Texas Instruments LaunchPad MSP430FR5994 User manual

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LaunchPad, BoosterPack, Code Composer Studio, MSP430, EnergyTrace++, EnergyTrace, E2E are trademarks of Texas Instruments.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
All other trademarks are the property of their respective owners.
User's Guide
SLAU678A–March 2016–Revised April 2016
MSP430FR5994 LaunchPad™ Development Kit
(MSP ‑‑ EXP430FR5994)
The MSP-EXP430FR5994 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) for
the MSP430FR5994 microcontroller (MCU). It contains everything needed to start developing on the ultra-
low-power MSP430FRx FRAM microcontroller platform, including onboard debug probe for programming,
debugging, and energy measurements. Figure 1 shows the development kit.
Figure 1. MSP-EXP430FR5994 LaunchPad Development Kit

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Contents
1 Getting Started............................................................................................................... 3
2 Hardware...................................................................................................................... 5
3 Software Examples ........................................................................................................ 16
4 Resources................................................................................................................... 25
5 FAQ .......................................................................................................................... 32
6 Schematics.................................................................................................................. 33
List of Figures
1 MSP-EXP430FR5994 LaunchPad Development Kit.................................................................... 1
2 MSP-EXP430FR5994 Overview........................................................................................... 5
3 MSP-EXP430FR5994 Block Diagram..................................................................................... 6
4 MSP430FR5994 Pinout..................................................................................................... 7
5 eZ-FET Debug Probe ....................................................................................................... 8
6 eZ-FET Isolation Jumper Block Diagram................................................................................ 10
7 Application Backchannel UART in Device Manager................................................................... 10
8 MSP-EXP430FR5994 Power Block Diagram........................................................................... 12
9 MSP-EXP430FR5994 Super Cap Power Block Diagram............................................................. 13
10 BoosterPack Plug-in Module Checker Tool............................................................................. 15
11 LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout.................................. 16
12 MSP-EXP430FR5994 Out-of-Box Demo GUI.......................................................................... 18
13 Live Temperature Mode................................................................................................... 19
14 FRAM Log Mode ........................................................................................................... 20
15 Record....................................................................................................................... 22
16 Playback..................................................................................................................... 23
17 Alternate Microphone Configuration ..................................................................................... 24
18 EEPROM SPI Interface Block Diagram ................................................................................. 25
19 EEPROM I2C Interface Block Diagram.................................................................................. 25
20 TI Resource Explorer Cloud .............................................................................................. 26
21 CCS Cloud .................................................................................................................. 27
22 Directing the Project>Import Function to the Demo Project .......................................................... 28
23 When CCS Has Found the Project ...................................................................................... 28
24 Using TI Resource Explorer to Browse MSP-EXP430FR5994 in MSPWare....................................... 30
25 Schematics (1 of 7) ........................................................................................................ 33
26 Schematics (2 of 7) ........................................................................................................ 34
27 Schematics (3 of 7) ........................................................................................................ 35
28 Schematics (4 of 7) ........................................................................................................ 36
29 Schematics (5 of 7) ........................................................................................................ 37
30 Schematics (6 of 7) ........................................................................................................ 38
31 Schematics (7 of 7) ........................................................................................................ 39

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1 Getting Started
1.1 Introduction
The MSP-EXP430FR5994 LaunchPad development kit is an easy-to-use evaluation module (EVM) for the
MSP430FR5994 microcontroller (MCU). The LaunchPad development kit contains everything needed to
start developing on the ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard
debug probe for programming, debugging and energy measurements. The board features onboard buttons
and LEDs for quick integration of a simple user interface, a microSD card port to interface with microSD
cards, and a super capacitor (super cap) to enable stand-alone applications without an external power
supply.
The MSP430FR5994 MCU features 256KB of embedded FRAM (Ferroelectric Random Access Memory),
a nonvolatile memory known for its ultra-low power, high endurance, and high speed write access. The
device also features 8 KB of SRAM, supports CPU speeds of up to 16 MHz and has integrated
peripherals for communication, ADC, timers, AES encryption, low-energy accelerator (LEA) (a new
hardware module for the FRAM family that is designed for fast, efficient, and low-power vector math), and
more–plenty to get you started in your development.
Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide
range of available BoosterPack modules. Quickly add features like wireless connectivity, graphical
displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or
choose among many already available from TI and third-party developers.
Free software development tools are also available, such as the TI Eclipse-based Code Composer
Studio™ IDE (CCS) and the IAR Embedded Workbench®for MSP430™ IDE (EW430). Both of these IDEs
support EnergyTrace++™ technology for real-time power profiling and debugging when paired with the
MSP430FR5994 LaunchPad kit.
1.2 Key Features
• MSP ULP FRAM technology based MSP430FR5994 16-bit MCU
• EnergyTrace++ Technology available for ultra-low-power debugging
• 40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
• Onboard eZ-FET debug probe
• Two buttons and two LEDs for user interaction
• Onboard microSD card
• Super capacitor (0.22 F)
1.3 What's Included
1.3.1 Kit Contents
• 1xMSP-EXP430FR5994 LaunchPad Development Kit
• 1xMicro USB cable
• 1xQuick start guide
1.3.2 Software Examples
• Out-of-box software
• Blink LED
• Audio BoosterPack plug-in module record and playback
• Low-energy accelerator for signal processing
• EEPROM emulation

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1.4 First Steps: Out-of-Box Experience
An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstrates
some key features from a user level.
1.4.1 Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
should illuminate. For proper operation, drivers are needed. TI recommends installing the drivers by
installing an IDE such as TI CCS or IAR EW430. Drivers are also available at ti.com/MSPdrivers.
1.4.2 Running the Out-of-Box Demo
When connected to the computer, the LaunchPad development kit powers up. Press and hold the S1 and
S2 buttons simultaneously to select a new mode. See Section 3.1 for a detailed explanation of each
mode.
1.4.2.1 Live Temperature Mode
This mode provides live temperature data streaming to the PC GUI. You can influence the temperature of
the device and see changes on the GUI.
1.4.2.2 FRAM Data Log Mode
This mode shows the FRAM data logging capabilities of the MSP430FR5994. After starting this mode, the
LaunchPad development kit wakes up every five seconds from sleep mode (indicated by LED blink) to log
both temperature and input voltage values. After reconnecting to the GUI, these values can be uploaded
and graphed in the GUI.
1.4.2.3 SD Card Data Log Mode
This mode shows the data logging capabilities of the MSP430FR5994 while interfacing with an SD card.
After starting this mode, the LaunchPad development kit wakes up every five seconds from sleep mode
(indicated by LED blink) to log both temperature and input voltage values. After reconnecting to the GUI,
these values can be uploaded and graphed in the GUI.
1.5 Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It's time to open an integrated
development environment and start editing the code examples. See Section 4 for available IDEs and
where to download them.
The quickest way to get started using the LaunchPad development kit is to use TI's Cloud Development
Tools. The cloud-based Resource Explorer provides access to all of the examples and resources in
MSPWare. Code Composer Studio Cloud is a simple cloud-based IDE that enables developing and
running applications on the LaunchPad development kit.
The out-of-box source code and more code examples are provided and available on the download page.
Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
Section 3 describes all functions in detail and provides a project structure to help familiarize you with the
code.
With the onboard eZ-FET debug probe debugging and downloading new code is simple. A USB
connection between the EVM and a PC through the provided USB cable is all that is needed.

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2 Hardware
Figure 2 shows an overview of the MSP-EXP430FR5994 hardware.
Figure 2. MSP-EXP430FR5994 Overview

Target device
MSP430FR5994
Crystal
32.768 kHz
Micro-B
USB
3.3-V
LDO
ESD
protection
Debug
MCU
LED
red, green
Crystal
4 MHz
UART, SBW to target
User interface
2 buttons, 2 LEDs
40-pin LaunchPad
standard headers
Power to target
Reset
button
Super capacitor
EnergyTrace
microSD Card
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2.1 Block Diagram
Figure 3 shows the block diagram.
Figure 3. MSP-EXP430FR5994 Block Diagram
2.2 Hardware Features
2.2.1 MSP430FR5994 MCU
The MSP430FR5994 is the next device in TI's new ULP FRAM technology platform. FRAM is a cutting-
edge memory technology that combines the best features of flash and RAM into one nonvolatile memory.
For more information on FRAM, see www.ti.com/fram.
Device features include:
• 1.8-V to 3.6-V operation
• 16-bit RISC architecture up to 16-MHz system clock and 8-MHz FRAM access
• 256KB of FRAM and 8KB of SRAM
• 16-channel 12-bit ADC
• 16-channel analog comparator
• Six 16-bit timers with seven capture/compare registers each
• 6-channel direct memory access (DMA)
• 128-bit or 256-bit AES
• 32-bit hardware multiplier (MPY)
• 68 GPIOs

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
DVSS3
22
DVCC2
23 24 25 26 27 28 29 30 31 32 33 34
P5.0/UCB1SIMO/UCB1SDA
35 36 37 38 39 40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61626364
DVCC1
65666768697071727374757677787980
P1.4/TB0.1/UCA0STE/A4/C4
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF-
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P3.0/A12/C12
P3.1/A13/C13
P3.2/A14/C14
P3.3/A15/C15
P1.3/TA1.2/UCB0STE/A3/C3
P1.5/TB0.2/UCA0CLK/A5/C5
P4.7
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6
PJ.1/TDI/TCLK/MCLK/SRSCG0/C7
PJ.2/TMS/ACLK/SROSCOFF/C8
PJ.3/TCK/SRCPUOFF/C9
P4.0/A8
P4.1/A9
P4.2/A10
P4.3/A11
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P2.6/TB0.1/UCA1RXD/UCA1SOMI
TEST/SBWTCK
RST/NMI/SBWTDIO
P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
P2.1/TB0.0/UCA0RXD/UCA0SOMI
P2.2/TB0.2/UCB0CLK
P3.4/TB0.3/SMCLK
P3.5/TB0.4/COUT
P3.6/TB0.5
P3.7/TB0.6
P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0
P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0
P4.4/TB0.5
P4.5
P4.6
DVSS1
P2.7 P2.3/TA0.0/UCA1STE/A6/C10
AVSS3
PJ.6/HFXIN PJ.7/HFXOUT
AVSS2
PJ.4/LFXIN PJ.5/LFXOUT
AVSS1 AVCC1
P2.4/TA1.0/UCA1CLK/A7/C11
DVSS2
P5.1/UCB1SOMI/UCB1SCL
P5.2/UCB1CLK/TA4CLK
P5.3/UCB1STE
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH P5.5/UCA2RXD/UCA2SOMI/ACLK P5.6/UCA2CLK/TA4.0/SMCLK P5.7/UCA2STE/TA4.1/MCLK
P8.0
P6.0/UCA3TXD/UCA3SIMO
P6.1/UCA3RXD/UCA3SOMI
P6.2/UCA3CLK
P6.3/UCA3STE
P8.1
DVCC3
P6.4/UCB3SIMO/UCB3SDA
P6.5/UCB3SOMI/UCB3SCL P6.6/UCB3CLK P6.7/UCB3STE
P8.2
P8.3
P7.0/UCB2SIMO/UCB2SDA
P7.2/UCB2CLK
P7.3/UCB2STE/TA4.1
P7.1/UCB2SOMI/UCB2SCL
P7.4//TA4.0/A16
P7.6/A18 P7.7/A19
P7.5/A17
MSP430FR59xxPN
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Figure 4 shows the pinout of the MSP430FR5994 MCU in the 80-pin PN package.
Figure 4. MSP430FR5994 Pinout

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2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace++ Technology
To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard
debug probe, which eliminates the need for expensive programmers. The MSP-EXP430FR5994 has the
eZ-FET debug probe (see Figure 5), which is a simple and low-cost debugger that supports all MSP430
device derivatives.
Figure 5. eZ-FET Debug Probe
The MSP-EXP430FR5994 LaunchPad development kit features full EnergyTrace++ technology. The
EnergyTrace™ functionality varies across the MSP portfolio (see Table 1).
Table 1. EnergyTrace Technology
Features EnergyTrace™ Technology EnergyTrace++™ Technology
Current Monitoring ✓ ✓
CPU State ✓
Peripheral and System State ✓
Devices Supported All MSP430 MCUs FR59 and FR69 MCUs
Development Tool Required MSP-FET or eZ-FET MSP-FET or eZ-FET
In Figure 5, the dotted line through J101 divides the eZ-FET debug probe from the target area. The
signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. For more
details on the isolation jumper block, see Section 2.2.3.
The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. For more details, see Section 2.2.4.
Details of the eZ-FET hardware can be found in the schematics in Section 6 and in the hardware design
files download page. The software and more information about the debugger can be found on the eZ-FET
wiki.

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2.2.3 Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 can connect or disconnect signals that cross from the eZ-FET
domain into the MSP430FR5994 target domain. This includes eZ-FET Spy-Bi-Wire signals, application
UART signals, and 3.3-V and 5-V power (see Table 2 and Figure 6).
Reasons to open these connections:
• To remove any and all influence from the eZ-FET debug probe for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other
than the onboard MCU.
Table 2. Isolation Block Connections
Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS in the eZ-FET domain
RXD << Backchannel UART: The target FR5994 receives data through this signal. The arrows indicate the direction of the
signal.
TXD >> Backchannel UART: The target FR5994 sends data through this signal. The arrows indicate the direction of the
signal.
SBW RST Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal.

eZ-FET Debug
Probe
Isolation
Jumper Block
Spy-Bi-Wire (SBW) Emulation
Application UART
3.3-V Power
5-V Power
Target MSP430 MCU
eZ-FETMSP430 Target
USB Connector
in out
LDO
BoosterPack Header
BoosterPack Header
USB
EnergyTrace
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Figure 6. eZ-FET Isolation Jumper Block Diagram
2.2.4 Application (or Backchannel) UART
The backchannel UART allows communication with the USB host that is not part of the target application's
main functionality. This is very useful during development, and also provides a communication channel to
the PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the
PC that communicate with the LaunchPad development kit.
Figure 6 shows the pathway of the backchannel UART. The backchannel UART is the UART on
eUSCI_A0. This UART channel is separate from the UART on the 40-pin BoosterPack plug-in module
connector (eUSCI_A3).
On the host side, a virtual COM port for the application backchannel UART is generated when the
LaunchPad development kit enumerates on the host. You can use any PC application that interfaces with
COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and
communicate with the target application. You need to identify the COM port for the backchannel. On
Windows PCs, Device Manager can assist (see Figure 7).
Figure 7. Application Backchannel UART in Device Manager

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The backchannel UART is the MSP Application UART1 (COM13) port. In this case, Figure 7 shows
COM13, but this port can vary from one host PC to the next. Identify the correct COM port and configure it
in the host application according to its documentation. Then open the port and begin communication to it
from the host.
On the target MSP430FR5994 side, the backchannel is connected to the eUSCI_A0 module. The eZ-FET
has a configurable baud rate; therefore, it is important that the PC application configures the baud rate to
be the same as what is configured on the eUSCI_A0.
2.2.5 Special Features
2.2.5.1 microSD Card
The MSP430FR5994 LaunchPad development kit features an onboard microSD card. With an SD card,
there is another method of cheap data logging available for users. The Out-Of-Box experience comes with
an SD Card Library that helps users interface the MSP430FR5994 with the SD Card. The library lets users
store data in files with a name of their choice, so that the data can be used later in conjunction with a PC.
The slot can detect if a card is present. If a card is inserted while the MSP430FR5994 is on, an interrupt
for the MCU is generated. Table 3 lists the SD Card Detect pin and the rest of the pin assignments that
are used to communicate with the SD card.
Table 3. microSD Card to MSP Connections
microSD Card Function MSP430FR5994 Pin
SD Card Detect P7.2
SD SPI MOSI P1.6
SD SPI MISO P1.7
SD SPI CS P4.0
SD SPI CLK P2.2
R7 on the MSP430FR5994 LaunchPad development kit is not populated on the board to ensure accurate
LPM current measurements. Use the internal MSP pullup resistor in software, or populate R7.
R5 is also not populated. In the SD Card library, the SPI CS line is driven high or low. Often why a pullup
resistor like R5 is included is for during system startup. Before the MSP430FR5994 fully starts and outputs
a high signal on the CS line, it is possible that CS may be floating, and the SD card may interpret other
floating SPI lines as communication. It is a good practice to populate this resistor in an application where
the exact startup conditions are not controlled. For the LaunchPad development kit, this resistor is
removed for precise current measurements when all GPIO are set low.
2.2.5.2 220-mF Super Capacitor
A 220-mF (0.22-F) capacitor is mounted onboard and allows powering the system without any external
power. The super cap can be used in the following ways: charging, using (direct connection to 3V3 rail),
and disconnected. For more details on these use modes and how to use them, see Section 2.3.

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2.3 Power
The board is designed to accommodate various powering methods, including through the onboard eZ-FET
and external or BoosterPack plug-in module power (see Figure 8).
Figure 8. MSP-EXP430FR5994 Power Block Diagram
2.3.1 eZ-FET USB Power
The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the
target side of the LaunchPad development kit. Power from the eZ-FET is controlled by jumper J101. For
3.3 V, make sure that a jumper is connected across the J101 3V3 terminal.
2.3.2 BoosterPack Plug-in Module and External Power Supply
Header J6 on the board supplies external power directly. Comply with the device voltage operation
specifications when supplying external power. The MSP430FR5994 has an operating range of 1.8 V to 3.6
V. More information can be found in the MSP430FR5994 data sheet.

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Figure 9. MSP-EXP430FR5994 Super Cap Power Block Diagram
2.3.3 Super Cap (C1)
A 220-mF (0.22-F) super cap is mounted onboard and allows powering the system without any external
power. This demonstrates the ultra-low power of the MSP430FR5994 target MCU. See how long you can
run your application on the super cap alone!
2.3.3.1 Charging the Super Cap
The super cap can be charged when the EVM is plugged into the PC or when the board is externally
powered. During charging, set J8 to the Charge setting, which adds a current limiting resistor for charging.
To charge the super cap, power must be coming from the eZ-FET debug probe, external power through
J5, or a BoosterPack plug-in module powering through J1. Allow two to three minutes for the super cap to
charge (time may vary depending on initial charge of the super cap and the power source) to full VCC.
2.3.3.2 Using the Super Cap
After charging of the super cap, move the J8 jumper to the Use setting and unplug power. This connects
the super cap to the 3V3 rail without the charging resistor. Now, the LaunchPad development kit is being
powered completely by the C1 super capacitor.
For the lowest-power operation, make sure to disconnect the J101 jumpers and remove the microSD card
if it is not in use. Removing J101 jumpers prevents the super cap from powering the eZ-FET circuitry and
consuming additional power. The microSD card has approximately 100 µA of current draw just being
plugged into the system, even when not in use. Taking these steps allows your application to be powered
longer from only the super cap.

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2.3.3.3 Disabling the Super Cap
The super cap can be completely decoupled from the board by removing the J8 jumper. Hang this jumper
off only one pin to prevent losing the jumper.
2.4 Measure MSP430 Current Draw
To measure the current draw of the MSP430FR5994 using a multimeter, use the 3V3 jumper on the J101
jumper isolation block. The current measured includes the target device and any current drawn through
the BoosterPack plug-in module headers.
To measure ultra-low power, follow these steps:
• Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper.
• Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR5994 may
have on current draw. Consider disconnecting these at the isolation jumper block, or at least consider
their current sinking and sourcing capability in the final measurement.
• Make sure there are no floating inputs or outputs (I/Os) on the MSP430FR5994. These cause
unnecessary extra current draw. Every I/O should either be driven out or, if it is an input, should be
pulled or driven to a high or low level.
• Begin target execution.
• Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
Alternatively, EnergyTrace++ technology can be used to measure the same current, and see energy
profiles through integrated GUI in CCS and IAR. EnergyTrace allows you to compare various current
profiles and better optimize the energy performance.
2.5 Clocking
The MSP-EXP430FR5994 provides external clocks in addition to the internal clocks in the device.
• Q1: 32-kHz Epson crystal (FC-135R)
• Q2: DNP high-frequency crystal footprint
The 32-kHz crystal allows for lower LPM3 sleep currents than do the other low-frequency clock sources.
Therefore, the presence of the crystal allows the full range of low-power modes to be used.
The high-frequency crystal is not populated by default, but the footprint for a crystal is provided. Populate
a high-frequency crystal for applications that need more precise high-frequency clock sources than the
internal DCO.
The internal clocks in the device default to the following configuration:
• MCLK: DCO 1 MHz
• SMCLK: DCO 1 MHz
• ACLK: REFO 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx Family User's Guide.
2.6 Using the eZ-FET Debug Probe With a Different Target
The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 derivative
devices, not just the onboard MSP430FR5994 target device.
To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the debug
probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.
Next, make sure the target board has proper connections for SBW. Note that to be compatible with SBW,
the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430
JTAG interface circuitry is the MSP430 Hardware Tools User's Guide.
Finally, wire together these signals from the debug probe side of the isolation jumper block to the target
hardware:

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• 5 V (if 5 V is needed)
• 3.3 V
• GND
• SBWTDIO
• SBWTCK
• TXD (if the UART backchannel is to be used)
• RXD (if the UART backchannel is to be used)
This wiring can be done either with jumper wires or by designing the board with a connector that plugs into
the isolation jumper block.
2.7 BoosterPack Plug-in Module Pinout
This LaunchPad development kit complies with the 40-pin LaunchPad development kit pinout standard.
This standard was created to aid compatibility between LaunchPad development kits and BoosterPack
plug-in modules across the TI ecosystem.
The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPad development
kit like the MSP-EXP430FR4133. This allows some subset of functionality of 40-pin BoosterPack plug-in
modules to be used with 20-pin LaunchPad development kits.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSP-
EXP430FR5994 LaunchPad development kit is compatible with all 40-pin BoosterPack plug-in module that
comply with the standard. If the reseller or owner of the BoosterPack plug-in module does not explicitly
indicate compatibility with the MSP-EXP430FR5994 LaunchPad development kit, compare the schematic
of the candidate BoosterPack plug-in module with the LaunchPad development kit to ensure compatibility.
Keep in mind that sometimes conflicts can be resolved by changing the MSP430FR5994 MCU pin
function configuration in software.
To check the compatibility of your desired BoosterPack plug-in module for your design, with a LaunchPad
development kit of your choice, you can use the BoosterPack Checker tool (see Figure 10). This allows
you to select any LaunchPad development kit we offer and determine its compatibility with any number of
BoosterPack plug-in module that we offer. You can also add your own BoosterPack plug-in module to
check its compatibility as you prototype that next design.
Figure 10. BoosterPack Plug-in Module Checker Tool

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Figure 11 shows the 40-pin pinout of the MSP430FR5994 LaunchPad development kit.
Software configuration of the pin functions plays a role in compatibility. The LaunchPad development kit
side of the dashed line shows only the applicable function for conforming to the standard. However, each
pin has other functionality that can be configured by the software. See the MSP430FR5994 data sheet for
more details on individual pin functions.
Figure 11. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout
2.8 Design Files
2.8.1 Hardware
See Section 6 for schematics. All design files including schematics, layout, bill of materials (BOM), Gerber
files, and documentation are available on the MSP-EXP430FR5994 Design File Download Page.
2.8.2 Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available on the MSP-EXP430FR5994 Design File Download Page.
2.9 Hardware Change Log
Table 4 lists the change history for all released hardware revisions.
Table 4. Hardware Change Log
PCB Revision Description
Rev 1.1 Initial Release
3 Software Examples
Software examples are included with the MSP430FR5994 LaunchPad development kit (see Table 5), and
can be found in the MSP430FR5994 LaunchPad development kit Download Page and are also available
in MSPWare.

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Table 5. Software Examples
Demo Name BoosterPack Required Description More Details
OutOfBox_FR5994 None The out-of-box demo pre-programmed on the LaunchPad from the factory. Demonstrates features of
MSP430FR5994 MCU. Section 3.1
BlinkLED_FR5994 None Blinks an LED on the LaunchPad at a fixed interval. Section 3.2
BOOSTXL-AUDIO_
RecordPlayback_
MSP430FR5994
• MSP-
EXP430FR5994
• BOOSTXL-AUDIO
Demonstrates how to record and playback audio from
FRAM memory using DMA. Section 3.3
BOOSTXL-AUDIO_
LEA_MSP430FR5994
• MSP-
EXP40FR5994
• BOOSTXL-AUDIO
• 430BOOST-
SHARP96
Demonstrates the performance of the MSP low-energy
accelerator (LEA) by performing FFT and FIR. Section 3.4
EEPROM Emulation
TI Design • MSP-
EXP40FR5994 Emulates EEPROM using FRAM technology on MSP
supporting both I2C and SPI Section 3.5
To use any of the software examples with the LaunchPad kit, you must have an integrated development
environment (IDE) that supports the MSP430FR5994 MCU. Table 6 lists the minimum requirements for
IDEs.
Table 6. IDE Minimum Requirements for MSP-EXP430FR5994
Code Composer Studio™ IDE IAR Embedded Workbench® IDE
CCS v6.1.3 or later IAR Embedded Workbench for MSP430 v6.30 or later
For more details on how to get started quickly, and where to download the latest CCS and IAR IDEs, see
Section 4.
3.1 Out-of-Box Software Example
This section describes the functionality and structure of the out-of-box software that is preloaded on the
EVM.
3.1.1 Source File Structure
The project is organized in multiple files. This organization makes it easier to navigate and to reuse parts
of it for other projects. Table 7 describes each file in the project
Table 7. Source File and Folders
Name Description
main.c The out-of-box demo main function, initializations, shared ISRs, and more
LiveTempMode.c Contains functions for the live temperature streaming mode
FRAMLogMode.c Contains functions for the FRAM data logging mode
SDCardLogMode.c Contains function for the SD card data logging mode
Library: Driverlib Device driver library
Library: FatFs Generic FAT file system module for small embedded systems (FatFs)
HAL/HAL_SDCard.c Hardware abstraction layer for board/device to SD card connection
Library: SDCardLib Wrapper library to provide higher-level SD card APIs

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3.1.2 Out-of-Box Demo GUI
The out-of-box demo GUI (see Figure 12) is required to control the out-of-box application running on the
MSP-EXP430FR5994 LaunchPad development kit. The GUI can be found in the latest MSPWare
installation or in MSP-EXP430FR5994_Software_Examples.zip, available on the MSP-EXP430FR5994
Design File Download Page.
Figure 12. MSP-EXP430FR5994 Out-of-Box Demo GUI
Establish connection to the LaunchPad development kit by first clicking the Connect button, followed by
selecting the correct Serial COM Port (MSP Application UART1) and clicking the Open button. On
Windows, open Device Manager →Ports (COM & LPT) to verify the corresponding COM port of the
backchannel UART.
After connection has been established, the GUI pings the LaunchPad development kit every few seconds
to make sure that it is still present and to keep the serial port open. If no response is received from the
LaunchPad development kit, the GUI automatically closes the serial port connection.
3.1.3 Power Up and Idle
When the LaunchPad development kit powers up after being connected to a computer, the red and green
LEDs toggle several times to indicate that the out-of-box demo is running. The MSP430FR5994 then
enters low-power mode 3 to wait for UART commands from the PC GUI.
3.1.4 Live Temperature Mode
To enter the live temperature mode, click the Start button below Live Temp Mode in the GUI Application
Controls panel (see Figure 13).

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Figure 13. Live Temperature Mode
The MSP430FR5994 first sends two ADC calibration constants for the temperature sensor to the PC GUI.
It then sets up its 12-bit ADC for sampling and converting the signals from its internal temperature sensor.
A hardware timer is also configured to trigger the ADC conversion every 0.125 seconds before the device
enters low-power mode 3 to conserve power. As soon as the ADC sample and conversion is complete,
the raw ADC data is sent the through the UART backchannel to the PC GUI.
As the raw ADC data is received by the PC GUI, Celsius and Fahrenheit units are calculated first. The PC
GUI keeps a buffer of the most recent 100 temperature measurements, which are graphed against the
current time of the PC on the Incoming Data panel.
A red horizontal line is drawn across the data plot to indicate the moving average of the incoming data.
To exit this mode, click the Stop button under Live Temp Mode. You must exit this mode before starting
the other modes.
3.1.5 FRAM Log Mode
To enter the FRAM Log Mode, click the Start button under FRAM Log Mode in the GUI Application
Controls panel. The PC GUI also sends its current timestamp over UART to be stored in the LaunchPad
development kit. This timestamp is later used to extrapolate the X-axis time values when the FRAM
logged data are transferred to the GUI (see Figure 14).

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Figure 14. FRAM Log Mode
When the MSP430FR5994 receives the UART command from the GUI, it starts the entry sequence by
initializing the Real-Time Clock to trigger an interrupt every 5 seconds. The red LED blinks three times to
indicate successful entry into FRAM Log Mode.
The MSP430FR5994 wakes up every 5 seconds from low-power mode 3 to perform data logging before
going back to low-power mode 3. The GUI automatically disconnects from the LaunchPad development kit
after entering FRAM Log Mode. Each time the device wakes up, the green LED lights up to indicate a data
point is stored. Two 10000 long FRAM array buffers are allocated to store the raw ADC output data.
Because the device can be powered solely with the onboard Super Cap, the 12-bit ADC is set up to
sample and convert the signals from its internal temperature sensor and battery monitor (super cap
voltage).
The board allows powering the application with the USB cable or the onboard super cap. See
Section 2.3.3 for more detail on the super cap. To switch to the super cap:
1. While board is powered through USB, configure the jumper to Charge on J8. Wait 2 to 3 minutes.
2. Start FRAM Logging.
3. Switch the jumper on J8 to Use.
4. Disconnect the SBWTDIO and 3v3 jumpers on J101 (to prevent back powering the eZ-FET).
5. Disconnect the USB.
NOTE: Remove the SD card from the holder to reduce power consumption and extend application
run time when using the super cap.
To exit the FRAM Log Mode, press the S2 (right) push button on the LaunchPad development kit. The red
LED turns on briefly to indicate successful exit and return to the Power up and Idle state. Reattach the
jumpers to the default positions and connect USB. Re-open the serial port to the LaunchPad development
kit in the GUI. Click the Transfer FRAM Data button to transmit the logged temperature and voltage data
from the device FRAM to the PC.