indication Pins............................................................48
Table 19: Pin Definition of STATUS...........................................................................................................49
Table 20: Behavior of RI ............................................................................................................................50
Table 21: Pin Definition of PCIe Interface.................................................................................................. 50
Table 22: Pin Definition of WLAN Control Interface...................................................................................51
Table 23: Pin Definition of SD Card Interface............................................................................................52
Table 24: Pin Definition of SPI Interface.................................................................................................... 54
Table 25: Parameters of SPI Interface Timing........................................................................................... 54
Table 26: Pin Definition of USB_BOOT Interface......................................................................................55
Table 27: Pin Definition of RF Antenna...................................................................................................... 57
Table 28: EG060V-EA Operating Frequencies..........................................................................................57
Table 29: Antenna Requirements.............................................................................................................. 61
Table 30: Absolute Maximum Ratings.......................................................................................................63
Table 31: Module Power Supply Ratings................................................................................................... 64
Table 32: Operation and Storage Temperatures....................................................................................... 64
Table 33: Module Current Consumption....................................................................................................65
Table 34: RF Output Power .......................................................................................................................67
Table 35: Conducted RF Receiving Sensitivity.......................................................................................... 68
Table 36: Electrostatic Discharge Characteristics.....................................................................................69
Table 37: Recommended Thermal Profile Parameters.............................................................................78
Table 38: Related Documents....................................................................................................................80
Table 39: Terms and Abbreviations...........................................................................................................80

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Figure Index
Figure 1: Functional Diagram..................................................................................................................... 14
Figure 2: Pin Assignment (Top View) ........................................................................................................ 17
Figure 3: DRX Run Time and Current Consumption in Sleep Mode.........................................................27
Figure 4: Set Sleep Mode via UART.......................................................................................................... 28
Figure 5: Sleep Mode with Remote Wakeup............................................................................................. 29
Figure 6: Sleep Mode with RI Signal Wakeup...........................................................................................29
Figure 7: Sleep Mode without Suspend Function...................................................................................... 30
Figure 8: Voltage Drop Limits during Tx....................................................................................................32
Figure 9: Star Structure of Power Supply..................................................................................................33
Figure 10: Reference Design of Power Supply.......................................................................................... 33
Figure 11: Turn on the Module with Driving Circuit....................................................................................34
Figure 12: Turn on the Module with Button................................................................................................35
Figure 13: Timing of Turning on the Module.............................................................................................. 35
Figure 14: Timing of Turning off the Module.............................................................................................. 36
Figure 15: Resetting the Module with Driving Circuit.................................................................................37
Figure 16: Resetting the Module with Button.............................................................................................37
Figure 17: Timing of Resetting the Module................................................................................................ 38
Figure 18: Reference Design of (U)SIM Interface with 8-Pin (U)SIM Card Connector.............................39
Figure 19: Reference Design of (U)SIM Interface with 6-Pin (U)SIM Card Connector.............................39
Figure 20: Reference Design of USB Interface .........................................................................................41
Figure 21: Reference Design of Translator Chip.......................................................................................43
Figure 22: Reference Design of Transistor Circuit..................................................................................... 44
Figure 23: Primary Mode Timing................................................................................................................ 45
Figure 24: Reference Design of PCM Interface with Audio Codec ...........................................................46
Figure 25: Reference Design of Network Indicator.................................................................................... 48
Figure 26: Reference Design of STATUS..................................................................................................49
Figure 27: Reference Design of SD Card Interface................................................................................... 53
Figure 28: SPI Interface Timing.................................................................................................................54
Figure 29: Reference Design of SPI Interface with Level Translator ........................................................55
Figure 30: Reference Design of USB_BOOT Interface............................................................................. 56
Figure 31: Reference Design of RF Antenna Interface .............................................................................58
Figure 32: Reference Design of Microstrip on 2-layer PCB.......................................................................59
Figure 33: Reference Design of Coplanar Waveguide on 2-layer PCB.................................................... 59
Figure 34: Reference Design of Coplanar Waveguide on 4-layer PCB (Layer 3 as Reference Ground).59
Figure 35: Reference Design of Coplanar Waveguide on 4-layer PCB (Layer 4 as Reference Ground).60
Figure 36: Dimensions of U.FL-R-SMT Connector (Unit: mm).................................................................. 61
Figure 37: Mechanical Features of U.FL-LP Connectors.......................................................................... 62
Figure 38: Form Factor of Mated Connectors (Unit: mm).......................................................................... 62
Figure 39: Reference Design of Heatsink (Heatsink at the Top of the Module)........................................70
Figure 40: Reference Design of Heatsink (Heatsink at the Backside of PCB)..........................................70
Figure 41: Top and Side Dimensions of the Module .................................................................................72

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Figure 42: Bottom Dimensions (Bottom View) of the Module.................................................................... 73
Figure 43: Recommended Footprint (Top View)........................................................................................74
Figure 44: Top View of the Module............................................................................................................75
Figure 45: Bottom View of the Module.......................................................................................................75
Figure 46: Recommended Reflow Soldering Thermal Profile ...................................................................78
Figure 47: Tape Specifications...................................................................................................................79
Figure 48: Reel Specifications ...................................................................................................................79

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1Introduction
This document defines the EG060V-EA module and describes its air and hardware interfaces which
connect to your applications.
It familiarizes you with the module’s interface specifications, electrical and mechanical details, as well as
other related information. To facilitate application of the module in different fields, its reference designs
are also provided for your reference. With this hardware design document, along with the application
notes and user guides explicated therein, you can use the product to design and set up mobile
applications easily.

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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating EG060V-EA module. Manufacturers of the
cellular terminal should notify users and operating personnel of the following safety information by
incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergent help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fueling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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2Product Concept
2.1. General Description
EG060V-EA, a type of LTE-FDD/LTE-TDD/WCDMA wireless communication module with receive
diversity, provides data connectivity on LTE-FDD, LTE-TDD, HSPA+, HSDPA, HSUPA, and WCDMA
networks.
Table 1: Frequency Bands of EG060V-EA Module
1. 1) For CA-3A-8A, “B3 (PCC) + B8 (SCC)” is supported, while “B8 (PCC) + B3 (SCC)” is not.
2. 2) EG060V-EA supports continuous intra-band CA, but not non-continuous intra-band CA.
With a compact profile of 37.0 mm × 39.5 mm × 3.05 mm, EG060V-EA can meet almost all requirements
for M2M applications, such as automotive applications, meters, tracking systems, security systems,
routers, wireless POS systems, mobile computing devices, PDA phones, tablet PCs, etc.
EG060V-EA is an SMD type module which can be embedded into applications through its 299 LGA pins.
Mode
EG060V-EA
LTE-FDD (with Rx-diversity)
B1/B3/B5/B7/B8/B20/B28
LTE-TDD (with Rx-diversity)
B38/B40/B41
2 × CA 2)
B1+B1/B3/B5/B8/B20/B28;
B3+B3/B5/B7/B8 1)/B20/B28;
B7+B5/B7/B8/B20/B28;
B38+B38; B40+B40; B41+B41
WCDMA
B1/B5/B8
NOTES

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2.2. Key Features
The following table describes the detailed features of the module.
Table 2: Key Features of EG060V-EA Module
Feature
Details
Power Supply
Supply voltage: 3.3–4.3 V
Typical supply voltage: 3.8 V
Transmitting Power
Class 3 (24 dBm +1/-3 dB) for WCDMA bands
Class 3 (23 dBm ±2 dB) for LTE-FDD bands 1)
Class 3 (23 dBm ±2 dB) for LTE-TDD bands
LTE Features
Support up to Cat 6 FDD and TDD CA
Support uplink QPSK and 16QAM modulation
Support downlink QPSK, 16QAM and 64QAM modulation
Support 1.4 MHz to 40 MHz (DL 2×CA) RF bandwidth
Support 4 ×2, 2 ×2 MIMO in DL direction
FDD: Max 300 Mbps (DL)/50 Mbps (UL)
TDD: Max 220 Mbps (DL)/30 Mbps (UL)
UMTS Features
Support 3GPP R7 HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16QAM and 64QAM modulation
HSDPA: Max 21 Mbps (DL) 2)
HSUPA: Max 5.76 Mbps (UL)
WCDMA: Max 384 kbps (DL)/384 kbps (UL)
Internet Protocol Features
Support PPP/TCP/UDP/FTP/HTTP/NTP/PING/HTTPS/SMTP*/
MMS*/FTPS/SMTPS*/SSL protocols
Support PAP and CHAP for PPP connections
SMS
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface
Support (U)SIM card: 1.8/3.0 V
Audio Features
Support one digital audio interface: PCM interface
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
PCM Interface
Used for audio function with external codec
Support 16-bit linear data format
Support short frame synchronization
Support master and slave modes

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1. 1) For LTE FDD Band 3, the transmitting power is 21.5 dBm ±1 dB.
2. 2) DC-HSDPA can be used, but the throughput speed and connection stability has yet to be optimized.
3. 3) Within operating temperature range, the module is 3GPP compliant.
4. 4) Within extended temperature range, the module keeps the ability to establish and maintain a voice,
SMS, data transmission, emergency call, etc. There won’t be unrecoverable malfunctions. Nor will
there be effects on the radio spectrum or harm to radio networks. Only one or more parameters like
Pout might reduce in the value and exceed specified tolerances. When the temperature returns to
normal operation temperature levels, the module will meet 3GPP specifications again.
5. It is not recommended to use the module without adopting a heat dissipation component. Tests are
USB Interface
Compliant with USB 2.0 specifications, with maximum transmission rates
up to 480 Mbps on USB 2.0.
Used for AT command communication, data transmission, firmware
upgrade, software debugging.
Support USB serial drivers for: Windows 7/8/8.1/10;
WinCE 5.0/6.0/7.0*; Linux 2.6/3.x/4.1–4.14; Android 4.x/5.x/6.x/7.x/8.x
UART Interfaces
Main UART:
Used for AT command communication and data transmission
Baud rate reaches up to 921600 bps, 115200 bps by default
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output
115200 bps baud rate
PCIe Interface*
Comply with PCI Express Specification Revision 1.0
Used for Ethernet or WLAN communication
Rx-diversity
Support LTE Rx-diversity
AT Commands
Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel enhanced
AT commands
Network Indication
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Antenna Interfaces
Including the main antenna interface (ANT_MAIN) and Rx-diversity
antenna interface (ANT_DRX)
Physical Characteristics
Size: (37.0 ±0.2) mm ×(39.5 ±0.2) mm ×(3.05 ±0.2) mm
Weight: approx. 6.7 g
Temperature Range
Operating temperature range: -20 °C to +55 °C 3)
Extended temperature range: -25 °C to +60 °C 4)
Storage temperature range: -40 °C to +90 °C
Firmware Upgrade
USB interface and FOTA
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES

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conducted at all temperature levels with heat sinks and rubber pads applied.
6. “*” means under development.
2.3. Functional Diagram
Below is the functional diagram of EG060V-EA with its major functional parts illustrated.
⚫Power management
⚫Baseband
⚫LPDDR (SDRAM) + NAND flash memory
⚫Radio frequency
⚫Peripheral interfaces
Baseband
PMIC
Transceiver NAND
DDR2
SDRAM
Tx/Rx Blocks
ANT_MAIN ANT_DIV
VBAT_BB
VBAT_RF
APT
PWRKEY
ADCs
VDD_EXT USB 2.0 (U)SIM PCM UARTs
I2C
RESET_N
32.768
kHz
GPIOs
Control
IQ Control
Tx
PRx DRx
PCIe SD
26 M
TCXO
SPI
Figure 1: Functional Diagram

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2.4. Evaluation Board
To help you develop applications handily with EG060V-EA, Quectel supplies an evaluation board (EVB),
USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.

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3Application Interfaces
3.1. General Description
EG060V-EA is equipped with 299 LGA pins that can be connected to a cellular application platform. The
following chapters describe the interfaces listed below.
⚫Power supply
⚫(U)SIM interface
⚫USB interface
⚫UART interfaces
⚫PCM and I2C interfaces
⚫ADC interfaces
⚫Network indication Interfaces
⚫Module status indication Interface
⚫RI behaviors
⚫PCIe interface*
⚫WLAN control interface*
⚫SD card interface*
⚫SPI interface
⚫USB_BOOT interface
⚫
“*” means under development.
NOTE

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3.2. Pin Assignment
The following figure shows the pin assignment of the module.
299
GND
176
RESERVED
298
GND
174
GND
172
RESERVED
170
NET_
STUTUS
168
VDD_EXT
166
SPI_CS
164
SPI_CLK
162
RESERVED
160
WLAN_WAKE
158
GND
156
VBAT_BB
154
GND
152
RESERVED
150
WAKEUP_
IN
148
GND
146
COEX_RXD
144
SLEEP_IND
142
GND
140
USB_BOOT
138
GPIO1
136
DBG_RXD
134
RESERVED
132
GND
130
GND
175
ADC1
173
ADC0
171
STATUS
169
WLAN_SLP
_CLK
167
GND
165
SPI_MISO
163
SPI_MOSI
161
RESERVED
159
RESERVED
157
GND
155
VBAT_BB
153
GND
151
W_
DISABLE#
149
WLAN_EN
147
NET_MODE
145
COEX_TXD
143
OTG_PWR_
EN
141
GND
139
GPIO2
137
DBG_TXD
135
RESERVED
133
GND
131
GND
129
GND
127
ANT_DRX
125
GND
123
GND
121
GND
119
RESERVED
117
GND
115
RESERVED
111
GND
109
GND
107
ANT_MAIN
105
GND
103
GND
101
RESERVED
99
GND
97
GND
95
RESERVED
128
GND
113
RESERVED
126
GND
124
GND
122
GND
120
GND
118
GND
116
GND
114
GND
112
GND
110
GND
108
GND
106
GND
104
GND
102
GND
100GND
98
GND
96
GND
213
RESERVED
212
RESERVED
211
RESERVED
210
RESERVED
209
RESERVED
208
GND
207
GND
206
GND
205
GND
204
GND
203
GND
202
GND
201
RESERVED
200
RESERVED
199
RESERVED
198
RESERVED
93
GND
91
RESERVED
89
GND
94
GND
92
GND
90
GND
197
RESERVED
196
GND
43
I2C_SCL
45
GND
47
SDIO_DATA2
49
SDIO_DATA0
51
SDIO_CMD
53
SDIO_CLK
55
GND
57
MAIN_RTS
59
MAIN_DCD
61
MAIN_RI
63
GND
65
PCM_SYNC
67
PCM_CLK
69
GND
71
RESERVED
73
RESERVED
75
GND
77
RESERVED
79
RESERVED
81
GND
83
GND
85
VBAT_RF
87
VBAT_RF
42
I2C_SDA
44
GND
46
SDIO_VDD
48
SDIO_DATA3
50
SDIO_DATA1
52
SD_DET
54
GND
56
MAIN_CTS
58
MAIN_RXD
60
MAIN_TXD
62
MAIN_DTR
64
GND
66
PCM_DIN
68
PCM_DOUT
70
GND
72
RESERVED
74
RESERVED
76
GND
78
RESERVED
80
RESERVED
82
GND
84
GND
86
VBAT_RF
88
VBAT_RF
41
RESERVED
39
GND
37
RESERVED
35
GND
33
USB_DM
31
GND
29
USIM_DATA
27
USIM_CLK
23
RESERVED
21
RESERVED
19
RESERVED
17
GND
15
RESERVED
13
GND
11
RESERVED
9
RESERVED
7
RESERVED
40
RESERVED
25
USIM_DET
38
RESERVED
36
USB_ID
34
USB_DP
32
USB_VBUS
30
GND
28
USIM_RST
26
USIM_VDD
24
USIM_GND
22
RESERVED
20
RESERVED
18
RESERVED
16
GND
14
RESERVED
12
RESERVED
10
GND
8
RESERVED
195
RESERVED
194
RESERVED
193
RESERVED
192
RESERVED
191
GND
190
PCIE_WAK
E_N
189
PCIE_RST_
N
188
PCIE_CLK_
REQ_N
187
GND
186
PCIE_RX_P
185
PCIE_RX_M
184
GND
183
PCIE_TX_P*
182
PCIE_TX_M
181
GND
180
PCIE_
REFCLK_M
179
PCIE_
REFCLK_P
5
WLAN_PWR
_EN
3
RESERVED
1
RESET_N
6
RESERVED
4
RESERVED
2
PWRKEY
178
GND
177
GND
Power GND GPIO and Other Pins RESVRVED
297
GND
296
GND
216
GND 217 GND 218 GND
215
GND 219 GND 220 GND 221 GND 222 GND 223 GND
224
GND
233
GND
242
GND
251
GND
260
GND
269
GND
278
GND
287
GND
225
GND
234
GND
243
GND
252
GND
261
GND
270
GND
279
GND
288
GND
226
GND
235
GND
244
GND
253
GND
262
GND
271
GND
280
GND
289
GND
227
GND
236
GND
272
GND
281
GND
290
GND
228
GND
237
GND
273
GND
282
GND
291
GND
229
GND
238
GND
274
GND
283
GND
292
GND
230
GND
239
GND
248
GND
257
GND
266
GND
275
GND
284
GND
293
GND
231
GND
240
GND
249
GND
258
GND
267
GND
276
GND
285
GND
294
GND
232
GND
241
GND
250
GND
259
GND
268
GND
277
GND
286
GND
295
GND
PCIe PCM (U)SIM USB
I2C
SD
ADC UART SPI ANT CLK
245
GND 246 GND 247 GND
254
GND 255 GND 256 GND
263
GND 264 GND 265 GND
214
GND
Figure 2: Pin Assignment (Top View)
1. Keep all RESERVED pins and unused pins disconnected.
2. GND pins 215–299 should be connected to ground in the design.
NOTES

LTE-A Module Series
EG060V-EA Hardware Design
EG060V-EA_Hardware_Design 18 / 82
3.3. Pin Description
The following tables define and describe the pins of the module.
Table 3: I/O Parameters Definition
Table 4: Pin Description
Type
Description
AI
Analog Input
AO
Analog Output
DI
Digital Input
DO
Digital Output
IO
Bidirectional
OD
Open Drain
PI
Power Input
PO
Power Output
Power Supply
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
VBAT_BB
155,156
PI
Power supply for
the module’s
baseband part and
RF part
Vmax = 4.3 V
Vmin = 3.3 V
Vnorm = 3.8 V
It must be provided
with a sufficient current
of 1.5 A at least.
VBAT_RF
85, 86,
87, 88
PI
Power supply for
the module’s RF
part
Vmax = 4.3 V
Vmin = 3.3 V
Vnorm = 3.8 V
It must be provided
with a sufficient current
of 0.5 A at least1).
VDD_EXT
168
PO
Provide 1.8 V for
external circuit
Vnorm = 1.8 V
IOmax = 50 mA
Power supply for
external GPIO’s
pull-up circuits.
GND
10, 13, 16, 17, 24, 30, 31, 35, 39, 44, 45, 54, 55, 63, 64, 69, 70, 75, 76, 81–84, 89, 90,
92–94, 96–100, 102–106, 108–112, 114, 116, 117, 118, 120–126, 128–133, 141, 142,
148, 153, 154, 157, 158, 167, 174, 177, 178, 181, 184, 187, 191,196, 202–208,
214–299

LTE-A Module Series
EG060V-EA Hardware Design
EG060V-EA_Hardware_Design 19 / 82
Turn on/off
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PWRKEY
2
DI
Turn on/off the
module
VIHmax = 4.1 V
VIHmin = 2.4 V
VILmax = 1.2 V
There is a pull-up
power supply inside,
no need to add any
pull-up power supply
outside.
RESET_N
1
DI
Reset the module
VIHmax = 2.0 V
VIHmin = 1.3 V
VILmax = 0.5 V
Module Status Indication Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
STATUS
171
DO
Indicate the
module’s operation
status
VOHmin = 1.35 V
VOLmax = 0.45 V
1.8 V power domain.
If unused, keep it
open.
Network Indication Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
NET_MODE
147
DO
Indicate the
module’s network
registration mode
VOHmin = 1.35 V
VOLmax = 0.45 V
1.8 V power domain.
If unused, keep it
open.
NET_
STATUS
170
DO
Indicate the
module’s network
activity status
VOHmin = 1.35 V
VOLmax = 0.45 V
1.8 V power domain.
If unused, keep it
open.
USB Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USB_VBUS
32
PI
USB connection
detect
Vmax = 5.25 V
Vmin = 3.0 V
Vnorm = 5.0 V
USB_DP
34
IO
USB differential
data (+)
Compliant with USB
2.0 standard
specifications.
Require a differential
impedance of 90 Ω.
USB_DM
33
IO
USB differential
data (-)
Compliant with USB
2.0 standard
specifications.
USB_ID*
36
DI
USB ID detect
VILmin = -0.3 V
VILmax = 0.6 V
VIHmin = 1.2 V
1.8 V power domain.
If unused, keep it
open.