Tait T830 Series User manual

Copyright TEL 31/01/96
T830 Series
Base Station Equipment
Service Manual
Issue 100
February 1996
M830-00-100

31/01/96 Copyright TEL
Head Office
New Zealand
Tait Electronics Ltd
558 Wairakei Road
P.O. Box 1645
Christchurch
New Zealand
Phone: [phone]
Fax: [phone]
Radio Infrastructure Division
535 Wairakei Road
P.O. Box 1645
Christchurch
New Zealand
Phone: [phone]
Fax: [phone]
Australia
Tait Electronics (Aust) Pty Ltd
275 Toombul Road
Northgate 4013
P.O. Box 679
Virginia
Queensland 4014
Australia
Phone: [phone]
Toll Free: 1800 077-112
Fax: [phone]
Canada
Tait Mobile Radio Inc.
Unit 5, 158 Anderson Avenue
Markham
Ontario L6E1A9
Canada
Phone: [phone]
Toll Free: 1 800 890-8248
Fax: [phone]
France
Tait France Sarl
2 Avenue de la Cristallerie
92 316 Sèvres, Cedex
France
Phone: [phone]
Fax: [phone]
Germany
Tait Mobilfunk GmbH
Willstätterstraße 50
D-90449 Nürnberg 60
Germany
Phone: [phone]
Fax: [phone]
New Zealand
Tait Communications Ltd
Unit 4, 75 Blenheim Road
P.O. Box 1185
Christchurch
Phone: [phone]
Fax: [phone]
Singapore
Tait Electronics (Far East) Pte Ltd
4 Leng Kee Road
SIS Building #05-11A
Singapore 159088
Phone: [phone]
Fax: [phone]
United Kingdom
Tait Mobile Radio Ltd
Ermine Business Park
Ermine Road
Huntingdon
Cambridgeshire PE18 6YA
United Kingdom
Phone: [phone]
Fax: [phone]
USA
Tait Electronics (USA) Inc.
9434 Old Katy Road
Suite 110
Houston
Texas 77055
USA
Phone: [phone]
Toll Free: 1 800 222-1255
Fax: [phone]

Copyright TEL 31/01/96
About This Manual
Scope This manual contains general, technical and servicing informa-
tion on T830 25W and 50W base stations which comprise the fol-
lowing equipment:
Format We have published this manual in a ring binder so that "revision
packages" containing additional information pertaining to new
issues of PCBs can be added as required.
Revision Packages Revision packages will normally be published to coincide with
the release of information on a new PCB, and may also contain
additions or corrections pertaining to other parts of the manual.
If you return the address card at the front of this manual, you
will be notified when revision packages containing new PCB
information and/or text are available. You may then order as
many packages as you require from your local Tait Company.
Revision packages are supplied ready-punched for inclusion in
your manual.
Revision Control Each page in this manual has a date of issue. This is to comply
with various Quality Standards, but will also serve to identify
which pages have been updated and when. Each page and its
publication date is listed in the "List of Effective Pages", and a
new list containing any new/revised pages and their publica-
tion dates will be sent with each revision package.
Any portion of text that has been changed is marked by a verti-
cal line (as shown at left) in the outer margin of the page. Where
the removal of an entire paragraph means there is no text left to
mark, an arrow (as shown at left) will appear in the outer mar-
gin. The number beside the arrow will indicate how many para-
graphs have been deleted.
The manual issue and revision status are indicated by the last
three digits of the manual IPN. These digits start at 100 and will
increment through 101, 102, 103, etc., as revision packages are
published, e.g:
Thus, Issue 103 indicates the third revision to issue 1 and means
that three packages should have been added to the manual. The
issue digit will only change if there is a major product revision,
25W base station T835 receiver
T836 25W transmitter
50W base station T835 receiver
T837 exciter
T838 50W power amplifier
2
1 0 3
issue status revision status

31/01/96 Copyright TEL
or if the number of revision packages to be included means that
the manual becomes difficult to use, at which point a new issue
manual will be published in a new ring binder.
PCB Information PCB information is provided for all current issue PCBs, as well
as all previous issue PCBs manufactured in production quanti-
ties, and is grouped according to PCB. Thus, you will find the
parts list, grid reference index (if necessary), PCB layouts and
circuit diagram(s) for each individual PCB grouped together.
Errors If you find an error in this manual, or have a suggestion on how
it might be improved, please do not hesitate to contact the Tech-
nical Writer, Tait Radio Infrastructure Division, Tait Electronics
Ltd, P.O. Box 1645, Christchurch, New Zealand.
Technical Information
Any enquiries regarding this manual or the equipment it describes should be addressed
in the first instance to your nearest approved Tait Dealer or Service Centre. Further
technical assistance may be obtained from the Customer Support Group, Radio Infra-
structure Division, Tait Electronics Ltd, Christchurch, New Zealand.
Updating Equipment And Manuals
In the interests of improving performance, reliability or servicing, Tait Electronics Ltd
reserve the right to update their equipment and/or manuals without prior notice.
Copyright
All information contained in this manual is the property of Tait Electronics Ltd. All
rights are reserved. This manual may not, in whole or part, be copied, photocopied,
reproduced, translated stored or reduced to any electronic medium or machine readable
form without prior written permission from Tait Electronics Ltd.
Ordering Tait Service Manuals
Service Manuals should be ordered from your nearest Tait Branch or approved Dealer.
When ordering, quote the Tait Internal Part Number (IPN) and, where applicable, the
version.
Date Of Issue
IPN M830-00-100 T830 Series Service Manual
Issue 100 published February 1996

Copyright TEL 31/01/96
Table Of Contents
This manual is divided into eight parts as listed below, with each part being further sub-
divided into sections. There is a detailed table of contents at the start of each part
and/or section.
Part Title
A Introduction To Servicing
B T835 Receiver
C T836 Transmitter & T837 Exciter
D T838 Power Amplifier
E T800 Memory & T830 VCO PCB Information
F Installation
G System Configurations
H T800 Ancillary Equipment

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Copyright TEL 31/01/96
Part A Introduction To Servicing
This part of the manual is divided into the sections listed below. These sections provide
some general and advisory information on servicing procedures, a brief history of T800
programming software, and a list of Technical Instructions pertaining to T830 Series
equipment.
Section Title Page
1
1.1
1.2
1.3
General
Caution: CMOS Devices
Caution: Aerial Load
Caution: Beryllium Oxide & Power Transistors
1.1
1.1
1.2
1.2
2
2.1
2.2
2.2.1
2.2.2
2.3
Mechanical
Pozidriv Recess Head Screws
Disassembly/Reassembly
Receivers/Exciters
Power Amplifiers
Cover Screw Torques
2.1
2.1
2.1
2.1
2.1
2.1
3
3.1
3.1.1
3.1.2
3.2
Component Replacement
Leaded Components
Desoldering Iron Method
Component Cutting Method
Surface Mount Devices
3.1
3.1
3.1
3.1
3.2
4 To Replace PA Transistors 4.1
5 To Remove The T838 PA PCB From The Heatsink 5.1
6 To Remove Cased Mica Capacitors 6.1
7
7.1
7.2
7.3
Software History
BASEPROG V1/PGM800 V2
PGM800 V2.01
PGM800 V2.21
7.1
7.1
7.1
7.2
8 Technical Instructions 8.1
Figure Title Page
4.1 Typical Transistor/Capacitor Spacing 4.1

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Copyright TEL 31/01/96
1 General
If further information is required about T830 Series equipment or this Manual, it may be
obtained from Tait Electronics Ltd or accredited agents. When requesting this informa-
tion, please quote the equipment type number (e.g. T835-20) and serial number. In the
case of the Service Manual quote the Tait Internal Part Number (IPN), e.g. M830-00-100,
and for circuit diagrams quote the 'Title', 'IPN' and 'Issue'.
1.1 Caution: CMOS Devices
This equipment contains CMOS Devices which are susceptible to damage from static
charges. Care when handling these devices is essential. For correct handling proce-
dures refer to the manufacturers' data books, e.g. Philips data books covering CMOS
devices, or Motorola CMOS data books, Section 5 'Handling', etc.
Figure 1.1 Typical Anti-static Bench Set-up
An anti-static bench kit (refer to Figure 1.1) is available from Tait Electronics Ltd under
the usual consumable goods ordering system. The kit is held in stock under IPN
937-00000-34 and contains:
• 1 conductive rubber bench mat
• 1 earth lead to connect the mat to ground (c/w 1M series resistor)
• 1 wrist strap
• information leaflet.
conductive rubber
bench mat
metal frame
to building earth
(not mains earth)
via 1M series resistor
conductive
wrist strap

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1.2 Caution: Aerial Load
The equipment has been designed to operate safely under a wide range of aerial loading
conditions. However, it is strongly recommended that the transmitter should not be
operated in the absence of a suitable load. Failure to observe this warning may result in
damage to the transmitter output power stage.
1.3 Caution: Beryllium Oxide & Power Transistors
The RF power transistors in current use all contain some beryllium oxide. This sub-
stance, while perfectly harmless in its normal solid form, can become a severe health
hazard when it has been reduced to dust. For this reason the RF power transistors
should not be broken open, mutilated, filed, machined, or physically damaged in any
way that can produce dust particles.

Copyright TEL 31/01/96
2 Mechanical
2.1 Pozidriv Recess Head Screws
Pozidriv recess head screws are the preferred standard on all Tait manufactured equip-
ment. The very real advantages of this type of screw will not be realised unless the cor-
rect screwdrivers are used by servicing personnel.
2.2 Disassembly/Reassembly
2.2.1 Receivers/Exciters
To carry out alignment or change option links it is necessary to remove only the top
cover, i.e. the one adjacent to the front panel handle and on the opposite side to the main
D-range connector.
Removal of the bottom cover is necessary to:
• access SMD components
• change solder blob links
• fit test leads to circuit block access points.
2.2.2 Power Amplifiers
The tuning and power output level setting procedures should be carried out with the
cover on.
2.3 Cover Screw Torques
Receivers/Exciters .. 12lb-in./1.36Nm
Power Amplifiers .. 8lb-in./0.9Nm

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Copyright TEL 31/01/96
3 Component Replacement
3.1 Leaded Components
Whenever components are removed from or fitted to the PCB, care must be taken to
avoid damage to the track. The two satisfactory methods of removing components from
PTH PCBs are detailed below.
Note: The first method requires the use of a desoldering station, e.g. Philips SBC
314 or Pace MBT-100E.
3.1.1 Desoldering Iron Method
Place the tip over the lead and, as the solder starts to melt, move the tip in a circu-
lar motion.
Start the suction and continue the movement until 3 or 4 circles have been com-
pleted.
Remove the tip while continuing suction to ensure that all solder is removed from
the joint, then stop the suction.
Before pulling the lead out, ensure it is not stuck to the plating.
If the lead is still not free, resolder the joint and try again.
Note: The desoldering iron does not usually have enough heat to desolder leads
from the ground plane. Additional heat may be applied by holding a sol-
dering iron on the tip of the desoldering iron (this may require some addi-
tional help).
3.1.2 Component Cutting Method
Cut the leads on the component side of the PCB.
Heat the solder joint sufficiently to allow easy removal of the lead by drawing it
out from the component side: do not use undue force.
Fill the hole with solder and then clear with solderwick.

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3.2 Surface Mount Devices
Caution: Surface mount devices (SMD's) require special storage, handling,
removal and replacement techniques. This equipment should be serv-
iced only by an approved Tait Dealer or Service Centre equipped with
the necessary facilities. Repairs attempted with incorrect equipment or
by untrained personnel may result in permanent damage. If in doubt,
contact Tait Electronics Ltd or your nearest Tait Branch or Subsidiary.

Copyright TEL 31/01/96
4 To Replace PA Transistors
Caution: As the location of certain components in the PA is critical to perform-
ance, it is important that any components removed or disturbed are
refitted in exactly the same position.
Caution: Before attempting to remove a transistor, measure the distance
between the capacitors and transistor body to the nearest 0.5mm (meas-
urements "A" and "B" in Figure 4.1) so that the capacitors can be
replaced in exactly the same position. These measurements are shown
in Figure 4.1 for the 6LFL package, however the same procedure
applies for the SOE (stud) package.
Caution: Do not solder the tabs before torquing down otherwise the device may
be broken.
Desolder the tabs by heating with a soldering iron and lifting away from the PCB
with a thin stainless steel spike, or screwdriver. Unscrew the transistor stud nut
and remove the device.
Trim the tabs of the replacement device to make them similar to the faulty device,
and tin the underside lightly. Smear the face of the device with heatsink com-
pound and tighten it securely (torque setting 8lb-in./0.9Nm) to the heatsink. Then
solder the tabs.
Replace each capacitor in exactly the same position as measured previously.
Figure 4.1 Typical Transistor/Capacitor Spacing (Not To Scale)
measurement A measurement B
base collector

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