Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 2
3 Description.......................................................................2
4 Functional Block Diagram.............................................. 3
5 Revision History.............................................................. 5
6 Device Comparison......................................................... 6
7 Pin Configuration and Functions...................................9
7.1 Pin Diagram – MOT Package (Top View)................... 9
7.2 Signal Descriptions – MOT Package........................ 10
7.3 Connections for Unused Pins and Modules.............. 11
8 Specifications................................................................ 12
8.1 Absolute Maximum Ratings...................................... 12
8.2 ESD Ratings............................................................. 12
8.3 Recommended Operating Conditions.......................12
8.4 Power Supply and Modules...................................... 12
8.5 Power Consumption - Power Modes........................ 13
8.6 Power Consumption - Radio Modes......................... 14
8.7 Nonvolatile (Flash) Memory Characteristics............. 14
8.8 Thermal Resistance Characteristics......................... 14
8.9 RF Frequency Bands................................................ 15
8.10 861 MHz to 1054 MHz - Receive (RX)....................16
8.11 861 MHz to 1054 MHz - Transmit (TX) .................. 21
8.12 861 MHz to 1054 MHz - PLL Phase Noise
Wideband Mode.......................................................... 22
8.13 861 MHz to 1054 MHz - PLL Phase Noise
Narrowband Mode.......................................................23
8.14 Timing and Switching Characteristics..................... 23
8.15 Peripheral Characteristics.......................................27
8.16 Typical Characteristics............................................ 35
9 Detailed Description......................................................44
9.1 Overview................................................................... 44
9.2 System CPU............................................................. 44
9.3 Radio (RF Core)........................................................45
9.4 Memory..................................................................... 46
9.5 Sensor Controller...................................................... 47
9.6 Cryptography............................................................ 48
9.7 Timers....................................................................... 49
9.8 Serial Peripherals and I/O.........................................50
9.9 Battery and Temperature Monitor............................. 50
9.10 µDMA......................................................................50
9.11 Debug......................................................................50
9.12 Power Management................................................51
9.13 Clock Systems, production calibration and
temperature compensation..........................................52
9.14 Network Processor..................................................53
9.15 Device Certification and Qualification..................... 54
9.16 Module Markings.....................................................56
9.17 End Product Labeling..............................................56
9.18 Manual Information to the End User....................... 56
10 Application, Implementation, and Layout................. 57
10.1 Application Information........................................... 57
10.2 Device Connection and Layout Fundamentals....... 58
10.3 PCB Layout Guidelines...........................................58
10.4 Reference Designs................................................. 62
11 Environmental Requirements and SMT
Specifications ...............................................................63
11.1 PCB Bending...........................................................63
11.2 Handling Environment.............................................63
11.3 Storage Condition................................................... 63
11.4 PCB Assembly Guide..............................................63
11.5 Baking Conditions................................................... 64
11.6 Soldering and Reflow Condition..............................65
12 Device and Documentation Support..........................66
12.1 Device Nomenclature..............................................66
12.2 Tools and Software................................................. 66
12.3 Documentation Support.......................................... 68
12.4 Support Resources................................................. 69
12.5 Trademarks.............................................................69
12.6 Electrostatic Discharge Caution..............................69
12.7 Glossary..................................................................69
13 Mechanical, Packaging, and Orderable
Information.................................................................... 70
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
November
2023
* Initial Release
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CC1312PSIP
SWRS293 – NOVEMBER 2023
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