Tektronix TDS3000C Series Installation and maintenance instructions

Instructions
TDS3000C Series Oscilloscopes
Declassification and Security
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*P077009100*
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TDS3000C Series Declassification and Security Instructions 1
Memory Erasure and Nonvolatile Memory Parts List
The standard TDS3000C Series instruments contain a proprietary architecture
based on a PowerPC and the VxWorks operating system. Instrument code and
calibration settings reside in FLASH memory.
Instrument setups and reference waveforms can be stored internally in FLASH or
on the USB flash drive.
Instrument code can be updated by the user from the USB flash drive. The latest
firmware is available on www.tektronix.com. Loading firmware does not
overwrite instrument calibration settings. Loading new firmware does not
guarantee overwriting the instrument setups and reference waveforms. To
guarantee FLASH memory erasure, use the TekSecure function.
The instrument application modules contain a single nonvolatile EEPROM
which holds application module code. No user data is stored in the application
modules.
If you have any questions, contact the Tektronix Technical Support Center at
http://www.tektronix.com/support.
Memory Erasure
A USB host port is standard on TDS3000C models. Remove all USB flash
drives. These can be stored or destroyed.
To erase confidential data in the FLASH memory on your oscilloscopes, use the
TekSecure function. The TekSecure function does the following:
HReplaces all waveforms in all reference memories with null sample values
HReplaces the current front-panel setup and all stored setups with the default
factory setup values
HCalculates the checksums of all reference waveform memory and setup
memory locations to verify successful completion of waveform and setup
erasure
HDisplays a dialog indicating whether the secure erase was successful or
unsuccessful
NOTE. TekSecure does not erase or change factory calibration constants or
Ethernet settings.

Memory Erasure and Nonvolatile Memory Parts List
2TDS3000C Series Declassification and Security Instructions
To use the TekSecure function to erase FLASH memory:
1. Push the front-panel UTILITY button.
2. Push the System bottom bezel button until Config is selected.
3. Push the TekSecure Erase Memory bottom bezel button.
4. Push the OK Erase Setup & Ref Memory side bezel button.
5. Power off the oscilloscope; then power on the oscilloscope to complete the
process.
Disable LAN Ethernet Connectivity
To disable LAN Ethernet connectivity:
1. Push the front-panel UTILITY button.
2. Push the System bottom bezel button until I/O is selected.
3. Push the Ethernet Network Settings bottom bezel button.
4. Push the Change Instrument Settings side bezel button.
5. Clear all settings. If you need to restore network connectivity at a later date,
make sure to write down all setting values before clearing them.
6. Push the OK Accept side bezel button.
The LAN system is disabled and no longer allows data traffic in or out.

Memory Erasure and Nonvolatile Memory Parts List
TDS3000C Series Declassification and Security Instructions 3
Memory Parts List
The memory parts used in the TDS3012C, TDS3012C-NV, TDS3014C,
TDS3032C, TDS3032C-AF, TDS3034C, TDS3052C, and TDS3054C
oscilloscopes are shown in the following table.
Table 1: TDS3000C series memory parts, board numbers 679- 0259- XX and 679- 0263- XX
Part number
Reference
designator Description Use
156--7633--XX U540 IC, MEMORY; CMOS, SRAM; 128K X 18,
SYNCHRONOUS, 10NS
Synchronous SRAM: holds the display image.
156--7633--XX U550 IC, MEMORY; CMOS, SRAM; 128K X 18,
SYNCHRONOUS, 10NS
Synchronous SRAM: holds the live acquisition
waveforms.
156--7633--XX U560 IC, MEMORY; CMOS, SRAM; 128K X 18,
SYNCHRONOUS, 10NS
Synchronous SRAM: holds the live acquisition
waveforms.
167--0815--XX U610 IC, MEMORY; CMOS, FLASH; 4M X 8/2 M X 16,
3.0 V ONLY, BOTTOM SECTORED
FLASH: stores the instrument code, calibration
constants, reference waveforms, and instrument
setups.
167--0815--XX U620 IC, MEMORY; CMOS, FLASH; 4M X 8/2 M X 16,
3.0V ONLY, BOTTOM SECTORED
FLASH: stores the instrument code, calibration
constants, reference waveforms, and instrument
setups.
167--0828--XX U640 IC, MEMORY; CMOS, NVRAM; 2K X 8, 150NS,
INTERNAL BATTERY, W/CLOCK, Y2K, 3.3V
NVRAM: stores date format, RS-232 settings, and
language choice.
156--9327--XX U670 IC, MEMORY; CMOS, DRAM; 4M X 32, 128MB,
SDRAM,3.3V
Synchronous DRAM: holds the instrument code
and data during operation.
167--0393--XX U808 IC, MEMORY; CMOS, EEPROM; SERIAL, 1M
(131,072 X 8), 2 WIRE, 2.7V TO 5.5V
Serial EEPROM: holds USB controller boot and
application programs.
167--0292--XX U825 IC, MEMORY; SRAM, 64K X16, 1MB, ASYN-
CHRONOUS
Asynchronous SRAM: holds the data being
communicated over USB.
167--0292--XX U855 IC, MEMORY; SRAM, 64K X16, 1MB, ASYN-
CHRONOUS
Asynchronous SRAM: holds the data being
communicated between the processor and the
USB controller.
167--0815--XX U860 IC, MEMORY; CMOS, FLASH; 4M X 8/2 M X 16,
3.0V ONLY, BOTTOM SECTORED
FLASH: holds USB controller application
programs.

Memory Erasure and Nonvolatile Memory Parts List
4TDS3000C Series Declassification and Security Instructions
Application Module Memory Part
The memory part used in the TDS3AAM, TDS3LIM, TDS3TMT, and TDS3VID
application modules is shown in the following table.
Table 2: Application module memory part, board number 679- 4489- XX
Part number
Reference
designator Description Use
156--6272--XX U1 IC, MEMORY; CMOS, EEPROM; 256 X 8, SERIAL EEPROM: holds the application module code.