Texas Instruments TLK3134 XAUI Installation and user guide

TLK3134
4-Channel Multi-Rate Transceiver
Data Manual
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Literature Number: SLLS838F
May 2007–Revised December 2009

TLK3134
SLLS838F–MAY 2007–REVISED DECEMBER 2009 www.ti.com
Contents
1 Introduction ...................................................................................................................... 11
1.1 Features .................................................................................................................... 11
1.2 Applications ................................................................................................................ 11
1.3 Pin Out ...................................................................................................................... 12
1.4 Description ................................................................................................................. 12
2 Detailed Description .......................................................................................................... 14
2.1 Clocking Modes ............................................................................................................ 14
2.2 Operating Frequency Range ............................................................................................. 15
2.3 CPRI Latency Support .................................................................................................... 15
2.4 Powerdown Mode ......................................................................................................... 15
2.5 Application Examples ..................................................................................................... 15
2.6 Device Operation Modes ................................................................................................. 20
2.7 Parallel Interface Modes - Detailed Description ....................................................................... 21
2.7.1 XAUI/10GFC Mode ............................................................................................. 21
2.7.2 RGMII Mode (Reduced Gigabit Media Independent Interface) ........................................... 22
2.7.3 RTBI Mode (Reduced Ten Bit Interface) .................................................................... 23
2.7.4 TBI Mode (Ten Bit Interface) .................................................................................. 24
2.7.5 GMII Mode (Gigabit Media Independent Interface) ........................................................ 25
2.7.6 EBI Mode (Eight Bit Interface) ................................................................................ 26
2.7.7 REBI Mode (Reduced Eight Bit Interface) ................................................................... 27
2.7.8 NBI Mode (Nine Bit Interface Mode) ......................................................................... 28
2.7.9 RNBI Mode (Reduced Nine Bit Interface) ................................................................... 29
2.7.10 TBID Mode (Ten Bit Interface DDR) ......................................................................... 30
2.7.11 NBID Mode (Nine Bit Interface DDR) ........................................................................ 31
2.7.12 Parallel Interface Clocking Modes ............................................................................ 32
2.7.13 Parallel Interface Data ......................................................................................... 33
2.7.14 Transmission Latency .......................................................................................... 33
2.7.15 Channel Clock to Serial Transmit Clock Synchronization ................................................. 34
2.7.16 Data Reception Latency ....................................................................................... 34
2.7.17 8B/10B Encoder ................................................................................................ 34
2.7.18 Comma Detect and 8B/10B Decoding ....................................................................... 36
2.7.19 Channel Initialization and Synchronization .................................................................. 36
2.7.20 Channel State Descriptions: ................................................................................... 37
2.7.21 End of Packet Error Detection ................................................................................ 38
2.7.22 Fault Detection and Reporting ................................................................................ 38
2.7.23 Receive Synchronization and Skew Compensation ....................................................... 39
2.7.24 Column State Descriptions: ................................................................................... 40
2.7.25 Inter-Packet Gap Management ............................................................................... 41
2.7.26 Clock Tolerance Compensation (CTC) ...................................................................... 44
2.7.27 Parallel to Serial ................................................................................................ 45
2.7.28 Serial to Parallel ................................................................................................ 45
2.7.29 High Speed CML Output ....................................................................................... 45
2.7.30 High Speed Receiver .......................................................................................... 47
2.7.31 Loopback ........................................................................................................ 47
2Contents Copyright © 2007–2009, Texas Instruments Incorporated

TLK3134
www.ti.com SLLS838F–MAY 2007–REVISED DECEMBER 2009
2.7.32 Link Test Functions ............................................................................................. 47
2.7.33 MDIO Management Interface ................................................................................. 47
2.7.34 MDIO Protocol Timing ......................................................................................... 48
2.7.35 Clause 22 Indirect Addressing ................................................................................ 49
2.8 Programmers Reference ................................................................................................. 51
2.8.1 10G XAUI Programmers Reference (ST = 0) ............................................................... 51
2.9 1G Programmers Reference ............................................................................................. 62
2.10 Top Level Programmers Reference ..................................................................................... 68
3 Device Reset Requirements/Procedure ................................................................................ 91
3.1 XAUI MODE (XGMII) ...................................................................................................... 91
3.2 Gigabit Ethernet Mode (RGMII) ......................................................................................... 94
3.3 Jitter Test Pattern Generation and Verification Procedures ......................................................... 97
3.4 PRBS Test Generation and Verification Procedures ................................................................ 101
3.5 Signal Pin Description ................................................................................................... 104
4 Electrical Specifications ................................................................................................... 112
4.1 ABSOLUTE MAXIMUM RATINGS .................................................................................... 112
4.2 RECOMMENDED OPERATING CONDITIONS ..................................................................... 112
4.3 REFERENCE CLOCK TIMING REQUIREMENTS (REFCLKP/N) ................................................ 113
4.4 REFERENCE CLOCK ELECTRICAL CHARACTERISTICS (REFCLKP/N) ..................................... 113
4.5 SINGLE ENDED REFERENCE CLOCK ELECTRICAL CHARACTERISTICS (REFCLK) ..................... 113
4.6 JITTER CLEANER TIMING PARAMETERS ......................................................................... 113
4.7 LVCMOS ELECTRICAL CHARACTERISTICS ...................................................................... 114
4.8 MDIO ELECTRICAL CHARACTERISTICS ........................................................................... 114
4.9 HSTL SIGNALS (VDDQ = 1.5/1.8 V) ELECTRICAL CHARACTERISTICS ...................................... 114
4.10 SERIAL TRANSMITTER/RECEIVER CHARACTERISTICS ....................................................... 115
4.11 Parameter Measurement ................................................................................................ 116
4.12 HSTL Output Switching Characteristics (DDR Timing Mode Only) ............................................... 120
4.13 HSTL Output Switching Characteristics (SDR Timing Mode Only) ................................................ 121
4.14 HSTL (DDR Timing Mode Only) Input Timing Requirements ...................................................... 122
4.15 HSTL (SDR Timing Mode Only) Input Timing Requirements ...................................................... 123
4.16 MDIO Timing Requirements Over Recommended Operating Conditions ........................................ 124
4.17 JTAG Timing Requirements Over Recommended Operating Conditions ........................................ 125
4.18 Package Dissipation Rating ............................................................................................ 127
A APPENDIX A – Frequency Ranges Supported ..................................................................... 129
A.1 Recovered Byte Clock Jitter Cleaner Mode: ......................................................................... 144
B APPENDIX B – Jitter Cleaner PLL External Loop Filter ......................................................... 146
C APPENDIX C – Device Test Mode ....................................................................................... 147
Copyright © 2007–2009, Texas Instruments Incorporated Contents 3

TLK3134
SLLS838F–MAY 2007–REVISED DECEMBER 2009 www.ti.com
List of Figures
1-1 System Block Diagram – XAUI................................................................................................. 13
1-2 System Block Diagram – XAUI Backplane.................................................................................... 14
1-3 Block Diagram – TLK3134 Clocking Architecture............................................................................ 14
2-1 Quad 10-Bit SERDES Application ............................................................................................. 16
2-2 XAUI Mode – XAUI (Serial) Loopback Application........................................................................... 16
2-3 XAUI Mode - XGMII (Parallel ) Loopback Application....................................................................... 16
2-4 Custom Independent Configuration Application.............................................................................. 17
2-5 TLK3134 Block Diagram ........................................................................................................ 18
2-6 Detailed XAUI/1000Base-X Core Block Diagram ............................................................................ 19
2-7 Block Diagram of SERDES Core............................................................................................... 19
2-8 RGMII – Individual Channel Byte Ordering – Channel 0 Example ........................................................ 22
2-9 RTBI – Individual Channel Byte Ordering – Channel 0 Example.......................................................... 23
2-10 TBI – Individual Channel Byte Ordering – Channel 0 Example............................................................ 24
2-11 GMII – Individual Channel Byte Ordering – Channel 0 Example .......................................................... 25
2-12 EBI – Individual Channel Byte Ordering – Channel 0 Example............................................................ 26
2-13 REBI – Individual Channel Byte Ordering – Channel 0 Example.......................................................... 27
2-14 NBI – Individual Channel Byte Ordering – Channel 0 Example............................................................ 28
2-15 RNBI – Individual Channel Byte Ordering – Channel 0 Example.......................................................... 29
2-16 TBID – Individual Channel Byte Ordering – Channel 0 Example.......................................................... 30
2-17 NBID – Individual Channel Byte Ordering – Channel 0 Example.......................................................... 31
2-18 Receive Interface Timing – Source Centered/Aligned....................................................................... 32
2-19 Transmit Interface Timing....................................................................................................... 33
2-20 Transmission Latency ........................................................................................................... 34
2-21 Receiver Latency................................................................................................................. 34
2-22 Channel Synchronization State Machine...................................................................................... 37
2-23 End of Packet Error Detection.................................................................................................. 38
2-24 Column De-Skew State Machine............................................................................................... 39
2-25 Channel Deskew Using Alignment Code...................................................................................... 41
2-26 Inter-Packet Gap Management................................................................................................. 42
2-27 IPG Management State Machine .............................................................................................. 43
2-28 Clock Tolerance Compensation: Add.......................................................................................... 44
2-29 Clock Tolerance Compensation: Drop......................................................................................... 45
2-30 Example High Speed I/O AC Coupled Mode................................................................................. 46
2-31 Output differential voltage with 1-tap FIR de-emphasis..................................................................... 47
2-32 CL45 - Management Interface Extended Space Address Timing.......................................................... 48
2-33 CL45 – Management Interface Extended Space Write Timing............................................................. 48
2-34 CL45 – Management Interface Extended Space Read Timing ............................................................ 49
2-35 CL45 – Management Interface Extended Space Read And Increment Timing.......................................... 49
2-36 CL22 – Management Interface Read Timing................................................................................. 49
2-37 CL22 - Management Interface Write Timing.................................................................................. 49
2-38 CL22 – Indirect Address Method – Address Write........................................................................... 50
2-39 CL22 – Indirect Address Method – Data Write............................................................................... 50
2-40 CL22 – Indirect Address Method – Address Write........................................................................... 50
2-41 CL22 – Indirect Address Method – Data Read............................................................................... 50
3-1 Device Pinout Diagram – Part 1 (Top View) ................................................................................ 111
3-2 Device Pinout Diagram – Part 2 (Top View) ................................................................................ 111
4List of Figures Copyright © 2007–2009, Texas Instruments Incorporated

TLK3134
www.ti.com SLLS838F–MAY 2007–REVISED DECEMBER 2009
4-1 Transmit Output Waveform Parameter Definitions......................................................................... 116
4-2 Transmit Template.............................................................................................................. 117
4-3 Receive Template .............................................................................................................. 117
4-4 Input Jitter........................................................................................................................ 117
4-5 HSTL (DDR Timing Mode Only) Source Centered Output Timing Requirements ..................................... 120
4-6 HSTL (DDR Timing Mode Only) Source Aligned Output Timing Requirements........................................ 120
4-7 HSTL (SDR Timing Mode Only) Rising Edge Aligned Output Timing Requirements.................................. 121
4-8 HSTL (SDR Timing Mode Only) Falling Edge Aligned Output Timing Requirements ................................. 121
4-9 HSTL (DDR Timing Mode Only) Source Centered Data Input Timing Requirements................................. 122
4-10 HSTL (DDR Timing Mode Only) Source Aligned Data Input Timing Requirements ................................... 122
4-11 HSTL (SDR Timing Mode Only) Falling Edge Aligned (Rising Edge Sampled) Data Input Timing
Requirements ................................................................................................................... 123
4-12 HSTL (SDR Timing Mode Only) Rising Edge Aligned (Falling Edge Sampled) Data Input Timing
Requirements ................................................................................................................... 123
4-13 MDIO Read/Write Timing...................................................................................................... 124
4-14 HSTL I/O Schematic............................................................................................................ 124
4-15 JTAG Timing .................................................................................................................... 126
4-16 TLK3134 Application Mode vs Interface Timing Mode Support .......................................................... 127
4-17 PACKAGE Information (Package Designator = ZEL)...................................................................... 127
4-18 Worst Case Device Power Dissipation....................................................................................... 128
A-1 Reference Clock Selection – XAUI – 10 GbE Mode....................................................................... 130
A-2 Reference Clock Selection – 10 Gigabit Fibre Channel Mode............................................................ 130
A-3 Reference Clock Selection – Gigabit Ethernet Mode ...................................................................... 131
A-4 Reference Clock Selection – 1X/2X Fibre Channel Mode................................................................. 131
A-5 Reference Clock Selection – OBSAI Mode ................................................................................. 132
A-6 Reference Clock Selection – CPRI Mode ................................................................................... 132
A-7 Reference Clock Selection – 9/10 Bit SERDES Mode – Full Rate (SPEED[1:0] == 00).............................. 133
A-8 Reference Clock Selection – 9/10 Bit SERDES Mode – Half Rate (SPEED[1:0] == 01) ............................. 133
A-9 Reference Clock Selection –9/10 Bit SERDES Mode – Quarter Rate (SPEED[1:0] == 10).......................... 134
A-10 Reference Clock Selection – 8 Bit SERDES Mode – Full Rate (SPEED[1:0] == 00).................................. 134
A-11 Reference Clock Selection – 8 Bit SERDES Mode – Half Rate (SPEED[1:0] == 01) ................................. 135
A-12 Reference Clock Selection – 8 Bit SERDES Mode – Quarter Rate (SPEED[1:0] == 10)............................. 136
A-13 Standard Based Jitter Cleaner/SERDES Provisioning..................................................................... 137
A-14 9/10 BIT SERDES Mode – Jitter Cleaner/SERDES (2x) Provisioning................................................... 138
A-15 9/10 BIT SERDES Mode – Jitter Cleaner/SERDES (1x) Provisioning................................................... 139
A-16 9/10 BIT SERDES Mode – Jitter Cleaner/SERDES (0.5x) Provisioning ................................................ 140
A-17 9/10 BIT SERDES Mode – Jitter Cleaner/SERDES (0.25x) Provisioning............................................... 141
A-18 8 BIT SERDES Mode – Jitter Cleaner/SERDES (2x) Provisioning ..................................................... 142
A-20 8 BIT SERDES Mode – Jitter Cleaner/SERDES (0.5x) Provisioning.................................................... 144
A-21 Recovered Byte Clock Jitter Cleaner Mode................................................................................. 145
B-1 Jitter Cleaner External Loop Filter............................................................................................ 146
Copyright © 2007–2009, Texas Instruments Incorporated List of Figures 5

TLK3134
SLLS838F–MAY 2007–REVISED DECEMBER 2009 www.ti.com
List of Tables
2-1 Supported Protocol Rates and REFCLK Values............................................................................. 15
2-2 Device Operation Modes........................................................................................................ 20
2-3 XAUI – Lane To Functional Pin Mapping (XAUI_ORDER = 1) ............................................................ 21
2-4 10GFC – Lane To Functional Pin Mapping (XAUI_ORDER = 0).......................................................... 21
2-5 RGMII – Lane To Functional Pin Mapping.................................................................................... 22
2-6 RTBI – Lane To Functional Pin Mapping ..................................................................................... 23
2-7 TBI – Lane To Functional Pin Mapping ....................................................................................... 24
2-8 GMII – Lane To Functional Pin Mapping...................................................................................... 25
2-9 EBI – Lane To Functional Pin Mapping ....................................................................................... 26
2-10 REBI – Lane To Functional Pin Mapping ..................................................................................... 27
2-11 NBI – Lane To Functional Pin Mapping ....................................................................................... 28
2-12 RNBI – Lane To Functional Pin Mapping ..................................................................................... 29
2-13 TBID – Lane To Functional Pin Mapping ..................................................................................... 30
2-14 NBID – Lane To Functional Pin Mapping ..................................................................................... 31
2-15 Valid K-Codes .................................................................................................................... 35
2-16 Valid XGMII Channel Encodings............................................................................................... 35
2-17 Receive Data Controls........................................................................................................... 36
2-18 IPG Management State Machine Notation.................................................................................... 43
2-19 XS_CONTROL_1 ................................................................................................................ 51
2-20 XS_STATUS_1................................................................................................................... 51
2-21 XS_DEVICE_IDENTIFIER_1 ................................................................................................... 51
2-22 XS_DEVICE_IDENTIFIER_2 ................................................................................................... 51
2-23 XS_SPEED_ABILITY............................................................................................................ 52
2-24 XS_DEVICES_IN_PACKAGE_1 ............................................................................................... 52
2-25 XS_DEVICES_IN_PACKAGE_2 ............................................................................................... 52
2-26 XS_STATUS_2................................................................................................................... 52
2-27 XS_PACKAGE_IDENTIFIER_1 ................................................................................................ 52
2-28 XS_PACKAGE_IDENTIFIER_2 ................................................................................................ 53
2-29 XS_LANE_STATUS.............................................................................................................. 53
2-30 XS_TEST_CONTROL ........................................................................................................... 53
2-31 TEST_CONFIG................................................................................................................... 53
2-32 TEST_VERIFICATION_CONTROL............................................................................................ 53
2-33 TX_FIFO_STATUS............................................................................................................... 54
2-34 TX_FIFO_DROP_COUNT ...................................................................................................... 54
2-35 TX_FIFO_INSERT_COUNT .................................................................................................... 54
2-36 TX_CODEGEN_STATUS....................................................................................................... 54
2-37 LANE_0_TEST_ERROR_COUNT............................................................................................. 54
2-38 LANE_1_ TEST_ERROR_COUNT ............................................................................................ 55
2-39 LANE_2_ TEST_ERROR_COUNT ............................................................................................ 55
2-40 LANE_3_ TEST_ERROR_COUNT ............................................................................................ 55
2-41 10GFCCJPAT_CRPAT_CJPAT_TEST_ERROR_COUNT_1 ............................................................. 55
2-42 10GFCCJPAT_CRPAT_CJPAT_TEST_ERROR_COUNT_2 ............................................................. 55
2-43 LANE_0_EOP_ERROR_COUNT ............................................................................................. 55
2-44 LANE_1_EOP_ERROR_COUNT ............................................................................................. 56
2-45 LANE_2_EOP_ERROR_COUNT ............................................................................................. 56
2-46 LANE_3_EOP_ERROR_COUNT ............................................................................................. 56
6List of Tables Copyright © 2007–2009, Texas Instruments Incorporated

TLK3134
www.ti.com SLLS838F–MAY 2007–REVISED DECEMBER 2009
2-47 LANE_0_CODE_ERROR_COUNT ........................................................................................... 56
2-48 LANE_1_CODE_ERROR_COUNT ........................................................................................... 56
2-49 LANE_2_CODE_ERROR_COUNT ........................................................................................... 57
2-50 LANE_3_CODE_ERROR_COUNT ........................................................................................... 57
2-51 RX_CHANNEL_SYNC_STATE ................................................................................................ 57
2-52 RX_LANE_ALIGN_STATUS.................................................................................................... 57
2-53 RX_CHANNEL_SYNC_STATUS............................................................................................... 57
2-54 BIT_ORDER ...................................................................................................................... 57
2-55 LOOPBACK_CONTROL ....................................................................................................... 58
2-56 TX_MODE_CONTROL.......................................................................................................... 58
2-57 RX_CTC_STATUS............................................................................................................... 58
2-58 RX_CTC_INSERT_COUNT..................................................................................................... 58
2-59 RX_CTC_DELETE_COUNT.................................................................................................... 59
2-60 DATA_DOWN..................................................................................................................... 59
2-61 RX_MODE_CONTROL.......................................................................................................... 59
2-62 CLOCK_DOWN_STATUS ...................................................................................................... 59
2-63 DATAPATH_RESET_CONTROL .............................................................................................. 59
2-64 TEST_PATTERN_STATUS..................................................................................................... 60
2-65 LANE_0_ERROR_CODE ....................................................................................................... 60
2-66 LANE_1_ERROR_CODE ....................................................................................................... 60
2-67 LANE_2_ERROR_CODE ....................................................................................................... 60
2-68 LANE_3_ERROR_CODE ....................................................................................................... 60
2-69 RX_PHASE_SHIFT_CONTROL ............................................................................................... 60
2-70 CHANNEL_SYNC_CONTROL ................................................................................................. 61
2-71 XGMII_IO_MODE_CONTROL.................................................................................................. 61
2-72 10G_MODE_CONTROL ........................................................................................................ 61
2-73 RX_CLK_OUTPUT_CONTROL................................................................................................ 61
2-74 PHY_CONTROL_1............................................................................................................... 62
2-75 PHY_STATUS_1 ................................................................................................................. 63
2-76 PHY_IDENTIFIER_1............................................................................................................. 63
2-77 PHY_IDENTIFIER_2............................................................................................................. 63
2-78 PHY_EXT_STATUS ............................................................................................................. 63
2-79 PHY_CH_CONTROL_1 ......................................................................................................... 64
2-80 PHY_CH_CONTROL_2 ......................................................................................................... 64
2-81 PHY_RX_CTC_FIFO_STATUS ................................................................................................ 66
2-82 PHY_TX_CTC_FIFO_STATUS ................................................................................................ 66
2-83 PHY_TX_WIDE_FIFO _STATUS .............................................................................................. 66
2-84 PHY_TEST_PATTERN_SYNC_STATUS..................................................................................... 66
2-85 PHY_TEST_PATTERN_COUNTER........................................................................................... 66
2-86 PHY_CRPAT_PATTERN_COUNTER_1 ..................................................................................... 66
2-87 PHY_CRPAT_PATTERN_COUNTER_2 ..................................................................................... 67
2-88 PHY_TEST_MODE_CONTROL................................................................................................ 67
2-89 PHY_CHANNEL_STATUS...................................................................................................... 67
2-90 PHY_PRBS_HIGH_SPEED_TEST_COUNTER ............................................................................. 67
2-91 PHY_EXT_ADDRESS_CONTROL ........................................................................................... 67
2-92 PHY_EXT_ADDRESS_DATA ................................................................................................. 67
2-93 SERDES_PLL_CONFIG ........................................................................................................ 68
2-94 PLL Multiplier Control............................................................................................................ 68
Copyright © 2007–2009, Texas Instruments Incorporated List of Tables 7

TLK3134
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2-95 SERDES_RATE_CONFIG_TX_RX ........................................................................................... 68
2-96 SERDES_RX0_CONFIG ....................................................................................................... 70
2-97 SERDES_RX1_CONFIG ....................................................................................................... 70
2-98 SERDES_RX2_CONFIG ....................................................................................................... 71
2-99 SERDES_RX3_CONFIG ....................................................................................................... 71
2-100 SERDES_TX0_CONFIG ....................................................................................................... 72
2-101 SERDES_TX1_CONFIG ....................................................................................................... 72
2-102 SERDES_TX2_CONFIG ....................................................................................................... 73
2-103 SERDES_TX3_CONFIG ....................................................................................................... 73
2-104 Transmit De-emphasis Control................................................................................................. 74
2-105 Output Swing Control............................................................................................................ 74
2-106 SERDES_TEST_CONFIG_TX ................................................................................................. 74
2-107 SERDES_TEST_CONFIG_RX ................................................................................................ 76
2-108 SERDES_RX0_STATUS ....................................................................................................... 76
2-109 SERDES_RX1_STATUS ....................................................................................................... 76
2-110 SERDES_RX2_STATUS ....................................................................................................... 77
2-111 SERDES_RX3_STATUS ....................................................................................................... 77
2-112 SERDES_TX0_STATUS ....................................................................................................... 77
2-113 SERDES_TX1_STATUS ....................................................................................................... 77
2-114 SERDES_TX2_STATUS ....................................................................................................... 77
2-115 SERDES_TX3_STATUS ....................................................................................................... 78
2-116 SERDES_PLL_STATUS ........................................................................................................ 78
2-117 JC_CLOCK_MUX_CONTROL.................................................................................................. 78
2-118 JC_VTP_CLK_DIV_CONTROL ................................................................................................ 79
2-119 JC_DELAY_STOPWATCH_CLK_DIV_CONTROL.......................................................................... 79
2-120 JC_DELAY_STOPWATCH_COUNTER....................................................................................... 79
2-121 JC_REFCLK_FB_DIV_CONTROL............................................................................................. 79
2-122 JC_RXB_OUTPUT_CLK_DIV_CONTROL ................................................................................... 80
2-123 JC_CHARGE_PUMP_ CONTROL ............................................................................................ 80
2-124 Charge Pump Control Setting (CP_CTRL) ................................................................................... 80
2-125 JC_PLL_CONTROL.............................................................................................................. 81
2-126 JC_TEST_CONTROL_1 ........................................................................................................ 81
2-127 JC_TEST_CONTROL_2 ........................................................................................................ 81
2-128 JC_TI_TEST_CONTROL_1..................................................................................................... 81
2-129 JC_TI_TEST_CONTROL_2..................................................................................................... 82
2-130 JC_TRIM_STATUS .............................................................................................................. 82
2-131 DIE_ID_7.......................................................................................................................... 82
2-132 DIE_ID_6.......................................................................................................................... 82
2-133 DIE_ID_5.......................................................................................................................... 82
2-134 DIE_ID_4.......................................................................................................................... 82
2-135 DIE_ID_3.......................................................................................................................... 82
2-136 DIE_ID_2.......................................................................................................................... 82
2-137 DIE_ID_1.......................................................................................................................... 83
2-138 DIE_ID_0.......................................................................................................................... 83
2-139 EFUSE_STATUS................................................................................................................. 83
2-140 EFUSE_CONTROL .............................................................................................................. 83
2-141 HSTL_INPUT_TERMINATION_CONTROL................................................................................... 83
2-142 HSTL_OUTPUT_SLEWRATE_CONTROL ................................................................................... 84
8List of Tables Copyright © 2007–2009, Texas Instruments Incorporated

TLK3134
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2-143 HSTL_INPUT_VTP_CONTROL................................................................................................ 84
2-144 HSTL_OUTPUT_VTP_CONTROL............................................................................................. 85
2-145 HSTL_GLOBAL_CONTROL.................................................................................................... 85
2-146 TX0_DLL_CONTROL............................................................................................................ 86
2-147 TX1_DLL_CONTROL............................................................................................................ 86
2-148 TX2_DLL_CONTROL............................................................................................................ 86
2-149 TX3_DLL_CONTROL............................................................................................................ 86
2-150 RX0_DLL_CONTROL ........................................................................................................... 87
2-151 RX1_DLL_CONTROL ........................................................................................................... 87
2-152 RX2_DLL_CONTROL ........................................................................................................... 87
2-153 RX3_DLL_CONTROL ........................................................................................................... 87
2-154 DLL Offset Control ............................................................................................................... 87
2-155 TX0_DLL_STATUS .............................................................................................................. 88
2-156 TX1_DLL_STATUS .............................................................................................................. 88
2-157 TX2_DLL_STATUS .............................................................................................................. 88
2-158 TX3_DLL_STATUS .............................................................................................................. 88
2-159 RX0_DLL_STATUS.............................................................................................................. 88
2-160 RX1_DLL_STATUS.............................................................................................................. 88
2-161 RX2_DLL_STATUS.............................................................................................................. 88
2-162 RX3_DLL_STATUS.............................................................................................................. 89
2-163 CH0_TESTFAIL_ERR_COUNTER ............................................................................................ 89
2-164 CH1_TESTFAIL_ERR_COUNTER ............................................................................................ 89
2-165 CH2_TESTFAIL_ERR_COUNTER ............................................................................................ 89
2-166 CH3_TESTFAIL_ERR_COUNTER ............................................................................................ 89
2-167 STCI_CONTROL_STATUS..................................................................................................... 89
2-168 TESTCLK_CONTROL........................................................................................................... 90
2-169 BIDI_CMOS_CONTROL ........................................................................................................ 90
2-170 DEBUG_CONTROL.............................................................................................................. 90
2-171 DUTY_CYCLE_CONTROL ..................................................................................................... 90
3-1 Global Signals................................................................................................................... 104
3-2 JTAG Signals.................................................................................................................... 105
3-3 MDIO Related Signals ......................................................................................................... 105
3-4 Parallel Data Pins............................................................................................................... 106
3-5 Serial Side Data/Clock Pins ................................................................................................... 108
3-6 Miscellaneous Pins ............................................................................................................. 108
3-7 Voltage Supply and Reference Pins ......................................................................................... 109
3-8 Jitter Cleaner Related Pins.................................................................................................... 110
4-1 XAUI Driver Template Parameters ........................................................................................... 116
4-2 Parallel Interface – Valid Signal Operational Mode Definitions........................................................... 118
C-1 Device Mode Configuration.................................................................................................... 147
C-2 Device Test Mode Pin Configuration......................................................................................... 147
Copyright © 2007–2009, Texas Instruments Incorporated List of Tables 9

TLK3134
SLLS838F–MAY 2007–REVISED DECEMBER 2009 www.ti.com
10 List of Tables Copyright © 2007–2009, Texas Instruments Incorporated

TLK3134
www.ti.com SLLS838F–MAY 2007–REVISED DECEMBER 2009
4-Channel Multi-Rate Transceiver
Check for Samples: TLK3134
1 Introduction
1.1 Features
1
• Four-Channel 600Mbps to 3.75Gbps Multi-Rate • XGMII/GMII/RGMII: Source And Data Centered
Transceiver I/O Timing Modes
• Supports 10GbE (XAUI), 1X/2X/10X Fibre • Supports Jumbo Packet (9600 byte maximum)
Channel (FC), CPRI (x1/x2/x4), OBSAI Operation.
(x1/x2/x4), and 1GbE (1000Base-X) Data Rates • XAUI Align Character Skew Support of 30 Bit
• Complete IEEE Compliant 10 GbE XGXS (XAUI) Times at Chip Pins
Compliant Core and 1000Base-X PCS Support • MDIO: IEEE 802.3ae Clause 22 and Clause 45
• Supports Independent Channel SERDES Compliant Management Data Input / Output
Operation Modes in 8/10 Bit Data Modes (TBI Interface Modes (Either 1.2 V or 2.5 V MDIO I/O)
and 8 Bit + Control) • 1.2 V Core, 1.5 V/1.8 V HSTL I/O Supply, and 2.5
• Serial Side Transmit De-Emphasis and Receive V LVCMOS I/O Supply
Adaptive Equalization to Allow Extended • JTAG: IEEE 1149.1/1149.6 Test Interface
Backplane Reach • ±200 ppm Clock Tolerance in XAUI TX and
• Low Jitter LC Oscillator Jitter-Cleaner Allows 1000Base-X/XAUI RX Datapaths
use of Poor Quality REFCLK • 90 nm Advanced CMOS Technology
• Full Datapath Loopback Capability • Package: PBGA, 19×19mm, 289 Ball, 1mm Pitch
(Serial/Parallel Side) • 1.3W Maximum Power Dissipation (1.5 V HSTL
• Support PRBS 27-1 and 223 - 1 Gen/Verify. XAUI Mode, Input HSTL Termination Disabled)
Support standard defined CJPAT, CRPAT, High • Asymmetric RX/TX Rates Supported in
and Low Frequency, and Mixed Freq Testing. Independent Channel Modes
• XGMII/GMII/RGMII: HSTL Class 1 I/O With • Industrial Ambient Operating Temperature
On-Chip 50ΩTermination on Inputs/Outputs (–40°C to 85°C) at Full Rate
(1.5/1.8 V Power Supply)
1.2 Applications
• Gigabit Ethernet links
• CPRI/OBSAI Links
• Point-to-Point High-Speed Backplane Links
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2007–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

TLK3134
4
4
TDP/N[3:0]
RDP/N[3:0]
TD(31..0)
TCLK(3:0)
TC(7..0)
RCLK(3:0)
RD(31..0)
RC(7..0)
(R)GMII/XGMII
XAUI/Serial I/F
TLK3134
SLLS838F–MAY 2007–REVISED DECEMBER 2009 www.ti.com
1.3 Pin Out
1.4 Description
The TLK3134 is a flexible four-channel independently configurable serial transceiver. It can be configured
to be compliant with the 10Gbps Ethernet XAUI specification. It can also be configured to be compliant
with the 1000Base-X 1Gbps Ethernet Specification (Auto-Negotiation not supported). The TLK3134
provides high-speed bidirectional point-to-point data transmissions with up to 30 Gbps of raw data
transmission capacity. The primary application of this device is in backplanes and front panel connections
requiring 10Gbps connections over controlled impedance media of approximately 50Ω. The transmission
media can be printed circuit board (PCB) traces, copper cables or fiber-optical media. The ultimate rate
and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise
coupling into the lines.
The TLK3134 performs the parallel-to-serial, serial-to-parallel conversion, and clock extraction functions
for a physical layer interface. The TLK3134 provides a complete XGXS/PCS function defined in Clause
47/48 of the IEEE 802.3ae 10Gbps Ethernet standard. The TLK3134 also provides 1000Base-X (PCS)
layer functionality described in Clause 36 of 802.3-2002. The serial transmitter is implemented using
differential Current Mode Logic (CML) with integrated termination resistors.
The TLK3134 can be optionally configured as a XAUI or 10GFC transceiver. TLK3134 supports a 32-bit
data path, 4-bit control, 10 Gigabit Media Independent Interface (XGMII) to the protocol device. Figure 1-1
shows an example system block diagram for TLK3134 used to provide the 10Gbps Ethernet Physical
Coding Sublayer to Coarse Wave-length Division Multiplexed optical transceiver or parallel optics.
Many common applications may be enabled by way of externally available control pins. Detailed control of
the TLK3134 on a per channel basis is available by way of accessing a register space of control bits
available through a two-wire access port called the Management Data Input/Output (MDIO) interface.
The PCS (Physical Coding Sublayer) functions such as the CTC FIFO are designed to be compliant for an
IEEE 802.3 XAUI or 1000Base-X PCS link. However, each of the PCS functions may be disabled or
bypassed until the TLK3134 is operating at its most basic state, that of a simple four channel 10-bit
SERDES suitable for a wide range of applications such as CPRI or OBSAI wireless infrastructure links.
The differential output swing for the TLK3134 is suitable for compliance with IEEE 802.3 XAUI links, which
is also suitable for CPRI LV serial links. The TLK3134 provides for setting larger output signal swing
suitable for CPRI HV links by setting an appropriate register bit available though MDIO.
12 Introduction Copyright © 2007–2009, Texas Instruments Incorporated
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TLK3134TLK3134
TD(31:0)
TCLK
RCLK
RD(31:0)
Line Card
4
4
4
4
TC(3:0)
RC(3:0)
XAUI Backplane
XAUI
XGMI RX
A
XGMI TX
A
MAC/
Packet
Processor
XAUI
CWDM or
Parallel
Optics
Line Card
4
4
4
4
TLK3134
TD(31:0)
RD(31:0)
TCLK
RCLK
RDP/N[3:0]
TDP/N[3:0]
TC(3:0)
TLK3134
TD(31:0)
RD(31:0)
TCLK
RCLK
RDP/N[3:0]
TDP/N[3:0]
TC(3:0)
RC(3:0)
RC(3:0)
MAC/
PACKET
PROCESSOR
FRAMER/
PCS
PHY/
OPTICS
System Backplane
SWITCH
FABRIC
TLK3134
www.ti.com SLLS838F–MAY 2007–REVISED DECEMBER 2009
Figure 1-1. System Block Diagram – XAUI
Figure 1-2 shows an example system block diagram for TLK3134 used to provide the system backplane
interconnect.
Figure 1-2. System Block Diagram – XAUI Backplane
Copyright © 2007–2009, Texas Instruments Incorporated Introduction 13
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REFCLK_P
REFCLK_N
REFCLK
RXBCLK[0]
REF_SEL[1:0]
REFCLK
Divider
REF_DIV[6:0]
PLL
Feedback
Divider
FB_DIV[6:0]
First PLL Output
Divider
RXTX_DIV[6:0]
Jitter Cleaner
PLL Core
Second PLL
Output
Divider
RXB_DIV[6:0]
TX_SEL[1:0]
RX_SEL[1:0]
REFCLK_TX
REFCLK_RX
Third PLL
Output
Divider
DEL_DIV[6:0]
DELAY_CLK
DEL_SEL[1:0]
RXB_SEL[1:0]
RXBYTE_CLK
00
01
1X
00
01
10
11
00
01
10
11
00
01
10
11
00
01
10
11
(2.875 Ghz Min., 3 Ghz Typ., 3.125 Ghz Max.)
Fourth PLL
Output
Divider
HSTL_DIV1[6:0]
HSTL_2X_CLK
HSTL_SEL[1:0]
00
01
10
11
SERDES TX
SERDES RX
TX3P/N
TX2P/N
TX1P/N
TX0P/N
RX3P/N
RX2P/N
RX1P/N
RX0P/N
PLL
P2S
P2S
P2S
P2S
PLL
S2P
S2P
S2P
S2P
Note: Default Mux Selects Are Underlined.
HSTL Output
Divider
HSTL_DIV2[6:0]
TLK3134
SLLS838F–MAY 2007–REVISED DECEMBER 2009 www.ti.com
Figure 1-3. Block Diagram – TLK3134 Clocking Architecture
2 Detailed Description
2.1 Clocking Modes
The TLK3134 contains an internal low-bandwidth, low-jitter high quality LC oscillator that may be
configured as a jitter cleaner. The jitter cleaner oscillator has a high frequency narrow band of operation
that may be used to generate all common reference clock frequencies by way of programmable pre-scaler
and post-scaler registers. In this manner a poor quality input reference clock can be input to the jitter
cleaner which will lock to the reference clock and provide a clean reference to the internal SERDES PLLs.
Appendix A defines in detail the clocking possibilities, and device settings.
Alternatively, the jitter cleaner may be used to lock to a recovered byte clock from RX channel 0 and
remove jitter that may have transferred through the clock/data recovery circuit from the serial data stream
to the recovered byte clock (including parallel output data timing). In this way the recovered byte clock
may be extracted from the serial data stream yet be suitable for use in applications that require a clean
clock source derived from the serial data stream. The TLK3134 jitter cleaner may only be used on the
recovered byte clock from Channel 0. If the jitter cleaner is used to clean the recovered byte clock, it may
not be used to clean the input reference clock, and the PLL at the center of the deserializer core must
have a clean low-jitter reference clock from an external clock source, preferably a low-jitter crystal based
oscillator. Note that the Transmit SERDES macro can run from the cleaned recovered RX channel 0 byte
clock which allows for the outgoing TX serial data rate for all channels to exactly match the incoming data
rate of RX Channel 0.
The TLK3134 clocking architecture allows for bypass of the Jitter cleaner PLL in cases where power or
application board area is critical.
See Figure 1-3 Clocking Architecture for a representation of the use of the jitter cleaner in the TLK3134.
14 Detailed Description Copyright © 2007–2009, Texas Instruments Incorporated
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TLK3134
www.ti.com SLLS838F–MAY 2007–REVISED DECEMBER 2009
2.2 Operating Frequency Range
The TLK3134 is optimized for operation at a serial data rate of 600 Mbit/s through 3.75 Gbit/s. The
external differential (optionally single-ended) reference clock has a large operating frequency range
allowing support for many different applications. The reference clock frequency must be within ±200 PPM
of the incoming serial data rate, and have less than 40ps of jitter. Table 2-1 shows a summary of
frequency ranges supported. For more details, see Appendix A. In all applications except XAUI/10GFC,
the transmit parallel clock must be frequency locked (0 ppm) to the supplied REFCLK frequency
(XAUI/10GFC allows ±200 ppm).
Table 2-1. Supported Protocol Rates and REFCLK Values
PROTOCOL Refclk (MHz) LINE RATE (Gbps)
XAUI – 10G Ethernet 78.125/156.25/312.5 3.125
10 Gigabit Fibre Channel 79.6875/159.375/ 318.75 3.1875
1G Ethernet 62.5/125/250 1.25
2.125
1X/2X Fibre Channel 53.125/106.25/212.5 1.0625
3.072
OBSAI 76.8/153.6/307.2 1.536
0.768
2.4576
CPRI 61.44/122.88/245.76 1.2288
0.6144
Generic TBI 50 →375 MHz 0.600 →3.75
Generic RTBI 50 →375 MHz 0.600 →1.6
Generic NBID/TBID 50 →375 MHz 0.600 →3.2
2.3 CPRI Latency Support
The TLK3134 has a round trip latency measurement capability to support its use in CPRI applications.
When enabled, the TLK3134 will measure the elapsed time from the transmission of a K28.5 code in a
CPRI frame until the reception of a K28.5 code in the receive path. This measurement result may be read
through an MDIO readable register. The measurement has an accuracy of ±4 ns with the Jitter Cleaner
PLL enabled, and an accuracy of ±2 parallel byte clock periods if the Jitter Cleaner PLL is disabled.
2.4 Powerdown Mode
The TLK3134 (through the ENABLE pin and through register control) is capable of going into a low power
quiescent state. In this state, all analog and digital circuitry is disabled.
2.5 Application Examples
TLK3134 supports many different application modes. Detailed register settings per application mode are
shown in Table 2-2. The following application diagrams do not show all possible applications, and are
intended only to illustrate the flexibility of the device.
Figure 2-1 shows the TLK3134 in a Quad independent channel SERDES Application. The 1000Base-X
PCS layer can be enabled or disabled. Note that in independent channel mode, the 8B/10B
encoder/decoder functions can either be turned on or turned off. When turned off, either 5 or 10 bits
(DDR/SDR) of data is accepted from and presented to the parallel side. When the 8B/10B
encoder/decoder functions are enabled, 1 bit of control and 8 bits of data are accepted from and
presented to the parallel side using the standardized (R)GMII control characters.
Copyright © 2007–2009, Texas Instruments Incorporated Detailed Description 15
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XGMII
10 1
10 1
10 1
10 1
10 1
10 1
10 1
10 1
XAUI
TLK3134
TLK3134
XGXS CORE
36
4
4
XGMII
XAUI
TLK3134
XGXS CORE A
36
4
XGMII
XAUI
TLK3134
SLLS838F–MAY 2007–REVISED DECEMBER 2009 www.ti.com
Figure 2-1. Quad 10-Bit SERDES Application
Figure 2-2 shows the TLK3134 in a XAUI Loopback Application. It is possible to configure XAUI side
loopback in SERDES mode for all 4 channels on an individual basis.
Figure 2-2. XAUI Mode – XAUI (Serial) Loopback Application
Figure 2-3 shows the TLK3134 in a XGMII Loopback Application. It is possible to configure XGMII side
loopback in SERDES mode for all 4 channels on an individual basis.
Figure 2-3. XAUI Mode - XGMII (Parallel ) Loopback Application
Figure 2-4 shows the TLK3134 in a custom application example with mixed modes per Channel.
• Channel 1 in Parallel independent loopback mode
• Channel 3 in Serial independent loopback mode
• Channel 0 & 2 in independent channel transceiver mode
16 Detailed Description Copyright © 2007–2009, Texas Instruments Incorporated
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PARALLEL
XGXS CORE
LANE0
LANE1
LANE2
LANE3
SERIAL
TLK3134
TLK3134
www.ti.com SLLS838F–MAY 2007–REVISED DECEMBER 2009
Figure 2-4. Custom Independent Configuration Application
The TLK3134 supports the IEEE 802.3 defined Management Data Input/Output (MDIO) Interface to allow
ease in configuration and status monitoring of the link. The bi-directional data pin (MDIO) must be
externally pulled up to 1.2 V or 2.5 V (VDDM) per the standard for MDIO.
The TLK3134 supports the IEEE 1149.1/1149.6 defined JTAG test port for ease in board manufacturing
test. It also supports a comprehensive series of built-in tests for self-test purposes including PRBS
generation and verification, CRPAT, CJPAT, Mixed/High/Low Frequency testing.
The TLK3134 operates with a 1.2 V core voltage supply, a 1.5/1.8 V HSTL I/O voltage supply and a 2.5 V
LVCMOS/bias supply.
The TLK3134 is packaged in a 19×19mm, 289-ball, 1mm ball pitch Plastic Ball Grid Array (PBGA)
package and is characterized for operation from –40°C to 85°C Ambient, 105°C Junction, and 5% power
supply variation at the balls of the device unless noted otherwise.
The following block diagram provides a high level description of the TLK3134.
Copyright © 2007–2009, Texas Instruments Incorporated Detailed Description 17
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XGMII/
GMII/
RGMII/
TBI/
RTBI
TX
TXD(31:0)
XGMII/
GMII/
RGMII/
TBI/
RTBI
RX
RXD(31:0)
Serial
I/F
Core
MDIO
PRTAD[4:0]
MDIO
MDC
JTAG
TCK
TDI
TMS
TRSTN
TDO
TDP[3:0]
TDN[3:0]
4
TCLK(3:0)
RCLK(3:0)
4
TXC(7:0)
RXC(7:0)
XAUI Core +
1000Base-X PCS
RDN[3:0]
RDP[3:0]
Jitter
Cleaner
PLL
TDP3/TDN3
RDP3/RDN3
CHANNEL 3
Test
mode
TDP2/TDN2
RDP2/RDN2
CHANNEL 2
Test
mode
TDP1/TDN1
RDP1/RDN1
CHANNEL 1
Test
mode
Self
Test
SERDES
Core
TCLK
TXD[7:0]
8 Bit 10 Bit
RCLK
REFCLKP
REFCLKN
8b/10b
Decoding
And
Self Test
Verification/
Reporting
RX
FIFO
/
CTC
RCLK
RXD(7:0)
TDP0
TDN0
RDP0
RDN0
RCLK
CHANNEL 0
10 Bit
Test
mode
8 Bit
8b/
10b
enc
TX
FIFO
/
CTC
TLK3134
SLLS838F–MAY 2007–REVISED DECEMBER 2009 www.ti.com
Figure 2-5. TLK3134 Block Diagram
Following is a more detailed block diagram description of the XAUI core.
Figure 2-6. Detailed XAUI/1000Base-X Core Block Diagram
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Parallel
to Serial
REFCLKP
/
NBaud
Clock
D Q
Serial to
Parallel
and
Comma
Detect
Interpolator
and Clock
Recovery
Multiplying
Clock
Synthesizer
RCLK
Recovered
Clock
TDP
TDN
RDP
RDN
Parallel Data In
Parallel Data Out
TLK3134
www.ti.com SLLS838F–MAY 2007–REVISED DECEMBER 2009
Figure 2-7. Block Diagram of SERDES Core
Copyright © 2007–2009, Texas Instruments Incorporated Detailed Description 19
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TLK3134
SLLS838F–MAY 2007–REVISED DECEMBER 2009 www.ti.com
2.6 Device Operation Modes
Table 2-2. Device Operation Modes
RTBI TBI NBI
XAUI(1) 10GFC(2) RGMII GMII REBI EBI RNBI TBID NBID
DEVICE MODE (DDR (SDR (SDR
(DDR) (DDR) (DDR) (SDR) (DDR) (SDR) (DDR) (DDR) (DDR)
) ) )
ST Primary Chip Input 0 1
MDIO Access Method Clause 45 Clause 22(3)
XAUI_ORDER 32809.15 1 0
Logical Or w/CODE pin X
XAUI_TX_EDGE_ALIGN 32808.15 0/1
XAUI_RX_EDGE_ALIGN 32808.11
DDR_SDR 17.5 1 0 1 0 1 0 1 0 X
NIBBLE_ORDER 17.4 0/1 X 0/1 X 0/1 X 0/1 X
TX_EDGE_MODE 17.1 0/1
RX_EDGE_MODE 17.0
FC_ENC_MODE 17.6 0 0/1 0 0/1
X
COMMA_DET_EN 17.7 0/1 0 1 0/1 1
PCS_EN 17.3 Logical OR w/CODE pin 1 0
ENC_DEC_EN 17.2 0 1 0 1
BUSWIDTH 36864.7 0 1 0
FULL_DDR 17.9 0 1
Legend : (X = Don’t Care) — (0 = Must Be Zero) — (1 = Must Be One) — (0/1 = Can Be Either Zero-or-One)
(1) Default Mode if ST Primary Chip Input Pin “0”, CODE Primary Chip Input Pin “1”.
(2) Default Mode if ST Primary Chip Input Pin “0”, CODE Primary Chip Input Pin “0”.
(3) All Clause 22 Registers are Per Device Channel.
20 Detailed Description Copyright © 2007–2009, Texas Instruments Incorporated
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