Texas Instruments Tiva C Series User manual

Development Guide
SPMU288A–August 2012–Revised April 2013
Tiva™ C Series EK-TM4C123GXL LaunchPad:
BoosterPack Development Guide
The Texas Instruments’ Tiva™ C Series TM4C123G LaunchPad concept is an extremely low-cost,
expandable evaluation system for TI microcontrollers. This concept began with the tremendously
successful MSP430™ LaunchPad which introduced a large number of engineers to the TI MSP430 family
of microcontrollers (MCUs). The Tiva Series of 32-bit ARM®Cortex™-M4 MCU family expands that
success by introducing the Tiva C Series TM4C123G LaunchPad featuring the Tiva C Series
TM4C123GH6PM microcontroller.
Build your own BoosterPack and take advantage of Texas Instruments’ website to help promote it! From
sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers
a variety of avenues for you to reach potential customers with your solutions.
This document briefly discusses the design and architecture of the LaunchPad platform and presents
practical guidelines for application developers to build their own BoosterPacks for use with any of the
available TI MCU LaunchPad kits. For more information about the LaunchPad, or about the BoosterPacks
currently available for each LaunchPad kit, visit the LaunchPad site at www.ti.com.
Contents
1 LaunchPad and BoosterPack Expansion Concept and Overview .................................................... 2
2 BoosterPack Functional Interface ......................................................................................... 4
3 BoosterPack XL Functional Interface .................................................................................... 5
4 LaunchPad Power Interface ............................................................................................... 6
5 Special Consideration for Shared Pins ................................................................................... 7
6 Tiva C Series LaunchPad Dimensions and Mating ..................................................................... 7
7 BoosterPack Design Guidelines .......................................................................................... 8
8 References and Schematics ............................................................................................... 9
List of Tables
1 LaunchPad BoosterPack Compatibility Summary ...................................................................... 2
2 J1 Connector ................................................................................................................ 4
3 J2 Connector ................................................................................................................ 4
4 J3 Connector ................................................................................................................ 5
5 J4 Connector ................................................................................................................ 5
6 Tiva C Series LaunchPad Jumper List................................................................................... 7
Tiva, MSP430 are trademarks of Texas Instruments.
Stellaris is a registered trademark of Texas Instruments.
Cortex is a trademark of ARM Limited.
ARM is a registered trademark of ARM Limited.
All other trademarks are the property of their respective owners.
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LaunchPad and BoosterPack Expansion Concept and Overview www.ti.com
1 LaunchPad and BoosterPack Expansion Concept and Overview
The Texas Instruments’ Tiva C Series TM4C123G LaunchPad concept is an extremely low-cost,
expandable evaluation system for TI's Tiva C Series of ARM microcontrollers. This concept began with the
tremendously successful MSP430™ LaunchPad which introduced a large number of engineers to the TI
MSP430 family of microcontrollers. The TI Stellaris®LM4F120 LaunchPad expanded on that success.
Now, the LaunchPad evaluation kit platform introduces the Tiva C Series EK-TM4C123GXL LaunchPad,
featuring the Tiva C Series TM4C123GH6PM MCU.
A Tiva C Series LaunchPad consists of a target microcontroller, an in-circuit debug interface (ICDI) such
as JTAG, a regulated power supply, a minimal microcontroller support circuit, a user interface, and a set of
expansion headers. These expansion headers are referred to as the BoosterPack Interface. A
BoosterPack is an expansion card designed for this interface. The BoosterPack interface provides a
mechanism for developers to easily extend the Tiva C Series LaunchPad with application- and user-
specific functions.
The EK-TM4C123GXL LaunchPad provides a BoosterPack interface that is compatible with the MSP430
LaunchPad. In addition, the TM4C123 LaunchPad provides access to additional Tiva C Series
functionality through an extended BoosterPack interface called the BoosterPack XL Interface.
BoosterPack interfaces with highly similar functionality for expansion will be available for the Tiva C Series
LaunchPad, in addition to microcontroller-family-specific functionality available on a BoosterPack XL
Interface for additional options. Table 1 provides a summary of current BoosterPack interface
compatibility.
Table 1. LaunchPad BoosterPack Compatibility Summary
Compatible with:
LaunchPad Kit BoosterPack Interface BoosterPack XL Interface
Stellaris LaunchPad Yes Yes
MSP430 LaunchPads Yes No
Tiva C Series LaunchPad Yes Yes
Other TI LaunchPads Yes No
2Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development SPMU288A–August 2012–Revised April 2013
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Power Select
Switch Green Power LED
USB Connector
(Power/ICDI)
Reset Switch
RGB User LED
User Switch 2User Switch 1
USB Micro-A/-B
Connector
(Device)
Tiva C Series
LaunchPad
BoosterPack XL
Interface (J1, J2, J3,
and J4 Connectors)
Tiva C Series
LaunchPad
BoosterPack XL
Interface (J1, J2, J3,
and J4 Connectors)
MSP430
LaunchPad-Compatible
BoosterPack Interface
MSP430
LaunchPad-Compatible
BoosterPack Interface
Tiva
TM4C123GH6PMI
Microcontroller
Tiva
TM4C123GH6PMI
Microcontroller
www.ti.com LaunchPad and BoosterPack Expansion Concept and Overview
This development guide provides necessary design information for developers who want to create
BoosterPacks that extend the functionality of the Tiva C Series or Stellaris LaunchPads using either the
original BoosterPack Interface or the BoosterPack XL Interface. Figure 1 shows a photo of the Tiva C
Series LaunchPad.
Figure 1. Tiva C Series TM4C123G LaunchPad Evaluation Board
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BoosterPack Functional Interface www.ti.com
2 BoosterPack Functional Interface
The Tiva C Series LaunchPad BoosterPack Interface provides compatibility with the original MSP430
LaunchPad BoosterPack interface. This interface consists of the outer 10-pin headers. The pins are
spaced 0.10 in (2,54 mm) apart with the two headers located 1.8 in (4,572 cm) apart.
Table 2 and Table 3 both provide information about which Tiva C Series MCU peripherals are routed to
each of the interface pins. The J1 connector is located on the far left side of the Tiva C Series LaunchPad.
The J2 connector is located on the far right side of the TM4C123G LaunchPad. Software is used to
configure the TM4C123GH6PM pin for one of the functions found in the tables. Highlighted functions
indicate configuration for compatibility with the MSP430 LaunchPad.
Table 2. J1 Connector(1)
Analog Tiva C GPIOPCTL Register Setting
On-
Function Series
J1 Pin GPIO board MCU
GPIO Function 1 2 3 4 5 6 7 8 9 14 15
Pin
AMSEL
1.01 3.3 V
1.02 PB5 AIN11 – 57 – SSI2Fss – M0PWM3 – – T1CCP1 CAN0Tx – – –
1.03 PB0 USB0ID – 45 U1Rx – – – – – T2CCP0 – – – –
1.04 PB1 USB0VBUS – 46 U1Tx – – – – – T2CCP1 – – – –
1.05 PE4 AIN9 – 59 U5Rx – I2C2SCL M0PWM4 M1PWM2 – – CAN0Rx – – –
1.06 PE5 AIN8 – 60 U5Tx – I2C2SDA M0PWM5 M1PWM3 – – CAN0Tx – – –
1.07 PB4 AIN10 – 58 – SSI2Clk – M0PWM2 – – T1CCP0 CAN0Rx – – –
1.08 PA5 – – 22 – SSI0Tx – – – – – – – – –
1.09 PA6 – – 23 – – I2C1SCL – M1PWM2 – – – – – –
1.10 PA7 – – 24 – – I2C1SDA – M1PWM3 – – – – – –
(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
Table 3. J2 Connector(1)
Analog Tiva C GPIOPCTL Register Setting
Function
J2 On-board Series
GPIO
Pin Function MCU
GPIO 1 2 3 4 5 6 7 8 9 14 15
Pin
AMSEL
2.01 GND
2.02 PB2 – – 47 – – I2C0SCL – – – T3CCP0 – – – –
2.03 PE0 AIN3 – 9 U7Rx – – – – – – – – – –
2.04(2) PF0 – USR_SW2/ 28 U1RTS SSI1Rx CAN0Rx – M1PWM4 PhA0 T0CCP0 NMI C0o – –
WAKE (R1)
2.05 RESET
PB7 – Connected 4 – SSI2Tx – M0PWM1 – – T0CCP1 – – – –
for MSP430
2.06 PD1 AIN6 62 SSI3Fss SSI1Fss I2C3SDA M0PWM7 M1PWM1 – WT2CCP1 – – – –
Compatibility
(R10)
PB6 – Connected 1 – SSI2Rx – M0PWM0 – – T0CCP0 – – – –
for MSP430
2.07 PD0 AIN7 61 SSI3Clk SSI1Clk I2C3SCL M0PWM6 M1PWM0 – WT2CCP0 – – – –
Compatibility
(R9)
2.08 PA4 – – 21 – SSI0Rx – – – – – – – – –
2.09 PA3 – – 20 – SSI0Fss – – – – – – – – –
2.10 PA2 – – 19 – SSI0Clk – – – – – – – – –
(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
(2) Not recommended for BoosterPack use. J2.04 is a TEST pin on the MSP430 LaunchPad. This signal tied to on-board function
via 0-Ωresistor.
4Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development SPMU288A–August 2012–Revised April 2013
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www.ti.com BoosterPack XL Functional Interface
3 BoosterPack XL Functional Interface
The BoosterPack XL Interface consists of the J1 and J2 connectors as well as the inner 10-pin headers
spaced 1.6 in (4,064 cm) apart directly inside of the MSP430 LaunchPad-compatible BoosterPack
interface headers. The pins are spaced on 0.10-inch (2,54-mm) centers. These inner 10-pin headers
(connectors J3 and J4) are not intended to be compatible with other TI LaunchPads or LaunchPad XL kits.
This feature is a Tiva C Series-only interface. TI recommends that LaunchPads provide analog functions
on the left side of the BoosterPack XL interface and timer or PWM functions on the right side of the
BoosterPack XL interface. The Tiva C Series board conforms to these recommendations. No effort has
been made to make this interface compatible with any other LaunchPad.
Table 4 and Table 5 show the Tiva C Series peripherals that are routed to each pin of the Tiva C Series-
only BoosterPack XL Interface pins. J3 is the inner left BoosterPack XL Interface header. J4 is the inner
right BoosterPack XL Interface header. Software is used to configure the TM4C123GH6PM pin for one of
the functions found in the tables.
Table 4. J3 Connector(1)
Analog Tiva C GPIOPCTL Register Setting
Function
J3 On-board Series
GPIO
Pin Function MCU
GPIO 1 2 3 4 5 6 7 8 9 14 15
Pin
AMSEL
3.01 5.0 V
3.02 GND
PD0 AIN7 Connected 61 SSI3Clk SSI1Clk I2C3SCL M0PWM6 M1PWM0 – WT2CCP0 – – – –
for MSP430
3.03 PB6 – 1 – SSI2Rx – M0PWM0 – T0CCP0 – – – –
Compatibilit
y (R9)
PD1 AIN6 Connected 92 SSI3Fss SSI1Fss I2C3SDA M0PWM7 M1PWM1 – WT2CCP1 – – – –
for MSP430
3.04 PB7 – 4 – SSI2Tx – M0PWM1 – – T0CCP1 – – – –
Compatibilit
y (R10)
3.05 PD2 AIN5 63 SSI3Rx SSI1Rx – M0FAULT0 – – WT3CCP0 USB0EPE
N
3.06 PD3 AIN4 – 64 SSI3Tx SSI1Tx – – – – WT3CCP1 USB0PFLT – – –
3.07 PE1 AIN2 – 8 U7Tx – – – – – – – – –
3.08 PE2 AIN1 – 7 – – – – – – – – – – –
3.09 PE3 AIN0 – 6 – – – – – – – – – – –
3.10 PF1 – – 29 U1CTS SSI1Tx – – M1PWM5 – T0CCP1 – C1o TRD1 –
(2)
(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
(2) Not recommended for BoosterPack use. This signal tied to on-board function via 0-Ωresistor.
Table 5. J4 Connector
Analog Tiva C GPIOPCTL Register Setting
On-
Function
J4 Series
GPIO board
Pin MCU
GPIO Function 1 2 3 4 5 6 7 8 9 14 15
Pin
AMSEL
4.01 PF2 – Blue LED 30 – SSI1Clk – M0FAULT0 M1PWM6 – T1CCP0 – – – TRD0
(R11)
4.02 PF3 – Green 31 – SSI1Fss CAN0Tx – M1PWM7 – T1CCP1 – – – TRCLK
LED
(R12)
4.03 PB3 – – 48 – – I2C0SDA – – – T3CCP1 – – – –
4.04 PC4 C1– – 16 U4Rx U1Rx – M0PWM6 – IDX1 WT0CCP0 U1RTS – – –
4.05 PC5 C1+ – 15 U4Tx U1Tx – M0PWM7 – PhA1 WT0CCP1 U1CTS – – –
4.06 PC6 C0+ – 14 U3Rx – – – – PhB1 WT1CCP0 USB0EPE – – –
N
4.07 PC7 C0– – 13 U3Tx – – – – – WT1CCP1 USB0PFLT – – –
4.08 PD6 – – 53 U2Rx – – – – PhA0 WT5CCP0 – – – –
4.09 PD7 – – 10 U2Tx – – – – PhB0 WT5CCP1 NMI – – –
4.10(1) PF4 – USR_SW 5 – – – – M1FAULT0 IDX0 T2CCP0 USB0EPE – – –
1 (R13) N
(1) Not recommended for BoosterPack use. This signal tied to on-board function via 0-Ωresistor.
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4 LaunchPad Power Interface
The Tiva C Series LaunchPad has provisions to provide power to a BoosterPack through either the
BoosterPack Interface or the BoosterPack XL Interface. The configuration of power and ground pins on
both of these interfaces must be consistent across LaunchPads from all TI microcontroller families.
The TM4C123G LaunchPad draws power from either of the on-board USB interfaces as selected by the
power switch in the top left corner of the board. Typically, the USB connection provides 500 mA at 5 V to
the Tiva C Series LaunchPad. The selected USB power source is made directly available to the
BoosterPack XL Interface on the J3.01 pin. This pin is a direct connection with only small decoupling
capacitors provided on the Tiva C Series LaunchPad.
All LaunchPads, including the TM4C123G LaunchPad, also provide a 3.3-V supply on pin J1.01 of the
BoosterPack Interface. On the Tiva C Series LaunchPad, this supply is sourced by a TPS73633 LDO
voltage regulator which converts the selected 5-V USB power to 3.3 V. The regulator is capable of
sourcing 400 mA at 3.3 V. This 3.3-V supply is shared between the BoosterPack Interface, the in-circuit
debug interface (ICDI), and the target microcontroller. Therefore, under normal circumstances,
approximately 300 mA to 350 mA are available to the BoosterPack Interface. Detailed power management
is the responsibility of the BoosterPack developer who must also manage the application to be run on the
target microcontroller.
The TM4C123G LaunchPad can be powered through an external supply on a BoosterPack. If providing
power to the Tiva C Series LaunchPad from a BoosterPack, move the power select switch to select an
unused USB connection to prevent power bus contention between the BoosterPack and the USB
connection. Power may be supplied to either the 3.3-V or the 5.0-V system, but not both. Providing
external power to both 5 V and 3.3 V would result in a contention between the external power supplies
and the TM4C123G LaunchPad voltage regulator. Providing only 3.3 V results in some lost functionality
(for example, the on-board LEDs may not illuminate). It may also result in reverse current leakage through
the on-board voltage regulator. Therefore, if providing power externally, it is recommended to use either
the existing USB connections or an external 5-V supply from a BoosterPack.
Ground connections are available on pins J2.01 and J3.02. These pins provide a ground connection for
both the BoosterPack Interface and the BoosterPack XL Interface, respectively.
Additional power and ground pins are available through labeled pins located in the extreme lower corners
of the Tiva C Series LaunchPad. These pins are connected to the same 3.3 V, 5 V, and ground
connections as the pins on the BoosterPack Interface and the BoosterPack XL Interface.
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www.ti.com Special Consideration for Shared Pins
5 Special Consideration for Shared Pins
To provide compatibility with the MSP430 LaunchPad's BoosterPack interface as well as to provide a
maximum number of signals to the BoosterPack Interface and BoosterPack XL Interface, it was necessary
to route some signals to more than one pin. In addition, certain on-board functions such as the button and
LED signals are available on the BoosterPack Interface and BoosterPack XL Interface. A 0-Ωjumper
resistor was installed for signals that are used for more than one purpose or routed to more than one
GPIO. Removal of this jumper disconnects the functions. All jumpers are installed by default. A listing of
these jumpers and the respective use of each is provided in Table 6.
Table 6. Tiva C Series LaunchPad Jumper List
Resistor Primary Function Alternate Function Comments
R1 Right User Switch J2.04 Test pin on MSP430 LaunchPad. This connection
along with R13 provides Hibernate wake to
BoosterPack Interface
R2 Red LED To PF1 and J3.10 If removed: allows extra GPIO to the BoosterPack
XL Interface.
If installed (default): allows BoosterPack to drive
LED or sense LED state. Also provides Embedded
Trace signal TRD1.
R8 Hibernate Wake To PF0 and J2.04 via Allows user switch 2 to wake device from
R1 hibernate. Also ties wake to J2.04 to allow
BoosterPack to wake Stellaris LaunchPad from
Hibernate.
R9 PB6 SSI2 TX on J2.07 PD0 I2C SCL on J2.07 Routes I2C from PD0 to J2.07 for MSP430-Tiva C
Series LaunchPad compatibility. If using PD0 or
PB6, the unused GPIO must be configured as an
input or R9 removed.
R10 PB7 SSI2 RX on J2.06 PD1 I2C SDA on J2.06 Routes I2C from PD1 to J2.06 for MSP430-Tiva C
Series LaunchPad compatibility. If using PD1 or
PB7, the unused GPIO must be configured as an
input or R9 removed.
R11 Blue LED To PF2 and J4.01 If removed: allows extra GPIO to the BoosterPack
XL Interface.
If installed (default): allows BoosterPack to drive
LED or sense LED state Also provides Embedded
Trace signal TRD0.
R12 Green LED To PF3 and J4.02 If removed: allows extra GPIO to the BoosterPack
XL Interface.
If installed (default): allows BoosterPack to drive
LED or sense LED state. Also provides Embedded
Trace signal TRDCLK.
R13 Left User Switch To PF4 and J4.10 If removed: allows extra GPIO to the BoosterPack
XL Interface.
If installed (default): allows BoosterPack to
simulate switch press or sense switch state.
6 Tiva C Series LaunchPad Dimensions and Mating
See Figure 2 for a dimensional drawing of the Stellaris LaunchPad. J1 and J2 are 1.8 in (4,572 cm) apart
and constitute the BoosterPack interface. J3 and J4 are 1.6 in (4,064 cm) apart and constitute the
BoosterPack XL Interface. Other major board signals are available on unpopulated headers on a 0.1-in
(2,54-mm) grid. Dimensions to these signals are provided for convenience. These signals are subject to
change or move across revisions of the Tiva C Series LaunchPad or future LaunchPads. It is
recommended that BoosterPacks use only the BoosterPack Interface and BoosterPack XL Interface. Use
of other pins and signals is acceptable, but these pins and signals can change at any time.
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Figure 2. Tiva C Series LaunchPad Dimensions
NOTE: Units are in mils (one thousandth of an inch): 1 mil = 0.001 inch (0.0254 mm).
7 BoosterPack Design Guidelines
Follow these guidelines when designing your BoosterPack:
• BoosterPacks should not extend more than 0.350 in (8,89 mm) above the center of the top
BoosterPack Interface pin.
• BoosterPacks should not extend more than 0.150 in (3,81 mm) below the center of the bottom pin of
the BoosterPack Interface.
NOTE: BoosterPacks that extend more than 0.150 in (3,81 mm) below the center of the bottom pin
will partially cover the Tiva C Series LaunchPad user switches, which can result in lost user
access to those user inputs.
• BoosterPacks are not restricted in width and may extend as much as desired left and right of the Tiva
C Series LaunchPad.
• For BoosterPacks with RF antennas, place the antenna to the left or right of the Tiva C Series
LaunchPad for minimal interference and signal attenuation.
• The BoosterPack interface does not provide any means of keying or alignment guidance. It is
recommended that visual cues be provided on the BoosterPack to assist user in proper orientation of
the BoosterPack.
• If possible, design the BoosterPack so that incorrect mating to a Tiva C Series LaunchPad does not
damage the BoosterPack.
8Tiva™ C Series EK-TM4C123GXL LaunchPad: BoosterPack Development SPMU288A–August 2012–Revised April 2013
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www.ti.com References and Schematics
8 References and Schematics
8.1 References
In addition to this document, the following references are available for download at www.ti.com:
• Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376).
• Tiva C Series LaunchPad (EK-TM4C123GXL) User Guide. Available for download at
www.ti.com/tool/ek-tm4c123gxl
• TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl.
• TivaWare for C Series Driver Library User’s Manual (literature number SPMU298).
• TPS73633 Low-Dropout Regulator with Reverse Current Protection Data Sheet (literature number
SBVS038)
8.2 Schematics
This section contains the complete schematics for the Tiva C Series LaunchPad board.
• Microcontroller, USB, Expansion, Buttons, and LED
• Power Management
• In-Circuit Debug Interface
9
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108 WILD BASIN ROAD, SUITE 350
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AUSTIN TX, 78746
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TIVA MICROCONTROLLERS
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TEXAS INSTRUMENTS
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0.3
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EK-TM4C123GXL
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Tiva TM4C123G LaunchPad
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Microcontroller, USB, Expansion, Buttons and LED
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DGT
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Booster Packs designed for MSP430 Launchpad
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J3 and J4 sit 100 mils inside J1 and J2 to provide
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extended functions specific to this board.
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58

PB4

57

PB5

59

PE4

60

PE5

61

PD0

62

PD1

63

PD2

64

PD3

U1-A

TM4C123G

1

A

2

R

3

G

4

B

D1

RGB_LED_0404_COMA

R9

0

R10

0

R1

0

R2

0

R11

0

R12

0

R13

0

R14

0

R4

330

B

E

C

Q2

DTC114EET1G

R3

330

B

E

C

Q1

DTC114EET1G

R5

330

B

E

C

Q3

DTC114EET1G

R25

0

R29

0

USB_DM

USB_DP

DEBUG/VCOM

GPIO

GPIO

PA2

PA3

PA4

PA5

PA6

PA7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PC4

PC5

PC6

PC7

PD0

PD1

PD2

PD3

PD6

PD7

PE0

PE1

PE2

PE3

PE4

PE5

PA0/U0RX_VCP_TXD

PA1/U0TX_VCP_RXD

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC2/TDI

DEBUG_PC3/TDO/SWO

USB_DM

USB_DP

USR_SW2

USR_SW1

GPIO

PB0

PB1

PB4

PB7

PB6

+3.3V

USR_SW2

USR_SW1

+USB_VBUS

WAKE

PB6

PB7

TARGETRST

PF4

PF3

PF2

PF1

PF0

PF4

PD7

+VBUS

PF2

PF3

PB2

+VBUS

LED_B

PB5

PE4

PE5

PA6

PA2

PA3

PA4

PF0

PE0

PF1

PB3

PC4

PC5

PC6

PC7

PD6

PA5

PA7

PD0

PD1

PD2

PD3

PE1

PE2

PE3

PD0

PD1

LED_G

LED_R

LED_R

LED_B

LED_G

PB1

PB0
