Quick EA-A10 User manual

QUICK EA-A10
BGA/CSP Rework Station
Operation Manual
Thank you for purchasing our BGA/SMD Rework System. The system is exclusively designed for reworking
and soldering SMD component. Please carefully read this manual before operating the system. Store this
manual in a safe, easily accessible place for future reference.

QUICKEA-A10 OPERATION MANUAL
目 录
3. The Unit is Supplied with ............................................................................................................................... 2
4. Safety Instructions .......................................................................................................................................... 3
5. Specifications and Technical Parameters ................................................................................................... 3
5.1 Specifications ........................................................................................................................................ 3
5.2 Technical Parameter ............................................................................................................................ 4
HED： the position of the top heater（UP-DOWN-UNKN） ............................................................................ 4
ALG： the position of the contraposition arm（IN-OUT-UNKN） ................................................................... 4
6. Installing and Connecting of the Equipment ....................................................................................... 4
6.1 Check the Package of the Equipment .............................................................................................. 4
6.2 Connect Equipment .......................................................................................................................... 4
7. Parts Instruction .............................................................................................................................................. 5
7.1 Sensor ................................................................................................................................................... 5
7.2 Heater System ..................................................................................................................................... 5
7.3 PCB Fixture and Movement Controlling .......................................................................................... 5
7.4 Keys Instructions ................................................................................................................................. 6
7.5 Aligning Arm Instruction ..................................................................................................................... 7
7.6 Nozzle Instruction ................................................................................................................................ 7
8、Technology Process ..................................................................................................................................... 8
8.1 Process of Sucking the Chip ............................................................................................................. 8
8.2 solder flow of chip ................................................................................................................................ 9
8.3 De-soldering Process ....................................................................................................................... 10
9、Description of the process ................................................................................................................... 11
9.1 place height and suck height ..................................................................................................... 11
9.2 soldering technology ..................................................................................................................... 11
9.3 Desolder technology ....................................................................................................................... 12
9.4 Aligning Technology .......................................................................................................................... 12
10. Equipment Maintenance ........................................................................................................................... 13
10.1 Clean parts ........................................................................................................................................ 13
10.2 Replace Suction Pad ....................................................................................................................... 13
11、QUICKSOFT brief instruction .................................................................................................................... 14
11.1 operation interface ............................................................................................................................... 14
11.2 counterpoint operation interface ........................................................................................... 15
11.3 parameter testing interface ..................................................................................................... 16
11.4 curve analysis display ........................................................................................................................ 17
11.3 advanced setting interface ................................................................................................................. 17

QUICK EA-A10 OPERATION MANUAL
Page 1
1. Summary
Thank you for using QUICK BGA EA-A10 Rework System. This system, have increase base heating power
to original system , which adopts micro-processor control and infrared sensor technology to do soldering and
de-soldering to surface mount components safely and accurately, increases bottom heating power based on the
original one. It can also control the whole technical process and record all the information by means of the IR
Software, thus meeting the higher technical demands of modern electronic industry. It becomes one of the most
valued electronic equipments in this field.
QUICKEA-A10 Rework System adopts hot airflow technology and closed–loop principle, integrating
harmoniously the infrared preheater and the sirocco heater together. In order to control the soldering process
optimally and get the nondestructive and reproductive PCB temperature, QUICKEA-A10’s heating power is up to
4200W and the heating power can be adjustable.
With K-type sensor controls the surface temperature of the BGA. For more preciseness technics demands
and effectual controlling the PCB temperature and the encapsulation temperature, the technology of re-flow
soldering controlled by closed-loop ensures the precise and smaller technical window, even heat distribution and
appropriate peak value of temperature for lead-free soldering. Besides, the infrared preheater is suitable for all
applications, such as large or small PCB and lead-free solder, moving automatically in X-axis to heating the PCB
evenly.
For reducing the manual effects, QUICK EA-A10 BGA rework system can automatically run the processes
except adjusting X、Y、θ with hand, but with the precise motor for precise alignment. Besides, the chip sucking
and pasting, lens moving, reflow controlling, heating moving and chip de-solder are all automatic controlled by
the step motor. And the system has the controlling software with wide screen display of LCD to multi-control the
processes unaided or by the outer computer.
The new BGA rework system has the advantages of the infrared heater and sirocco heater, satisfying the
demands of reworking the BGA, especially in lead-free soldering.

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2. Product Picture
3. The Unit is Supplied with
Please check whether the following parts are included and intact.
* QUICK EA-A10 Main Unit 1 pcs
* PC（optional） 1 pcs
* QUICK EA-A10 Operation Manual 1 pcs
* top Sirocco nozzle (client provide size) 3 pcs
* Bottom Sirocco nozzle (50*50) 、(36*36) 2 pcs
* Video line 1 pcs
* USB line 1 pcs
* K-type sensors 5 pcs
* BGA Toolbox 1 pcs
Note:
 The parts will be packed according to the packing list. If you don’t purchase the optional part, it will not be in
the package. If any part stated above is missed out, please contact with our company or agents immediately.
rotate
External K type
temperature sensor
Scram switch
Power switch
Bottom infrared preheat
Bottom hot wind heating
Support fixed knob
PCB fixed support

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4. Safety Instructions
Note: For the safety of the system and operator, please read this manual carefully before operating the unit.
Please note that the unit is suitable for soldering and de-soldering of electronic components.
Note: Top and bottom infrared heater and sirocco nozzle will be very hot during working, so explosive and
combustible object or gas and solvent is strictly prohibited in working areas, also please don’ touch the hot
surface parts.
This equipment must be grounding when using.
Note: The laser alignment device includes a secondary laser device, so don’t see the laser bean directly.
Note: When the system in trouble and needs maintenance, it should be maintained by an experienced and
authorized technician or expert, or contact with service agent and factory.
The unit with dangerous voltage! The inexperienced maintenance is dangerous for the operators.
5. Specifications and Technical Parameters
5.1 Specifications
1. Power: 4200W（max）
2. Voltage: 220V/230V AC、 50/60HZ
3. Power of top Heater: 1200W
4. Power of Bottom infrared preheater:： 400W*4=1600W（infrared heat）
5. Power of Bottom Sirocco Heater： 1200W
6. Temperature of the Sirocco Heater: ≤3.5 m3/min
7. Temperature of the infrared heater: 400℃（MAX）
8. Preheating temperature range: 400℃（MAX）
9. Size of the infrared heater: 290mm*3240mm
10. Maximal PCB size: 380mm*260mm
11. Chip size range: 2*2mm ~60*60mm
12. Placement precision ±0.02mm
13. Placement force 1.5N / zero pressure placement （two mode realize）
14. Camera： 12V/300mA；
22*10 Horizontal resolution: 480 TV lines
PAL format (composite)
15. LED light: White LED (lower side), Red LED (upper side) (with adjustable brightness)
16. communicate： USB （can connect to PC）
17. Bump： 12V/300mA, 0.05Mpa（max）
18. K-type sensor： 5个

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19. Dimension： 1200(L) mm×800(W) mm×940 (H)mm
20. net weight： about 60kg
5.2 Technical Parameter
T0: Valve temperature and T0≤TIR. Only when the temperature of the bottom infrared heater up to the T0, the
top and bottom hot air heater comes to heat.
VT: The setting airflow of the top hot air
VB: The setting airflow of the bottom hot air
Top Sirocco: set top sirocco temperature of flow
Bottom sirocco: set bottom sirocco temperature of flow
Time: The setting time in the D1~D6&COOL zone
D1~D6：The six zone of one flow
COOL：The cooling zone
KT1~KT5: The testing temperature on the PCB with the outer K-type sensor 1~5
TC：The real temperature of the top sirocco heater
TB：The real temperature of the bottom sirocco heater
Tir：The setting temperature of bottom infrared heater
TIR：The real temperature of the bottom infrared heater
BUM：Pump is in working mode or not
FAN： The nearside cooling fan is in working mode or not
HED： the position of the top heater（UP-DOWN-UNKN）
ALG： the position of the contraposition arm（IN-OUT-UNKN）
6. Installing and Connecting of the Equipment
6.1 Check the Package of the Equipment
 Check the package of the equipment is good or not.
 Take out the QUICK EA-A10 from the package and place it on the solid working desk.
 Check every unit is good or not according to the packing list. If not, please replace the unit from our company
or agents in time.
6.2 Connect Equipment
 Check the power supply whether is the same with the rating voltage value in the specification scutcheon.
 Check the switches of the entire units are turn off or not.
 Connect the power cord to the power socket.
 Connect the RS-232 cord to the RS-232 socket in PC if you use the BGA software.
 Connect the video line of the external LCD to the VIDEO-OUT socket.
 Connect the K type sensors (optional) to the external sensor’s socket in the front.

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7. Parts Instruction
7.1 Sensor
The system has five K-type sensors for checking the temperature on the PCB,
such as the temperature of BGA surface, bottom temperature of the PCB, real
temperature of the tin ball. And these values can show on the LCD. Besides,
users can select the sensors during KT1-KT5.
7.2 Heater System
* Main Heater
1. The main heater includes the top hot air heater and the
bottom hot air heater.
2. The top and bottom hot air heater both provides
1200W-heating power. The temperature and the airflow
both can be adjustable by the software, main zone of
heating warming rapid, heat distribution uniformity, reduce
vertical range of temperature between chip surface and
welding spot , shorten craft carry out time.
* The Bottom Infrared Preheater
The maximal heating power of the bottom infrared heater is 1600W.
7.3 PCB Fixture and Movement Controlling
* Bottom Preheater and the PCB Fixture
The adjustable infrared heater can provide even quantity of heat for the PCB and protect the PCB from distortion.
The infrared heater
* Movement of the PCB Fixture
1. Movable PCB fixture is able to fix PCB with different size.
2. It has two lock knobs which are used for locking PCB Fixed Bar and to prevent it from moving the PCB.
3. Unscrew PCB Lock Knobs and push the Slide Block by hand to open the PCB Fixed Bar, make the distance
accord with the PCB’s size. Fix the PCB between them and screw the lock knobs. And then screw the fixture
lock knob.
4. Before doing the precise alignment, please screw the Fixture Lock Knob. By “PCB MOVE CONTROL” to
control the alignment from X, Y and θ.
5. Press the key on the top of the rocker “PCB MOVE CONTROL” and when swinging the rocker leftward or
rightward, the PCB fixture will do the corresponding movement, leftward or rightward. When swinging the
Top hot air heater
bottom hot air heater
Bottom Sirocco heater

QUICK EA-A10 OPERATION MANUAL
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rocker onward or backward, the PCB fixture will do the corresponding movement, onward or backward. If do
not press the key on the top of the rocker and swing the rocker, the pad sucking the chip can do turn 360°.
6. Fix anomalistic PCB with anomalistic knightheads and bottom fixtures for preventing subside.
7.4 Keys Instructions
1. Press rocker and move it left and right, then realize the PCB guide rail move left and
right; move rocker front and back, then realize the PCB move front and back.
2. When proceed θ count point , not need press rocker, spin it direct , can realize chip
360°rotate , then finish counterpoint of chip.
Key name function description
START After set craft and select flow, press START key
about 2S, auto start flow.
STOP Click STOP key, auto stop flow
EMERGENCY
STOP
When happen accident, press this key, X/Y/Z
stop move ,hot air and sirocco stop; rotate
clockwise remove emergency ,X/Y/Z rest.
POWER Rotate clockwise, connect power;
Rotate anticlockwise, cutoff power
Anomalistic
knightheads
Bottom fixtures for preventing subside

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7.5 Aligning Arm Instruction
1、the movement of Aligning arm is control by software ; controlling by “aligning in/aligning out”in interface of
software.
2、arm is used for the element alignment. In the aligning arm. Aligning arm contain camera, camera export video
signal to monitor which produce from PCB and mouth, user can see the picture from monitor, can aligning by
rocker and knob.
3、only when top heater reset, Aligning arm can movement.
4、when use camera, Aligning arm must be in out, light can adjust by BLUE、YELLOW knob, adjust picture by
FOCUS）、（ZOOM） , can obtain clear picture , and micro-adjust, Aligning simpleness .
7.6 Nozzle Instruction
1. Software can realize auto place and suck chip.
2. Turn the rocker when optics alignment to make the sucked BGA by the nozzle turning until the stannum
ballpoint in the BGA is superposable with the cuprum point in the PCB. During the process, make the rocker
leftward and rightward, onward and backward for precise alignment.
Key name Function description
Zoom Control magnify and reduce of picture, 1~8 zoom ratio in all;
Rotate clockwise（+），picture magnification, anticlockwise（-），reduction
Focus Camera focus key
Rotate clockwise (+），focus magnification,， anticlockwise（-）， reduction
TOP-LIGHT Top white light
Rotate clockwise （+），blue white brighten, anticlockwise （-），darken
BOT-LIGHT Bottom orange light
Rotate clockwise （+）， orange light brighten ， anticlockwise （-）， darken
Z
Rotate clockwise （+），downward movement, anticlockwise （-），upward movement
Press Z rotate,(prism state is OUT), realize change “high speed mode”and“low speed
mode”can see state of soft
Aligning prism

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8、Technology Process
8.1 Process of Sucking the Chip
Click CAMERA key
The alignment arm is out.
Click SUCKER key
The nozzle moves downward to suck the
chip and then move upward. At the time, the
Alignment adjust
By the rocker, the ZOOM
keys and the FOCUS
keys
The image is clear
or not? Has
completed the
alignment or not?
Chip solder
Technology Process contain: solder and desolder.
The soldering process includes suck, alignment and soldering.
The de-soldering process includes laser alignment and de-soldering.
Place chip