Renesas ISL81801EVAL1Z User manual

R12UZ0082EU0100 Rev.1.00 Page 1 of 17
May.6.20
ISL81801EVAL1Z
Evaluation Board
User’s Manual
The ISL81801EVAL1Z evaluation board (shown in Figure 5) features the ISL81801, a 80V high voltage
synchronous buck-boost controller that provides external soft-start, independent enable functions, and integrates
UV/OV/OC/OT protection. A programmable switching frequency ranging from 100kHz to 600kHz helps to
optimize the inductor size while the strong gate driver delivers up to 20A for the buck-boost output.
Key Features
• Wide input range: 9V to 80V
• Bi-directional operation
• High light-load efficiency in pulse skipping DEM operation
• Programmable soft-start
• Optional DEM/PWM operation
• Optional CC/HICCUP OCP protection
• Supports pre-bias output with soft-start
• PGOOD indicator
• OVP, OTP, and UVP protection
• Back biased from output to improve efficiency
Specifications
The ISL81801EVAL1Z evaluation board is designed for high current applications. The current rating of the
ISL81801EVAL1Z is limited by the FETs and inductor selected. The ISL81801EVAL1Z electrical ratings are
shown in Ta ble 1.
Ordering Information
Related Literature
For a full list of related documents, visit our website:
•ISL81801 device page
Table 1. Electrical Rating
Parameter Rating
Input Voltage 9V to 80V
Switching Frequency 200kHz
Output Voltage 12V
Output Current 10A
OCP Set Point Minimum 11A at ambient room temperature
Part Number Description
ISL81801EVAL1Z High Voltage BUCK-BOOST Controller Evaluation Board

ISL81801EVAL1Z
R12UZ0082EU0100 Rev.1.00 Page 2 of 17
May.6.20
Figure 1. ISL81801EVAL1Z Block Diagram
ISL81801 TQFN
EXTBIAS
VDD
SS/TRK
RT/SYNC
FB_OUT
PGND
VIN
CLKOUT DITHER
EN/UVLO
SGND
VCC5V
COMP
ISEN- ISEN+ CS-
CS+
PHASE2
LG1/
PWM_MODE
PHASE1
UG1
BOOT1
UG2
BOOT2
LG2/
OC_M ODE
VDD
VDD
PLL_COMP
VIN
VOUT
FB_IN
IMON_IN
IMON_OUT
PGOOD
CLKEN
BSTEN
OV

ISL81801EVAL1Z 1. Functional Description
R12UZ0082EU0100 Rev.1.00 Page 3 of 17
May.6.20
1. Functional Description
The ISL81801EVAL1Z is the same test board used by Renesas application engineers and IC designers to
evaluate the performance of the ISL81801 TQFN IC. The board provides an easy and complete evaluation of all
the IC and board functions.
As shown in Figure 4, 9V to 80V VIN is supplied to J1 (+) and J2 (-). The regulated 12V output on J4 (+) and J5 (-)
can supply up to 10A to the load. Due to the high power efficiency, the evaluation board can run at 10A
continuously without airflow at room temperature ambient conditions.
Test points TP1 through TP28 provide easy access to the IC pin and external signal injection terminals.
As shown in Tabl e 2 , connector J8 provides a selection of either Forced PWM mode (shorting Pin 1 and Pin 2) or
DEM mode (shorting Pin 2 and Pin 3). Connector J9 provides a selection of either constant current limit (shorting
Pin 1 and Pin 2) or HICCUP OCP (shorting Pin 2 and Pin 3). Connector J3 provides an option to disable the
converter by shorting its Pin 1 and Pin 2.
1.1 Recommended Testing Equipment
The following materials are recommended for testing:
• 0V to 80V power supply with at least 30A source current capability
• Electronic loads capable of sinking current up to 20A
• Digital Multimeters (DMMs)
• 100MHz quad-trace oscilloscope
1.2 Operating Range
The input voltage range is from 9V to 80V for an output voltage of 12V. If the output voltage is set to a lower value,
the minimum VIN can be reset to a lower value by changing the ratio of R2and R3. The minimum EN threshold
that VIN can be set to is 4.5V.
The rated load current is 10A with the OCP point set at minimum 11A at ambient room temperature conditions.
The operating temperature range of this board is -40°C to +85°C.
Note: Airflow is needed for higher temperature ambient conditions.
1.3 Bi-Directional Operation
See Figure 2 for proper setup. Float the FBI pin (J7) and set the mode to CCM before powering on the board. The
rated voltage of the super capacitor must be higher than 12V.
1. Adjust the input voltage higher than 9V. Switch on the input power source.
2. Switch off the input power source after the super capacitor is fully charged.
Figure 2. Proper Setup for Bi-Directional Operation
DC ISL81801EVAL1Z
VIN
GND
VOUT
GND
Load

ISL81801EVAL1Z 1. Functional Description
R12UZ0082EU0100 Rev.1.00 Page 4 of 17
May.6.20
1.4 Quick Test Guide
1. Jumper J8 provides the option to select PWM or DEM. Jumper J9 provides the option to select constant current
limit or HICCUP. See Table 2 for the operating options. Ensure that the circuit is correctly connected to the
supply and electronic loads before applying any power. See Figure 4 for proper setup.
2. Turn on the power supply.
3. Adjust the input voltage (VIN) within the specified range and observe the output voltage. The output voltage
variation should be within 3%.
4. Adjust the load current within the specified range and observe the output voltage. The output voltage variation
should be within 3%.
5. Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, see
Figure 3 for proper test setup.
Table 2. Operating Options
Jumper Position Function
3 EN-GND Disable output
EN Floating Enable output
6I
IN Floating Enable input current limit
IIN-VCC5 Disable input current limit
7 FBI-GND Disable VIN limit
FBI Floating Enable VIN limit
8Pin1-2 PWM
Pin 2-3 DEM
9 Pin 1-2 Constant current limit
Pin 2-3 HICCUP
Figure 3. Proper Probe Setup to Measure Output Ripple and Phase Node Ringing
Figure 4. Proper Test Setup
Output Capacitor
or MOSFET
A
V
A
LOAD
Vin
+
-
+-
Vo
+
-+
-

ISL81801EVAL1Z 2. PCB Layout Guidelines
R12UZ0082EU0100 Rev.1.00 Page 5 of 17
May.6.20
2. PCB Layout Guidelines
Careful attention to Printed Circuit Board (PCB) layout requirements is necessary for successful implementation
of an ISL81801 based DC/DC converter. The ISL81801 switches at a high frequency; therefore, the switching
times are short. At these switching frequencies, even the shortest trace has significant impedance and the peak
gate drive current rises significantly in an extremely short time. The transition speed of the current from one
device to another causes voltage spikes across the interconnecting impedances and parasitic circuit elements.
These voltage spikes can degrade efficiency, generate EMI, and increase device voltage stress and ringing.
Careful component selection and proper PCB layout minimizes the magnitude of these voltage spikes.
Three sets of components are critical when using the ISL81801 DC/DC converter:
• Controller
• Switching power components
• Small-signal components
The switching power components are the most critical to the layout because they switch a large amount of energy,
which tends to generate a large amount of noise. The critical small-signal components are those connected to
sensitive nodes or those supplying critical bias currents. A multilayer PCB is recommended.
Complete the following steps to optimize the PCB layout.
1. Place the input capacitors, buck FETs, inductor, boost FETs, and output capacitor first. Isolate these power
components on dedicated areas of the board with their ground terminals adjacent to one another. Place the
input and output high frequency decoupling ceramic capacitors very close to the MOSFETs.
2. If signal components and the IC are placed separately from the power train, Renesas recommends using full
ground planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise,
use separate ground planes for the power ground and the small signal ground. Connect the SGND and PGND
together close to the IC. Note: DO NOT connect them together anywhere else.
3. Keep the loop formed by the input capacitor, the buck top FET, and the buck bottom FET as small as possible.
Keep the loop formed by the output capacitor, the boost top FET, and the boost bottom FET as small as
possible.
4. Ensure the current paths from the input capacitor to the buck FETs, the power inductor, the boost FETs, and
the output capacitor are as short as possible with maximum allowable trace widths.
5. Place the PWM controller IC close to the lower FETs. The low-side FETs gate drive connections should be
short and wide. Place the IC over a quiet ground area. Avoid switching ground loop currents in this area.
6. Place the VDD bypass capacitor very close to the VDD pin of the IC and connect its ground end to the PGND
pin. Connect the PGND pin to the ground plane by a via.
Note: DO NOT connect the PGND pin directly to the SGND EPAD.
7. Place the gate drive components (BOOT diodes and BOOT capacitors) together near the controller IC.
8. Place the output capacitors as close to the load as possible. Use short, wide copper regions to connect output
capacitors to load to avoid inductance and resistances.
9. Use copper filled polygons or wide, short traces to connect the junction of the buck or boost upper FET, buck
or boost lower FET, and output inductor. Keep the buck and boost PHASE nodes connection to the IC short.
Note: DO NOT unnecessarily oversize the copper islands for the PHASE nodes. Because the phase nodes
are subjected to very high dv/dt voltages, the stray capacitor formed between these islands and the
surrounding circuitry tends to couple switching noise.
10. Route all high speed switching nodes away from the control circuitry.
11. Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. Connect all
small signal grounding paths including feedback resistors, current monitoring resistors and capacitors,
soft-starting capacitors, loop compensation capacitors and resistors, and EN pull-down resistors to this SGND
plane.

ISL81801EVAL1Z 2. PCB Layout Guidelines
R12UZ0082EU0100 Rev.1.00 Page 6 of 17
May.6.20
12. Use a pair of traces with minimum loop for the input or output current sensing connection.
13. Ensure the feedback connection to the output capacitor is short and direct.
2.1 ISL81801EVAL1Z Evaluation Board
Figure 5. ISL81801EVAL1Z Evaluation Board, Top View
Figure 6. ISL81801EVAL1Z Evaluation Board, Bottom View

ISL81801EVAL1Z 2. PCB Layout Guidelines R12UZ0082EU0100 Rev.1.00 Page 7 of 17 May.6.20
2.2 ISL81801EVAL1Z Circuit Schematic
Figure 7. Schematic
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ISL81801EVAL1Z 2. PCB Layout Guidelines
R12UZ0082EU0100 Rev.1.00 Page 8 of 17
May.6.20
2.3 Bill of Materials
Qty Reference Designator Description Manufacturer Manufacturer Part
1 PWB-PCB, ISL81801EVAL1Z,
REVD, ROHS
IMAGINEERING INC ISL81801EVAL1ZREVDPCB
1 C33 CAP-AEC-Q200, SMD, 0603,
0.01µF, 50V, 10%, X7R, ROHS
TDK CGA3E2X7R1H103K080AE
10 C1, C2, C5, C6, C7, C8, C9,
C10, C52, C53
CAP-AEC-Q200, SMD, 1210,
4.7µF, 100V, 10%, X7S, ROHS
TDK CGA6M3X7S2A475K200AE
1 C39 CAP-AEC-Q200, SMD, 0603,
0.022µF, 25V, 10%, X7R, ROHS
TDK CGJ3E2X7R1E223K080AA
1 C36 CAP-AEC-Q200, SMD, 0603,
0.033µF, 25V, 10%, X7R, ROHS
TDK CGJ3E2X7R1E333K080AA
2 C14, C45 CAP-AEC-Q200, SMD, 0603,
0.047µF, 25V, 10%, X7R, ROHS
TDK CGJ3E2X7R1E473K080AA
2 C16, C46 CAP-BOARDFLEX, SMD, 0603,
0.1µF, 100V, 10%, X7R, ROHS
MURATA GRJ188R72A104KE11D
3 C17, C31, C32 CAP, SMD, 0805, 10µF, 16V, 10%,
X7S, ROHS
MURATA GRM21BC71C106KE11L
10 C18, C19, C20, C21, C22,
C23, C24, C25, C54, C55
CAP, SMD, 1210, 22µF, 25V, 10%,
X7R, ROHS
MURATA GRM32ER71E226KE15L
3 C11, C15, C43 CAP, SMD, 0603, 1000pF, 50V,
10%, X7R, ROHS
AVX 06035C102KAT2A
4 C12, C13, C41, C42 CAP, SMD, 0603, 220pF, 100V,
5%, X7R, ROHS
PANASONIC C0603C103J1RACTU
1 C29 CAP, SMD, 0603, 0.01µF, 100V,
10%, X7R, ROHS
PANASONIC ECJ-1VB2A221K
1 C40 CAP, SMD, 0603, 220pF, 50V,
10%, X7R, ROHS
MURATA GRM188R71H221KA01D
2 C30, C37 CAP, SMD, 0603, 0.47µF, 25V,
10%, X7R, ROHS
MURATA GRM188R71E474KA12D
1 C34 CAP, SMD, 0603, 820pF, 50V,
10%, X7R, ROHS
KEMET C0603C821K5RACTU
0 C35 CAP, SMD, 0603, DNP-PLACE
HOLDER, ROHS
2 C26, C27 CAP-OSCON, SMD, 10mm,
1000µF, 16V, 20%, 12mΩ, ROHS
SANYO 16SVPF1000M
4 C3, C4 CAP, RADIAL, 12.5x26.5, 220µF,
100V, 20%, ALUM.ELEC., 5mm,
ROHS
UNITED CHEMI-CON EKZN101ELL221MK25S
1 L1 COIL-PWR INDUCTOR, SMD,
16.4mm, 6.8µH, 20%, 46A,
4.1mΩ, ROHS
WURTH 74439370068
27 TP1, TP2, TP5, TP6,
TP8-TP30
CONN-COMPACT TEST PT,
VERTICAL, WHT, ROHS
KEYSTONE 5007
2 J3, J6 CONN-HEADER, 1x2, BRKAWY
1x36, 2.54mm, ROHS
BERG/FCI 68000-236HLF
3 J7, J8, J9 CONN-HEADER, 1x3,
BREAKAWY 1x36, 2.54mm,
ROHS
BERG/FCI 68000-236HLF
3 J7-Pins FBI-GND, J8-Pins
PWM, J9-Pins CC
CONN-JUMPER, SHORTING,
2PIN, BLACK, GOLD, ROHS
SULLINS SPC02SYAN
3 D1, D2, D6 DIODE-RECTIFIER, SMD, 2P,
S0D-123FL, 100V, 1A, ROHS
On Semiconductor MBR1H100SFT3G

ISL81801EVAL1Z 2. PCB Layout Guidelines
R12UZ0082EU0100 Rev.1.00 Page 9 of 17
May.6.20
1 D4 DIODE-ZENER, SMD, SOD-323,
4.7V, 6%, 300mW, ROHS
Diodes, Inc. MM3Z4V7T1G
1 U1 IC-80V 4-SWITCH PWM
CONTROLLER, 32P, TQFN, 5x5,
ROHS
Renesas Electronics America ISL81801FRTZ
2 Q3, Q8 TRANSIST-MOS, N-CHANNEL,
SMD, 8P, PG-TDSON, 25V, 25A,
ROHS
Infineon Technology BSC024NE2LSATMA1
2 Q2, Q5 TRANSISTOR-MOS,
N-CHANNEL, SMD, 8P, PPK
SO-8, 100V, 80A, ROHS
Infineon Technology BSC070N10NS5ATMA1
4 R8, R10, R23, R35, R37 RES, SMD, 0603, 1Ω, 1/10W, 1%,
TF, ROHS
Panasonic ERJ-3RQF1R0V
2 R9, R46 RES, SMD, 0603, 20Ω, 1/10W,
1%, TF, ROHS
Panasonic ERJ-3EKF20R0V
2 R4, R28 RES, SMD, 0603, 2.2Ω, 1/10W,
1%, TF, ROHS
Panasonic ERJ-3RQF2R2V
3 R19, R20, R29 RES, SMD, 0603, 0Ω, 1/10W, TF,
ROHS
Venkel CR0603-10W-000T
1 R22 RES, SMD, 0603, 3.3Ω, 1/10W,
1%, TF, ROHS
Panasonic ERJ-3RQF3R3V
1 R54 RES, SMD, 0603, 100Ω, 1/10W,
1%, TF, ROHS
Venkel CR0603-10W-1000FT
1 R53 RES, SMD, 0603, 1k, 1/10W, 1%,
TF, ROHS
Panasonic ERJ-3EKF1001V
1 R36 RES, SMD, 0603, 10k, 1/10W, 1%,
TF, ROHS
Venkel CR0603-10W-1002FT
1 R33 RES, SMD, 0603, 100k, 1/10W,
1%, TF, ROHS
Venkel CR0603-10W-1003FT
3 R21, R40, R42 RES, SMD, 0603, 15k, 1/10W, 1%,
TF, ROHS
Panasonic ERJ-3EKF1502V
1 R25 RES, SMD, 0603, 169k, 1/10W,
1%, TF, ROHS
Venkel CR0603-10W-1693FT
1 R3 RES, SMD, 0603, 200k, 1/10W,
1%, TF, ROHS
Venkel CR0603-10W-2003FT
1 R53 RES, SMD, 0603, 200k, 1/10W,
1%, TF, ROHS
Venkel CR0603-10W-2003FT
1 R26 RES, SMD, 0603, 2.7k, 1/10W,
1%, TF, ROHS
Venkel CR0603-10W-2701FT
1 R44 RES, SMD, 0603, 3.48k, 1/10W,
1%, TF, ROHS
Panasonic ERJ-3EKF3481V
1 R7 RES, SMD, 0603, 37.4k, 1/10W,
1%, TF, ROHS
Yageo RC0603FR-0737K4L
2 R12, R18 RES, SMD, 0603, 40.2k, 1/10W,
1%, TF, ROHS
Yageo RC0603FR-0740K2L
1 R39 RES, SMD, 0603, 44.2k, 1/10W,
1%, TF, ROHS
Venkel CR0603-10W-4422FT
2 R5, R38 RES, SMD, 0603, 5.1k, 1/10W,
1%, TF, ROHS
Venkel CR0603-10W-5101FT
2 R41, R43 RES, SMD, 0603, 51k, 1/10W, 1%,
TF, ROHS
Yageo RC0603FR-0751KL
0 R15, R16, R24, R27, R58 RES, SMD, 0603, DNP-PLACE
HOLDER, ROHS
Qty Reference Designator Description Manufacturer Manufacturer Part

ISL81801EVAL1Z 2. PCB Layout Guidelines
R12UZ0082EU0100 Rev.1.00 Page 10 of 17
May.6.20
2.4 Board Layout
1 R17 RES, SMD, 1206, 154k, 1/4W, 1%,
TF, ROHS
Yageo RC1206FR-07154KL
1 R45 RES, SMD, 1206, 48.7k, 1/4W,
1%, TF, ROHS
Yageo RC1206FR-0748K7L
1 R2 RES, SMD, 1206, 820k, 1/4W, 1%,
TF, ROHS
Yageo AC1206FR-07820KL
2 R6, R57 RES, SMD, 1206, 0.006Ω, 1W,
1%, TF, ROHS
Rohm PMR18EZPFU6L00
2 R1, R56 RES, SMD, 1206, 0.008Ω, 1W,1%,
TF, ROHS
Rohm PMR18EZPFU8L00
4 Four corners SCREW, 4-40X1/4in, PHILLIPS,
PANHEAD, STAINLESS, ROHS
Building Fasteners PMSSS 440 0025 PH
4 Four corners STANDOFF, 4-40X3/4in, F/F, HEX,
ALUMINUM, 0.25 OD, ROHS
Keystone 2204
4 J1, J2, J4, J5 HDWARE, TERMINAL, M4
METRIC SCREW, TH, 4P,
SNAP-FIT, ROHS
Keystone 7795
1 Place assy in bag BAG, STATIC, 6X8, ZIPLOC,
ROHS
Uline S-2262
0 Q1, Q4, Q6, Q7 DO NOT POPULATE OR
PURCHASE
0 TP3 DO NOT POPULATE OR
PURCHASE
1 AFFIX TO BACK OF PCB LABEL-DATE CODE_LINE 1:
YRWK/REV#, LINE 2: BOM NAME
Renesas Electronics America LABEL-DATE CODE
Figure 8. Silkscreen Top
Qty Reference Designator Description Manufacturer Manufacturer Part

ISL81801EVAL1Z 2. PCB Layout Guidelines
R12UZ0082EU0100 Rev.1.00 Page 11 of 17
May.6.20
Figure 9. Top Layer
Figure 10. Second Layer (Solid Ground)

ISL81801EVAL1Z 2. PCB Layout Guidelines
R12UZ0082EU0100 Rev.1.00 Page 12 of 17
May.6.20
Figure 11. Third Layer
Figure 12. Bottom Layer

ISL81801EVAL1Z 2. PCB Layout Guidelines
R12UZ0082EU0100 Rev.1.00 Page 13 of 17
May.6.20
Figure 13. Silkscreen Bottom

ISL81801EVAL1Z 3. Typical Performance Curves
R12UZ0082EU0100 Rev.1.00 Page 14 of 17
May.6.20
3. Typical Performance Curves
VIN = 12V, TA= 25°C, unless otherwise noted.
Figure 14. Efficiency, CCM Figure 15. Efficiency, DEM
Figure 16. Load Regulation, CCM Figure 17. Load Regulation, DEM
Figure 18. Phase 1, Phase 2, VOUT and Inductor Current,
VIN = 9V, IOUT = 10A
Figure 19. Phase 1, Phase 2, VOUT and Inductor Current,
VIN = 12V, IOUT = 10A
30
40
50
60
70
80
90
100
0246810
Efficiency (%)
I
OUT
(A)
Vin = 9V Vin = 12V
Vin = 24V Vin = 36V
Vin = 48V Vin = 60V
Vin = 80V
30
40
50
60
70
80
90
100
02468
10
Efficiency (%)
I
OUT
(A)
Vin = 9V Vin = 12V
Vin = 24V Vin = 36V
Vin = 48V Vin = 60V
Vin = 80V
11.90
11.92
11.94
11.96
11.98
12.00
12.02
12.04
12.06
12.08
12.10
02468
10
V
OUT
(V)
IOUT (A)
Vin = 9V Vin = 12V
Vin = 24V Vin = 36V
Vin = 48V Vin = 60V
Vin = 80V
11.90
11.92
11.94
11.96
11.98
12.00
12.02
12.04
12.06
12.08
12.10
0246810
VOUT (V)
I
OUT
(A)
Vin = 9V Vin = 12V
Vin = 24V Vin = 36V
Vin = 48V Vin = 60V
Vin = 80V
4µs/Div
Phase 1 10V/Div
Phase 2 20V/Div
VOUT 100mV/Div
IL10A/Div
4µs/Div
VOUT 100mV/Div
IL10A/Div
Phase 2 20V/Div
Phase 1 10V/Div

ISL81801EVAL1Z 3. Typical Performance Curves
R12UZ0082EU0100 Rev.1.00 Page 15 of 17
May.6.20
Figure 20. Phase 1, Phase 2, VOUT and Inductor Current,
VIN = 80V, IOUT = 10A
Figure 21. Load Transient, VIN = 9V, IOUT = 0A to 10A,
2.5A/µs, CCM
Figure 22. Load Transient, VIN = 12V, IOUT = 0A to 10A,
2.5A/µs, CCM
Figure 23. Load Transient, VIN = 80V, IOUT = 0A to 10A,
2.5A/µs, CCM
Figure 24. Start-Up Waveform, VIN = 9V, IOUT = 10A, CCM Figure 25. Start-Up Waveform, VIN = 12V, IOUT = 10A,
CCM
VIN = 12V, TA= 25°C, unless otherwise noted. (Continued)
4µs/Div
Phase 1 50V/Div
Phase 2 20V/Div
VOUT 100mV/Div
IL10A/Div
VOUT 200mV/Div
2ms/Div
IOUT 5A/Div
VOUT 200mV/Div
2ms/Div
IOUT 5A/Div
VOUT 200mV/Div
2ms/Div
IOUT 5A/Div
4ms/Div
Phase 1 10V/Div
Phase 2 10V/Div
VOUT 5V/Div
IL10A/Div
4ms/Div
Phase 1 10V/Div
Phase 2 10V/Div
VOUT 5V/Div
IL10A/Div

ISL81801EVAL1Z 3. Typical Performance Curves
R12UZ0082EU0100 Rev.1.00 Page 16 of 17
May.6.20
Figure 26. Start-Up Waveform, VIN = 80V, IOUT = 10A,
CCM
Figure 27. Short-Circuit Waveform
Figure 28. Bi-Directional Operation, VIN = 18V,
Vin_limit = 9V, IIN = 1A
Figure 29. Line Transient, VIN = 9V to 80V, 1V/ms,
IOUT =0A
Figure 30. Line Transient, VIN = 80V to 9V, 1V/ms, IOUT =0A
VIN = 12V, TA= 25°C, unless otherwise noted. (Continued)
4ms/Div
Phase 1 50V/Div
Phase 2 10V/Div
VOUT 5V/Div
IL10A/Div
40ms/Div
Phase 1 10V/Div
Phase 2 10V/Div
VOUT 10V/Div
IL20A/Div
VIN 5V/Div
VOUT 10V/Div
IL10A/Div
4ms/Div
VIN 20V/Div
VOUT 200mV/Div
IL10A/Div
20ms/Div
20ms/Div
VOUT 200mV/Div
IL10A/Div
VIN 20V/Div

ISL81801EVAL1Z 4. Revision History
R12UZ0082EU0100 Rev.1.00 Page 17 of 17
May.6.20
4. Revision History
Rev. Date Description
1.00 May.6.20 Initial release

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