Ublox TOBY-L1 series Quick setup guide

TOBY-L1 and MPCI-L1 series
LTE modules
System Integration Manual
Abstract
This document describes the features and the system integration
of
TOBY-L1 and MPCI-L1 series LTE cellular modules.
These modules are a complete and cost efficient 4G solution offering
100 Mb/s download, 50 Mb/s upload, and covering
2 LTE Bands in
the compact TOBY form factor or in the industry standard
PCI Express
Mini Card (MPCI) form factor.
.
UBX
-13001482 - R04
TOBY-L1 series
MPCI-L1 series
www.u
-blox.com

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Document Information
Title TOBY-L1 and MPCI-L1 series
Subtitle LTE modules
Document type System Integration Manual
Document number UBX-13001482
Revision, date R04 15-Oct-2014
Document status Advance Information
Document status explanation
Objective Specification Document contains target values. Revised and supplementary data will be published later.
Advance Information Document contains data based on early testing. Revised and supplementary data will be published later.
Early Production Information Document contains data from product verification. Revised and supplementary data may be published later.
Production Information Document contains the final product specification.
This document applies to the following products:
Product name Type number Firmware version PCN / IN
TOBY-L100 TOBY-L100-00S-00 G0.V.00.00.15R UBX-14002653
MPCI-L100 MPCI-L100-00S-00 G0.V.01.00.02 UBX-14041173
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein
may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this
document or any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.
Copyright © 2014, u-blox AG.
u-blox®is a registered trademark of u-blox Holding AG in the EU and other countries.
Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other
countries. PCI, PCI Express, PCIe, and PCI-SIG are trademarks or registered trademarks of PCI-SIG. All other registered trademarks or
trademarks mentioned in this document are property of their respective owners.

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Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
•AT Commands Manual: This document provides the description of the AT commands supported by
u-blox cellular modules.
•System Integration Manual: This document describes u-blox cellular modules from the hardware and the
software point of view. It provides hardware design guidelines for the optimal integration of the cellular
module in the application device and it provides information on how to set up production and final product
tests on application devices integrating the cellular module.
•Application Notes: These documents provide guidelines and information on specific hardware and/or
software topics on u-blox cellular modules. See Related documents for a list of application notes related to
your cellular module.
How to use this Manual
The TOBY-L1 and MPCI-L1 series System Integration Manual provides the necessary information to successfully
design and configure the u-blox cellular modules.
This manual has a modular structure. It is not necessary to read it from the beginning to the end.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
Questions
If you have any questions about u-blox cellular Integration:
•Read this manual carefully.
•Contact our information service on the homepage http://www.u-blox.com
Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information and technical documents can
be accessed 24h a day.
By E-mail
Contact the closest Technical Support office by email. Use our service pool email addresses rather than any
personal email address of our staff. This makes sure that your request is processed as soon as possible. You will
find the contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support, have the following information ready:
•Module type (example: TOBY-L100) and firmware version
•Module configuration
•Clear description of your question or the problem
•A short description of the application
•Your complete contact details

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Contents
Preface ................................................................................................................................3
Contents..............................................................................................................................4
1System description.......................................................................................................7
1.1 Overview .............................................................................................................................................. 7
1.2 Architecture.......................................................................................................................................... 9
1.2.1 Internal blocks ............................................................................................................................. 10
1.3 Pin-out ............................................................................................................................................... 11
1.3.1 TOBY-L1 series pin assignment .................................................................................................... 11
1.3.2 MPCI-L1 series pin assignment .................................................................................................... 13
1.4 Operating modes................................................................................................................................ 15
1.5 Supply interfaces ................................................................................................................................ 17
1.5.1 Module supply input (VCC or 3.3aux).......................................................................................... 17
1.5.2 RTC supply output (V_BCKP) ....................................................................................................... 21
1.5.3 Generic digital interfaces supply output (V_INT)........................................................................... 21
1.6 System function interfaces.................................................................................................................. 22
1.6.1 Module power-on ....................................................................................................................... 22
1.6.2 Module power-off....................................................................................................................... 25
1.6.3 Module reset............................................................................................................................... 27
1.7 Antenna interface............................................................................................................................... 29
1.7.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 29
1.8 SIM interface ...................................................................................................................................... 32
1.8.1 SIM card interface ....................................................................................................................... 32
1.9 Data communication interfaces .......................................................................................................... 32
1.9.1 Universal Serial Bus (USB) ............................................................................................................ 32
1.10 General Purpose Input/Output (GPIO) ............................................................................................. 33
1.11 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#) .................................................................. 34
1.12 Reserved pins (RSVD) ...................................................................................................................... 34
1.13 Not connected pins (NC) ................................................................................................................. 34
1.14 System features............................................................................................................................... 35
1.14.1 Network indication...................................................................................................................... 35
1.14.2 Power saving............................................................................................................................... 35
2Design-in.....................................................................................................................36
2.1 Overview ............................................................................................................................................ 36
2.2 Supply interfaces ................................................................................................................................ 37
2.2.1 Module supply (VCC or 3.3aux)................................................................................................... 37
2.2.2 RTC supply output (V_BCKP) ....................................................................................................... 45
2.2.3 Digital I/O interfaces supply output (V_INT).................................................................................. 45
2.3 System functions interfaces ................................................................................................................ 46
2.3.1 Module power-on (PWR_ON) ...................................................................................................... 46

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2.3.2 Module reset (RESET_N and PERST#) ........................................................................................... 47
2.4 Antenna interface............................................................................................................................... 49
2.4.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 49
2.5 SIM interface ...................................................................................................................................... 55
2.5.1 Guidelines for SIM circuit design.................................................................................................. 55
2.5.2 Guidelines for SIM layout design ................................................................................................. 58
2.6 Data communication interfaces .......................................................................................................... 59
2.6.1 Universal Serial Bus (USB) ............................................................................................................ 59
2.7 General Purpose Input/Output (GPIO) ................................................................................................. 61
2.8 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)...................................................................... 62
2.9 Reserved pins (RSVD) .......................................................................................................................... 64
2.10 Module placement .......................................................................................................................... 64
2.11 TOBY-L1 series module footprint and paste mask ........................................................................... 65
2.12 MPCI-L1 series module installation .................................................................................................. 66
2.13 Thermal guidelines.......................................................................................................................... 68
2.14 ESD guidelines ................................................................................................................................ 69
2.14.1 ESD immunity test overview ........................................................................................................ 69
2.14.2 ESD immunity test of TOBY-L1 and MPCI-L1 series reference designs .......................................... 69
2.14.3 ESD application circuits................................................................................................................ 70
2.15 Schematic for TOBY-L1 and MPCI-L1 series module integration ...................................................... 72
2.16 Design-in checklist .......................................................................................................................... 74
2.16.1 Schematic checklist ..................................................................................................................... 74
2.16.2 Layout checklist ........................................................................................................................... 74
2.16.3 Antenna checklist........................................................................................................................ 75
3Handling and soldering .............................................................................................76
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 76
3.2 Handling............................................................................................................................................. 76
3.3 Soldering ............................................................................................................................................ 77
3.3.1 Soldering paste............................................................................................................................ 77
3.3.2 Reflow soldering ......................................................................................................................... 77
3.3.3 Optical inspection........................................................................................................................ 78
3.3.4 Cleaning...................................................................................................................................... 78
3.3.5 Repeated reflow soldering........................................................................................................... 78
3.3.6 Wave soldering............................................................................................................................ 79
3.3.7 Hand soldering............................................................................................................................ 79
3.3.8 Rework........................................................................................................................................ 79
3.3.9 Conformal coating ...................................................................................................................... 79
3.3.10 Casting........................................................................................................................................ 79
3.3.11 Grounding metal covers .............................................................................................................. 79
3.3.12 Use of ultrasonic processes.......................................................................................................... 79
4Approvals....................................................................................................................80
4.1 Product certification approval overview............................................................................................... 80
4.2 Federal Communications Commission and Industry Canada notice..................................................... 81

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4.2.1 Declaration of Conformity – United States only ........................................................................... 81
4.2.2 Modifications .............................................................................................................................. 81
5Product Testing...........................................................................................................83
5.1 u-blox in-series production test........................................................................................................... 83
5.2 Test parameters for OEM manufacturer.............................................................................................. 84
5.2.1 “Go/No go” tests for integrated devices...................................................................................... 84
5.2.2 RF functional tests ....................................................................................................................... 84
5.2.3 Connecting to Wireless Communication Test Set......................................................................... 86
Appendix ..........................................................................................................................87
AGlossary ......................................................................................................................87
Related documents...........................................................................................................89
Revision history................................................................................................................89
Contact..............................................................................................................................90

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1System description
1.1 Overview
The TOBY-L1 and MPCI-L1 series comprises 4G LTE-only modules supporting two LTE bands for data
communication:
•TOBY-L1 and MPCI-L1 series modules are designed for operation on the LTE Verizon network in North
America (LTE bands 4, 13), and meets the requirements of Verizon network certification for LTE only devices.
LTE-only modules offer cost advantages compared to multi-mode (LTE/3G/2G) modules and are optimized for
applications using only LTE networks. Additionally, the TOBY-L1 and MPCI-L1 series modules are designed in two
different form-factors suitable for applications as following:
•TOBY-L1 modules are designed in the small TOBY 152-pin Land Grid Array form-factor (35.6 x 24.8 mm),
easy to integrate in compact designs and form-factor compatible with the u-blox cellular module families.
This allows customers to take the maximum advantage of their hardware and software investments, and
provides very short time-to-market.
•MPCI-L1 modules are designed in the industry standard PCI Express Full-Mini Card form-factor (51 x 30 mm),
easy to integrate into industrial and consumer applications and also ideal for manufacturing small series.
The modules are dedicated for data transfer, supporting a high-speed USB 2.0 interface. With LTE Category 3
data rates of 100 Mb/s (downlink) and 50 Mb/s (uplink), they are ideal for applications requiring the highest data
rates and high-speed internet access. TOBY-L1 and MPCI-L1 series modules are the perfect choice for consumer
fixed-wireless terminals, mobile routers and gateways, and applications requiring video streaming. They are also
optimally suited for industrial (M2M) applications, such as remote access to video cameras, digital signage,
telehealth, security, and surveillance systems.
TOBY-L1 and MPCI-L1 series main features and interface are summarized in Table 1.
Module Region /
Operator LTE UMTS
GSM GNSS Interfaces Audio Features
LTE category
LTE bands
UMTS bands
GSM bands
GNSS receiver
CellLocate™
UART
USB 2.0
USB HSIC
RMII
SDIO
GPIO
Audio
MIMO 2x2
CSFB
VoLTE
Embedded TCP/UDP stack
Embedded HTTP, FTP, SSL
FOTA
TOBY-L100 Verizon 3 4, 13 •6 •
MCPI-L100 Verizon 3 4, 13 ••
Table 1: TOBY-L1 and MPCI-L1 series main features summary
GPIOs are not supported by the TOBY-L1 modules’ initial FW release. Check FW release schedule.

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Table 2 reports a summary of LTE characteristics of the TOBY-L1 and MPCI-L1 series module.
4G LTE Characteristics
3GPP Release 9 - Long Term Evolution (LTE)
Evolved Universal Terrestrial Radio Access (E-UTRA)
Frequency Division Duplex (FDD)
Multi-Input Multi-Output (MIMO) 2 x 2 antenna support
Band support:
•Band 4: 1710 - 1755 MHz (Tx), 2110 - 2155 MHz (Rx)
•Band 13: 777 -787 MHz (Tx), 746 - 756 MHz (Rx)
Channel bandwidth:
•Band 4: 5 MHz, 10 MHz, 15 MHz, 20 MHz
•Band 13: 10 MHz
Power class:
• Class 3 (+23 dBm)
Data rate:
•LTE category 3: up to 50 Mb/s Up-Link, 100 Mb/s Down-Link
Short Message Service (SMS):
• SMS via embedded IMS (IP Multimedia Subsystem)
Table 2: TOBY-L1 and MPCI-L1 series LTE characteristics summary

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1.2 Architecture
Cellular
Base-band
Processor
Memory
Power Management Unit
26 MHz
32.768 kHz
ANT1
RF
Transceiver
ANT2
V_INT (I/O)
V_BCKP
VCC (Supply)
SIM
USB
GPIO *
Power On
External Reset
PA
LNA Filter
Filter
Duplexer
Filter
PA
LNA Filter
Filter
Duplexer
Filter
LNA FilterFilter
LNA FilterFilter
Switch
Switch
Figure 1: TOBY-L100 block diagram
* = GPIOs are not supported by initial FW release.
ANT1
SIM
USB
LED_WWAN#
TOBY-L1
series
Signal
Conditioning
ANT2
W_DISABLE#
PERST#
U.FL
U.FL
3.3Vaux (Supply)
Boost
Converter
VCC
Figure 2: MPCI-L100 block diagram

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1.2.1 Internal blocks
As described in Figure 2, each MPCI-L100 module integrates one TOBY-L100 module, which consists of the
following internal sections: RF, baseband and power management.
RF section
The RF section is composed of RF transceiver, PAs, LNAs, crystal oscillator, filters, duplexers and RF switches.
Tx signal is pre-amplified by RF transceiver, then output to the primary antenna input/output port (ANT1) of the
module via power amplifier (PA), SAW band pass filters band, specific duplexer and antenna switch.
Dual receiving paths are implemented according to Down-Link MIMO 2 x 2 radio technology supported by the
modules as mandatory feature for LTE category 3 User Equipment designed to operate on Verizon LTE network:
incoming signals are received through the primary (ANT1) and secondary (ANT2) antenna input ports which are
connected to the RF transceiver via specific antenna switch, diplexer, duplexer, LNA, SAW band pass filters.
•RF transceiver performs modulation, up-conversion of the baseband I/Q signals for Tx, down-conversion and
demodulation of the dual RF signals for Rx. The RF transceiver contains:
Automatically gain controlled direct conversion Zero-IF receiver,
Highly linear RF demodulator / modulator capable QPSK/16QAM/64QAM,
Fractional-N Sigma-Delta RF synthesizer,
VCO.
•Power Amplifiers (PA) amplify the Tx signal modulated by the RF transceiver
•RF switches connect primary (ANT1) and secondary (ANT2) antenna ports to the suitable Tx / Rx path
•Low Noise Amplifiers (LNA) enhance the received sensitivity
•SAW duplexers separate the Tx and Rx signal paths and provide RF filtering
•SAW band pass filters enhance the rejection of out-of-band signals
•26 MHz crystal oscillator generates the clock reference in active-mode or connected-mode.
Baseband and Power Management section
The Baseband and Power Management section is composed of the following main elements:
•A mixed signal ASIC, which integrates
Microprocessor for control functions,
DSP core for LTE Layer 1 and digital processing of Rx and Tx signal paths,
Memory interface controller,
Dedicated peripheral blocks for control of the USB, SIM and GPIO digital interfaces,
Analog front end interfaces to RF transceiver ASIC.
•Memory system, which includes NAND flash and LPDDR.
•Voltage regulators to derive all the subsystem supply voltages from the module supply input VCC
•Voltage sources for external use: V_BCKP and V_INT
•Hardware power on
•Hardware reset
•Low power idle-mode support
•32.768 kHz crystal oscillator to provide the clock reference in the low power idle-mode, which can be set by
enable power saving configuration using the AT+UPSV command.