Texas Instruments SimpleLink Ethernet MSP432E401Y User manual

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SimpleLink™ Ethernet MSP432E401Y Microcontroller LaunchPad™
Development Kit (MSP-EXP432E401Y)
User's Guide
SLAU748B–October 2017–Revised September 2018
SimpleLink™ Ethernet MSP432E401Y Microcontroller
LaunchPad™ Development Kit (MSP-EXP432E401Y)
The SimpleLink™ Ethernet MSP432E401Y Microcontroller LaunchPad™ Development Kit is a low-cost
evaluation platform for SimpleLink Arm®Cortex®-M4F-based Ethernet microcontrollers. The Ethernet
LaunchPad development kit highlights the MSP432E401Y microcontroller with its on-chip 10/100 Ethernet
MAC and PHY, USB 2.0, hibernation module, motion control pulse-width modulation, and a multitude of
simultaneous serial connectivity.
Contents
1 Board Overview.............................................................................................................. 2
1.1 Kit Contents.......................................................................................................... 3
1.2 Using the Ethernet LaunchPad Development Kit............................................................... 3
1.3 Features.............................................................................................................. 3
1.4 BoosterPack Plug-in Modules..................................................................................... 4
1.5 Specifications........................................................................................................ 4
2 Hardware Description ....................................................................................................... 5
2.1 Functional Description.............................................................................................. 5
2.2 Power Management............................................................................................... 20
2.3 Debug Interface.................................................................................................... 21
3 Software Development .................................................................................................... 21
3.1 Software Description.............................................................................................. 21
3.2 Source Code....................................................................................................... 21
3.3 Tool Options ....................................................................................................... 21
3.4 Programming the Ethernet LaunchPad Development Kit.................................................... 22
4 PCB Schematics ........................................................................................................... 22
List of Figures
1 SimpleLink Ethernet MSP432E401Y LaunchPad Development Kit................................................... 2
2 SimpleLink Ethernet LaunchPad Development Kit Block Diagram ................................................... 5
3 Default Jumper Locations................................................................................................. 18
4 BSL Header and Resistors................................................................................................ 19
5 Ethernet LaunchPad Development Kit Schematics (1 of 5) .......................................................... 23
6 Ethernet LaunchPad Development Kit Schematics (2 of 5) .......................................................... 24
7 Ethernet LaunchPad Development Kit Schematics (3 of 5) .......................................................... 25
8 Ethernet LaunchPad Development Kit Schematics (4 of 5) .......................................................... 26
9 Ethernet LaunchPad Development Kit Schematics (5 of 5) .......................................................... 27
List of Tables
1 MSP-EXP432E401Y Specifications....................................................................................... 4
2 BoosterPack Plug-in Module Interface 1 GPIO and Signal Muxing................................................... 8
3 BoosterPack 2 GPIO and Signal Muxing ............................................................................... 11
4 X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing.......................................... 14
5 X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing......................................... 15
6 Resistors for Serial Bootloader Protocols............................................................................... 19

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Trademarks
SimpleLink, LaunchPad, BoosterPack, Code Composer Studio are trademarks of Texas Instruments.
Arm, Cortex, Keil, RealView are registered trademarks of Arm Limited.
IAR Embedded Workbench is a registered trademark of IAR Systems.
All other trademarks are the property of their respective owners.
1 Board Overview
The SimpleLink Ethernet MSP432E401Y Microcontroller LaunchPad Development Kit is a low-cost
evaluation platform for SimpleLink Arm Cortex-M4F-based Ethernet microcontrollers. The Ethernet
LaunchPad development kit design highlights the MSP432E401Y microcontroller with its on-chip 10/100
Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width modulation, and a
multitude of simultaneous serial connectivity. The Ethernet LaunchPad development kit also features two
user switches, four user LEDs, dedicated reset and wake switches, a breadboard expansion option and
two independent BoosterPack™ XL expansion connectors. The preprogrammed quick start application on
the Ethernet LaunchPad development kit also enables remote monitoring and control of the evaluation
board from an internet browser anywhere in the world. The web interface is provided by a third party,
Exosite. Each Ethernet LaunchPad development kit is enabled on the Exosite platform allowing users to
create and customize their own Internet-of-Things applications.
Figure 1 shows the Ethernet LaunchPad development kit with key features highlighted.
Figure 1. SimpleLink Ethernet MSP432E401Y LaunchPad Development Kit

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1.1 Kit Contents
The Ethernet LaunchPad development kit contains the following items:
• SimpleLink Ethernet MSP432E401Y LaunchPad Development Board (MSP-EXP432E401Y)
• USB Micro-B plug to USB-A plug cable
• Quick Start Guide
1.2 Using the Ethernet LaunchPad Development Kit
The recommended steps for using the Ethernet LaunchPad development kit are:
1. Run the Out of Box demo software. For detailed instruction on how to run the out of box demo, visit
this SimpleLink Academy tutorial.
2. Take the first step towards developing your own applications. The Ethernet LaunchPad development
kit is supported by the SimpleLink MSP432E4 SDK. After installing the SDK, look in the following
installation directories for bare metal and rtos based examples
a. examples\nortos\MSP_EXP432E401Y\
b. examples\rtos\MSP_EXP432E401Y\
See Section 3 for more details about software development.
3. Experiment with BoosterPack plug-in modules. This development kit conforms to the latest revision of
the BoosterPack plug-in module pinout standard. It has two independent BoosterPack plug-in module
connections to enable a multitude of expansion opportunities.
4. Customize and integrate the hardware to suit your end application. This development kit can be used
as a reference for building your own custom circuits based on SimpleLink microcontrollers or as a
foundation for expansion with your custom BoosterPack plug-in module or other circuit. This manual
can serve as a starting point for this endeavor.
5. More Resources. See the TI MCU LaunchPad web page for more information and available
BoosterPack modules.
1.3 Features
The Ethernet LaunchPad development kit includes the following features:
• SimpleLink MSP432E401Y microcontroller
• Ethernet connectivity with fully integrated 10/100 Ethernet MAC and PHY
• Motion Control PWM
• USB 2.0 Micro A/B connector
• 4 user LEDs
• 2 user switches
• 1 independent hibernate wake switch
• 1 independent microcontroller reset switch
• Jumper for selecting power source:
– XDS-110 USB
– USB Device
– BoosterPack
• Preloaded Internet-of-Things application
• I/O brought to board edge for breadboard expansion
• Two independent BoosterPack XL standard connectors featuring stackable headers to maximize
expansion through BoosterPack plug-in module ecosystem

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1.4 BoosterPack Plug-in Modules
The Ethernet LaunchPad development kit provides an easy and inexpensive way to develop applications
with the MSP432E401YPDT microcontroller. BoosterPack plug-in modules are add-on boards that follow a
pinout standard created by TI. The TI and third-party ecosystem of BoosterPack plug-in modules greatly
expands the peripherals and potential applications that you can easily explore with the Ethernet
LaunchPad development kit.
You can also build your own BoosterPack plug-in module by following the design guidelines on the TI
website. TI even helps you promote your BoosterPack plug-in module to other members of the
community. TI offers a variety of avenues for you to reach potential customers with your solutions.
1.5 Specifications
Table 1 summarizes the specifications for the Ethernet LaunchPad.
Table 1. MSP-EXP432E401Y Specifications
Parameter Value
Board Supply
Voltage
4.75 VDC to 5.25 VDC from one of the following sources:
• XDS-110 USB Micro-B cable connected to PC or other compatible power source
• Target USB (U7) USB Micro-B cable connected to PC or other compatible power source
• BoosterPack 1 Interface (J3-21)
• BoosterPack 2 Interface (J7-21)
• 5-V Power header (J13-1)
• Breadboard expansion header (J10-2 or J10-97). See schematic symbol JP1 for power input selection.
Dimensions 6.85 in × 2.5 in × .425 in (17.4 cm × 6.35 cm × 10.8 mm) (L × W × H)
Break-out
Power Output
• 5 VDC to BoosterPack modules, current limited by TPS2052B. Nominal rating is 1 A. Board input power
supply limitations may also apply.
• 3.3 VDC to BoosterPack modules, limited by output of TPS79601 LDO. This 3.3-V plane is shared with
onboard components. Total output power limit of TPS79601 is 1 A.
RoHS Status Compliant

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2 Hardware Description
The Ethernet LaunchPad development kit includes an MSP432E401YPDT microcontroller with an
integrated 10/100 Ethernet MAC and PHY. This advanced Arm Cortex-M4F MCU has a wide range of
peripherals that are made available to users through the onboard accessories and the BoosterPack plug-
in module connectors. This chapter explains how those peripherals operate and interface to the
microcontroller.
Figure 2 shows a high-level block diagram of the Ethernet LaunchPad development kit.
Figure 2. SimpleLink Ethernet LaunchPad Development Kit Block Diagram
2.1 Functional Description
2.1.1 Microcontroller
The MSP432E401Y is a 32-bit Arm Cortex-M4F based microcontroller with 1024KB of flash memory,
256KB of SRAM, 6KB of EEPROM, and 120-MHz operation, integrated 10/100 Ethernet MAC and PHY,
integrated USB 2.0 connectivity with external high-speed USB 3.0 PHY capability, a hibernation module, a
multitude of serial connectivity and motion control PWM, as well as a wide range of other peripherals. See
the MSP432E401Y microcontroller data sheet for more complete details.
Most of the microcontroller signals are routed to 0.1-in (2.54-mm) pitch headers or through-hole solder
pads. An internal multiplexor allows different peripheral functions to be assigned to each of these GPIO
pads. When adding external circuitry, consider the additional load on the evaluation board power rails.
The MSP432E401Y microcontroller is factory-programmed with a quick start demo program. The quick
start program resides in on-chip Flash memory and runs each time power is applied, unless the quick start
application has been replaced with a user program. The quick start application automatically connects to
http://ti.exosite.com when an internet connection is provided through the RJ45 Ethernet jack on the
evaluation board.
2.1.2 Ethernet Connectivity
The Ethernet LaunchPad development kit is designed to connect directly to an Ethernet network using
RJ45 style connectors. The microcontroller contains a fully integrated Ethernet MAC and PHY. This
integration creates a simple, elegant and cost-saving Ethernet circuit design. Example code is available for
LwIP TCP/IP protocol stack. The embedded Ethernet on this device can be programmed to act as an
HTTP server, client or both. The design and integration of the circuit and microcontroller also enable users
to synchronize events over the network using the IEEE1588 precision time protocol.
When configured for Ethernet operation, it is recommended that the user configure LED D3 and D4 to be
controlled by the Ethernet PHY to indicate connection and transmit or receive status.

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2.1.2.1 RJ-45 Connections
To improve EMI performance, use a metal-shielded RJ-45 connector with the shield connected to chassis
ground.
Bob Smith termination to the RJ-45 connector involves 75-Ωtermination resistors connected to the
unused differential pair connections on the RJ-45 connector. Bob Smith termination is used to reduce
noise that results from common-mode current flows and to reduce susceptibility to noise from unused wire
pairs on the RJ-45.
NOTE: Power Over Ethernet (PoE) applications require a modified Bob Smith termination, which
consists of DC-blocking capacitors in series with the 75-Ωtermination resistors.
2.1.3 USB Connectivity
The Ethernet LaunchPad development kit is designed to be USB 2.0 ready. A TPS2052B load switch is
connected to and controlled by the microcontroller USB peripheral, which manages power to the USB
micro A/B connector when functioning in a USB host. When functioning as a USB device, the entire
Ethernet LaunchPad development kit can be powered directly from the USB micro A/B connector. Use
JP1 to select the desired power source.
USB 2.0 functionality is provided and supported directly out of the box with the target USB micro A/B
connector. High-speed USB 3.0 functionality can be enabled by adding an external USB PHY. The USB
external PHY control and data signals are provided on the breadboard expansion header J10.
2.1.4 Motion Control
The Ethernet LaunchPad development kit includes motion control functionality through the use of a PWM
module capable of generating eight PWM outputs. The PWM module provides a great deal of flexibility
and can generate simple PWM signals – for example, those required by a simple charge pump – as well
as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three
generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter
bridge.
A quadrature encoder interface (QEI) is also available to provide motion control feedback.
See Section 2.1.6 for details about the availability of these signals on the BoosterPack interfaces.
2.1.5 User Switches and LEDs
Two user switches are provided for input and control of the MSP432E401Y software. The switches are
connected to GPIO pins PJ0 and PJ1.
A reset switch and a wake switch are also provided. The reset switch initiates a system reset of the
microcontroller whenever it is pressed and released. Pressing the reset switch also asserts the reset
signal to the BoosterPack plug-in module and Breadboard headers. The wake switch is one way to bring
the device out of hibernate mode.
Four user LEDs are provided on the board. D1 and D2 are connected to GPIOs PN1 and PN0. These
LEDs are dedicated for use by the software application. D3 and D4 are connected to GPIOs PF4 and
PF0, which can be controlled by user’s software or the integrated Ethernet module of the microcontroller.
A power LED is also provided to indicate that 3.3-V power is present on the board.

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2.1.6 BoosterPack Plug-in Modules and Headers
2.1.6.1 BoosterPack Plug-in Module Interface 1
The Ethernet LaunchPad development kit features two fully independent BoosterPack XL connectors.
BoosterPack Plug-in Module Interface 1, located near the XDS110 emulator, is fully compliant with the
BoosterPack plug-in module standard.
I2C is provided in both the original BoosterPack plug-in module standard configuration as well as the
updated standard location. Use of I2C on the bottom left of the BoosterPack plug-in module connections
per the updated standard is highly encouraged whenever possible.
Motion control advanced PWM connections are provided on the inner right connector for motion control
applications.
Table 2 lists the BoosterPack plug-in module pins and the GPIO alternate functions available on each pin.
The MSP432E401Y GPIO register GPIOPCTL values are shown for each configuration. The headers in
this table are labeled from left to right in ten pin columns. J1 and J2 make up the outer BoosterPack plug-
in module standard pins, and J3 and J4 make up the inner BoosterPack XL standard pins.

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Table 2. BoosterPack Plug-in Module Interface 1 GPIO and Signal Muxing
Header Pin Standard
Function GPIO MCU Pin Analog Digital Function (GPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
J1 1 3.3 V 3.3 V
J1 2 Analog PE4 123 AIN9 U1RI – – – – – – – – – SSI1XDAT0
J1 3 UART RX PC4 25 C1- U7Rx – – – – – – – – – EPI0S7
J1 4 UART TX PC5 24 C1+ U7Tx – – – – RTCCLK – – – – EPI0S6
J1 5 GPIO PC6 23 C0+ U5Rx – – – – – – – – – EPI0S5
J1 6 Analog PE5 124 AIN8 – – – – – – – – – – SSIXDAT1
J1 7 SPI CLK PD3 4 AIN12 – I2C8SDA T1CCP1 – – – – – – – SSI2CLk
J1 8 GPIO PC7 22 C0- U5Tx – – – – – – – – – EPI0S4
J1 9 I2C SCL PB2 91 – – I2C0SCL T5CCP0 – – – – – – USB0STP EPI0S27
J1 10 I2C SDA PB3 92 – – I2C0SDA T5CCP1 – – – – – – USB0CLK EPI0S28
J3 21 5 V 5 V
J3 22 ground GND
J3 23 Analog PE0 15 AIN3 U1RTS – – – – – – – – – –
J3 24 Analog PE1 14 AIN2 U1DSR – – – – – – – – – –
J3 25 Analog PE2 13 AIN1 U1DCD – – – – – – – – – –
J3 26 Analog PE3 12 AIN0 U1DTR – – – – – – – – – –
J3 27 Analog PD7 128 AIN4 U2CTS – T4CCP1 USB0PFLT – – NMI – – – SSI2XDAT2
J3 28 Analog PD6 127 AIN5 U2RTS – T4CCP0 – USB0EPEN – – – – – SSI2XDAT3
J3 29 A out PM4 74 TMPR3 U0CTS – T4CCP0 – – – – – – – –
J3 30 A out PM5 73 TMPR2 U0DCD – T4CCP1 – – – – – – – –
J4 40 PWM PF1 43 – – – – EN0LED2 M0PWM1 – – – – SSI3XDAT0 TRD1
J4 39 PWM PF2 44 – – – – – M0PWM2 – – – – SSI3Fss TRD0
J4 38 PWM PF3 45 – – – – – M0PWM3 – – – – SSI3Clk TRCLK
J4 37 PWM PG0 49 – – I2C1SCL – EN0PPS M0PWM4 – – – – – EPI0S11
J4 36 Capture PL4 85 – – – T0CCP0 – – – – – – USB0D4 EPI0S26
J4 35 Capture PL5 86 – – – T0CCP1 – – – – – – USB0D5 EPI0S33
J4 34 GPIO PL0 81 – – I2C2SDA – – M0FAULT3 – – – – USB0D0 EPI0S16
J4 33 GPIO PL1 82 – – I2C2SCL – – PhA0 – – – – USB0D1 EPI0S17
J4 32 GPIO PL2 83 – – – – C0o PhB0 – – – – USB0D2 EPI0S18
J4 31 GPIO PL3 84 – – – – C1o IDX0 – – – – USB0D3 EPI0S19
J2 11 ground GND
J2 12 PWM PM3 75 – – – T3CCP1 – – – – – – – EPI0S12
J2 13 GPIO PH2 31 – U0DCD – – – – – – – – – EPI0S2
J2 14 GPIO PH3 32 – U0DSR – – – – – – – – – EPI0S3
J2 15 reset RESET
J2 16 SPI MOSI PD1 2 AIN14 – I2C7SDA T0CCP1 C1o – – – – – – SSI2XDAT0
J2 17 SPI MISO PD0 1 AIN15 – I2C7SCL T0CCP0 C0o – – – – – – SSI2XDAT1
J2 18 GPIO PN2 109 – U1DCD U2RTS – – – – – – – – EPI0S29
J2 19 GPIO PN3 110 – U1DSR U2CTS – – – – – – – – EPI0S30

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Table 2. BoosterPack Plug-in Module Interface 1 GPIO and Signal Muxing (continued)
Header Pin Standard
Function GPIO MCU Pin Analog Digital Function (GPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
J2 20 GPIO PP2 103 – U0DTR – – – – – – – – USB0NXT EPI0S29

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2.1.6.2 BoosterPack Plug-in Module Interface 2
The second BoosterPack XL interface is located near the bottom of the board. This interface is fully
compliant with the BoosterPack plug-in module standard, and adds features not covered by the
BoosterPack plug-in module standard that enable operation with additional BoosterPack plug-in modules.
Using the jumpers JP4 and JP5, Controller Area Network (CAN) digital receive and transmit signals can
be optionally routed to the BoosterPack Plug-in Module Interface 2 connector. In the default configuration,
UART0 is used for the XDS-110 backchannel UART and CAN is not present on the BoosterPack plug-in
module headers. In this configuration, the ROM serial bootloader can be used over the XDS-110
backchannel UART. When the jumpers are configured for CAN on the BoosterPack plug-in module
interface, then UART2 must be used for the XDS-110 backchannel UART.
To comply with both the original and the new BoosterPack plug-in module standard, I2C is provided on
both sides of the BoosterPack plug-in module connection. Use of I2C on the bottom left of the BoosterPack
plug-in module connection is highly encouraged where possible, to be in compliance with the new
BoosterPack plug-in module standard. To provide I2C capability on the right side of the connector, per the
original standard, two 0-Ωresistors (R19 and R20) are used to combine the SPI and I2C signals. These
signals are not shared with any other pins on the LaunchPad development kit and therefore removal of
these zero-ohm resistors should not be required. Software should be certain that unused GPIO signals are
configured as inputs.
Table 3 lists the BoosterPack plug-in module pins and the GPIO alternate functions available at each pin.
The MSP432E401Y GPIO register GPIOPCTL values are shown for each configuration. The headers in
this table are labeled from left to right in ten pin columns. J5 and J6 make up the outer BoosterPack
standard pins, J7 and J8 make up the inner BoosterPack XL standard pins.

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Table 3. BoosterPack 2 GPIO and Signal Muxing
Header Pin Standard
Function GPIO MCU Pin Analog Digital Function (FPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
J5 1 3.3 V
J5 2 Analog PD2 3 AIN13 – I2C8SCL T1CCP0 C2o – – – – – – SSI2Fss
J5 3 UART RX PP0 118 C2+ U6Rx – – – – – – – – – SSI3XDAT2
J5 4 UART TX PP1 119 C2- U6Tx – – – – – – – – – SSI3XDAT3
J5 5 GPIO (See
JP4) PD4 125 AIN7 U2Rx – T3CCP0 – – – – – – – SSI1XDAT2
PA0 33 – U0Rx I2C9SCL T0CCP0 – – CANORx – – – – –
J5 6 Analog (See
JP5) PD5 126 AIN6 U2Tx – T3CCP1 – – – – – – – SSI1XDAT3
PA1 34 – U0Tx I2C9SDA T0CCP1 – – CAN0Tx – – – – –
J5 7 SPI CLK PQ0 5 – – – – – – – – – – SSI3Clk EPI0S20
J5 8 GPIO PP4 105 – U3RTS U0DSR – – – – – – – USB0D7 –
J5 9 I2C SCL PN5 112 – U1RI U3CTS I2C2SCL – – – – – – – EPIO0S35
J5 10 I2C SDA PN4 111 – U1DTR U3RTS I2C2SDA – – – – – – – EPIO0S34
J7 21 5 V
J7 22 GND
J7 23 Analog PB4 121 AIN10 U0CTS I2C5SCL – – – – – – – – SSI1Fss
J7 24 Analog PB5 120 AIN11 U0RTS I2C5SDA – – – – – – – – SSI1Clk
J7 25 Analog PK0 18 AIN16 U4Rx – – – – – – – – – EPI0S0
J7 26 Analog PK1 19 AIN17 U4Tx – – – – – – – – – EPI0S1
J7 27 Analog PK2 20 AIN18 U4RTS – – – – – – – – – EPI0S2
J7 28 Analog PK3 21 AIN19 u4CTS – – – – – – – – – EPI0S3
J7 29 A out PA4 37 – U3Rx I2C7SCL T2CCP0 – – – – – – – SSI0XDAT0
J7 30 A out PA5 38 – U3Tx I2C7SDA T2CCP1 – – – – – – – SSI0XDAT1
J8 40 PWM PG1 50 – – I2C1SDA – – M0PWM5 – – – – – EPI0S10
J8 39 PWM PK4 63 – – I2C3SCL – EN0LED0 M0PWM6 – – – – – EPI0S32
J8 38 PWM PK5 62 – – I2C3SDA – EN0LED2 M0PWM7 – – – – – EPI0S31
J8 37 PWM PM0 78 – – – T2CCP0 – – – – – – – EPI0S15
J8 36 Capture PM1 77 – – – T2CCP1 – – – – – – – EPI0S14
J8 35 Capture PM2 76 – – – T3CCP0 – – – – – – – EPI0S13
J8 34 GPIO PH0 29 – U0RTS – – – – – – – – – EPI0S0
J8 33 GPIO PH1 30 – U0CTS – – – – – – – – – EPI0S1
J8 32 GPIO PK6 61 – – I2C4SCL – EN0LED1 M0FAULT1 – – – – – EPI0S25
J8 31 GPIO PK7 60 – U0RI I2C4SDA – RTCCLK M0FAULT2 – – – – – EPI0S24
J6 11 GND
J6 12 PWM PM7 71 TMPR0 U0RI – T5CCP1 – – – – – – – –
J6 13 GPIO PP5 106 – U3CTS I2C2SDL – – – – – – – USB0D6 –
J6 14 GPIO PA7 41 – U2Tx I2C6SDA T3CCP1 USB0PFLT – – – USB0EPEN SSI0XDAT3 – EPI0S9
J6 15 RESET
J6 16 SPI MOSI PQ2 11 – – – – – – – – – – SSI3XDAT0 EPI0S22

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Table 3. BoosterPack 2 GPIO and Signal Muxing (continued)
Header Pin Standard
Function GPIO MCU Pin Analog Digital Function (FPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
I2C PA3 36 – U4Tx I2C8SDA T1CCP1 – – – – – – – SSI0Fss
J6 17 SPI MISO PQ3 27 – – – – – – – – – – SSI3XDAT1 EPI0S23
I2C PA2 35 – U4Rx I2C8SCL T1CCP0 – – – – – – – SSI0Clk
J6 18 GPIO PP3 104 – U1CTS U0DCD – – – – – – – USB0DIR EPI0S30
J6 19 GPIO PQ1 6 – – – – – – – – – – SSI3Fss EPI0S21
J6 20 GPIO PM6 72 TMPR1 U0DSR – T5CCP0 – – – – – – – –

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2.1.6.3 Breadboard Connection
The breadboard adapter section of the board is a set of 98 holes on a 0.1-inch grid. Properly combined
with a pair of right angle headers, the entire Ethernet LaunchPad development kit can be plugged directly
into a standard 300-mil (0.3-in) wide solderless breadboard. The right angle headers and breadboard are
not provided with this kit. Suggested part numbers are Samtec TSW-149-09-L-S-RE and TSW-149-08-L-
S-RA right angle pin headers and Twin industries TW-E40-1020 solderless breadboard. Samtec TSW-
149-09- F-S-RE and TSW-149-09-F-S-RA may be substituted.
Most microcontroller signals are made available at the breadboard adapter holes (J10). These signals are
grouped by function where possible. For example, all EPI signals are grouped on one side of the
connector. Many of the analog signals are grouped near VREF, and UART, SSI, and I2C signals are
grouped by peripheral to make expansion and customization simpler.
Table 4 and Table 5 list the GPIO pin and signal muxing for the X11 breadboard adapter pads.

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Table 4. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing
Pin Port MCU Pin Analog Digital Function (GPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
1 3V3
3 GND
5 PB4 121 AIN10 U0CTS I2C5SCL – – – – – – – – SSI1Fss
7 PB5 120 AIN11 U0RTS I2C5SDA – – – – – – – – SSI1Clk
9 PH0 29 – U0RTS – – – – – – – – – EPI0S0
11 PH1 30 – U0CTS – – – – – – – – – EPI0S1
13 PH2 31 – U0DCD – – – – – – – – – EPI0S2
15 PH3 32 – U0DSR – – – – – – – – – EPI0S3
17 PC7 22 C0- U5Tx – – – – – – – – – EPI0S4
19 PC6 23 C0+ U5Rx – – – – – – – – – EPI0S5
21 PC5 24 C1+ U7Tx – – – – RTCCLK – – – – EPI0S6
23 PC4 25 C1- U7Rx – – – – – – – – – EPI0S7
25 PA6 40 – U2Rx I2C6SCL T3CCP0 USB0EPEN – – – – SSI0XDAT2 – EPI0S8
27 PA7 41 – U2Tx I2C6SDA T3CCP1 USB0PFLT – – – USB0EPEN SSI0XDAT3 – EPI0S9
29 PG1 50 – – I2C1SDA – – M0PWM5 – – – – – EPI0S10
31 PG0 49 – – I2C1SCL – EN0PPS M0PWM4 – – – – – EPI0S11
33 PM3 75 – – – T3CCP1 – – – – – – – EPI0S12
35 GND
37 PM2 76 – – – T3CCP0 – – – – – – – EPI0S13
39 PM1 77 – – – T2CCP1 – – – – – – – EPI0S14
41 PM0 78 – – – T2CCP0 – – – – – – – EPI0S15
43 PL0 81 – – I2C2SDA – – M0FAULT3 – – – – USB0D0 EPI0S16
45 PL1 82 – – I2C2SCL – – PhA0 – – – – USB0D1 EPI0S17
47 PL2 83 – – – – C0o PhB0 – – – – USB0D2 EPI0S18
49 PL3 84 – – – – C1o IDX0 – – – – USB0D3 EPI0S19
51 PQ0 5 – – – – – – – – – – SSI3Clk EPI0S20
53 PQ1 6 – – – – – – – – – – SSI3Fss EPI0S21
55 PQ2 11 – – – – – – – – – – SSI3XDAT0 EPI0S22
57 PQ3 27 – – – – – – – – – – SSI3XDAT1 EPI0S23
59 PK7 60 – U0RI I2C4SDA – – – – – – EPI0S24
61 GND
63 PK6 61 – – I2C4SCL – EN0LED1 M0FAULT1 – – – – – EPI0S25
65 PL4 85 – – – T0CCP0 – – – – – – USB0D4 EPI0S26
67 PB2 91 – – I2C0SCL T5CCP0 – – – – – – USB0STP EPI0S27
69 PB3 92 – – I2C0SDA T5CCP1 – – – – – – USB0CLK EPI0S28
71 PP2 103 – U0DTR – – – – – – – – USB0NXT EPI0S29
73 PP3 104 – U1CTS U0DCD – – – RTCCLK – – – USB0DIR EPI0S30
75 PK5 62 – – I2C3SDA – EN0LED2 M0PWM7 – – – – – EPI0S31
77 PK4 63 – – I2C3SCL – EN0LED0 M0PWM6 – – – – – EPI0S32

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Table 4. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing (continued)
Pin Port MCU Pin Analog Digital Function (GPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
79 PL5 86 – – – T0CCP1 – – – – – – USB0D5 EPI0S33
81 PN4 111 – U1DTR U3RTS I2C2SDA – – – – – – – EPI0S34
83 PN5 112 – U1RI U3CTS I2C2SCL – – – – – – – EPI0S35
85 PN0 107 – U1RTS – – – – – – – – – –
87 PN1 108 – U1CTS – – – – – – – – – –
89 PN2 109 – U1DCD U2RTS – – – – – – – – EPI0S29
91 PN3 110 – U1DSR U2CTS – – – – – – – – EPI0S30
93 PQ4 102 – U1Rx – – – – – DIVSCLK – – – –
95 WAKE
97 5 V
Table 5. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing
Pin Port MCU Pin Analog Digital Function (GPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
2 5 V
4 GND
6 PA2 35 – U4Rx I2C8SCL T1CCP0 – – – – – – – SSI0Clk
8 PA3 36 – U4Tx I2C8SDA T1CCP1 – – – – – – – SSI0Fss
10 PA4 37 – U3Rx I2C7SCL T2CCP0 – – – – – – – SSI0XDAT0
12 PA5 38 – U3Tx I2C7SDA T2CCP1 – – – – – – – SSI0XDAT1
14 PE0 15 AIN3 U1RTS – – – – – – – – – –
16 PE1 14 AIN2 U1DSR – – – – – – – – – –
18 PE2 13 AIN1 U1DCD – – – – – – – – – –
20 PE3 12 AIN0 U1DTR – – – – – – – – – –
22 PE4 123 AIN9 U1RI – – – – – – – – – SSI1XDAT0
24 PE5 124 AIN8 – – – – – – – – – – SSI1XDAT1
26 PK0 18 AIN16 U4Rx – – – – – – – – – EPI0S0
28 PK1 19 AIN17 U4Tx – – – – – – – – – EPI0S1
30 PK2 20 AIN18 U4RTS – – – – – – – – – EPI0S2
32 PK3 21 AIN19 U4CTS – – – – – – – – – EPI0S3
34 VREF
36 GND
38 PD5 126 AIN6 U2Tx – T3CCP1 – – – – – – – SSI1XDAT3
40 PD4 125 AIN7 U2Rx – T3CCP0 – – – – – – – SSI1XDAT2
42 PD7 128 AIN4 U2CTS – T4CCP1 USB0PFLT – – NMI – – – SSI2XDAT2
44 PD6 127 AIN5 U2RTS – T4CCP0 USB0EPEN – – – – – – SSI2XDAT3
46 PD3 4 AIN12 – I2C8SDA T1CCP1 – – – – – – – SSI2Clk
48 PD1 2 AIN14 – I2C7SDA T0CCP1 C1o – – – – – – SSI2XDAT0

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Table 5. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing (continued)
Pin Port MCU Pin Analog Digital Function (GPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
50 PD0 1 AIN15 – I2C7SCL T0CCP0 C0o – – – – – – SSI2XDAT1
52 PD2 3 AIN13 – I2C8SCL T1CCP0 C2o – – – – – – SSI2Fss
54 PP0 118 C2+ U6Rx – – – – – – – – – SSI3XDAT2
56 PP1 119 C2- U6Tx – – – – – – – – – SSI3XDAT3
58 PB0 95 USB0ID U1Rx I2C5SCL T4CCP0 – – CAN1Rx – – – – –
60 PB1 96 USB0VBUS U1Tx I2C5SDA T4CCP1 – – CAN1Tx – – – – –
62 GND
64 PF4 46 – – – – EN0LED1 M0FAULT0 – – – – SSI3XDAT2 TRD3
66 PF0 42 – – – – EN0LED0 M0PWM0 – – – – SSI3XDAT1 TRD2
68 PF1 43 – – – – EN0LED2 M0PWM1 – – – – SSI3XDAT0 TRD1
70 PF2 44 – – – – – M0PWM2 – – – – SSI3Fss TRD0
72 PF3 45 – – – – – M0PWM3 – – – – SSI3Clk TRCLK
74 PA0 33 – U0Rx I2C9SCL T0CCP0 – – CAN0Rx – – – – –
76 PA1 34 – U0Tx I2C9SDA T0CCP1 – – CAN0Tx – – – – –
78 PP4 105 – U3RTS U0DSR – – – – – – – USB0D7 –
80 PP5 106 – U3CTS I2C2SCL – – – – – – – USB0D6 –
82 PJ0 116 – U3Rx – – – – – – – – –
84 PJ1 117 – U3Tx – – – – – – – – – –
86 PM7 71 TMPR0 U0RI – T5CCP1 – – – – – – – –
88 PM6 72 TMPR1 U0DSR – T5CCP0 – – – – – – – –
90 PM5 73 TMPR2 U0DCD – T4CCP1 – – – – – – – –
92 PM4 74 TMPR3 U0CTS – T4CCP0 – – – – – – – –
94 RESET
96 GND
98 3V3

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2.1.6.4 Other Headers and Jumpers
JP1 is provided to select the 5-V power input source for the Ethernet LaunchPad development kit. The left
position is for BoosterPack plug-in module power; this position also disconnects both USB voltages from
the board’s primary 5-V input. In the left position, the TPS2052B does not limit current so additional care
should be exercised. The middle position draws power from the USB connector on the bottom of the board
near the Ethernet jack. The right position is the default, in which power is drawn from the XDS-110 USB
connection through J101. If JP1 is in the left or middle position, which selects the BoosterPack headers or
the USB OTG connector, respectively, externally provide 3.3 V to the board, and remove the 3V3 jumper
on J101.
JP2 separates the MCU 3.3-V power domain from the rest of the 3.3-V power on the board allowing an
ammeter to be used to obtain more accurate measurements of microcontroller power consumption. JP4
and JP5 are used to configure CAN signals to the BoosterPack Plug-in Module Interface 2 connector. In
the default vertical configuration, CAN is not present on the BoosterPack plug-in module connector.
UART2 goes to the BoosterPack plug-in module connector and UART 0 goes to the XDS-110
backchannel serial port and can also be used for the ROM serial bootloader. In the horizontal CAN-
enabled configuration, UART2 goes to the XDS-110 backchannel serial port and CAN signals are
available on the BoosterPack Plug-in Module Interface 2 connector. The ROM serial bootloader is not
available to the XDS-110 backchannel serial port while the jumpers are in the CAN position.
Figure 3 shows the default configuration and relative location of the jumpers on the board.

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Figure 3. Default Jumper Locations

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2.1.7 Serial Bootloader
The Ethernet LaunchPad development kit enables the serial boot loader on the MSP432E401Y through
the BSL header for connecting to an external BSL host interface, such as the BSL Rocket. The BSL
header supports three communication protocols to the serial boot loader: SPI, UART, and I2C. To use the
serial bootloader, a shrouded 100mil header (such as the AWHW-10G-0202-T from Assman WSW)
should be soldered into the top side of the PCB, paying careful attention to make sure pin 1 of the
connector lines up to pin one of the PCB (denoted by a square pad).
Because several of the pins for different communication protocols are shared on the header, the Ethernet
LaunchPad development kit enables support for all three protocols by using 0-Ωresistor bridges for each
of the signals. See Figure 4 for the location of the header and resistors on the PCB. To connect a specific
protocol, populate the designated resistors with 0-Ωresistors and remove the resistors for the others
protocols (see Table 6). When using I2C, populate R13 and R14 with the pullup resistors if no I2C pullups
are on the external host. Typically the I2C pullup resistors should be 3.3 kΩ.
Figure 4. BSL Header and Resistors
Table 6. Resistors for Serial Bootloader Protocols
Serial Bootloader
Protocol Resistors Populated With 0-ΩResistors Resistors Left Unpopulated
I2CR7
R8
R5
R6
R9
R10
R11
R12
UART R5
R6
R7
R8
R9
R10
R11
R12
SPI R9
R10
R11
R12
R5
R6
R7
R8

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2.2 Power Management
2.2.1 Power Supplies
The Ethernet LaunchPad development kit can be powered from three different input options:
• Onboard XDS-110 USB cable (Debug, Default)
• Target USB cable
• BoosterPack plug-in module or Breadboard adapter connections
The JP1 power-select jumper is used to select one of the power sources.
In addition, the 3V3 Jumper on J101 power jumper can be used to isolate the 3.3-V output of the
TPS79601 in the XDS-110 emulator from the 3.3-V rail of the target side.
A TPS2052B load switch is used to regulate and control power to the Target USB connector when the
microcontroller is acting in USB host mode. This load switch also limits current to the BoosterPack plug-in
module and Breadboard adapter headers when the JP1 jumper is in the XDS-110 position.
2.2.2 Low Power Modes
The Ethernet LaunchPad development kit demonstrates several low power microcontroller modes. In run
mode, the microcontroller can be clocked from several sources such as the internal precision oscillator or
an external crystal oscillator. Either of these sources can then optionally drive an internal PLL to increase
the effective frequency of the system up to 120 MHz. In this way, the run mode clock speed can be used
to manage run mode current consumption.
The microcontroller also provides sleep and deep sleep modes and internal voltage adjustments to the
flash and SRAM to further refine power consumption when the processor is not in use but peripherals
must remain active. Each peripheral can be individually clock gated in these modes so that current
consumption by unused peripherals is minimized. A wide variety of conditions from internal and external
sources can trigger a return to run mode.
The lowest power setting of the microcontroller is hibernation, which requires a small amount of supporting
external circuitry available on the Ethernet LaunchPad development kit. The Ethernet LaunchPad
development kit can achieve microcontroller current consumption modes under 2 µA using hibernate
VDD3ON mode. Hibernation with VDD3ON mode is not supported on this board. The Ethernet LaunchPad
can be woken from hibernate by several triggers including the dedicated wake button, the reset button, an
internal RTC timer and a subset of the device GPIO pins. The hibernation module provides a small area of
internal battery backed register bank that can preserve data through a hibernate cycle.
2.2.3 Clocking
The Ethernet LaunchPad uses a 25-MHz crystal (Y1) to drive the main MSP432E401Y internal clock
circuit. Most software examples use the internal PLL to multiply this clock to higher frequencies up to 120
MHz for core and peripheral timing. The 25-MHz crystal is required when using the integrated Ethernet
MAC and PHY.
The Hibernation module is clocked from an external 32.768-kHz crystal (Y3).
2.2.4 Reset
The RESET signal to the MSP432E401Y microcontroller connects to the RESET switch, BoosterPack
plug-in module connectors, breadboard adapter, and the XDS-110 target reset line.
External reset is asserted (active low) under the following conditions:
• Power-on reset (filtered by an RC network)
• RESET switch held down
• By the XDS-110 circuit when instructed by the debugger (this capability is optional, and may not be
supported by all debuggers)
• By an external circuit attached to the BoosterPack plug-in module or breadboard connectors