Quectel EM160R-GL Supplement

EM160R-GL
Hardware Design
LTE-A Module Series
Version: 1.3.3
Date: 2023-10-18
Status: Preliminary

LTE-A Module Series
EM160R-GL_Hardware_Design 1 / 73
At Quectel, our aim is to provide timely and comprehensive services to our customers. If you
require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
200233, China
Tel: [phone]
Email: [e-mail]
Or our local offices. For more information, please visit:
http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm.
Or email us at: [email protected]om.
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we
make every effort to ensure its quality. You agree that you are responsible for using independent analysis
and evaluation in designing intended products, and we provide reference designs for illustrative purposes
only. Before using any hardware, software or service guided by this document, please read this notice
carefully. Even though we employ commercially reasonable efforts to provide the best possible
experience, you hereby acknowledge and agree that this document and related services hereunder are
provided to you on an “as available” basis. We may revise or restate this document from time to time at
our sole discretion without any prior notice to you.
Use and Disclosure Restrictions
License Agreements
Documents and information provided by us shall be kept confidential, unless specific permission is
granted. They shall not be accessed or used for any purpose except as expressly provided herein.
Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material
shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior
written consent. We and the third party have exclusive rights over copyrighted material. No license shall
be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid
ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal
non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for
noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of
the material.

LTE-A Module Series
EM160R-GL_Hardware_Design 2 / 73
Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights
to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel
or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties
(“third-party materials”). Use of such third-party materials shall be governed by all restrictions and
obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials,
including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular
purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any
third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein
constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell,
offer for sale, or otherwise maintain production of any our products or any other hardware, software,
device, tool, information, or product. We moreover disclaim any and all warranties arising from the course
of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the
relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the
purpose of performing the service only or as permitted by applicable laws. Before data interaction with
third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
otherwise provided by valid agreement, we make no warranties of any kind, either implied or express,
and exclude all liability for any loss or damage suffered in connection with the use of features and
functions under development, to the maximum extent permitted by law, regardless of whether such
loss or damage may have been foreseeable.
d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of
information, advertising, commercial offers, products, services, and materials on third-party websites
and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

LTE-A Module Series
EM160R-GL_Hardware_Design 3 / 73
Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal should notify
users and operating personnel of the following safety information by incorporating these guidelines into all
manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with
these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the terminal or mobile before boarding an aircraft. The operation of
wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Terminals or mobiles operating over radio signal and cellular network cannot be
guaranteed to connect in certain conditions, such as when the mobile bill is unpaid
or the (U)SIM card is invalid. When emergency help is needed in such conditions,
use emergency call if the device supports it. In order to make or receive a call, the
terminal or mobile must be switched on in a service area with adequate cellular
signal strength. In an emergency, the device with emergency call function cannot
be used as the only contact method considering network connection cannot be
guaranteed under all circumstances.
The terminal or mobile contains a transceiver. When it is ON, it receives and
transmits radio frequency signals. RF interference can occur if it is used close to
TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other terminals. Areas
with explosive or potentially explosive atmospheres include fuelling areas, below
decks on boats, fuel or chemical transfer or storage facilities, and areas where the
air contains chemicals or particles such as grain, dust or metal powders.

LTE-A Module Series
EM160R-GL_Hardware_Design 4 / 73
About the Document
Revision History
Update Log
Version
Date
What/Where
Why
Update
1.0.0
2020-08-31
Creation of the document
1.0
2020-12-23
First official release
Jim HAN/
Lewis PENG
1.1
2021-01-15
Updated the function diagram (Figure 1).
Jim HAN/
Lewis PENG
Updated the I/O parameter definitions (Table 3).
Updated the description of turn-on timing (Table 7).
Updated the figure of turn-off timing through FULL_CARD_POWER_OFF# (Figure 8).
Updated the figure of turn-off timing through AT command and power supply (Figure 10).
Updated the figure of reset timing (Figure 14).
Updated the description of reset timing (Table 10).
Updated the description of PCIe power-on timing requirements (Table 13).
Update GNSS to Gen9-VT.
Updated the receiving sensitivity (Table 40, delta of 0.1 dB for B8/B20 and delta of 0.2 dB for
B3/B18/B28).
Add four-antenna conducted receiving sensitivity (Table 41).
Updated the mechanical dimensions figure (Figure 38).
Updated the bottom view figures (Figure 42 and Figure 44).
1.2
2021-02-01
Updated the functional diagram (Figure 1).
Davon ZHAO

LTE-A Module Series
EM160R-GL_Hardware_Design 5 / 73
Updated the description about EVB (Chapter 2.4).
Added the ripple and VBAT data in the figure of power supply limits (Figure 3).
Updated the turn-on and turn-off timing information (Chapters 3.4.1.1 and 3.4.2.1).
Deleted the information about turning off the module throughAT command.
Updated the module reset information (Chapter 3.5).
Changed pin 24 into VDDIO in the table of PCM interface pin (Table 13).
Deleted the figure of PCIe turn-on timing requirements of M.2 Specification.
Updated the figure of thermal dissipation area on bottom side of the module (Figure 33).
1.3.0
2023-06-05
Deleted the related information of EM120R-GL.
To meet the specific demanding of Lenovo.
Iyukee SHEN/
Lewis PENG
Updated the PCIE_REFCLK in turn-on timing (Figure 7).
To prevent module unrecognition problems caused by incorrect reference clock timing.
Iyukee SHEN
Updated the PCIE_REFCLK and CLKREQ# in timing of resetting the module (Figure 11).
To prevent module unrecognition problems caused by incorrect reference clock timing.
Iyukee SHEN
Updated the PCIe Interface Reference Circuit (EP Mode) (Figure 16).
To prevent module unrecognition problems caused by incorrect GPIO configuration
during host turn-on.
Iyukee SHEN
Updated the PCIe D3 Cold State Timing (Figure 17).
The timing of the wake-up control signal is provided to the customer, which more
intuitively shows the process of the module from D3cold to D0 state.
Iyukee SHEN
Updated reference circuit of DPR (Chapter 3.9.5).
To prevent customers from directly connecting, which may cause the module to fail to
work properly.
Iyukee SHEN
Updated configuration of config pins (Figure 24 and Table 24).
To meet the specific demanding of Lenovo.
Iyukee SHEN
Added B29/B32/B46 in Rx Sensitivity (Chapter 4.1.2).
To add the data of Rx only.
Lewis PENG
Remove the type Compass in GNSS frequency (Chapter 4.2).
To follow the specification of EM160R-GL.
Lewis PENG
Updated the data in GNSS performance (Table 35).
To add the data of GNSS performance.
Lewis PENG
Updated the top view of the module (Chapter 6.2).
Follow Quectel standard.
Iyukee SHEN
Added the description of module installation (Chapter 6.4).
To remind customers to assemble correctly so as to make sure the normal operation of
the module.
Iyukee SHEN
Updated packaging specifications (Chapter 6.5).
Follow Quectel standard.
Iyukee SHEN
1.3.1
2023-07-15
Added a note to the host in the procedure of turning on (Chapter 3.4.1).
To remind customers not to drive RESET# low after FULL_CARD_POWER_OFF# is
de-asserted at booting stage so as to turn on successfully.
Fung ZHU
Updated the pulling down time of RESET# (Chapter 3.5).
To meet the specific demanding of Lenovo.
Fung ZHU
Updated the time of T1 in the turn-off procedure (Table 9).
To disable PCIe interface successfully by asserting PERST#.
Fung ZHU
1.3.2
2023-09-01
Updated the timing of RESET# (Table 11).
To meet the specific demanding of Lenovo.
Fung ZHU

LTE-A Module Series
EM160R-GL_Hardware_Design 6 / 73
1.3.3
2023-10-18
Added related note description in turn-on chapter (Chapter 3.4.1).
Optimize the description and reduce risk points.
Fung ZHU
Added related note description of RESET# (Chapter 3.5).
Optimize the description and reduce risk points.
Fung ZHU
Added related note description in (U)SIM design notices (Chapter 3.6.4).
Optimize the description and reduce risk points.
Fung ZHU
Added related note description in DPR (Chapter 3.8.5).
Optimize the description and reduce risk points.
Fung ZHU

LTE-A Module Series
EM160R-GL_Hardware_Design 7 / 73
Contents
Safety Information.......................................................................................................................................3
About the Document...................................................................................................................................4
Contents.......................................................................................................................................................7
Table Index...................................................................................................................................................9
Figure Index...............................................................................................................................................11
1Introduction........................................................................................................................................12
1.1. Introduction ...............................................................................................................................12
1.2. Reference Standard..................................................................................................................12
1.3. Special Marks............................................................................................................................13
2Product Overview ..............................................................................................................................14
2.1. Frequency Bands and Functions..............................................................................................14
2.2. Key Features.............................................................................................................................15
2.3. Functional Diagram...................................................................................................................17
2.4. EVB Kit......................................................................................................................................17
3Application Interfaces .......................................................................................................................18
3.1. Pin Assignment .........................................................................................................................19
3.2. Pin Description..........................................................................................................................20
3.3. Power Supply............................................................................................................................24
3.3.1. Voltage Stability Requirements......................................................................................24
3.3.2. Reference Design for Power Supply..............................................................................25
3.4. Turn On, Turn Off and Reset Scenarios...................................................................................26
3.4.1. Turn On ..........................................................................................................................26
3.4.2. Turn Off ..........................................................................................................................28
3.5. RESET# ....................................................................................................................................29
3.6. (U)SIM Interface........................................................................................................................31
3.6.1. (U)SIM Hot-Plug.............................................................................................................31
3.6.2. Normally Closed (U)SIM Card Connector......................................................................32
3.6.3. Normally Open (U)SIM Card Connector........................................................................33
3.6.4. (U)SIM Card Connector Without Hot-Plug.....................................................................34
3.7. PCIe Interface...........................................................................................................................35
3.7.1. Endpoint Mode...............................................................................................................36
3.7.2. PCIe D3cold State............................................................................................................37
3.8. Control and Indication Interfaces..............................................................................................38
3.8.1. W_DISABLE1#...............................................................................................................39
3.8.2. W_DISABLE2#*.............................................................................................................39
3.8.3. WWAN_LED#.................................................................................................................40
3.8.4. WAKE_ON_WAN#.........................................................................................................42
3.8.5. DPR................................................................................................................................42
3.8.6. ANT_CONFIG................................................................................................................43
3.9. COEX UART*............................................................................................................................44

LTE-A Module Series
EM160R-GL_Hardware_Design 8 / 73
3.10. Antenna Tuner Control Interfaces* ...........................................................................................44
3.10.1. Antenna Tuner Control Interface through GPIOs ..........................................................44
3.10.2. Antenna Tuner Control Interface through RFFE............................................................45
3.11. Configuration Pins.....................................................................................................................45
4RF Specifications...............................................................................................................................47
4.1. Cellular Network........................................................................................................................47
4.1.1. Antenna Interface & Frequency Bands..........................................................................47
4.1.2. Rx Sensitivity..................................................................................................................49
4.1.3. Tx Power........................................................................................................................51
4.2. GNSS ......................................................................................................................................52
4.2.1. Antenna Interface & Frequency Bands..........................................................................52
4.2.2. GNSS Performance .......................................................................................................53
4.3. Antenna Connectors.................................................................................................................54
4.3.1. Antenna Connector Location .........................................................................................54
4.3.2. Antenna Connector Specifications.................................................................................55
4.3.3. Antenna Connector Installation......................................................................................56
4.4. Antenna Requirements.............................................................................................................58
5Electrical Characteristics and Reliability........................................................................................59
5.1. Absolute Maximum Ratings......................................................................................................59
5.2. Power Supply Ratings...............................................................................................................59
5.3. Digital I/O Characteristics .........................................................................................................60
5.4. Operating and Storage Temperatures ......................................................................................61
5.5. Power Consumption..................................................................................................................61
5.6. ESD Protection..........................................................................................................................64
5.7. Thermal Dissipation ..................................................................................................................65
5.8. Notification ................................................................................................................................66
5.8.1. Coating...........................................................................................................................66
5.8.2. Cleaning.........................................................................................................................66
6Mechanical Information.....................................................................................................................67
6.1. Mechanical Dimensions............................................................................................................67
6.2. Top and Bottom Views..............................................................................................................68
6.3. M.2 Connector...........................................................................................................................68
6.4. Module Installation....................................................................................................................69
6.5. Packaging Specifications..........................................................................................................70
6.5.1. Blister Tray .....................................................................................................................70
6.5.2. Packaging Process ........................................................................................................71
7Appendix References........................................................................................................................72

LTE-A Module Series
EM160R-GL_Hardware_Design 9 / 73
Table Index
Table 1: Special Marks............................................................................................................................... 13
Table 2: Frequency Bands and GNSS Functions of EM160R-GL.............................................................14
Table 3: Key Features of EM160R-GL.......................................................................................................15
Table 4: Parameter Definition..................................................................................................................... 20
Table 5: Pin Description .............................................................................................................................20
Table 6: Pin Definition of VCC and GND Pins ...........................................................................................24
Table 7: Pin Definition of FULL_CARD_POWER_OFF#........................................................................... 26
Table 8: Description of Turn-on Timing ......................................................................................................27
Table 9: Description of the Turn-off Timing through FULL_CARD_POWER_OFF#..................................28
Table 10: Pin Definition of RESET#........................................................................................................... 29
Table 11: Description of Reset Timing........................................................................................................30
Table 12: Pin Definition of (U)SIM Interface...............................................................................................31
Table 13: Pin Definition of PCIe Interface..................................................................................................35
Table 14: Exit D3cold State Timing of the Module........................................................................................38
Table 15: Pin Definition of Control and Indication Interfaces.....................................................................38
Table 16: RF Function Status.....................................................................................................................39
Table 17: GNSS Function Status............................................................................................................... 39
Table 18: RF Status Indications of WWAN_LED#..................................................................................... 41
Table 19: State of the WAKE_ON_WAN#..................................................................................................42
Table 20: Function of the DPR Signal........................................................................................................42
Table 21: Pin Definition of ANT_CONFIG..................................................................................................43
Table 22: Pin Definition of COEX UART.................................................................................................... 44
Table 23: Pin Definition of Antenna Tuner Control Interface through GPIOs ............................................44
Table 24: Pin Definition of Antenna Tuner Control Interface through RFFE..............................................45
Table 25: Configuration Pins of the Module............................................................................................... 45
Table 26: Configuration Pins List of M.2 Specification...............................................................................46
Table 27: EM160R-GLConnector Definition ofAntenna Interfaces.......................................................... 47
Table 28: Frequency Bands ....................................................................................................................... 48
Table 29: Dual-Antenna Conducted RF Receiver Sensitivity (Unit: dBm).................................................49
Table 30: Four-Antenna Conducted RF Receiver Sensitivity ....................................................................51
Table 31: EM160R-GLTransmitting Power................................................................................................52
Table 32: GNSS Frequency .......................................................................................................................52
Table 33: GNSS Performance....................................................................................................................53
Table 34: Major Specifications of the RF Connector.................................................................................. 55
Table 35: Antenna Requirements...............................................................................................................58
Table 36: Absolute Maximum Ratings........................................................................................................59
Table 37: Power Supply Requirements...................................................................................................... 59
Table 38: Logic Levels of 1.8 V Digital I/O................................................................................................. 60
Table 39: Logic Levels of 3.3 V Digital I/O................................................................................................. 60
Table 40: (U)SIM High/Low-voltage I/O Requirements.............................................................................. 60
Table 41: Operating and Storage Temperatures........................................................................................ 61