Texas Instruments LaunchPad MSP430FR5994 User manual

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MSP430FR5994 LaunchPad™ Development Kit (MSP ‑ EXP430FR5994)
LaunchPad, BoosterPack, Code Composer Studio, MSP430, EnergyTrace++, EnergyTrace, E2E are trademarks of Texas Instruments.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
All other trademarks are the property of their respective owners.
User's Guide
SLAU678A–March 2016–Revised April 2016
MSP430FR5994 LaunchPad™ Development Kit
(MSP ‑‑ EXP430FR5994)
The MSP-EXP430FR5994 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) for
the MSP430FR5994 microcontroller (MCU). It contains everything needed to start developing on the ultra-
low-power MSP430FRx FRAM microcontroller platform, including onboard debug probe for programming,
debugging, and energy measurements. Figure 1 shows the development kit.
Figure 1. MSP-EXP430FR5994 LaunchPad Development Kit

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Contents
1 Getting Started............................................................................................................... 3
2 Hardware...................................................................................................................... 5
3 Software Examples ........................................................................................................ 16
4 Resources................................................................................................................... 25
5 FAQ .......................................................................................................................... 32
6 Schematics.................................................................................................................. 33
List of Figures
1 MSP-EXP430FR5994 LaunchPad Development Kit.................................................................... 1
2 MSP-EXP430FR5994 Overview........................................................................................... 5
3 MSP-EXP430FR5994 Block Diagram..................................................................................... 6
4 MSP430FR5994 Pinout..................................................................................................... 7
5 eZ-FET Debug Probe ....................................................................................................... 8
6 eZ-FET Isolation Jumper Block Diagram................................................................................ 10
7 Application Backchannel UART in Device Manager................................................................... 10
8 MSP-EXP430FR5994 Power Block Diagram........................................................................... 12
9 MSP-EXP430FR5994 Super Cap Power Block Diagram............................................................. 13
10 BoosterPack Plug-in Module Checker Tool............................................................................. 15
11 LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout.................................. 16
12 MSP-EXP430FR5994 Out-of-Box Demo GUI.......................................................................... 18
13 Live Temperature Mode................................................................................................... 19
14 FRAM Log Mode ........................................................................................................... 20
15 Record....................................................................................................................... 22
16 Playback..................................................................................................................... 23
17 Alternate Microphone Configuration ..................................................................................... 24
18 EEPROM SPI Interface Block Diagram ................................................................................. 25
19 EEPROM I2C Interface Block Diagram.................................................................................. 25
20 TI Resource Explorer Cloud .............................................................................................. 26
21 CCS Cloud .................................................................................................................. 27
22 Directing the Project>Import Function to the Demo Project .......................................................... 28
23 When CCS Has Found the Project ...................................................................................... 28
24 Using TI Resource Explorer to Browse MSP-EXP430FR5994 in MSPWare....................................... 30
25 Schematics (1 of 7) ........................................................................................................ 33
26 Schematics (2 of 7) ........................................................................................................ 34
27 Schematics (3 of 7) ........................................................................................................ 35
28 Schematics (4 of 7) ........................................................................................................ 36
29 Schematics (5 of 7) ........................................................................................................ 37
30 Schematics (6 of 7) ........................................................................................................ 38
31 Schematics (7 of 7) ........................................................................................................ 39

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1 Getting Started
1.1 Introduction
The MSP-EXP430FR5994 LaunchPad development kit is an easy-to-use evaluation module (EVM) for the
MSP430FR5994 microcontroller (MCU). The LaunchPad development kit contains everything needed to
start developing on the ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard
debug probe for programming, debugging and energy measurements. The board features onboard buttons
and LEDs for quick integration of a simple user interface, a microSD card port to interface with microSD
cards, and a super capacitor (super cap) to enable stand-alone applications without an external power
supply.
The MSP430FR5994 MCU features 256KB of embedded FRAM (Ferroelectric Random Access Memory),
a nonvolatile memory known for its ultra-low power, high endurance, and high speed write access. The
device also features 8 KB of SRAM, supports CPU speeds of up to 16 MHz and has integrated
peripherals for communication, ADC, timers, AES encryption, low-energy accelerator (LEA) (a new
hardware module for the FRAM family that is designed for fast, efficient, and low-power vector math), and
more–plenty to get you started in your development.
Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide
range of available BoosterPack modules. Quickly add features like wireless connectivity, graphical
displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or
choose among many already available from TI and third-party developers.
Free software development tools are also available, such as the TI Eclipse-based Code Composer
Studio™ IDE (CCS) and the IAR Embedded Workbench®for MSP430™ IDE (EW430). Both of these IDEs
support EnergyTrace++™ technology for real-time power profiling and debugging when paired with the
MSP430FR5994 LaunchPad kit.
1.2 Key Features
• MSP ULP FRAM technology based MSP430FR5994 16-bit MCU
• EnergyTrace++ Technology available for ultra-low-power debugging
• 40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
• Onboard eZ-FET debug probe
• Two buttons and two LEDs for user interaction
• Onboard microSD card
• Super capacitor (0.22 F)
1.3 What's Included
1.3.1 Kit Contents
• 1xMSP-EXP430FR5994 LaunchPad Development Kit
• 1xMicro USB cable
• 1xQuick start guide
1.3.2 Software Examples
• Out-of-box software
• Blink LED
• Audio BoosterPack plug-in module record and playback
• Low-energy accelerator for signal processing
• EEPROM emulation

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1.4 First Steps: Out-of-Box Experience
An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstrates
some key features from a user level.
1.4.1 Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
should illuminate. For proper operation, drivers are needed. TI recommends installing the drivers by
installing an IDE such as TI CCS or IAR EW430. Drivers are also available at ti.com/MSPdrivers.
1.4.2 Running the Out-of-Box Demo
When connected to the computer, the LaunchPad development kit powers up. Press and hold the S1 and
S2 buttons simultaneously to select a new mode. See Section 3.1 for a detailed explanation of each
mode.
1.4.2.1 Live Temperature Mode
This mode provides live temperature data streaming to the PC GUI. You can influence the temperature of
the device and see changes on the GUI.
1.4.2.2 FRAM Data Log Mode
This mode shows the FRAM data logging capabilities of the MSP430FR5994. After starting this mode, the
LaunchPad development kit wakes up every five seconds from sleep mode (indicated by LED blink) to log
both temperature and input voltage values. After reconnecting to the GUI, these values can be uploaded
and graphed in the GUI.
1.4.2.3 SD Card Data Log Mode
This mode shows the data logging capabilities of the MSP430FR5994 while interfacing with an SD card.
After starting this mode, the LaunchPad development kit wakes up every five seconds from sleep mode
(indicated by LED blink) to log both temperature and input voltage values. After reconnecting to the GUI,
these values can be uploaded and graphed in the GUI.
1.5 Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It's time to open an integrated
development environment and start editing the code examples. See Section 4 for available IDEs and
where to download them.
The quickest way to get started using the LaunchPad development kit is to use TI's Cloud Development
Tools. The cloud-based Resource Explorer provides access to all of the examples and resources in
MSPWare. Code Composer Studio Cloud is a simple cloud-based IDE that enables developing and
running applications on the LaunchPad development kit.
The out-of-box source code and more code examples are provided and available on the download page.
Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
Section 3 describes all functions in detail and provides a project structure to help familiarize you with the
code.
With the onboard eZ-FET debug probe debugging and downloading new code is simple. A USB
connection between the EVM and a PC through the provided USB cable is all that is needed.

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2 Hardware
Figure 2 shows an overview of the MSP-EXP430FR5994 hardware.
Figure 2. MSP-EXP430FR5994 Overview

Target device
MSP430FR5994
Crystal
32.768 kHz
Micro-B
USB
3.3-V
LDO
ESD
protection
Debug
MCU
LED
red, green
Crystal
4 MHz
UART, SBW to target
User interface
2 buttons, 2 LEDs
40-pin LaunchPad
standard headers
Power to target
Reset
button
Super capacitor
EnergyTrace
microSD Card
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2.1 Block Diagram
Figure 3 shows the block diagram.
Figure 3. MSP-EXP430FR5994 Block Diagram
2.2 Hardware Features
2.2.1 MSP430FR5994 MCU
The MSP430FR5994 is the next device in TI's new ULP FRAM technology platform. FRAM is a cutting-
edge memory technology that combines the best features of flash and RAM into one nonvolatile memory.
For more information on FRAM, see www.ti.com/fram.
Device features include:
• 1.8-V to 3.6-V operation
• 16-bit RISC architecture up to 16-MHz system clock and 8-MHz FRAM access
• 256KB of FRAM and 8KB of SRAM
• 16-channel 12-bit ADC
• 16-channel analog comparator
• Six 16-bit timers with seven capture/compare registers each
• 6-channel direct memory access (DMA)
• 128-bit or 256-bit AES
• 32-bit hardware multiplier (MPY)
• 68 GPIOs

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
DVSS3
22
DVCC2
23 24 25 26 27 28 29 30 31 32 33 34
P5.0/UCB1SIMO/UCB1SDA
35 36 37 38 39 40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61626364
DVCC1
65666768697071727374757677787980
P1.4/TB0.1/UCA0STE/A4/C4
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF-
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P3.0/A12/C12
P3.1/A13/C13
P3.2/A14/C14
P3.3/A15/C15
P1.3/TA1.2/UCB0STE/A3/C3
P1.5/TB0.2/UCA0CLK/A5/C5
P4.7
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6
PJ.1/TDI/TCLK/MCLK/SRSCG0/C7
PJ.2/TMS/ACLK/SROSCOFF/C8
PJ.3/TCK/SRCPUOFF/C9
P4.0/A8
P4.1/A9
P4.2/A10
P4.3/A11
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P2.6/TB0.1/UCA1RXD/UCA1SOMI
TEST/SBWTCK
RST/NMI/SBWTDIO
P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
P2.1/TB0.0/UCA0RXD/UCA0SOMI
P2.2/TB0.2/UCB0CLK
P3.4/TB0.3/SMCLK
P3.5/TB0.4/COUT
P3.6/TB0.5
P3.7/TB0.6
P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0
P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0
P4.4/TB0.5
P4.5
P4.6
DVSS1
P2.7 P2.3/TA0.0/UCA1STE/A6/C10
AVSS3
PJ.6/HFXIN PJ.7/HFXOUT
AVSS2
PJ.4/LFXIN PJ.5/LFXOUT
AVSS1 AVCC1
P2.4/TA1.0/UCA1CLK/A7/C11
DVSS2
P5.1/UCB1SOMI/UCB1SCL
P5.2/UCB1CLK/TA4CLK
P5.3/UCB1STE
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH P5.5/UCA2RXD/UCA2SOMI/ACLK P5.6/UCA2CLK/TA4.0/SMCLK P5.7/UCA2STE/TA4.1/MCLK
P8.0
P6.0/UCA3TXD/UCA3SIMO
P6.1/UCA3RXD/UCA3SOMI
P6.2/UCA3CLK
P6.3/UCA3STE
P8.1
DVCC3
P6.4/UCB3SIMO/UCB3SDA
P6.5/UCB3SOMI/UCB3SCL P6.6/UCB3CLK P6.7/UCB3STE
P8.2
P8.3
P7.0/UCB2SIMO/UCB2SDA
P7.2/UCB2CLK
P7.3/UCB2STE/TA4.1
P7.1/UCB2SOMI/UCB2SCL
P7.4//TA4.0/A16
P7.6/A18 P7.7/A19
P7.5/A17
MSP430FR59xxPN
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Figure 4 shows the pinout of the MSP430FR5994 MCU in the 80-pin PN package.
Figure 4. MSP430FR5994 Pinout

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2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace++ Technology
To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard
debug probe, which eliminates the need for expensive programmers. The MSP-EXP430FR5994 has the
eZ-FET debug probe (see Figure 5), which is a simple and low-cost debugger that supports all MSP430
device derivatives.
Figure 5. eZ-FET Debug Probe
The MSP-EXP430FR5994 LaunchPad development kit features full EnergyTrace++ technology. The
EnergyTrace™ functionality varies across the MSP portfolio (see Table 1).
Table 1. EnergyTrace Technology
Features EnergyTrace™ Technology EnergyTrace++™ Technology
Current Monitoring ✓ ✓
CPU State ✓
Peripheral and System State ✓
Devices Supported All MSP430 MCUs FR59 and FR69 MCUs
Development Tool Required MSP-FET or eZ-FET MSP-FET or eZ-FET
In Figure 5, the dotted line through J101 divides the eZ-FET debug probe from the target area. The
signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. For more
details on the isolation jumper block, see Section 2.2.3.
The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. For more details, see Section 2.2.4.
Details of the eZ-FET hardware can be found in the schematics in Section 6 and in the hardware design
files download page. The software and more information about the debugger can be found on the eZ-FET
wiki.

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2.2.3 Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 can connect or disconnect signals that cross from the eZ-FET
domain into the MSP430FR5994 target domain. This includes eZ-FET Spy-Bi-Wire signals, application
UART signals, and 3.3-V and 5-V power (see Table 2 and Figure 6).
Reasons to open these connections:
• To remove any and all influence from the eZ-FET debug probe for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other
than the onboard MCU.
Table 2. Isolation Block Connections
Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS in the eZ-FET domain
RXD << Backchannel UART: The target FR5994 receives data through this signal. The arrows indicate the direction of the
signal.
TXD >> Backchannel UART: The target FR5994 sends data through this signal. The arrows indicate the direction of the
signal.
SBW RST Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal.

eZ-FET Debug
Probe
Isolation
Jumper Block
Spy-Bi-Wire (SBW) Emulation
Application UART
3.3-V Power
5-V Power
Target MSP430 MCU
eZ-FETMSP430 Target
USB Connector
in out
LDO
BoosterPack Header
BoosterPack Header
USB
EnergyTrace
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Figure 6. eZ-FET Isolation Jumper Block Diagram
2.2.4 Application (or Backchannel) UART
The backchannel UART allows communication with the USB host that is not part of the target application's
main functionality. This is very useful during development, and also provides a communication channel to
the PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the
PC that communicate with the LaunchPad development kit.
Figure 6 shows the pathway of the backchannel UART. The backchannel UART is the UART on
eUSCI_A0. This UART channel is separate from the UART on the 40-pin BoosterPack plug-in module
connector (eUSCI_A3).
On the host side, a virtual COM port for the application backchannel UART is generated when the
LaunchPad development kit enumerates on the host. You can use any PC application that interfaces with
COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and
communicate with the target application. You need to identify the COM port for the backchannel. On
Windows PCs, Device Manager can assist (see Figure 7).
Figure 7. Application Backchannel UART in Device Manager