Texas Instruments SimpleLink CC2651R3SIPA User manual

CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package
Module with integrated Antenna & 352-KB Memory
1 Features
Wireless microcontroller
• Powerful 48-MHz Arm® Cortex®-M4 processor
• 352KB flash program memory
• 32KB of ultra-low leakage SRAM
• 8KB of Cache SRAM (Alternatively available as
general-purpose RAM)
• Programmable radio includes support for 2-
(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low
Energy, IEEE 802.15.4 PHY and MAC
• Supports over-the-air upgrade (OTA)
Low power consumption
• MCU consumption:
– 3.60 mA active mode, CoreMark
– 61 μA/MHz running CoreMark
– 0.8 μA standby mode, RTC, 32KB RAM
– 0.1 μA shutdown mode, wake-up on pin
• Radio Consumption:
– 6.8 mA RX
– 7.1 mA TX at 0 dBm
– 9.6 mA TX at +5 dBm
Wireless protocol support
•Zigbee®
•Bluetooth® 5.2 Low Energy
•SimpleLink™ TI 15.4-stack
• Proprietary systems
High performance radio
• -104 dBm for Bluetooth® Low Energy 125-kbps
• Output power up to +5 dBm with temperature
compensation
Regulatory compliance
• Regulatory certification for compliance with
worldwide radio frequency:
– ETSI RED (Europe) / RER (UK)
– ISED (Canada)
– FCC (USA)
MCU peripherals
• Digital peripherals can be routed to any GPIO
• Four 32-bit or eight 16-bit general-purpose timers
• 12-bit ADC, 200 kSamples/s, 8 channels
• 8-bit DAC
• Two comparators
• Programmable current source
• UART, SSI, I2C, I2S
• Real-time clock (RTC)
• Integrated temperature and battery monitor
Security enablers
• AES 128-bit cryptographic accelerator
• True random number generator (TRNG)
• Additional cryptography drivers available in
Software Development Kit (SDK)
Development tools and software
•LP-CC2651R3SIPA Development Kit
•SimpleLink™ CC13xx and CC26xx Software
Development Kit (SDK)
•SmartRF™ Studio for simple radio configuration
•SysConfig system configuration tool
Operating range
• On-chip buck DC/DC converter
• 1.8-V to 3.8-V single supply voltage
• Tj: -40 to +105°C
Package
• 7-mm × 7-mm MOU (32 GPIOs)
• RoHS-compliant package
CC2651R3SIPA
SWRS278B – FEBRUARY 2022 – REVISED AUGUST 2023
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

2 Applications
• 2400 to 2480 MHz ISM and SRD systems 1
•Building automation
– Building security systems – motion detector,
electronic smart lock, door and window sensor,
garage door system, gateway
– HVAC – thermostat, wireless environmental
sensor, HVAC system controller, gateway
– Fire safety system – smoke and heat detector,
fire alarm control panel (FACP)
– Video surveillance – IP network camera
– Elevators and escalators – elevator main
control panel for elevators and escalators
•Industrial transport – asset tracking
•Factory automation and control
•Medical
•Electronic point of sale (EPOS) – Electronic Shelf
Label (ESL)
•Communication equipment
–Wired networking – wireless LAN or Wi-Fi
access points, edge router , small business
router
•Personal electronics
–Portable electronics – RF smart remote control
–Home theater & entertainment – smart
speakers, smart display, set-top box
–Connected peripherals – consumer wireless
module, pointing devices, keyboards and
keypads
–Gaming – electronic and robotic toys
–Wearables (non-medical) – smart trackers,
smart clothing
3 Description
The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting
Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is
based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and
advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical
applications.
The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated
antenna, DCDC components, Balun, and high frequency crystal oscillator.
The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for
multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency
band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive
sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.
The CC2651R3SIPA has a low sleep current of 0.9 μA with RTC and 32KB RAM retention.
TI has a product life cycle policy with a commitment to product longevity and continuity of supply.
The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low
Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU.CC2651R3SIPA
is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options.
The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system
configuration tool supports migration between devices in the portfolio. A comprehensive number of software
stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more
information, visit wireless connectivity.
Device Information
PART NUMBER (1) PACKAGE BODY SIZE (NOM)
CC2651R3SIPAT0MOUR QFM (59) 7.00 mm × 7.00 mm
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section
13, or see the TI website.
1See RF Core for additional details on supported protocol standards, modulation formats, and data rates.
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4 Functional Block Diagram
Figure 4-1 shows the functional block diagram of the CC2651R3SIPA module.
Figure 4-1. CC2651R3SIPA Block Diagram
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Figure 4-2 shows an overview of the CC2651R3SIPA hardware.
2.4 GHz (Optional
External Antenna)
5-dBm
RF Balun
48-MHz
Crystal
Oscillator
CC2651R3SIPA
Integrated Antenna
Main CPU
Up to
352KB
Flash
with 8KB
Cache
cJTAG
Up to
32KB
SRAM
Arm®Cortex®-M4
Processor
LDO, Clocks, and References
Optional DC/DC Converter
RF Core
Arm®Cortex®-M0
Processor
DSP Modem
SRAM
ROM
ADC
ADC
48 MHz
Digital PLL
40KB
ROM
General Hardware Peripherals and Modules
4× 32-bit Timers
SSI (SPI)
Watchdog Timer
Temperature and
Battery Monitor
RTC
I2C
UART
I2S
Up to 32 GPIOs
AES & TRNG
32 ch. µDMA
2x Low-Power Comparator
12-bit ADC, 200 ks/s
Time-to-Digital Converter
8-bit DAC
Figure 4-2. CC2651R3SIPA Hardware Overview
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 2
3 Description.......................................................................2
4 Functional Block Diagram.............................................. 3
5 Revision History.............................................................. 5
6 Device Comparison......................................................... 6
7 Terminal Configuration and Functions..........................7
7.1 Pin Diagram................................................................ 7
7.2 Signal Descriptions – SIPA Package.......................... 8
7.3 Connections for Unused Pins and Modules................9
8 Specifications................................................................ 10
8.1 Absolute Maximum Ratings...................................... 10
8.2 ESD Ratings............................................................. 10
8.3 Recommended Operating Conditions.......................10
8.4 Power Supply and Modules...................................... 10
8.5 Power Consumption - Power Modes.........................11
8.6 Power Consumption - Radio Modes......................... 12
8.7 Nonvolatile (Flash) Memory Characteristics............. 12
8.8 Thermal Resistance Characteristics......................... 12
8.9 RF Frequency Bands................................................ 12
8.10 Antenna Characteristics..........................................13
8.11 Bluetooth Low Energy - Receive (RX).................... 14
8.12 Bluetooth Low Energy - Transmit (TX)....................17
8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz
(OQPSK DSSS1:8, 250 kbps) - RX.............................18
8.14 Zigbee - IEEE 802.15.4-2006 2.4 GHz
(OQPSK DSSS1:8, 250 kbps) - TX............................. 19
8.15 Timing and Switching Characteristics..................... 19
8.16 Peripheral Characteristics.......................................23
8.17 Typical Characteristics............................................ 31
9 Detailed Description......................................................38
9.1 Overview................................................................... 38
9.2 System CPU............................................................. 38
9.3 Radio (RF Core)........................................................39
9.4 Memory..................................................................... 40
9.5 Cryptography............................................................ 41
9.6 Timers....................................................................... 42
9.7 Serial Peripherals and I/O.........................................43
9.8 Battery and Temperature Monitor............................. 43
9.9 µDMA........................................................................43
9.10 Debug..................................................................... 43
9.11 Power Management................................................ 44
9.12 Clock Systems........................................................ 45
9.13 Network Processor..................................................45
9.14 Device Certification and Qualification..................... 46
9.15 Module Markings.....................................................49
9.16 End Product Labeling..............................................49
9.17 Manual Information to the End User....................... 50
10 Application, Implementation, and Layout................. 51
10.1 Typical Application Circuit....................................... 51
10.2 Alternate Application Circuit....................................53
10.3 Device Connections................................................ 55
10.4 PCB Layout Guidelines...........................................55
10.5 Reference Designs................................................. 61
10.6 Junction Temperature Calculation...........................62
11 Environmental Requirements and SMT
Specifications ...............................................................63
11.1 PCB Bending...........................................................63
11.2 Handling Environment.............................................63
11.3 Storage Condition................................................... 63
11.4 PCB Assembly Guide..............................................63
11.5 Baking Conditions................................................... 64
11.6 Soldering and Reflow Condition..............................65
12 Device and Documentation Support..........................66
12.1 Device Nomenclature..............................................66
12.2 Tools and Software................................................. 66
12.3 Documentation Support.......................................... 69
12.4 Support Resources................................................. 69
12.5 Trademarks............................................................. 69
12.6 Electrostatic Discharge Caution..............................70
12.7 Glossary..................................................................70
13 Mechanical, Packaging, and Orderable
Information.................................................................... 71
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2022) to Revision B (August 2023) Page
• Added RER (UK) to module comparison table................................................................................................... 6
• Corrected pin diagram to properly represent Top View ......................................................................................7
• Added Section 8.10; Antenna Characteristics, to Section 8 ............................................................................ 10
• List of certifications updated to include RER (UK)............................................................................................46
• FCC ID corrected to ZAT-2651R3SIPA.............................................................................................................46
• Added Korea, Japan, and Taiwan certifications................................................................................................46
• Added MIC (Japan) certification section........................................................................................................... 47
• Added Korea certification section..................................................................................................................... 47
• Added NCC (Taiwan) certification section........................................................................................................ 48
• Module layout guidelines updated.................................................................................................................... 56
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6 Device Comparison
Device
RADIO SUPPORT
FLASH
(KB)
RAM +
Cache (KB) GPIO
PACKAGE SIZE
Sub-1 GHz Prop.
2.4 GHz Prop. Wireless M-Bus
Wi-SUN® Sidewalk
Bluetooth® LE ZigBee Thread
Multiprotocol
+20 dBm PA 4 x 4 mm VQFN (32) 5 x 5 mm VQFN (32) 5 x 5 mm VQFN (40) 7 x 7 mm VQFN (48)
CC1310 X X 32-128 16-20 + 8 10-30 X X X
CC1311R3 X X 352 32 + 8 22-30 X X
CC1311P3 X X X 352 32 + 8 26 X
CC1312R X X X 352 80 + 8 30 X
CC1312R7 X X X X X 704 144 + 8 30 X
CC1352R X X X X X X X X 352 80 + 8 28 X
CC1352P X X X X X X X X X 352 80 + 8 26 X
CC1352P7 X X X X X X X X X X 704 144 + 8 26 X
CC2640R2F X 128 20 + 8 10-31 X X X
CC2642R X 352 80 + 8 31 X
CC2642R-Q1 X 352 80 + 8 31 X
CC2651R3 X X X 352 32 + 8 23-31 X X
CC2651P3 X X X X 352 32 + 8 22-26 X X
CC2652R X X X X X 352 80 + 8 31 X
CC2652RB X X X X X 352 80 + 8 31 X
CC2652R7 X X X X X 704 144 + 8 31 X
CC2652P X X X X X X 352 80 + 8 26 X
CC2652P7 X X X X X X 704 144 + 8 26 X
Module
ANTENNA RADIO SUPPORT CERTIFICATIONS
FLASH (KB)
RAM + Cache (KB) GPIO
PACKAGE SIZE
External Integrated Bluetooth® LE ZigBee
+10 dBm PA
FCC/IC CE RER (UK) Japan Korea Taiwan 7 x 7 QFM (73) 7 x 7 QFM (59) 16.9 x 11.0 QFM (29)
CC2650MODA X X X X X X 128 20+8 15 X
CC2651R3SIPA X X X X X X X X X X 352 32 + 8 32 X
CC2652RSIP X X X X X X 352 80 + 8 32 X
CC2652PSIP X X X X X X X 352 80 + 8 30 X
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7 Terminal Configuration and Functions
7.1 Pin Diagram
CC2651R3SIPA
DIO_28
2
1
DIO_26
DIO_27
INT_ANT RF
3
4
5
6
7
8
9
10
11
12
13
14 15
16
27
28
26
25
24
23
22
21
20
19
18
17
40 41 42 43 44 45 46 47
48
55
53 54
5652 59
5751 58
GND
RESET_N
DIO_29
GND
X32K_Q2
DIO_30
GND
X32K_Q1
GND
GND
JTAG_TCKC
DIO_17
DIO_16
DIO_15
JTAG_TMSC
DIO_13
DIO_14
DIO_11
DIO_12
GND
DIO_10
ANT_GND
NC
2.4 GHz PCB Antenna
49
50
GND
DIO_9
DIO_8 DIO_7
DIO_6 DIO_5
DIO_4 DIO_3
DIO_2
DIO_1
DIO_0
39 39 37 36 35 34 33 32
31
30
29
DIO_25
DIO_31
DIO_18 DIO_19
DIO_20 DIO_21
DIO_22 DIO_23
DIO_24
VDDS
VDDS_PU
Figure 7-1. MOU (7-mm × 7-mm) Pinout, 0.5-mm Pitch (Top View)
The following I/O pins marked in Figure 7-1 in bold have high-drive capabilities:
• Pin 25, JTAG_TMSC
• Pin 27, DIO_16
• Pin 28, DIO_17
• Pin 46, DIO_5
• Pin 47, DIO_6
• Pin 48, DIO_7
The following I/O pins marked in Figure 7-1 in italics have analog capabilities:
• Pin 1, DIO_26
• Pin 2, DIO_27
• Pin 3, DIO_28
• Pin 7, DIO_29
• Pin 8, DIO_30
• Pin 35, DIO_23
• Pin 36, DIO_24
• Pin 39, DIO_25
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7.2 Signal Descriptions – SIPA Package
Table 7-1. Signal Descriptions – SIPA Package
PIN I/O TYPE DESCRIPTION
NAME NO.
ANT_GND 16 — — Antenna GND
DIO_0 41 I/O Digital GPIO
DIO_1 42 I/O Digital GPIO
DIO_10 19 I/O Digital GPIO
DIO_11 20 I/O Digital GPIO
DIO_12 21 I/O Digital GPIO
DIO_13 22 I/O Digital GPIO
DIO_14 23 I/O Digital GPIO
DIO_15 24 I/O Digital GPIO
DIO_16 27 I/O Digital GPIO, JTAG_TDO, high-drive capability
DIO_17 28 I/O Digital GPIO, JTAG_TDI, high-drive capability
DIO_18 30 I/O Digital GPIO
DIO_19 31 I/O Digital GPIO
DIO_2 43 I/O Digital GPIO
DIO_20 32 I/O Digital GPIO
DIO_21 33 I/O Digital GPIO
DIO_22 34 I/O Digital GPIO
DIO_23 35 I/O Digital or Analog GPIO, analog capability
DIO_24 36 I/O Digital or Analog GPIO, analog capability
DIO_25 39 I/O Digital or Analog GPIO, analog capability
DIO_26 1 I/O Digital or Analog GPIO, analog capability
DIO_27 2 I/O Digital or Analog GPIO, analog capability
DIO_28 3 I/O Digital or Analog GPIO, analog capability
DIO_29 7 I/O Digital or Analog GPIO, analog capability
DIO_3 44 I/O Digital GPIO
DIO_30 8 I/O Digital or Analog GPIO, analog capability
DIO_31(1) 29 I/O Digital Supports only peripheral functionality. Does not support general
purpose I/O functionality.
DIO_4 45 I/O Digital GPIO
DIO_5 46 I/O Digital GPIO, high-drive capability
DIO_6 47 I/O Digital GPIO, high-drive capability
DIO_7 48 I/O Digital GPIO, high-drive capability
DIO_8 49 I/O Digital GPIO
DIO_9 50 I/O Digital GPIO
GND 5 — — GND
GND 6 — — GND
GND 11 — — GND
GND 12 — — GND
GND 13 — — GND
GND 18 — — GND
GND 40 — — GND
GND 51-59 — — GND
INT_ANT 15 RF RF connection to integral PCB antenna
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Table 7-1. Signal Descriptions – SIPA Package (continued)
PIN I/O TYPE DESCRIPTION
NAME NO.
JTAG_TCKC 26 I/O Digital JTAG_TCKC
JTAG_TMSC 25 I/O Digital JTAG_TMSC, high-drive capability
NC 17 — — No Connect
RESET_N 4 I Digital Reset, active low. Internal pullup resistor to VDDS_PU
RF 14 — RF 50 ohm RF port
VDDS 37 I/O Digital 1.8-V to 3.8-V main SIP supply
VDSS_PU 38 — Power Power to reset internal pullup resistor
X32K_Q1 10 — — 32-kHz crystal oscillator pin 1
X32K_Q2 9 — — 32-kHz crystal oscillator pin 2
(1) PORT_ID = 0x00 is not supported. See the SimpleLink™ CC13x1x3, CC26x1x3 Wireless MCU Technical Reference Manual for further
details.
7.3 Connections for Unused Pins and Modules
Table 7-2. Connections for Unused Pins – SIPA Package
FUNCTION SIGNAL NAME PIN NUMBER ACCEPTABLE PRACTICE(1) PREFERRED
PRACTICE(1)
GPIO DIO_n
1-3
7-8
19-24
27-36
39
41-50
NC or GND NC
32.768-kHz crystal X32K_Q2 9 NC NC
X32K_Q1 10
No Connects NC 17 NC NC
(1) NC = No connect
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8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN MAX UNIT
VDDS(3) Supply voltage –0.3 4.1 V
Voltage on any digital pin(4) (5) –0.3 VDDS + 0.3, max 4.1 V
Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2 –0.3 VDDR + 0.3, max 2.25 V
Vin Voltage on ADC input
Voltage scaling enabled –0.3 VDDS
VVoltage scaling disabled, internal reference –0.3 1.49
Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9
Input level, RF pin 5 dBm
Tstg Storage temperature –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to ground, unless otherwise noted.
(3) VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
(4) Including analog capable DIOs.
(5) Injection current is not supported on any GPIO pin
8.2 ESD Ratings
VALUE UNIT
VESD Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins ±2000 V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) All pins ±500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating ambient temperature(1) –40 105 °C
Operating supply voltage (VDDS) 1.8 3.8 V
Rising supply voltage slew rate 0 100 mV/µs
Falling supply voltage slew rate 0 20 mV/µs
(1) For thermal resistance characteristics refer to Section 8.8.
8.4 Power Supply and Modules
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
VDDS Power-on-Reset (POR) threshold 1.1 - 1.55 V
VDDS Brown-out Detector (BOD) Rising threshold 1.77 V
VDDS Brown-out Detector (BOD), before initial boot (1) Rising threshold 1.70 V
VDDS Brown-out Detector (BOD) Falling threshold 1.75 V
(1) Brown-out Detector is trimmed at initial boot, value is kept until device is reset by a POR reset or the RESET_N pin
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8.5 Power Consumption - Power Modes
When measured on the CC2651RSIPA-EM reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless
otherwise noted.
PARAMETER TEST CONDITIONS TYP UNIT
Core Current Consumption
Icore
Reset and Shutdown Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 150 nA
Shutdown. No clocks running, no retention 100
Standby
without cache retention
RTC running, CPU, 32KB RAM and (partial) register retention.
RCOSC_LF 0.8 µA
RTC running, CPU, 32KB RAM and (partial) register retention
XOSC_LF 0.9 µA
Standby
with cache retention
RTC running, CPU, 32KB RAM and (partial) register retention.
RCOSC_LF 2.4 µA
RTC running, CPU, 32KB RAM and (partial) register retention.
XOSC_LF 2.6 µA
Idle Supply Systems and RAM powered
RCOSC_HF 650 µA
Active MCU running CoreMark at 48 MHz
RCOSC_HF 2.91 mA
Peripheral Current Consumption
Iperi
Peripheral power
domain Delta current with domain enabled 56
µA
Serial power domain Delta current with domain enabled 5.0
RF Core Delta current with power domain enabled,
clock enabled, RF core idle 144
µDMA Delta current with clock enabled, module is idle 68.6
Timers Delta current with clock enabled, module is idle(3) 102
I2C Delta current with clock enabled, module is idle 12.1
I2S Delta current with clock enabled, module is idle 30.8
SSI Delta current with clock enabled, module is idle 71.7
UART Delta current with clock enabled, module is idle(1) 147
CRYPTO (AES) Delta current with clock enabled, module is idle(2) 28.1
TRNG Delta current with clock enabled, module is idle 27.1
(1) Only one UART running
(2) Only one SSI running
(3) Only one GPTimer running
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8.6 Power Consumption - Radio Modes
When measured on the CC2651RSIPA-EM reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless
otherwise noted.
PARAMETER TEST CONDITIONS TYP UNIT
Radio receive current 2440 MHz 6.7 mA
Radio transmit current
2.4 GHz PA (Bluetooth Low Energy)
0 dBm output power setting
2440 MHz 7.7 mA
+5 dBm output power setting
2440 MHz 10 mA
8.7 Nonvolatile (Flash) Memory Characteristics
Over operating free-air temperature range and VDDS = 3.0 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Flash sector size 8 KB
Supported flash erase cycles before failure, full bank(1) (5) 30 k Cycles
Supported flash erase cycles before failure, single sector(2) 60 k Cycles
Maximum number of write operations per row before sector
erase(3) 83 Write Operations
Flash retention 105 °C 11.4 Years
Flash sector erase current Average delta current 10.7 mA
Flash sector erase time(4) Zero cycles 10 ms
30k cycles 4000 ms
Flash write current Average delta current, 4 bytes at a time 6.2 mA
Flash write time(4) 4 bytes at a time 21.6 ms
(1) A full bank erase is counted as a single erase cycle on each sector
(2) Up to 4 customer-designated sectors can be individually erased an additional 30k times beyond the baseline bank limitation of 30k
cycles
(3) Each wordline is 2048 bits (or 256 bytes) wide. This limitation corresponds to sequential memory writes of 4 (3.1) bytes minimum
per write over a whole wordline. If additional writes to the same wordline are required, a sector erase is required once the maximum
number of write operations per row is reached.
(4) This number is dependent on Flash aging and increases over time and erase cycles
(5) Aborting flash during erase or program modes is not a safe operation.
8.8 Thermal Resistance Characteristics
THERMAL METRIC(1)
PACKAGE
UNIT
MOU
(SIP)
59 PINS
RθJA Junction-to-ambient thermal resistance 48.7 °C/W(2)
RθJC(top) Junction-to-case (top) thermal resistance 12.4 °C/W(2)
RθJB Junction-to-board thermal resistance 32.2 °C/W(2)
ψJT Junction-to-top characterization parameter 0.40 °C/W(2)
ψJB Junction-to-board characterization parameter 32.0 °C/W(2)
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.
8.9 RF Frequency Bands
Over operating free-air temperature range (unless otherwise noted).
PARAMETER MIN TYP MAX UNIT
Frequency bands 2360 2500 MHz
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8.10 Antenna Characteristics
When measured on the LP-CC2651R3SIPA LaunchPad design with Tc = 25 °C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Polarization Linear
Peak Gain 2.4 GHz Band 3.5 dBi
Efficiency 2.4 GHz Band 70% dBi
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8.11 Bluetooth Low Energy - Receive (RX)
When measured on the CC2651RSIPA-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed conducted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
125 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –103 dBm
Receiver saturation Differential mode. BER = 10–3 >5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and
the internally generated carrier frequency > (–300 / 300) kHz
Data rate error tolerance Difference between incoming data rate and the internally
generated data rate (37-byte packets) > (–320 / 240) ppm
Data rate error tolerance Difference between incoming data rate and the internally
generated data rate (255-byte packets) > (–125 / 125) ppm
Co-channel rejection(1) Wanted signal at –79 dBm, modulated interferer in
channel, BER = 10–3 –1.5 dB
Selectivity, ±1 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±1
MHz, BER = 10–3 8 / 4.5(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±2
MHz, BER = 10–3 44 / 39(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±3
MHz, BER = 10–3 46 / 44(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±4
MHz, BER = 10–3 44 / 46(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –79 dBm, modulated interferer at ≥ ±6
MHz, BER = 10–3 48 / 44(2) dB
Selectivity, ±7 MHz Wanted signal at –79 dBm, modulated interferer at ≥ ±7
MHz, BER = 10–3 51 / 45(2) dB
Selectivity, Image frequency(1) Wanted signal at –79 dBm, modulated interferer at image
frequency, BER = 10–3 39 dB
Selectivity, Image frequency ±1
MHz(1)
Note that Image frequency + 1 MHz is the Co- channel
–1 MHz. Wanted signal at –79 dBm, modulated interferer
at ±1 MHz from image frequency, BER = 10–3
4.5 / 44 (2) dB
500 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –99 dBm
Receiver saturation Differential mode. BER = 10–3 > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and
the internally generated carrier frequency > (–300 / 300) kHz
Data rate error tolerance Difference between incoming data rate and the internally
generated data rate (37-byte packets) > (–450 / 450) ppm
Data rate error tolerance Difference between incoming data rate and the internally
generated data rate (255-byte packets) > (–175 / 175) ppm
Co-channel rejection(1) Wanted signal at –72 dBm, modulated interferer in
channel, BER = 10–3 –3.5 dB
Selectivity, ±1 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±1
MHz, BER = 10–3 8 / 4(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±2
MHz, BER = 10–3 44 / 37(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±3
MHz, BER = 10–3 46 / 42(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±4
MHz, BER = 10–3 45 / 43(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –72 dBm, modulated interferer at ≥ ±6
MHz, BER = 10–3 46 / 45(2) dB
Selectivity, ±7 MHz Wanted signal at –72 dBm, modulated interferer at ≥ ±7
MHz, BER = 10–3 49 / 45(2) dB
Selectivity, Image frequency(1) Wanted signal at –72 dBm, modulated interferer at image
frequency, BER = 10–3 37 dB
Selectivity, Image frequency ±1
MHz(1)
Note that Image frequency + 1 MHz is the Co- channel
–1 MHz. Wanted signal at –72 dBm, modulated interferer
at ±1 MHz from image frequency, BER = 10–3
4 / 46(2) dB
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When measured on the CC2651RSIPA-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed conducted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
1 Mbps (LE 1M)
Receiver sensitivity Differential mode. BER = 10–3 –96 dBm
Receiver saturation Differential mode. BER = 10–3 > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and
the internally generated carrier frequency > (–350 / 350) kHz
Data rate error tolerance Difference between incoming data rate and the internally
generated data rate (37-byte packets) > (–750 / 750) ppm
Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in
channel, BER = 10–3 –6 dB
Selectivity, ±1 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±1
MHz, BER = 10–3 7 / 4(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2
MHz,BER = 10–3 40 / 33(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±3
MHz, BER = 10–3 36 / 41(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4
MHz, BER = 10–3 40 / 45(2) dB
Selectivity, ±5 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at ≥ ±5
MHz, BER = 10–3 40 dB
Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image
frequency, BER = 10–3 33 dB
Selectivity, image frequency
±1 MHz(1)
Note that Image frequency + 1 MHz is the Co- channel
–1 MHz. Wanted signal at –67 dBm, modulated interferer
at ±1 MHz from image frequency, BER = 10–3
4 / 41(2) dB
Out-of-band blocking(3) 30 MHz to 2000 MHz –10 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –18 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –12 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –2 dBm
Intermodulation
Wanted signal at 2402 MHz, –64 dBm. Two interferers
at 2405 and 2408 MHz respectively, at the given power
level
–42 dBm
Spurious emissions,
30 to 1000 MHz Measurement in a 50-Ω single-ended load. < –59 dBm
Spurious emissions,
1 to 12.75 GHz Measurement in a 50-Ω single-ended load. < –47 dBm
RSSI dynamic range 70 dB
RSSI accuracy ±4 dB
2 Mbps (LE 2M)
Receiver sensitivity Differential mode. Measured at SMA connector, BER =
10–3 –91 dBm
Receiver saturation Differential mode. Measured at SMA connector, BER =
10–3 > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and
the internally generated carrier frequency > (–500 / 500) kHz
Data rate error tolerance Difference between incoming data rate and the internally
generated data rate (37-byte packets) > (–700 / 750) ppm
Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in
channel,BER = 10–3 –7 dB
Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2
MHz, Image frequency is at –2 MHz, BER = 10–3 8 / 4(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4
MHz, BER = 10–3 36 / 36(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±6
MHz, BER = 10–3 37 / 36(2) dB
Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image
frequency, BER = 10–3 4 dB
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When measured on the CC2651RSIPA-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed conducted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Selectivity, image frequency
±2 MHz(1)
Note that Image frequency + 2 MHz is the Co-channel.
Wanted signal at –67 dBm, modulated interferer at ±2
MHz from image frequency, BER = 10–3
–7 / 36(2) dB
Out-of-band blocking(3) 30 MHz to 2000 MHz –16 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –21 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –15 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –12 dBm
Intermodulation
Wanted signal at 2402 MHz, –64 dBm. Two interferers
at 2408 and 2414 MHz respectively, at the given power
level
–38 dBm
(1) Numbers given as I/C dB
(2) X / Y, where X is +N MHz and Y is –N MHz
(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification
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8.12 Bluetooth Low Energy - Transmit (TX)
When measured on the CC2651RSIPA-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed conducted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General Parameters
Max output power Differential mode, delivered to a single-ended 50 Ω load through a balun 5 dBm
Output power
programmable range Differential mode, delivered to a single-ended 50 Ω load through a balun 26 dB
Spurious emissions and harmonics
Spurious emissions
f < 1 GHz, outside restricted bands
+5 dBm setting
< –36 dBm
f < 1 GHz, restricted bands ETSI < –54 dBm
f < 1 GHz, restricted bands FCC < –55 dBm
f > 1 GHz, including harmonics < –42 dBm
Harmonics Second harmonic < –42 dBm
Third harmonic < –42 dBm
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8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
When measured on the CC2651RSIPA-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed conducted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General Parameters
Receiver sensitivity PER = 1% –99 dBm
Receiver saturation PER = 1% > 5 dBm
Adjacent channel rejection Wanted signal at –82 dBm, modulated interferer at ±5 MHz,
PER = 1% 36 dB
Alternate channel rejection Wanted signal at –82 dBm, modulated interferer at ±10 MHz,
PER = 1% 57 dB
Channel rejection, ±15 MHz or more
Wanted signal at –82 dBm, undesired signal is IEEE
802.15.4 modulated channel, stepped through all channels
2405 to 2480 MHz, PER = 1%
59 dB
Blocking and desensitization,
5 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1% 57 dB
Blocking and desensitization,
10 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1% 63 dB
Blocking and desensitization,
20 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1% 63 dB
Blocking and desensitization,
50 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1% 66 dB
Blocking and desensitization,
–5 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1% 60 dB
Blocking and desensitization,
–10 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1% 60 dB
Blocking and desensitization,
–20 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1% 63 dB
Blocking and desensitization,
–50 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level),
CW jammer, PER = 1% 65 dB
Spurious emissions, 30 MHz to 1000
MHz Measurement in a 50-Ω single-ended load –66 dBm
Spurious emissions, 1 GHz to 12.75
GHz Measurement in a 50-Ω single-ended load –53 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the
internally generated carrier frequency > 350 ppm
Symbol rate error tolerance Difference between incoming symbol rate and the internally
generated symbol rate > 1000 ppm
RSSI dynamic range 95 dB
RSSI accuracy ±4 dB
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8.14 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
When measured on the CC2651RSIPA-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed conducted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General Parameters
Max output power Differential mode, delivered to a single-ended 50-Ω load through a balun 5 dBm
Output power
programmable range Differential mode, delivered to a single-ended 50-Ω load through a balun 25 dB
Spurious emissions and harmonics
Spurious emissions (1)
f < 1 GHz, outside restricted
bands
+5 dBm setting
< -36 dBm
f < 1 GHz, restricted bands ETSI < -47 dBm
f < 1 GHz, restricted bands FCC < -55 dBm
f > 1 GHz, including harmonics < –42 dBm
Harmonics Second harmonic < -42 dBm
Third harmonic < -42 dBm
IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps)
Error vector magnitude +5 dBm setting 2 %
(1) To meet the FCC 15.247 Part 15 (US) Band Edge requirement, Channel 26 is reduced by 3 dBm when using the integrated antenna.
When using the external antenna option, Channel 26 output power is reduding by 4 dBm, with a max allowable antenna gain of 3.3
dBi.
8.15 Timing and Switching Characteristics
8.15.1 Reset Timing
PARAMETER MIN TYP MAX UNIT
RESET_N low duration 1 µs
8.15.2 Wakeup Timing
Measured over operating free-air temperature with VDDS = 3.0 V (unless otherwise noted). The times listed here do not
include software overhead.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MCU, Reset to Active(1) 850 - 3000 µs
MCU, Shutdown to Active(1) 850 - 3000 µs
MCU, Standby to Active 160 µs
MCU, Active to Standby 36 µs
MCU, Idle to Active 14 µs
(1) The wakeup time is dependent on remaining charge on VDDR capacitor when starting the device, and thus how long the device has
been in Reset or Shutdown before starting up again.
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8.15.3 Clock Specifications
8.15.3.1 48 MHz Crystal Oscillator (XOSC_HF)
Measured on a Texas Instruments reference design with integrated 48 MHz crystal including parameters based on external
manufacturer's crystal specification at Tc = 25 °C, VDDS = 3.0 V at initial time, unless otherwise noted.
PARAMETER MIN TYP MAX UNIT
Crystal frequency 48 MHz
Start-up time(1) 200 µs
Crystal frequency tolerance(2) -16 18 ppm
Crystal aging(2) -4 2 ppm/year
(1) Start-up time using the TI-provided power driver. Start-up time may increase if driver is not used.
(2) External manufacturer's crystal specification
8.15.3.2 48 MHz RC Oscillator (RCOSC_HF)
Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
MIN TYP MAX UNIT
Frequency 48 MHz
Uncalibrated frequency accuracy ±1 %
Calibrated frequency accuracy(1) ±0.25 %
Start-up time 5 µs
(1) Accuracy relative to the calibration source (XOSC_HF)
8.15.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
MIN TYP MAX UNIT
Crystal frequency 32.768 kHz
ESR Equivalent series resistance 30 100 kΩ
CLCrystal load capacitance 6 7(1) 12 pF
(1) Default load capacitance using TI reference designs including parasitic capacitance. Crystals with different load capacitance may be
used.
8.15.3.4 32 kHz RC Oscillator (RCOSC_LF)
Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
MIN TYP MAX UNIT
Frequency 32.8 kHz
Calibrated
RTC
variation(1)
Calibrated periodically against XOSC_HF(2) ±600(3) ppm
Temperature coefficient. 50 ppm/°C
(1) When using RCOSC_LF as source for the low frequency system clock (SCLK_LF), the accuracy of the SCLK_LF-derived Real Time
Clock (RTC) can be improved by measuring RCOSC_LF relative to XOSC_HF and compensating for the RTC tick speed. This
functionality is available through the TI-provided Power driver.
(2) TI driver software calibrates the RTC every time XOSC_HF is enabled.
(3) Some device's variation can exceed 1000 ppm. Further calibration will not improve variation.
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