Quectel FC905A User manual

FC905A
User Manual
Wi-Fi&Bluetooth Module Series
Version: 1.0.1
Date: 2022-08-05
Status: Preliminary

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require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
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Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we
make every effort to ensure its quality. You agree that you are responsible for using independent analysis
and evaluation in designing intended products, and we provide reference designs for illustrative purposes
only. Before using any hardware, software or service guided by this document, please read this notice
carefully. Even though we employ commercially reasonable efforts to provide the best possible
experience, you hereby acknowledge and agree that this document and related services hereunder are
provided to you on an “as available” basis. We may revise or restate this document from time to time at
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to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel
or any third party in advertising, publicity, or other aspects.

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Third-Party Rights
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We make no warranty or representation, either express or implied, regarding the third-party materials,
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offer for sale, or otherwise maintain production of any our products or any other hardware, software,
device, tool, information, or product. We moreover disclaim any and all warranties arising from the course
of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the
relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the
purpose of performing the service only or as permitted by applicable laws. Before data interaction with
third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
otherwise provided by valid agreement, we make no warranties of any kind, either implied or express,
and exclude all liability for any loss or damage suffered in connection with the use of features and
functions under development, to the maximum extent permitted by law, regardless of whether such
loss or damage may have been foreseeable.
d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of
information, advertising, commercial offers, products, services, and materials on third-party websites
and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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Contents
Safety Information....................................................................................................................................3
Contents....................................................................................................................................................4
Table Index ...............................................................................................................................................6
Figure Index..............................................................................................................................................7
1Introduction.......................................................................................................................................8
1.1. Special Marks.........................................................................................................................12
2Product Overview............................................................................................................................13
2.1. General Description................................................................................................................13
2.2. Key Features..........................................................................................................................13
2.3. EVB........................................................................................................................................15
3Application Interfaces.....................................................................................................................16
3.1. General Description................................................................................................................16
3.2. Pin Assignment ......................................................................................................................17
3.3. Pin Description .......................................................................................................................18
3.4. Power Supply.........................................................................................................................20
3.4.1. Power Supply Pins Introduction...................................................................................20
3.4.2. Buck Circuit Pins Introduction......................................................................................21
3.5. WLAN Application Interface....................................................................................................22
3.5.1. SDIO Interface.............................................................................................................22
3.5.2. WLAN_EN...................................................................................................................24
3.5.3. WLAN_WAKE .............................................................................................................24
3.6. Bluetooth Application Interface...............................................................................................24
3.6.1. UART Interface............................................................................................................25
3.6.2. BT_EN.........................................................................................................................26
3.6.3. BT_WAKE_HOST and HOST_WAKE_BT ..................................................................26
3.6.4. PCM Interface .............................................................................................................27
3.7. Other Interfaces......................................................................................................................28
3.7.1. WLAN_SLP_CLK........................................................................................................28
3.7.2. XTAL_IN/OUT.............................................................................................................29
3.7.3. SDIO_VSEL ................................................................................................................29
3.7.4. GPIOs .........................................................................................................................29
3.8. RF Antenna Interfaces............................................................................................................30
3.8.1. Operating Frequency...................................................................................................30
3.8.2. Pin Definition of RF Antenna Interface........................................................................30
3.8.3. Reference Design........................................................................................................31
3.8.4. Reference Design of RF Routing.................................................................................31
3.8.5. Requirements for Antenna Design ..............................................................................33
3.8.6. RF Connector Recommendation.................................................................................33

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4Electrical Characteristics & Reliability..........................................................................................36
4.1. General Description................................................................................................................36
4.2. Absolute Maximum Ratings & Recommended Operating Conditions.....................................36
4.3. I/O Interface Characteristics...................................................................................................37
4.4. Power Consumption...............................................................................................................37
4.5. Wi-Fi RF Performances..........................................................................................................38
4.5.1. Conducted RF Output Power ......................................................................................38
4.5.2. Conducted RF Receiving Sensitivity ...........................................................................39
4.6. Bluetooth RF Performance.........................................................................................................40
4.6.1 Conducted RF Output Power ......................................................................................41
4.6.2 Conducted RF Receiving Sensitivity ...........................................................................41
4.7. ESD........................................................................................................................................41
5Mechanical Information..................................................................................................................43
5.6 Mechanical Dimensions..........................................................................................................43
5.7 Top and Bottom Views ...........................................................................................................44
6Storage, Manufacturing & Packaging............................................................................................45
6.6 Storage Conditions.................................................................................................................45
6.7 Manufacturing and Soldering..................................................................................................46
6.8 Packaging Specifications........................................................................................................48
6.8.1 Carrier Tape................................................................................................................48
6.8.2 Plastic Reel .................................................................................................................48
6.8.3 Packaging Process......................................................................................................49
7Appendix References .....................................................................................................................50

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Table Index
Table 1: Special Marks............................................................................................................................ 12
Table 2: Key Features............................................................................................................................. 13
Table 3: I/O Parameters Definition.......................................................................................................... 18
Table 4: Pin Description.......................................................................................................................... 18
Table 5: Definition of Power Supply and GND Pins................................................................................. 21
Table 6: Definition of Buck Circuit Pins ................................................................................................... 21
Table 7: Recommended Inductance Parameters.................................................................................... 22
Table 8: Pin Definition of SDIO Interface................................................................................................. 23
Table 9: Pin Definition of WLAN_EN....................................................................................................... 24
Table 10: Pin Definition of WLAN_WAKE ............................................................................................... 24
Table 11: Pin Definition of UART Interface.............................................................................................. 25
Table 12: Pin Definition of BT_EN........................................................................................................... 26
Table 13: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT .......................................... 27
Table 14: Pin Definition of PCM Interface ............................................................................................... 27
Table 15: Pin Definition of WLAN_SLP_CLK Interface ........................................................................... 28
Table 16: WLAN_SLP_CLK Parameter Recommendation...................................................................... 28
Table 17: XO Parameter Definition.......................................................................................................... 29
Table 18: Pin Definition of SDIO_VSEL .................................................................................................. 29
Table 19: Pin Definition of GPIOs............................................................................................................ 30
Table 20: FC905A Operating Frequency................................................................................................. 30
Table 21: Pin Definition of RF Antenna Interfaces................................................................................... 30
Table 22: Antenna Cable Requirements ................................................................................................. 33
Table 23: Antenna Requirements............................................................................................................ 33
Table 24: Absolute Maximum Ratings..................................................................................................... 36
Table 25: Recommended Operating Conditions...................................................................................... 36
Table 26: General DC Electrical Characteristics ..................................................................................... 37
Table 27: Power Consumption of the Module ......................................................................................... 37
Table 28: Conducted RF Output Power at 2.4 GHz ................................................................................ 38
Table 29: Conducted RF Output Power at 5 GHz ................................................................................... 39
Table 31: Conducted RF Receiving Sensitivity at 5 GHz ........................................................................ 40
Table 32: Conducted RF Output Power .................................................................................................. 41
Table 33: Conducted RF Receiving Sensitivity at 2.4 GHz ..................................................................... 41
Table 34: Electrostatic Discharge Characteristics (25 ºC, 45 % Relative Humidity)................................ 41
Table 35: Recommended Thermal Profile Parameters ........................................................................... 47
Table 36: Carrier Tape Dimension Table (Unit: mm)............................................................................... 48
Table 37: Plastic Reel Dimension Table (Unit: mm)................................................................................ 49
Table 38: Related Documents................................................................................................................. 50
Table 39: Terms and Abbreviations......................................................................................................... 50

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Figure Index
Figure 2: Pin Assignment (Top View)...................................................................................................... 17
Figure 4: Power-up Timing...................................................................................................................... 21
Figure 6: WLAN Application Interface Connection .................................................................................. 22
Figure 7: SDIO Interface Connection ...................................................................................................... 23
Figure 8: Block Diagram of Bluetooth Application Interface Connection ................................................. 25
Figure 9: Reference Design for UART Interface Connection................................................................... 26
Figure 10: PCM Interface Connection..................................................................................................... 27
Figure 12: Microstrip Design on a 2-layer PCB ....................................................................................... 31
Figure 13: Coplanar Waveguide Design on a 2-layer PCB ..................................................................... 31
Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)................... 32
Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)................... 32
Figure 16: Dimensions of the U.FL-R-SMT Connector (Unit: mm).......................................................... 34
Figure 17: Mechanicals of U.FL-LP Connectors...................................................................................... 34
Figure 18: Space Factor of Mated Connector (Unit: mm)........................................................................ 35
Figure 19: Top and Side Dimensions (Top and Side View)..................................................................... 43
Figure 22: Top & Bottom View of FC905A .............................................................................................. 44
Figure 23: Recommended Reflow Soldering Thermal Profile.................................................................. 46
Figure 24: Carrier Tape Dimension Drawing....................................................................................... 48
Figure 25: Plastic Reel Dimension Drawing........................................................................................ 48
Figure 26: Packaging Process................................................................................................................. 49

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1Introduction
This document defines the FC905A and describes its air interfaces and hardware interfaces which are
connected with your application.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular
installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined
by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help.
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to
avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna
shall not be less than 20cm (8 inches) during normal operation.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Any changes or modifications not expressly approved by the party responsible forcompliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part
15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the
transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation
should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band

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emissions). The host manufacturer must verify that there are no additional unintentional emissions other than
what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as
described by the instructions, require that the host product manufacturer must notify to Quectel Wireless
Solutions Co., Ltd that they wish to change the antenna trace design. In this case, a Class II permissive
change application is required to be filed by the USI, or the host manufacturer can take responsibility through
the change in FCC ID (new application) procedure followed by a Class II permissive change application.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window
on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
second label must be placed on the outside of the final device that contains the following text: “Contains FCC
ID: XMR202208FC905A”
The FCC ID can be used only when all FCC compliance requirements are met.
Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) Only antennas of the same type and with equal or less gains as shown below may be used with this
module. Other types of antennas and/or higher gain antennas may require additional authorization for
operation.
(4) The max allowed antenna gain is WIFI 2.4G/BT 0.52dBi; WIFI 5G 0.66 dBi for external antenna.
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID
cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This device complies with ISED’s licence-exempt RSSs. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage
préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de
provoquer un fonctionnement indésirable.