Ublox VERA-P171 User manual

VERA-P1 series
Host-based V2X transceiver module
Data Sheet
Abstract
This technical data sheet describes the VERA-P1 series transceiver
module that enables development of electronics for Vehicle-to-
Everything (V2X) communication systems. The VERA-P1 series
includes an integrated MAC/LLC/Baseband processor and the
required RF front-end components. It is connected to a host
processor through a USB or SPI interface.
www.u-blox.com
UBX-17004377 - R04

VERA-P1 series - Data Sheet
UBX-17004377 - R04 Confidential Contents
Page 2 of 28
Document Information
Title
VERA-P1 series
Subtitle
Host-based V2X transceiver module
Document type
Data Sheet
Document number
UBX-17004377
Revision and date
R04
7-Dec-2017
Disclosure restriction
Confidential
Product Status
Corresponding content status
Functional Sample
Draft
For functional testing. Revised and supplementary data will be published later.
In Development /
Prototype
Objective Specification
Target values. Revised and supplementary data will be published later.
Engineering Sample
Advance Information
Data based on early testing. Revised and supplementary data will be published later.
Initial Production
Early Prod. Information
Data from product verification. Revised and supplementary data may be published later.
Mass Production /
End of Life
Production Information
Final product specification.
This document applies to the following products:
Product name
Type number
Firmware version
PCN reference
Product Status
VERA-P171
VERA-P171-00A-00
N/A
N/A
Prototype
VERA-P173
VERA-P173-00A-00
N/A
N/A
Prototype
VERA-P174
VERA-P174-00A-00
N/A
N/A
Prototype
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whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or
any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose
of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.
Copyright © 2017, u-blox AG.
u-blox is a registered trademark of u-blox Holding AG in the EU and other countries.

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Contents
Contents..............................................................................................................................3
1Functional description..................................................................................................5
1.1 Overview .............................................................................................................................................. 5
1.2 Product features ................................................................................................................................... 5
1.3 Block diagrams ..................................................................................................................................... 6
1.4 Product description............................................................................................................................... 6
1.5 Supported features............................................................................................................................... 7
2Host interfaces .............................................................................................................8
2.1 USB interface........................................................................................................................................ 8
2.2 SPI interface.......................................................................................................................................... 8
3Pin Definition................................................................................................................9
3.1 Pin description ...................................................................................................................................... 9
4Electrical specification................................................................................................14
4.1 Absolute maximum ratings ................................................................................................................. 14
4.2 Operating conditions .......................................................................................................................... 14
4.3 Digital pad ratings .............................................................................................................................. 14
4.4 Peak current consumption .................................................................................................................. 15
4.5 Current consumption.......................................................................................................................... 15
4.6 Radio specifications ............................................................................................................................ 16
5Mechanical specifications ..........................................................................................18
5.1 Physical dimensions ............................................................................................................................ 18
6Qualification and approvals ......................................................................................20
6.1 Approvals ........................................................................................................................................... 20
6.1.1 European Union regulatory compliance ....................................................................................... 20
6.1.2 FCC compliance .......................................................................................................................... 20
6.1.3 IC compliance.............................................................................................................................. 20
6.1.4 FCC and IC IDs ............................................................................................................................ 20
6.1.5 Certification in other countries .................................................................................................... 21
7Product handling & soldering....................................................................................22
7.1 Packaging........................................................................................................................................... 22
7.1.1 Reels ........................................................................................................................................... 22
7.1.2 Tapes .......................................................................................................................................... 22
7.2 Shipment, storage and handling ......................................................................................................... 22
7.2.1 Moisture sensitivity levels............................................................................................................. 22
7.2.2 Mounting process and soldering recommendations..................................................................... 23
7.2.3 ESD handling precautions............................................................................................................ 24

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8Labeling and ordering information...........................................................................25
8.1 Product labeling.................................................................................................................................. 25
8.2 Explanation of codes........................................................................................................................... 25
8.3 Ordering codes ................................................................................................................................... 25
Appendix ..........................................................................................................................26
Glossary ............................................................................................................................26
Related documents...........................................................................................................27
Revision history................................................................................................................27
Contact..............................................................................................................................28

VERA-P1 series - Data Sheet
UBX-17004377 - R04 Confidential Functional description
Page 5 of 28
1Functional description
1.1 Overview
The VERA-P1 series are compact, embedded transceiver modules that enables development of electronics for
Vehicle-to-Everything (V2X) communication systems. These automotive grade modules are designed for
applications such as traffic safety, intelligent traffic management and entertainment. The modules can be used
for in-vehicle units (OBU - On Board Unit) –their use in V2X infrastructure (RSU - Road Side Unit) is intended, but
not authorized yet. The VERA-P1 series modules provide superior performance compared to V2X systems based
on consumer-grade Wi-Fi chipsets, especially at high vehicle speeds and in non-line-of-sight (NLOS) conditions.
The VERA-P1 series includes an integrated MAC/LLC/Baseband processor and the required RF front-end
components. The module is connected to a host processor through USB or SPI interface. Both interfaces can be
used for data communication and firmware download.
1.2 Product features
Table 1: VERA-P1 series main features summary

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1.3 Block diagrams
Figure 1: Block diagram of VERA-P171
Figure 2: Block diagram of VERA-P173 and VERA-P174
1.4 Product description
Model
Description
VERA-P171
Single channel, no antenna diversity, one antenna
VERA-P173
Single channel, antenna diversity, two antennas
VERA-P174
Dual channel or single channel with antenna diversity, two antennas
Table 2: Product description

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1.5 Supported features
Compliance with WAVE and ETSI ITS G5 for US and Europe operations
USB and SPI
1
host interfaces
Frequency band 5.850 –5.925 MHz (channels 172, 174, 176, 178, 180, 182, 184)
Channel bandwidth 10 MHz
2
Data rates 3, 4.5, 6, 9, 12, 18, 24, 27 Mbps
Antenna diversity (VERA-P173, VERA-P174) –CDD for TX and MRC for RX mode
TX output power from -10 to +23 dBm (Class C), RX sensitivity -97 dBm at 3 Mbps
Power supply 3.3 V and 5.0 V, 4 W maximum
Operation temperature -40 °C to +95 °C
Dimensions 29.6 x 24.8 x 3.5 mm
1
SPI is not recommended as the main host interface for communication due to performance limitations.
2
Support for 20 MHz mode is planned for future firmware releases subject to certain limitations, as the requirements for 20 MHz operation
have not been fully specified.

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2Host interfaces
2.1 USB interface
The VERA-P1 series module supports a USB 2.0 high-speed interface for firmware loading (booting) and high
speed data transfer (> 200 Mbps). The USB interface of the module is powered with 3.3 V supply voltage. The
module acts as a device on the USB bus.
2.2 SPI interface
The VERA-P1 series module supports an SPI interface for firmware loading (booting) and data communication.
Firmware can be loaded by the host processor while the module operates as a slave or from the FLASH memory
while the module is in the master mode. When the module is configured as a master, it needs a USB interface
connection for communication to the host. The interface is capable of full-duplex operation in master or slave
mode. The maximum clock rate is 50 MHz in master mode, and 25 MHz in slave mode
3
.
3
SPI host interface for data communication in slave mode is tested only with 15 MHz clock rate.

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3Pin Definition
3.1 Pin description
Figure 3: Pin allocation (top view)

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No.
Name
Pin
type
Power
domain
Description
A1
GND
Ground
-
Ground
A2
GND
Ground
-
Ground
A3
RSTn
I
VIO
Module Reset, has internal pull-up 100k to VIO
A4
GND
Ground
-
Ground
A5
3V3
Power
-
Baseband/Radio supply (3.0 to 3.6V)
A6
GND
Ground
-
Ground
A7
NC
-
-
Leave unconnected
A8
VIO
Power
-
I/O voltage (1.8/2.5/3.3V), in case of 1.8V pin 8 can get supply from pin B7
A9
GND
Ground
-
Ground
A10
NC
-
-
Leave unconnected
A11
GND
Ground
-
Ground
A12
NC
-
-
Leave unconnected
A13
NC
-
-
Leave unconnected
A14
NC
-
-
Leave unconnected
A15
NC
-
-
Leave unconnected
A16
NC
-
-
Leave unconnected
A17
NC
-
-
Leave unconnected
A18
GND
Ground
-
Ground
A19
5V0_A1
Power
-
Antenna 1 radio front-end supply (4.5 to 5.5V)
A20
GND
Ground
-
Ground
A21
NC
-
-
Leave unconnected
A22
NC
-
-
Leave unconnected
A23
GND
Ground
-
Ground
A24
GND
Ground
-
Ground
A25
GND
Ground
-
Ground
A26
ANT1
RF I/O
-
Antenna 1
A27
GND
Ground
-
Ground
A28
GND
Ground
-
Ground
A29
NC
-
-
Leave unconnected
A30
GND
Ground
-
Ground
A31
GND
Ground
-
Ground
A32
NC
-
-
Leave unconnected
A33
GND
Ground
-
Ground
A34
GND
Ground
-
Ground
A35
NC
-
-
Leave unconnected
A36
GND
Ground
-
Ground
A37
GND
Ground
-
Ground
A38
NC
-
-
Leave unconnected
A39
GND
Ground
-
Ground
A40
GND
Ground
-
Ground
A41
ANT2
RF I/O
-
Antenna 2
A42
GND
Ground
-
Ground
A43
GND
Ground
-
Ground
A44
GND
Ground
-
Ground

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No.
Name
Pin
type
Power
domain
Description
A45
5V0_A2
Power
-
Antenna 2 radio front-end supply (4.5 to 5.5 V)
A46
GND
Ground
-
Ground
A47
SPI_MOSI
I/O
VIO
SPI Bus
A48
SPI_MISO
I/O
VIO
SPI Bus
A49
MOD_IO_SPARE
I/O
VIO
Optional SPI CS
A50
GND
Ground
-
Ground
A51
NC
-
-
Leave unconnected
A52
NC
-
-
Leave unconnected
A53
NC
-
-
Leave unconnected
A54
NC
-
-
Leave unconnected
A55
NC
-
-
Leave unconnected
A56
NC
-
-
Leave unconnected
A57
GND
Ground
-
Ground
A58
NC
-
-
Leave unconnected
A59
NC
-
-
Leave unconnected
A60
NC
-
-
Leave unconnected
A61
GND
Ground
-
Ground
A62
USB_DN
I/O
-
USB Bus
A63
USB_DP
I/O
-
USB Bus
A64
USB_VBUS
I
-
USB VBUS detect input
A65
GND
Ground
-
Ground
A66
GND
Ground
-
Ground
A67
GND
Ground
-
Ground
A68
NC
-
-
Leave unconnected
A69
GND
Ground
-
Ground
A70
1PPS
I
1V8
One pulse per second input
A71
GND
Ground
-
Ground
A72
NC
-
-
Leave unconnected
A73
NC
-
-
Leave unconnected
A74
NC
-
-
Leave unconnected
A75
NC
-
-
Leave unconnected
A76
NC
-
-
Leave unconnected
A77
GND
Ground
-
Ground
A78
NC
-
-
Leave unconnected
A79
BOOT_0
I
VIO
Boot mode configuration
A80
NC
-
-
Leave unconnected
A81
GND
Ground
-
Ground
A82
NC
-
-
Leave unconnected
A83
NC
-
-
Leave unconnected
A84
GND
Ground
-
Ground
B1
NC
-
-
Leave unconnected
B2
NC
-
-
Leave unconnected
B3
GND
Ground
-
Ground
B4
3V3
Power
-
Baseband/Radio supply (3.0 to 3.6 V)
B5
GND
Ground
-
Ground

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No.
Name
Pin
type
Power
domain
Description
B6
NC
-
-
Leave unconnected
B7
1V8
O
-
1.8 V supply output, can be connected to pin 8 only as a VIO voltage source
B8
GND
Ground
-
Ground
B9
NC
-
-
Leave unconnected
B10
GND
Ground
-
Ground
B11
NC
-
-
Leave unconnected
B12
NC
-
-
Leave unconnected
B13
NC
-
-
Leave unconnected
B14
NC
-
-
Leave unconnected
B15
NC
-
-
Leave unconnected
B16
NC
-
-
Leave unconnected
B17
GND
Ground
-
Ground
B18
5V0_A1
Power
-
Antenna 1 radio front-end supply (4.5 to 5.5 V)
B19
GND
Ground
-
Ground
B20
NC
-
-
Leave unconnected
B21
NC
-
-
Leave unconnected
B22
GND
Ground
-
Ground
B23
GND
Ground
-
Ground
B24
GND
Ground
-
Ground
B25
NC
-
-
Leave unconnected
B26
NC
-
-
Leave unconnected
B27
NC
-
-
Leave unconnected
B28
GND
Ground
-
Ground
B29
GND
Ground
-
Ground
B30
GND
Ground
-
Ground
B31
GND
Ground
-
Ground
B32
GND
Ground
-
Ground
B33
GND
Ground
-
Ground
B34
NC
-
-
Leave unconnected
B35
NC
-
-
Leave unconnected
B36
NC
-
-
Leave unconnected
B37
GND
Ground
-
Ground
B38
GND
Ground
-
Ground
B39
GND
Ground
-
Ground
B40
5V0_A2
Power
-
Antenna 2 radio front-end supply (4.5 to 5.5 V)
B41
GND
Ground
-
Ground
B42
SPI_SCK
I/O
VIO
SPI Bus
B43
SPI_CSn
I/O
VIO
SPI Bus
B44
NC
-
-
Leave unconnected
B45
GND
Ground
-
Ground
B46
NC
-
-
Leave unconnected
B47
NC
-
-
Leave unconnected
B48
NC
-
-
Leave unconnected
B49
NC
-
-
Leave unconnected
B50
NC
-
-
Leave unconnected

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No.
Name
Pin
type
Power
domain
Description
B51
NC
-
-
Leave unconnected
B52
GND
Ground
-
Ground
B53
NC
-
-
Leave unconnected
B54
NC
-
-
Leave unconnected
B55
NC
-
-
Leave unconnected
B56
GND
Ground
-
Ground
B57
NC
-
-
Leave unconnected
B58
NC
-
-
Leave unconnected
B59
NC
-
-
Leave unconnected
B60
NC
-
-
Leave unconnected
B61
NC
-
-
Leave unconnected
B62
NC
-
-
Leave unconnected
B63
GND
Ground
-
Ground
B64
NC
-
-
Leave unconnected
B65
NC
-
-
Leave unconnected
B66
NC
-
-
Leave unconnected
B67
NC
-
-
Leave unconnected
B68
NC
-
-
Leave unconnected
B69
NC
-
-
Leave unconnected
B70
GND
Ground
-
Ground
B71
BOOT_2
I
VIO
Boot mode configuration
B72
BOOT_1
I
VIO
Boot mode configuration
B73
NC
-
-
Leave unconnected
B74
GND
Ground
-
Ground
B75
NC
-
-
Leave unconnected
B76
NC
-
-
Leave unconnected
EP
GND
Ground
-
20 Ground/Thermal exposed pads, connect to the ground
Table 3: VERA-P1 series pin description

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Page 14 of 28
4Electrical specification
Stressing the device above one or more of the ratings listed in the Absolute Maximum Rating
section may cause permanent damage. These are stress ratings only. Operating the module at
these or at any conditions other than those specified in the Operating conditions section of this
document should be avoided. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
Operating condition ranges define those limits within which the functionality of the device is guaranteed.
Where application information is given, it is advisory only and does not form part of the specification.
4.1 Absolute maximum ratings
Symbol
Description
Min.
Max.
Units
5V0_A1, 5V0_A2
Power supply voltage 5.0 V
-0.3
6.0
V
3V3
Power supply voltage 3.3 V
-0.3
3.9
V
VIO
I/O supply voltage 1.8 V/2.5 V/3.3 V
-0.3
3.9
V
TSTORAGE
Storage temperature
-40
+95
ºC
Table 4: Absolute maximum ratings
The product is not protected against overvoltage or reversed voltages. If necessary, voltage
spikes exceeding the power supply voltage specification, given in table above, must be limited
to values within the specified boundaries by using appropriate protection devices.
4.2 Operating conditions
Symbol
Parameter
Min.
Typ
Max.
Units
5V0_A1,
5V0_A2
Power supply voltage 5.0 V
4.5
5.0
5.5
V
3V3
Power supply voltage 3.3 V
3.0
3.3
3.6
V
VIO
I/O supply voltage 1.8 V/2.5 V/3.3 V
1.65
1.8
1.95
V
2.3
2.5
2.8
3.0
3.3
3.6
V
TA
Ambient operating temperature
-40
-
+95
ºC
Ripple Noise
Peak-to-peak voltage ripple on 5V0 and 3V3 supply
lines.
-
-
10
mV
Table 5: Operating conditions
4.3 Digital pad ratings
Symbol
Parameter
Conditions
Min.
Max.
Units
VIH
Input high voltage
0.7*VIO4
VIO1
V
VIL
Input low voltage
-0.3
0.65
V
VHYS
Input hysteresis
0.18
-
V
VOH
Output high voltage
IOmax = 5 mA
VIO-0.4
-
V
VOH
Output low voltage
IOmax = -5 mA
-
0.4
V
Table 6: Digital pad ratings
4
1PPS pad always use 1.8 V internally generated IO supply regardless of the VIO pad voltage.
5
RSTn pad internally pulled high to VIO voltage by 100k. During reset it should be below 0.2 V.

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4.4 Peak current consumption
Operation Mode
Peak current6(mA)
3V3
VIO7
5V0_A1
5V0_A2
RX
700
TBD
35
35
TX
+23 dBm
700
TBD
500
500
+15 dBm
700
TBD
TBD
TBD
+10 dBm
700
TBD
TBD
TBD
+0 dBm
700
TBD
TBD
TBD
Table 7: Peak current consumption
4.5 Current consumption
Power consumption for different operation modes –TBD
6
Peak values are shown. The average current for full operation mode strongly depends on RX/TX time ratio and remains within the range
between the peak values of RX and TX.
7
VIO current is shown for 1.8 V I/O voltage.

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4.6 Radio specifications
Parameter
Operation Mode
Specification
RF Frequency Range
802.11p
5.85 –5.925 GHz
Modulation
802.11p
OFDM
Supported Data Rates
802.11p
3, 4.5, 6, 9, 12, 18, 24, 27 Mbps
Supported Bandwidth
802.11p
10 MHz
Maximum Transmit Power
802.11p
20 dBm ± 2 dB
Minimum Transmit Power
802.11p
-10 dBm
Receiver sensitivity
802.11p
10 MHz,
no multipath,
25 °C
3 Mbps
-98 dBm typ., -95 dBm min.
4.5 Mbps
-96 dBm typ., -93 dBm min.
6 Mbps
-95 dBm typ., -92 dBm min.
9 Mbps
-93 dBm typ., -90 dBm min.
12 Mbps
-90 dBm typ., -87 dBm min.
18 Mbps
-86 dBm typ., -83 dBm min.
24 Mbps
-82 dBm typ., -79 dBm min.
27 Mbps
-80 dBm typ., -77 dBm min.
10 MHz,
NLoS (Non-line-of-sight),
25 °C
3 Mbps
-95 dBm typ., -92 dBm min.
4.5 Mbps
-92 dBm typ., -89 dBm min.
6 Mbps
-88 dBm typ., -85 dBm min.
9 Mbps
-86 dBm typ., -83 dBm min.
12 Mbps
-85 dBm typ., -82 dBm min.
18 Mbps
-82 dBm typ., -79 dBm min.
24 Mbps
na
27 Mbps
na
Receiver maximum operating input level
802.11p
-20 dBm
RSSI accuracy
802.11p
Over tempearature range
+/-2 dB
Centre frequency and symbol clock tolerance
802.11p
+/-10 ppm
Transmitter spectral flatness
802.11p
All modulation modes
< +/-2 dB
Transmitter centre frequency leakage
802.11p
< -15 dB
Transmit power control step size
802.11p
0.5 dB
Transmit power control accuracy
802.11p
Over tempearature range
+/-2 dB
Table 8: Radio specifications
Table 9 shows the Highway NLoS (Non-line-of-sight) channel parameters that are used to obtain the receiver
sensitivity values in Table 8. This channel was used in RF testing at the third ETSI Plug test (CMS3).
Each tap is faded using Pure Doppler, but the second antenna has a Doppler increased by 11 Hz, which prevents
phase synchronization of channels. The RX Power listed in Table 8 refers to the power of Tap 0.
The values presented are typical values, measured at +25 °C.
Tap#
Relative Power (dB)
Delay (ns)
Doppler Frequency (Hz)
0
0
0
0
1
-2
200
689
2
-5
433
-492
3
-7
700
886
Table 9: Highway NLoS channel parameters
The adjacent and non-adjacent channel rejection measurements are provided in Table 10 and Table 11
respectively.

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Page 17 of 28
Bit rate
Target ACR (dB)
Target opt. enc. ACR (dB)
VERA-P1 typical ACR (dB)
3 Mbps (1/2BPSK)
16
28
37
4.5 Mbps (3/4BPSK)
15
27
33
6 Mbps (1/2QPSK)
13
25
35
9 Mbps (3/4QPSK)
11
23
29
12 Mbps (1/2QAM16)
8
20
29
18 Mbps (3/4QAM16)
4
16
25
24 Mbps (2/3QAM64)
0
12
22
27 Mbps (3/4QAM64)
-1
11
20
Table 10: Adjacent channel rejection
Bit rate
Target ACR (dB)
Target opt. enc. ACR (dB)
VERA-P1 typical ACR (dB)
3 Mbps (1/2BPSK)
32
42
51
4.5 Mbps (3/4BPSK)
31
41
48
6 Mbps (1/2QPSK)
29
39
48
9 Mbps (3/4QPSK)
27
37
45
12 Mbps (1/2QAM16)
24
34
42
18 Mbps (3/4QAM16)
20
30
38
24 Mbps (2/3QAM64)
16
26
34
27 Mbps (3/4QAM64)
15
25
32
Table 11: Non-adjacent channel rejection
Channel
Frequency, GHz
172
5.860
174
5.870
176
5.880
178
5.890
180
5.900
182
5.910
184
5.920
Table 12: Supported channels

VERA-P1 series - Data Sheet
UBX-17004377 - R04 Confidential Mechanical specifications
Page 18 of 28
5Mechanical specifications
5.1 Physical dimensions
Figure 4: Physical dimensions

VERA-P1 series - Data Sheet
UBX-17004377 - R04 Confidential Mechanical specifications
Page 19 of 28
Symbol
Description
Millimeters
Min.
Nom.
Max.
A
Module Thickness
3.3
3.5
3.7
A1
Vertical distance from the solder mask to the pad surface
0.010
0.020
0.035
b
Width of the peripheral pads
0.70
0.75
0.80
D
Module horizontal dimension
24.8 BSC
D2
Horizontal dimension of the exposed thermal pads pattern
17.7
17.8
17.9
D3
Horizontal dimension of the individual exposed thermal pad
3.9
4.0
4.1
E
Module vertical dimension
29.6 BSC
E2
Vertical dimension of the exposed thermal pads pattern
22.3
22.4
22.5
E3
Vertical dimension of the individual exposed thermal pad
3.9
4.0
4.1
e
Pitch of the peripheral pads
1.2 BSC
E1
Pitch of the individual exposed thermal pads
4.6 BSC
aaa
Bilateral profile tolerance of the module body
0.2
ddd
Co-planarity of the module bottom surface (unilateral tolerance)
0.1
eee
Tolerance of the peripheral pads pattern position
0.2
fff
Tolerance of the peripheral pads position with respect to each other
0.04
ggg
Tolerance of the exposed thermal pads pattern position
0.08
Table 13: VERA-P1 series dimensional references
The “aaa” tolerances +/- 0.2 mm may be exceeded in the corners of the PCB due to the cutting process.
In worst case, the outer dimension “D” could reach 25.1 mm.

VERA-P1 series - Data Sheet
UBX-17004377 - R04 Confidential Qualification and approvals
Page 20 of 28
6Qualification and approvals
6.1 Approvals
8
Products marked with this lead-free symbol on the product label comply with the
"Directive 2002/95/EC of the European Parliament and the Council on the Restriction of
Use of certain Hazardous Substances in Electrical and Electronic Equipment" (RoHS).
VERA-P1 series V2X modules are RoHS compliant.
6.1.1 European Union regulatory compliance
TBD
6.1.2 FCC compliance
The VERA-P173 module complies with Part 95, Subpart L of the FCC Rules. Operation is subject to the following
two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired
operation.
Non authorized modification could void authority to use this equipment. The internal / external antenna(s) used
for this module must provide a separation distance of at least 20 cm from all persons and must not be
co-located or operating in conjunction with any other antenna or transmitter.
These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the manufacturer’s instructions, may cause harmful interference to radio
communications.
The outside of final product that contains the VERA-P173 module must display in a user accessible area a
label referring to the enclosed module. This exterior label can use wording such as the following:
“Contains Transmitter Module FCC ID: XPYVERAP173” or “Contains FCC ID: XPYVERAP173”.
Part 95, Subpart L covers DSRC service of On-Board Units. VERA-P173 authorization for Road Side Units is
pending.
6.1.3 IC compliance
TBD
6.1.4 FCC and IC IDs
Model
FCC ID
IC ID
VERA-P171
tbd
tbd
VERA-P173
XPYVERAP173
tbd
VERA-P174
tbd
tbd
Table 14: FCC and IC IDs for different models of VERA-P1 series
8
These approvals are pending.