CONTENT
Product Introduction...............................................................................................................................3
Packing Configuration............................................................................................................................4
Hardware Orientation..............................................................................................................................5
Front Panel.........................................................................................................................................5
Back Panel .........................................................................................................................................6
Menu Orientation.....................................................................................................................................7
Software Operation..................................................................................................................................8
Software Installation...........................................................................................................................8
Software Operation ..........................................................................................................................11
Software Operation...................................................................................................................11
Connect.....................................................................................................................................11
Disconnect ................................................................................................................................13
Layout........................................................................................................................................13
Operating Mode........................................................................................................................15
Basic Operation.........................................................................................................................16
Layer Settings...........................................................................................................................16
Input/Output Settings................................................................................................................18
Signals Merger..........................................................................................................................21
Data Management.....................................................................................................................22
Other .........................................................................................................................................23
Other .........................................................................................................................................25
Power........................................................................................................................................25
Bank..........................................................................................................................................25
Factory Settings........................................................................................................................26