Quick BGA EA-H00 User manual

QUICK BGA EA-H00 OPERATION MANUAL
QUICK BGA EA-H00
BGA/SMD Rework Station
Operation Manual
Thank you for purchasing our BGA/SMD Rework System. The system is exclusively designed for reworking
and soldering SMD component. Please carefully read this manual before operating the system. Store this
manual in a safe, easily accessible place for future reference.

QUICK BGA EA-H00 OPERATION MANUAL
Contents
1. Summary .......................................................................................................................... 1
2. Product Picture ................................................................................................................. 2
3、Enchase component ........................................................................................................ 2
4. Safety Instructions ............................................................................................................ 2
5. Specifications and Technical Parameters ........................................................................... 3
5.1 Specifications ................................................................................................................. 3
5.2 Technical Parameters ...................................................................................................... 4
6. Install and Connect System ............................................................................................... 5
6.1 Place System .................................................................................................................. 5
6.2 Install RPC ..................................................................................................................... 5
6.3 System Connecting ......................................................................................................... 5
7. control box Instructions .................................................................................................... 6
8. IR System Operation ........................................................................................................ 6
8.1 Part Function .................................................................................................................. 6
8.2 Parameters Setting .......................................................................................................... 7
8.3 Operating technics instruction ....................................................................................... 15
9. PL System Operation ...................................................................................................... 18
9.1 Component function ..................................................................................................... 18
10．Equipment Maintenance ............................................................................................. 19
11、QUICKSOFT brief instruction ................................................................................... 20
11.1 operation interface ...................................................................................................... 20
11.2 parameter testing interface .......................................................................................... 21
11.3 curve analysis interface ............................................................................................... 22
11.4dvanced setting interface .............................................................................................. 22

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1. Summary
Thank you for using QUICK BGA EA-H00 Rework System. This system, which adopts
micro-processor control and infrared sensor technology to do soldering and de-soldering to
surface mount components safely and accurately, increases bottom heating power based on the
original one. It can also control the whole technical process and record all the information by
means of the IR Software, thus meeting the higher technical demands of modern electronic
industry. It becomes one of the most valued electronic equipments in this field. QUICK BGA
EA-H00 consists of two parts: QUICK IR EA-H00 Infrared Rework System and QUICK PL
EA-H00 Precision Placement System.
In order to control the soldering process optimally and get the nondestructive and
reproductive PCB temperature, IR EA-H00’s heating power is up to 2400W, suitable for all
applications, such as large or small PCB as well as lead-free process. The technology of re-flow
soldering controlled by closed-loop ensures the precise and smaller technical window, even heat
distribution and appropriate peak value of temperature for lead-free soldering.
IR EA-H00 Rework System adopts micro-processor control and infrared sensor technology.
It has the precision non-contact infrared temperature sensor for de-soldering parts and the
middle wavelength infrared heater. The soldering process is under the monitoring of
non-contact infrared sensor and optimum control of process can be achieved at any time. The
middle-wavelength infrared heater has a well-proportioned and safe heating and power and
flexibleness necessary for the system, so it can also deal with some PCBs with big thermal
capacity and other high temperature situation (lead-free soldering) easily. The adjustable
aperture under the infrared heater can protect the adjacent components (which are sensitive to
the temperature) on PCB from being heated. No need for nozzles.
IR EA-H00 works under the “open environment”, that is, it can calibrate and test
temperature in soldering process. When the melting of solder is found by visual inspection,
press down the calibrating button to record the melting temperature of solder. IR EA-H00 has
10 types of working modes and programmable temperature controlling can modify the
parameters of every working modes. IR system and setting of parameters are operated by
outside Keyboard as well as by IR soft.

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2. Product Picture
3、Enchase component
Please check whether the following parts are included and intact.
* Main Unit BGA EA-H00
* Control box
* BGA EA-H00 Operation Manual
* video line
* USB connect line
* video capture card
* BGA tool box
* IR Camera—RPC（optional）
* computer、LCD(optional）
Note: The parts will be packed according to the packing list. If you don’t purchase the
optional part, it will not be in the package. If any part stated above is missed out, please
contact with our company or agents immediately.
4. Safety Instructions
Note:
For safety of system and operator, please read this manual carefully before operating the
unit.
Please note that the unit is suitable for soldering and de-soldering of electronic

BGA2015 OPERATION MANUAL
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components.
Note: Top and bottom IR radiator will be very hot during working, so explosive and
combustible object or gas and solvent is strictly prohibited in working areas, also please
don’ touch the hot housing parts
Note: The laser alignment device includes two secondary laser device, so don’t see the laser
bean directly.
Note: When the system happens trouble and needs maintenance, it should be carried on by a
experienced and authorized technician or expert, or contact with service agent and
factory.
The unit with dangerous voltage! The inexperienced work is dangerous for operators.
5. Specifications and Technical Parameters
5.1 Specifications
1．Total power: 2400W（max）
2．Power of Bottom Heater: 400W*4=1600W （Infrared ceramic heating tube）
3．Power of Top Heater: 120W*6=720W （Infrared heating tube,
wavelength about 2~8µm，size:60*60mm）
4．Preheating Time of Bottom Heater: about:90s, size:260*260mm
5．Top heater range size: 20~60mm
6．Heating time of Top Heater: about 10s（room temperature~230℃）
7．Vacuum Pump: 12V/300mA, 0.05Mpa
8．Top cooling Fan: 24V/300mA 00CFM
9．Laser Alignment Tube: 5V/30mA 2pcs
10．LCD Display window: 65.7*23.5（mm） 16*2 character
11．Communication: Standard USB connector (Connect with PC）
12．Movable Motor : stepping motor
13．Movable Arm Range: 128mm
14．Infrared Temperature sensor : 0~300℃（Testing range）
00．Outside K Type Sensor: 3pcs
16．Max PCB Size : 400mm*400mm
17．fuse 3pcs, 20A（220V）

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Net weight： 52kg
Packaging dimension： 970*830*520（mm）
Note: When purchasing the equipment, please indicate the working voltage.
5.2 Technical Parameters
TL：Melting temperature of solder
T1：Heat preservation starting temperature of reflow soldering
T2：Heat preservation ending temperature of reflow soldering
T3：Peak value temperature of soldering and de-soldering
T0：Valve temperature: The lowest temperature of Bottom Heater when Top Heater heats up.
T0<TB
Tir：The set temperature of bottom heater
TB：The real-time temperature of bottom heater
TC：The real-time temperature of top heater
S1：Heating time rising from T1 to T2
S2：Heating time rising from T2 to T3
S3：Heat preservation time of T3
IR EA-H00 Rework System has ten working modes and its parameter can be changed according to
demand. The following eight data can be referred.
0． T1=120℃ S1=50s T2=140℃ S2=45s T3=195℃ S3=15s TL=183℃ TB=150℃
T0=100℃
1． T1=130℃ S1=40s T2=145℃ S2=45s T3=200℃ S3=15s TL=183℃ TB=160℃
T0=150℃
2． T1=140℃ S1=30s T2=150℃ S2=50s T3=200℃ S3=20s TL=183℃ TB=160℃
T0=155℃
3． T1=140℃ S1=40s T2=150℃ S2=50s T3=195℃ S3=25s TL=183℃ TB=165℃
T0=160℃
4． T1=160℃ S1=50s T2=180℃ S2=40s T3=230℃ S3=15s TL=217℃ TB=170℃
T0=150℃
5． T1=160℃ S1=40s T2=175℃ S2=50s T3=225℃ S3=20s TL=217℃ TB=180℃
T0=170℃
6． T1=170℃ S1=40s T2=185℃ S2=50s T3=228℃ S3=20s TL=217℃ TB=180℃
T0=180℃
7． T1=180℃ S1=40s T2=185℃ S2=50s T3=228℃ S3=25s TL=217℃ TB=190℃
T0=185℃

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6. Install and Connect System
6.1 Place System
* Unwrap the packing of the unit, then take out BGA EA-H10 Main Unit and put it on the
horizontal worktable.
* Make sure whether the unit and parts are in good conditions.
6.2 Install RPC
1. Unscrew RPC Fixing Knob on the RPC Fixing Bracket and install RPC in the Bracket ,
tighten knob.
2. Put the plug of RPC connecting wire into Camera Socket.
3. RPC’s position can be adjusted. Unscrew fixing knob in corresponding direction and then
adjust. RPC can be moved up and down or turned.
6.3 System Connecting
* Please check whether the supply voltage accords with the rated voltage on the system
nameplate.
* Please check whether all switches are turned off .
* Connect the video cord of outside Indicator or Monitor to the VIDEO-OUT socket.
* Connect IR camera（RPC）to IR camera socket.
* Connect control box to socket.
* connect ground line to ground hole.
After all above steps, insert power plug into power sockets, and turn on switch.
Install RPC herein.
RPC Fixing Knob
RPC Fixing Bracket
Camera
RPC (Reflow Process Camera)

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7. control box Instructions
A. During selecting working flow period, UP and DOWN knobs are used for controlling the
moving upward or downward of cursor but when in standby interface, it can increase or
decrease the digital.
B. Function of OK key: Make the BGA-IR enter parameters setting mode and cursor move a
step forward.
C. Function of “cool/stop” key: if BGA-IR in flow, stop an finish flow; if BGA-IR in flow,
open or close cool fan.
D. Function of “START” key: in standby state, make BGA-IR enter solder and desolder.
E. Function of “in-out/suck” key: cool fan stretch out or retraction; in desolder mode, when
flow reach T3 section, it can control IR suck mouth suck chip.
8. IR System Operation
8.1 Part Function
* Adjust the Aperture System
The Aperture System of Top Radiator can be adjust from 20×20 (mm) to 60×60 (mm) by two
Adjustment Knobs. Unscrew the knobs before adjusting, and adjust the window size, then
tighten knobs. The scale “2” on the housing means 20mm and “3’ means 30mm, other scale is
similar. For example, if you want to adjust size to 50×50(mm), adjust two knobs to the scale of
“5” and tighten them.
Connect USB line
Connect video line
Connect control box
Connect ground line

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Note:
Adjusting the aperture system can protect the adjacent components on the PCB from being
heated. But, when the aperture system is adjusted to small size, the Top Radiator will be very
hot and decrease its lifetime, so it’s necessary to increase the window size appropriately to
avoid the damage of the Top Radiator.
8.2 Parameters Setting
Parameter settings order as the follows:
A．_password: *** （Password settings）
B、_select: 0 （Flow settings, it can modify parameter inside.）
C．_type: solder （Working mode settings）
D．_laser: off (Laser alignment settings)
E．_baud: 19200 （Communication speed settings）
A. Input password
The initial password of system is “000”. At the same time, system also has the omnipotent
password “159”. If you forget the setting password, you can input “159” to make the password
of system come back to initial password “000”.
Note: If want to modify any parameter system, you must input password, otherwise, you can only
browse them.
For instance: Input the initial password “000” of system.
press MENU press MENU
TC:022˙C Tb:019˙C
ready for flow
_password: ***
select: 0
Scale
Adjustment

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Rotate MENU press MENU
旋转
rotate MENU press MENU
rotate MENU press OK
After input password:
1. If you want to modify the password, return to above mode to input the new password. If
password is modified successfully, it will show:
2. If you want to modify the next working flow, operate as the following B item; If you don’t
want to modify, please press DOWN knob to browse the following parameter settings.
B. Modify working flow
For instance: Modify the working flow and make it become 1 flow.
password: ***
select: 0
password: 0**
select: 0
password: 0**
select: 0
password: 00*
select: 0
password: 00*
select: 0
password: 000
select: 0
Saving Password !
Any key return ！
Saving Password!
Any key return

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rotate MENU press MENU
Step① Step②
rotate MENU press OK
Step③ Step④
1. When carry on the forth step (Step④), if press “SET” key, you can browse and modify
parameter of this flow, shown as C-1 item.
2. After finishing modifying of working flow 1, if you want to modify the next working mode,
operate as C item shows; If you don’t want to modify it, yon can press DOWN knob to
browse the next parameter settings.
C. Modify working mode
For instance: Modify the working mode and make it in “desolder” mode.
rotate MENU press MENU
rotate MENU press OK
password: ***
select: 0
password: ***
select: 0
password: ***
select: 0
password: ***
select: 1
password: ***
select: 1
password: ***
select: 1
select: 1
type: solder
select: 1
type: solder
select: 1
type: desolder
select: 1
type: desolder

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After finishing modifying working mode, if you want to modify laser alignment mode, operate
as D item shows; if no need to modify it, please press DOWN key to browse the next parameter
settings.
C-1. Modify Parameter of working flow
If it is necessary to modify parameter of a working flow, first you must select the working flow
and then modify its parameter.
The soldering technics is decided by T0, TB, T1, T2, T3, S1, S2 and S3. It describes the
temperature graph during the system working. TL denotes Melting temperature of solder and
the range between T2 and T3.
T0
T0 is the valve temperature for bottom heater required by top heater when it heats up. Also it is
the first temperature of this technics process. When the work flow begins, the bottom heater
starts to heat up. After reaching the T0, the top heater begins to heat up.
TB、Tb、
TC
TB: The test temperature of bottom preheating Tb: set temperature of bottom heating TC:
Real-time temperature of top heating
T1
It is the heat preservation starting temperature of reflow soldering. It is the second temperature
of this technics process. The temperature rises to T1 with a proper speed the component permits.
In parameter modifying, use the UP and DOWN knob to set the value of T1.
T2
It is the temperature when finish the heat preservation of reflow soldering. The pre-heating
temperature rises to T2, after the time of S1 finishes. Within this time, PCB and component
pre-heating is finished and the solder is activated. In parameter modifying, use the UP and
DOWN key to set the value of T2.
T3
It is the peak value temperature of reflow soldering. When the temperature reaches T2, the
temperature equably rises to T3 with a definite raising speed. The soldering or de-soldering will
be finished when the temperature reaches to the peak value and performs the next step. In
parameter modifying, use the UP and DOWN key to set the value of T3.
TL
Melting temperature of solder. At this temperature, the solder starts to melt down and turn into
liquid.
During the soldering and de-soldering, users can press CAL Key to calibrate the value of TL
when the solder turn into liquid. In parameter modifying, use the UP and DOWN knob to set

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the value of TL.
S1
Heating time rising from T1 to T2. User can set the value in the range of 0~300s.
S2
Heating time rising from T2 to T3. User can set the value in the range of 0~300s.
S3
Prolonged heating time (Heat preservation time) after the temperature reach T3, and user can
also set the value in the range of 0~999s.
Unit
It’s able to set the unit of display temperature during work flow. In parameter modifying, use
UP and DOWN keys to set the value of it.
Sensor
It is used for choosing the system’s sensor type. Users can also choose K type sensor used for
measuring temperature, besides system’s IR sensor. The signal of chosen sensor will be
displayed and used for process controlling. In parameter modifying, use the UP and DOWN key
to set the value.
Password
It is used for setting password. It is designed for preventing the equipment unnecessary or
non-authorized change. When it is set to “000”, the password protecting is useless. The
password is used for all flows and it can be useful and useless in each flow. The system requires
inputting correct password before any change.
Using of password refer to A item.
For instance : Modify parameter of flow one and make T1=130 , S1=70s, T2=160 , S2=50s, ℃ ℃
TB=130 . (Flow one has been selected)℃
press MENU press MENU
press MENU rotate MENU
password: ***
select: 1
_T1: 110℃
S1: 060s
T1: 110℃
S1: 060s
T1: 110℃
S1: 060s

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press OK rotate MENU
press MENU press MENU
rotate MENU press OK
rotate MENU press MENU
press MENU rotate MENU
press OK press MENU
press MENU press MENU
T1: 130℃
S1: 060s
_T1: 130℃
S1: 060s
T1: 130℃
_S1: 060s
T1: 130℃
S1: 060s
S1: 070s
T2: 150℃
S1: 070s
T2: 150℃
S1: 060s
T2: 150℃
S1: 060s
T2: 160℃
T1: 130℃
S1: 060s
T1: 130℃
S1: 070s
T1: 130℃
S1: 070s
S1: 060s
T2: 160℃
T2: 160℃
S2: 030s
T2: 160℃
S2: 030s

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press MENU press OK
rotate MENU rotate MENU
rotate MENU rotate MENU
press MENU press MENU
按下 MENU
rotate MENU press OK
rotate MENU rotate MENU
rotate MENU press OK
TL: 183℃
TB: 140℃
T0: 090℃
T FAN:100S
T FAN:100S
SPD: 80
T2: 160℃
S2: 030s
T2: 160℃
S2: 050s
T2: 160℃
S2: 050s
S2: 050s
T3: 200℃
T3: 200℃
S3: 010s
S3: 010s
TL: 183℃
TL: 183℃
TB: 140℃
TL: 183℃
TB: 140℃
TL: 183℃
TB: 130℃
TL: 183℃
TB: 130℃
TB: 130℃
T0: 090℃

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D. Modify laser alignment mode
For instance: Modify the laser alignment mode and set it to “on”.
rotate MENU press MENU
rotate MENU press OK
1. After finishing the modification, the next step communication speed, will not be able
modified by keyboard.
2. Press OK key to exit. Now, the system has saved all parameter settings, IR window will
display:
3. After all technology parameters have been selected, press BEGIN key and the system
perform the set flow.
E. System Error Indication
1. In initial state, if the top sensor or outer sensor is broken, it displays:
select: 1
type: desolder
type: desolder
laser: off
type: desolder
laser: off
type: desolder
laser: on
type: desolder
laser: on
TC:022℃ Tb:019℃
ready for flow
TC:022˙C Tb:019˙C
ready for flow

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If the bottom sensor is broken, it displays:
If above status happens, user should stop operating.
1. During the upward or downward movement of Top Heater or holding out and drawing back
of fan arm, if it doesn’t reach over 10 seconds, the unit will come back to initial state all and
singular in spite of what state it is here. It displays:
And forbid all mechanical movement of machine until restart.
2. When TC is less than 180℃ during working, if the rising temperature is less than 7℃, and
the system will exit the process and display “TC raise error”.
3. If TC is over than 265 during working, the system will exit the process and display “TC ℃
over error”.
8.3 Operating technics instruction
Note: Top and Bottom Heater will be very hot during working, so please don’ touch the hot
housing parts.
Note: The laser alignment device includes a secondary laser device, so don’t see the laser bean
directly.
TC: ***℃ Tb: ***℃
T sense error !
TC: ***℃ Tb: ***℃
B sense error !
TC: ***℃ Tb: ***℃
Move error !

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8.3.1Soldering Technics
1. Turn on power switch of each part.
2. Move PCB Fixture with fixed PCB and make it above the Bottom Radiator and make the
soldered component on the PCB between Top Radiator and Bottom Radiator. The position is
easy to be measured with laser alignment device. The right position should make the red
laser point in the center of component.
3. Adjust aperture system, and get a proper window size.
4. Adjust RPC in appropriate place, adjust size and focus of image with PL keyboard to
display component image in the monitor clearly.
5. Select parameter with keyboard. (Refer to Parameters setting)
A. Input password ”000”
B. Select the required flow, if need to modify, perform relevant operation.
C. Select “solder” working mode.
D. Select “IR” laser alignment mode.
E. No change to communication speed, and press EXIT key to exit. IR window shows:
F. Press “START” key ，and the system start working, perform content of selected flow.
6. IR window will display series of setting temperatures and the current temperature of Tb and
TC during working, and indicate when it reaches T0, T1, T2, T3 and TL. S1, S2 and S3 are
counted down and user can know about the setting value clearly.
7. If you see the solder has melted down (It is watched with RPC and Monitor), you can press
CAL key to calibrate temperature of TL to adjust the display temperature to liquid
temperature TL.
8. When the temperature reaches TL, there will be a voice signal.
9. When the temperature reaches T3, the sound signal changes to a briefness sound and the
system delays heating by S3 seconds. After that, the system will not heat up anymore and
exit the process automatically, the technical process is over.
10. The system can perform a series of function action during working.
A. After press START key, the top heater move downwards near to bottom.
B. After the system sounds unvaryingly, the top heater move upwards and Top Cooling
Fan and Outside Cooling Fan spread out to blow cooling air simultaneously.
C. After 150 seconds, the two Cooling Fns stop blowing, and the soldering technics has
been finished.
8.3.2 De-soldering Technics
1. Turn on power switch of each part.
2. Fix the PCB on the top of Bottom Heater and make the de-soldered component between Top
TC:022˙C Tb:019˙
C
ready for flow

BGA2015 OPERATION MANUAL
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Heater and Bottom Heater. The position is easy to be measured with laser alignment device.
The right position should make the red laser point in the center of component and the
suction pad in center of component also.
3. Press the vacuum suction tube to check whether suction pad is in the center of component.
(If the deflection is too much, the tube will not be able to pick up the component.
4. Adjust aperture system, and get a proper window size.
5. Adjust RPC in appropriate place, adjust size and focus of image with PL keyboard to
display component image in the monitor clearly.
6. Select parameter with keyboard. (Refer to Parameters setting)
A. Input password ”000”
B. Select the required flow, if need to modify, perform relevant operation.
C. Select “desolder” working mode.
D. Select “IR” laser alignment mode.
E. No change to communication speed, and press OK key to exit. IR window shows:
F. Press START key and the system start working, perform content of selected flow.
7. After pressing START key, Bottom Heater starts to heat up and Top Heater moves
downwards and reach to bottom.
8. IR window will show a series of setting temperatures during working. Indicate when it
reaches T0, T1, T2, T3 and TL. When the bottom temperature reaches T0, the top heater
begins to heat up.
9. When the temperature reaches TL, it will give a sound alert automatically (Low frequency).
10. When the temperature reaches T3, it will also give a sound alert automatically. (Middle
frequency)
11. When the solder has melted down, press the vacuum suction tube to pick up the component.
12. Press the vacuum suction tube, the vacuum pump start to work and pick up component, then
return to original position. The system stops heating.
13. The Top Heater moves upwards and stops at top.
14. Top Cooling fan and Outside Cooling Fan spreads out to blow cooling air simultaneously.
15. 90 seconds after the top heater starts moving upwards, the vacuum suction tube looses
component automatically.
16. After the two Cooling Fans blow cooling air for 150 seconds, the whole de-soldering
process will be over.
TC:022˙C Tb:019˙
C
ready for flow

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9. PL System Operation
9.1 Component function
1. Crosswise Cooling Fan
Besides the existing top cooling system, the system adds outside Cooling Fan again to speed up
the cooling process of PCB.
2、PCB fixture
* The movable PCB fixture is able to fix PCBs of different sizes. It has four Fixing Knobs. Two
PCB Fixing Knobs are used for locking PCB Clamp Bar to fix PCB. The other two Fixture
Fixing Knobs are used for locking the PCB Fixture to prevent it from moving lengthways and
transverse.
* Unscrew PCB Fixing Knobs and move the Slide Block to open the PCB Clamp Bar, make the
distance in accordance with PCB size. Fix PCB between Clamp Bars and screw down PCB
Fixing Knob after adjusting position. If you want to lock PCB Fixture, please screw down
Fixture Fixed Knob.
4.RPC (Reflow Process Camera)
RPC’s position can be adjusted. First, unscrew Fixed Knob in corresponding direction and then
adjust. RPC can be moved up and down or turned.
Fixed Knob
Slide
PCB
Fixed