Ublox TOBY-L2 series Quick setup guide

TOBY-L2 and MPCI-L2 series
LTE/DC-HSPA+/EGPRS modules
System Integration Manual
Abstract
This document describes the features and the system integration of TOBY-L2 and MPCI-L2 series
multi-mode cellular modules. These modules are a complete and cost efficient LTE/3G/2G solution
offering up to 150 Mb/s download and 50 Mb/s upload data rates, covering up to six LTE bands, up
to five WCDMA/DC-HSPA+ bands and up to four GSM/EGPRS bands in the compact TOBY LGA form
factor of TOBY-L2 modules or in the industry standard PCI Express Mini Card form factor of MPCI-L2
modules.
www.u-blox.com
UBX-13004618 - R28

TOBY-L2 and MPCI-L2 series - System Integration Manual
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Document Information
Title
TOBY-L2 and MPCI-L2 series
Subtitle
LTE/DC-HSPA+/EGPRS modules
Document type
System Integration Manual
Document number
UBX-13004618
Revision and date
R28
12-Apr-2019
Disclosure Restriction
Product status
Corresponding content status
Functional Sample
Draft
For functional testing. Revised and supplementary data will be published later.
In Development /
Prototype
Objective Specification
Target values. Revised and supplementary data will be published later.
Engineering Sample
Advance Information
Data based on early testing. Revised and supplementary data will be published later.
Initial Production
Early Production Information
Data from product verification. Revised and supplementary data may be published later.
Mass Production /
End of Life
Production Information
Document contains the final product specification.
u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this document.
Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only permitted with the
express written permission of u-blox.
The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent documents,
visit www.u-blox.com.
Copyright © u-blox AG.

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This document applies to the following products:
Product name
Type number
Modem version
Application version
PCN reference
Product status
TOBY-L200
TOBY-L200-00S-00
09.71
A01.15
UBX-14044437
Obsolete
TOBY-L200-00S-01
09.71
A01.30
UBX-16026448
Obsolete
TOBY-L200-02S-00
15.90
A01.00
UBX-15029946
Obsolete
TOBY-L200-02S-01
15.90
A01.10
UBX-16031212
End of Life
TOBY-L200-03A-01
16.19
A01.02
UBX-19004188
Initial Production
TOBY-L200-03S-00
15.90
A01.50
UBX-17022983
End of Life
TOBY-L200-03S-01
16.19
A01.02
UBX-19000820
Initial Production
TOBY-L201
TOBY-L201-01S-00
09.93
A01.07
UBX-18012849
End of Life
TOBY-L201-02S-00
(for AT&T): 09.93
(for AT&T): A02.50
UBX-17013932
End of Life
(for VZW): 09.94
(for VZW): A01.02
UBX-17013932
End of Life
TOBY-L201-02S-01
(for AT&T): 20.03
(for AT&T): A01.02
UBX-19000820
Initial Production
(for VZW): 20.03
(for VZW): A01.02
UBX-19000820
Initial Production
TOBY-L210
TOBY-L210-00S-00
09.71
A01.15
UBX-14044437
Obsolete
TOBY-L210-02S-00
15.63
A01.03
UBX-15029946
Obsolete
TOBY-L210-02S-01
15.63
A01.10
UBX-16031212
End of Life
TOBY-L210-03A-00
15.63
A01.60
UBX-18010749
End of Life
TOBY-L210-03A-01
16.19
A01.02
UBX-19012118
Initial Production
TOBY-L210-03S-00
15.63
A01.50
UBX-17022983
End of Life
TOBY-L210-03S-01
16.19
A01.02
UBX-19000820
Initial Production
TOBY-L210-60S-00
09.94
A01.00
UBX-15021694
Obsolete
TOBY-L210-60S-01
09.94
A01.01
UBX-16005471
Obsolete
TOBY-L210-62S-00
16.05
A01.02
UBX-17003573
Initial Production
TOBY-L220
TOBY-L220-02S-00
15.93
A01.00
UBX-16025501
Mass Production
TOBY-L220-62S-00
16.04
A01.00
UBX-17013073
Mass Production
TOBY-L280
TOBY-L280-02S-00
15.63
A01.03
UBX-15029946
Obsolete
TOBY-L280-02S-01
15.63
A01.10
UBX-16031212
End of Life
TOBY-L280-03A-01
16.19
A01.02
UBX-19004188
Initial Production
TOBY-L280-03S-00
15.63
A01.50
UBX-17022983
End of Life
TOBY-L280-03S-01
16.19
A01.02
UBX-19000820
Initial Production
MPCI-L200
MPCI-L200-00S-00
09.71
A01.15
UBX-14044437
Obsolete
MPCI-L200-00S-01
09.71
A01.30
UBX-16026448
Obsolete
MPCI-L200-02S-00
15.90
A01.00
UBX-15029946
Obsolete
MPCI-L200-02S-01
15.90
A01.10
UBX-16031212
End of Life
MPCI-L200-03S-00
15.90
A01.50
UBX-17022983
Mass Production
MPCI-L201
MPCI-L201-01S-00
09.93
A01.07
UBX-18012849
End of Life
MPCI-L201-02S-00
(for AT&T): 09.93
(for AT&T): A02.50
UBX-17013932
End of Life
(for VZW): 09.94
(for VZW): A01.02
UBX-17013932
End of Life
MPCI-L201-02S-01
(for AT&T): 20.03
(for AT&T): A01.02
UBX-19000820
Initial Production
(for VZW): 20.03
(for VZW): A01.02
UBX-19000820
Initial Production
MPCI-L210
MPCI-L210-00S-00
09.71
A01.15
UBX-14044437
Obsolete
MPCI-L210-02S-00
15.63
A01.03
UBX-15029946
Obsolete
MPCI-L210-02S-01
15.63
A01.10
UBX-16031212
End of Life
MPCI-L210-03S-00
15.63
A01.50
UBX-17022983
Mass Production
MPCI-L210-60S-00
09.94
A01.00
UBX-15021694
Obsolete
MPCI-L210-60S-01
09.94
A01.01
UBX-16005471
Mass Production
MPCI-L220
MPCI-L220-02S-00
15.93
A01.00
UBX-16025501
Initial Production
MPCI-L220-62S-00
16.04
A01.00
UBX-17013073
Initial Production
MPCI-L280
MPCI-L280-02S-00
15.63
A01.03
UBX-15029946
Obsolete
MPCI-L280-02S-01
15.63
A01.10
UBX-16031212
End of Life
MPCI-L280-03S-00
15.63
A01.50
UBX-17022983
Mass Production

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Contents
Document Information................................................................................................................................2
Contents ..........................................................................................................................................................4
1System description...............................................................................................................................8
1.1 Overview........................................................................................................................................................8
1.2 Architecture ................................................................................................................................................ 11
1.2.1 Internal blocks ....................................................................................................................................12
1.3 Pin-out......................................................................................................................................................... 13
1.3.1 TOBY-L2 series pin assignment.................................................................................................... 13
1.3.2 MPCI-L2 series pin assignment......................................................................................................17
1.4 Operating modes....................................................................................................................................... 19
1.5 Supply interfaces .......................................................................................................................................21
1.5.1 Module supply input (VCC or 3.3Vaux)..........................................................................................21
1.5.2 RTC supply input/output (V_BCKP) ..............................................................................................28
1.5.3 Generic digital interfaces supply output (V_INT).......................................................................29
1.6 System function interfaces ....................................................................................................................30
1.6.1 Module power-on ..............................................................................................................................30
1.6.2 Module power-off..............................................................................................................................32
1.6.3 Module reset......................................................................................................................................34
1.6.4 Module configuration selection by host processor....................................................................34
1.7 Antenna interface.....................................................................................................................................35
1.7.1 Antenna RF interfaces (ANT1 / ANT2)..........................................................................................35
1.7.2 Antenna detection interface (ANT_DET).....................................................................................38
1.8 SIM interface..............................................................................................................................................38
1.8.1 SIM interface .....................................................................................................................................38
1.8.2 SIM detection interface...................................................................................................................38
1.9 Data communication interfaces ............................................................................................................39
1.9.1 Universal Serial Bus (USB) ..............................................................................................................39
1.9.2 Asynchronous serial interface (UART).........................................................................................43
1.9.3 DDC (I2C) interface............................................................................................................................54
1.9.4 Secure Digital Input Output interface (SDIO) .............................................................................55
1.10 Audio............................................................................................................................................................55
1.10.1 Digital audio over I2S interface.......................................................................................................55
1.11 General Purpose Input/Output...............................................................................................................57
1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)................................................................58
1.13 Reserved pins (RSVD) ..............................................................................................................................58
1.14 Not connected pins (NC)..........................................................................................................................58
1.15 System features........................................................................................................................................59
1.15.1 Network indication ...........................................................................................................................59
1.15.2 Antenna supervisor..........................................................................................................................59
1.15.3 Jamming detection..........................................................................................................................59

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1.15.4 IP modes of operation ......................................................................................................................60
1.15.5 Dual stack Ipv4/Ipv6.........................................................................................................................60
1.15.6 TCP/IP and UDP/IP............................................................................................................................60
1.15.7 FTP.......................................................................................................................................................60
1.15.8 HTTP.................................................................................................................................................... 61
1.15.9 SSL / TLS............................................................................................................................................ 61
1.15.10 Bearer Independent Protocol.......................................................................................................... 61
1.15.11 Wi-Fi integration............................................................................................................................... 61
1.15.12 Firmware update Over AT (FOAT).................................................................................................62
1.15.13 Firmware update Over The Air (FOTA).........................................................................................62
1.15.14 Smart temperature management ................................................................................................62
1.15.15 SIM Access Profile (SAP).................................................................................................................65
1.15.16 Power saving......................................................................................................................................67
2Design-in................................................................................................................................................ 68
2.1 Overview......................................................................................................................................................68
2.2 Supply interfaces ......................................................................................................................................69
2.2.1 Module supply (VCC or 3.3Vaux) ...................................................................................................69
2.2.2 RTC supply output (V_BCKP) ......................................................................................................... 81
2.2.3 Generic digital interfaces supply output (V_INT).......................................................................82
2.3 System functions interfaces..................................................................................................................83
2.3.1 Module power-on (PWR_ON)..........................................................................................................83
2.3.2 Module reset (RESET_N or PERST#)............................................................................................84
2.3.3 Module configuration selection by host processor....................................................................85
2.4 Antenna interface.....................................................................................................................................86
2.4.1 Antenna RF interfaces (ANT1 / ANT2)..........................................................................................86
2.4.2 Antenna detection interface (ANT_DET).....................................................................................94
2.5 SIM interface..............................................................................................................................................96
2.6 Data communication interfaces ..........................................................................................................103
2.6.1 Universal Serial Bus (USB) ............................................................................................................103
2.6.2 Asynchronous serial interface (UART).......................................................................................105
2.6.3 DDC (I2C) interface..........................................................................................................................109
2.6.4 Secure Digital Input Output interface (SDIO) ............................................................................110
2.7 Audio interface .........................................................................................................................................112
2.7.1 Digital audio interface.....................................................................................................................112
2.8 General Purpose Input/Output..............................................................................................................116
2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)............................................................... 117
2.10 Reserved pins (RSVD) .............................................................................................................................118
2.11 Module placement ...................................................................................................................................119
2.12 TOBY-L2 series module footprint and paste mask ......................................................................... 120
2.13 MPCI-L2 series module installation .....................................................................................................121
2.14 Thermal guidelines ................................................................................................................................. 122
2.15 ESD guidelines......................................................................................................................................... 124
2.15.1 ESD immunity test overview ........................................................................................................ 124

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2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 reference design .......................................... 125
2.15.3 ESD application circuits ................................................................................................................ 125
2.16 Schematic for TOBY-L2 and MPCI-L2 module integration ............................................................ 128
2.16.1 Schematic for TOBY-L2 module “00” product version ........................................................... 128
2.16.2 Schematic for TOBY-L2 module “01” or “60” product versions............................................. 129
2.16.3 Schematic for TOBY-L2 module “02”, “03” or “62” product versions ..................................130
2.16.4 Schematic for MPCI-L2 series ......................................................................................................131
2.17 Design-in checklist.................................................................................................................................. 132
2.17.1 Schematic checklist....................................................................................................................... 132
2.17.2 Layout checklist.............................................................................................................................. 133
2.17.3 Antenna checklist........................................................................................................................... 134
3Handling and soldering ....................................................................................................................135
3.1 Packaging, shipping, storage and moisture preconditioning ........................................................ 135
3.2 Handling.................................................................................................................................................... 135
3.3 Soldering................................................................................................................................................... 136
3.3.1 Soldering paste ............................................................................................................................... 136
3.3.2 Reflow soldering.............................................................................................................................. 136
3.3.3 Optical inspection........................................................................................................................... 137
3.3.4 Cleaning ............................................................................................................................................ 137
3.3.5 Repeated reflow soldering ............................................................................................................138
3.3.6 Wave soldering................................................................................................................................ 138
3.3.7 Hand soldering ................................................................................................................................138
3.3.8 Rework ..............................................................................................................................................138
3.3.9 Conformal coating.......................................................................................................................... 138
3.3.10 Casting.............................................................................................................................................. 138
3.3.11 Grounding metal covers ................................................................................................................ 139
3.3.12 Use of ultrasonic processes ......................................................................................................... 139
4Approvals............................................................................................................................................. 140
4.1 Product certification approval overview............................................................................................. 140
4.2 US Federal Communications Commission notice.............................................................................141
4.2.1 Safety warnings review the structure.........................................................................................141
4.2.2 Declaration of Conformity..............................................................................................................141
4.2.3 Modifications................................................................................................................................... 142
4.3 Innovation, Science, Economic Development Canada notice ........................................................ 143
4.3.1 Declaration of Conformity............................................................................................................. 143
4.3.2 Modifications................................................................................................................................... 143
4.4 Brazilian Anatel certification ................................................................................................................ 145
4.5 European Conformance CE mark ........................................................................................................ 146
4.6 Australian Regulatory Compliance Mark ........................................................................................... 147
4.7 Taiwanese NCC certification ................................................................................................................ 147
4.8 Japanese Giteki certification ............................................................................................................... 148
5Product testing ..................................................................................................................................149

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5.1 u-blox in-series production test........................................................................................................... 149
5.2 Test parameters for OEM manufacturer...........................................................................................150
5.2.1 “Go/No go” tests for integrated devices ....................................................................................150
5.2.2 RF functional tests.........................................................................................................................150
Appendix ......................................................................................................................................................152
AMigration between TOBY-L1 and TOBY-L2...............................................................................152
A.1 Overview.................................................................................................................................................... 152
A.2 Pin-out comparison between TOBY-L1 and TOBY-L2 ..................................................................... 154
A.3 Schematic for TOBY-L1 and TOBY-L2 integration........................................................................... 157
BGlossary ................................................................................................................................................158
Related documents .................................................................................................................................. 161
Revision history .........................................................................................................................................162
Contact.........................................................................................................................................................164

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1System description
1.1 Overview
TOBY-L2 and MPCI-L2 series comprises LTE/3G/2G multi-mode modules supporting up to six LTE
bands, up to five UMTS/DC-HSPA+ bands and up to four GSM/(E)GPRS bands for voice and/or data
transmission as following:
TOBY-L200, TOBY-L201, MPCI-L200 and MPCI-L201 are designed primarily for operation in
America
TOBY-L210 and MPCI-L210 are designed primarily for operation in Europe, Asia and other
countries
TOBY-L220 and MPCI-L220 are designed primarily for operation in Japan
TOBY-L280 and MPCI-L280 are designed primarily for operation in Asia and Oceania
TOBY-L2 and MPCI-L2 series are designed in two different form-factors suitable for applications as
following:
TOBY-L2 modules are designed in the small TOBY 152-pin Land Grid Array form-factor (35.6 x 24.8
mm), easy to integrate in compact designs and form-factor compatible with the u-blox cellular
module families: this allows customers to take the maximum advantage of their hardware and
software investments, and provides very short time-to-market.
The modules are the perfect choice for consumer fixed-wireless terminals, mobile routers and
gateways, and applications requiring video streaming. They are also optimally suited for industrial
(M2M) applications, such as remote access to video cameras, digital signage, telehealth, and
security and surveillance systems
MPCI-L2 modules are designed in the industry standard PCI Express Full-Mini Card form-factor
(51 x 30 mm) easy to integrate into industrial and consumer applications and also ideal for
manufacturing of small series.
Typical applications are industrial computing, ruggedized terminals, video communications,
wireless routers, alarm panels and surveillance, digital signage and payment systems.
With LTE Category 4 data rates at up to 150 Mb/s (down-link) and 50 Mb/s (up-link), the TOBY-L2 and
MPCI-L2 series modules are ideal for applications requiring the highest data-rates and high-speed
internet access.

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Table 1 summarizes the TOBY-L2 and MPCI-L2 series main features and interfaces.
Module
LTE
UMTS
GSM
Interfaces
Audio
Features
Grade
LTE FDD category
Bands
HSDPA category
HSUPA category
Bands
GPRS/EDGE multi-slot class
Bands
UART
USB 2.0
SDIO (Master)
DDC (I2C)
GPIOs
Analog audio
Digital audio
Network indication
Antenna supervisor
MIMO 2x2 / Rx Diversity
Embedded TCP/UDP stack
Embedded HTTP,FTP
FOTA
Dual stack IPv4/IPv6
Standard
Professional
Automotive
TOBY-L200
4
2,4,5
7,17
24
6
1,2,4
5,8
12
Quad
♦
●
♦
♦
♦
♦
●
♦
●
♦
♦
♦
●
●
●
TOBY-L201
4
2,4,5
13,17
24
6
2,5
●
●
♦
♦
●
♦
●
●
●
●
●
●
TOBY-L210
4
1,3,5
7,8,20
24
6
1,2
5,8
12
Quad
♦
●
■
■
■
■
●
■
●
■
■
■
●
●
●
TOBY-L220 1
4
1,3,5
6,8,19
24
6
1,6
8,19
●
●
●
●
●
▲
●
●
●
●
●
●
●
●
TOBY-L280
4
1,3,5
7,8,28
24
6
1,2
5,8
12
Quad
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
MPCI-L200
4
2,4,5
7,17
24
6
1,2,4
5,8
12
Quad
●
●
●
♦
♦
♦
●
●
MPCI-L201
4
2,4,5
13,17
24
6
2,5
●
●
●
●
●
●
●
●
MPCI-L210
4
1,3,5
7,8,20
24
6
1,2
5,8
12
Quad
●
●
●
■
■
■
●
●
MPCI-L2201
4
1,3,5
6,8,19
24
6
1,6
8,19
●
●
●
●
●
●
●
●
MPCI-L280
4
1,3,5
7,8,28
24
6
1,2
5,8
12
Quad
●
●
●
●
●
●
●
●
●= supported by all product versions
♦= supported by all product versions except versions “00”,”01”
■= supported by all product versions except versions “00”,”60”
▲= supported by all product versions except versions “62”
Table 1: TOBY-L2 and MPCI-L2 series main features summary
TOBY-L2 modules provide Circuit-Switched-Fall-Back (CSFB)
2
audio capability.
Table 2 reports a summary of cellular radio access technologies characteristics and features of the
modules.
1
TOBY-L220-62S and MPCI-L220-62S product versions do not support UMTS Radio Access Technology
2
Not supported by “00”, “01”, “60”, TOBY-L201-02S and TOBY-L220-62S product versions.

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4G LTE
3G UMTS/HSDPA/HSUPA
2G GSM/GPRS/EDGE
3GPP Release 9
Long Term Evolution (LTE)
Evolved UTRA (E-UTRA)
Frequency Division Duplex (FDD)
DL Multi-Input Multi-Output (MIMO) 2x2
3GPP Release 8
Dual-Cell HS Packet Access (DC-HSPA+)
UMTS Terrestrial Radio Access (UTRA)
Frequency Division Duplex (FDD)
DL Rx diversity
3GPP Release 8
Enhanced Data rate GSM Evolution (EDGE)
GSM EGPRS Radio Access (GERA)
Time Division Multiple Access (TDMA)
DL Advanced Rx Performance Phase 1
Band support3:
TOBY-L200 / MPCI-L200:
oBand 17 (700 MHz)
oBand 5 (850 MHz)
oBand 4 (AWS, i.e. 1700 MHz)
oBand 2 (1900 MHz)
oBand 7 (2600 MHz)
TOBY-L201 / MPCI-L201:
oBand 17 (700 MHz)
oBand 13 (750 MHz)
oBand 5 (850 MHz)
oBand 4 (AWS, i.e. 1700 MHz)
oBand 2 (1900 MHz)
TOBY-L210 / MPCI-L210:
oBand 20 (800 MHz)
oBand 5 (850 MHz)
oBand 8 (900 MHz)
oBand 3 (1800 MHz)
oBand 1 (2100 MHz)
oBand 7 (2600 MHz)
TOBY-L220 / MPCI-L220:
oBand 19 (850 MHz)
oBand 6 (850 MHz)
oBand 5 (850 MHz)
oBand 8 (900 MHz)
oBand 3 (1800 MHz)
oBand 1 (2100 MHz)
TOBY-L280 / MPCI-L280:
oBand 28 (750 MHz)
oBand 5 (850 MHz)
oBand 8 (900 MHz)
oBand 3 (1800 MHz)
oBand 1 (2100 MHz)
oBand 7 (2600 MHz)
Band support:
TOBY-L200 / MPCI-L200:
oBand 5 (850 MHz)
oBand 8 (900 MHz)
oBand 4 (AWS, i.e. 1700 MHz)
oBand 2 (1900 MHz)
oBand 1 (2100 MHz)
TOBY-L201 / MPCI-L201:
oBand 5 (850 MHz)
oBand 2 (1900 MHz)
TOBY-L210 / MPCI-L210:
oBand 5 (850 MHz)
oBand 8 (900 MHz)
oBand 2 (1900 MHz)
oBand 1 (2100 MHz)
TOBY-L2204/ MPCI-L2204:
oBand 19 (850 MHz)
oBand 6 (850 MHz)
oBand 8 (900 MHz)
oBand 1 (2100 MHz)
TOBY-L280 / MPCI-L280:
oBand 5 (850 MHz)
oBand 8 (900 MHz)
oBand 2 (1900 MHz)
oBand 1 (2100 MHz)
Band support
TOBY-L200 / MPCI-L200:
oGSM 850 MHz
oE-GSM 900 MHz
oDCS 1800 MHz
oPCS 1900 MHz
TOBY-L210 / MPCI-L210:
oGSM 850 MHz
oE-GSM 900 MHz
oDCS 1800 MHz
oPCS 1900 MHz
TOBY-L280 / MPCI-L280:
oGSM 850 MHz
oE-GSM 900 MHz
oDCS 1800 MHz
oPCS 1900 MHz
LTE Power Class
Class 3 (23 dBm)
for LTE mode
WCDMA/HSDPA/HSUPA Power Class
Class 3 (24 dBm)
for UMTS/HSDPA/HSUPA mode
GSM/GPRS (GMSK) Power Class
Class 4 (33 dBm) in GSM/E-GSM bands
Class 1 (30 dBm) in DCS/PCS bands
EDGE (8-PSK) Power Class
Class E2 (27 dBm) in GSM/E-GSM bands
Class E2 (26 dBm) in DCS/PCS bands
Data rate
LTE category 4:
up to 150 Mb/s DL, 50 Mb/s UL
Data rate
xxxx-L200 / xxxx-L201:
oHSDPA cat.14, up to 21 Mb/s DL5
oHSUPA cat.6, up to 5.6 Mb/s UL
xxxx-L210 / xxxx-L220 / xxxx-L280:
oHSDPA cat.24, up to 42 Mb/s DL
oHSUPA cat.6, up to 5.6 Mb/s UL
Data rate6
GPRS multi-slot class 127, CS1-CS4,
up to 85.6 kb/s DL/UL
EDGE multi-slot class 127, MCS1-MCS9
up to 236.8 kb/s DL/UL
Table 2: TOBY-L2 and MPCI-L2 series LTE, 3G and 2G characteristics summary
3
The modules support all E-UTRA channel bandwidths for each operating band according to 3GPP TS 36.521-1 [23]
4
TOBY-L220-62S and MPCI-L220-62S product versions do not support 3G Radio Access Technology
5
HSDPA category 24 capable
6
GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at
which data can be transmitted and received, with higher classes typically allowing faster data transfer rates.
7
GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in Down-Link and 4 slots in Up-Link with 5 slots in total.

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1.2 Architecture
Figure 1 summarizes the internal architecture of TOBY-L2 series modules.
Cellular
Base-band
Processor
Memory
Power Management Unit
26 MHz
32.768 kHz
ANT1
RF
Transceiver
ANT2
V_INT (I/O)
V_BCKP (RTC)
VCC (Supply)
SIM
USB
GPIO
Power On
External Reset
PAs
LNA
s
Filters
Filter
s
Duplexer
Filters
PAs
LNA
s
Filter
s
Filter
s
Duplexer
Filters
LNA
s
Filter
s
Filters
LNA
s
FiltersFilter
s
Switch
Switch
DDC(I2C)
SDIO
UART
Digital audio (I2S)
ANT_DET
Host Select
Figure 1: TOBY-L2 series block diagram
As described in the Figure 2, each MPCI-L2 series module integrates one TOBY-L2 series module:
The MPCI-L200 integrates a TOBY-L200 module
The MPCI-L201 integrates a TOBY-L201 module
The MPCI-L210 integrates a TOBY-L210 module
The MPCI-L220 integrates a TOBY-L220 module
The MPCI-L280 integrates a TOBY-L280 module
The TOBY-L2 module represents the core of the device, providing the related LTE/3G/2G modem and
processing functionalities. Additional signal conditioning circuitry is implemented for PCI Express
Mini Card compliance, and two UF.L connectors are available for easy antenna integration.
ANT1
SIM
USB
W_DISABLE#
TOBY-L2
series
Signal
Conditioning
ANT2
PERST#
LED_WWAN#
U.FL
U.FL
3.3Vaux (Supply)
Boost
Converter
VCC
Figure 2: MPCI-L2 series block diagram

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1.2.1 Internal blocks
As described in Figure 2, each MPCI-L2 series module integrates one TOBY-L2 series module, which
consists of the following internal sections: RF, baseband and power management.
RF section
The RF section is composed of RF transceiver, PAs, LNAs, crystal oscillator, filters, duplexers and RF
switches.
Tx signal is pre-amplified by RF transceiver, then output to the primary antenna input/output port
(ANT1) of the module via power amplifier (PA), SAW band pass filters band, specific duplexer and
antenna switch.
Dual receiving paths are implemented according to LTE Down-Link MIMO 2 x 2 and 3G Receiver
Diversity radio technologies supported by the modules as LTE category 4 and HSDPA category 24
User Equipments: incoming signals are received through the primary (ANT1) and the secondary
(ANT2) antenna input ports which are connected to the RF transceiver via specific antenna switch,
diplexer, duplexer, LNA, SAW band pass filters.
RF transceiver performs modulation, up-conversion of the baseband I/Q signals for Tx,
down-conversion and demodulation of the dual RF signals for Rx. The RF transceiver contains:
oAutomatically gain controlled direct conversion Zero-IF receiver,
oHighly linear RF demodulator / modulator capable GMSK, 8-PSK, QPSK, 16-QAM, 64-QAM,
oFractional-N Sigma-Delta RF synthesizer,
oVCO.
Power Amplifiers (PA) amplify the Tx signal modulated by the RF transceiver
RF switches connect primary (ANT1) and secondary (ANT2) antenna ports to the suitable Tx / Rx
path
Low Noise Amplifiers (LNA) enhance the received sensitivity
SAW duplexers separate the Tx and Rx signal paths and provide RF filtering
SAW band pass filters enhance the rejection of out-of-band signals
26 MHz crystal oscillator generates the clock reference in active-mode or connected-mode.
Baseband and power management section
The Baseband and Power Management section is composed of the following main elements:
A mixed signal ASIC, which integrates
oMicroprocessor for control functions
oDSP core for LTE/3G/2G Layer 1 and digital processing of Rx and Tx signal paths
oMemory interface controller
oDedicated peripheral blocks for control of the USB, SIM and GPIO digital interfaces
oAnalog front end interfaces to RF transceiver ASIC
Memory system, which includes NAND flash and LPDDR
Voltage regulators to derive all the subsystem supply voltages from the module supply input VCC
Voltage sources for external use: V_BCKP and V_INT (not available on MPCI-L2 series modules)
Hardware power on
Hardware reset
Low power idle-mode support
32.768 kHz crystal oscillator to provide the clock reference in the low power idle-mode, which can
be set by enable power saving configuration using the AT+UPSV command.

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1.3 Pin-out
1.3.1 TOBY-L2 series pin assignment
Table 3 lists the pin-out of the TOBY-L2 series modules, with pins grouped by function.
Function
Pin name
Pin No
I/O
Description
Remarks
Power
VCC
70,71,72
I
Module supply input
VCC pins are internally connected each other.
VCC supply circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.5.1 for functional description/ requirements
See section 2.2.1 for external circuit design-in.
GND
2, 30, 32,
44, 46, 69,
73, 74, 76,
78, 79, 80,
82, 83, 85,
86, 88-90,
92-152
N/A
Ground
GND pins are internally connected each other.
External ground connection affects the RF and thermal
performance of the device.
See section 1.5.1 for functional description.
See section 2.2.1 for external circuit design-in.
V_BCKP
3
I/O
RTC supply
input/output
V_BCKP = 3.0 V (typical) generated by internal regulator
when valid VCC supply is present.
See section 1.5.2 for functional description.
See section 2.2.2 for external circuit design-in.
V_INT
5
O
Generic digital
interfaces supply
output
V_INT = 1.8 V (typical) generated by internal regulator
when the module is switched on.
Test-Point for diagnostic access is recommended.
See section 1.5.3 for functional description.
See section 2.2.3 for external circuit design-in.
System
PWR_ON
20
I
Power-on input
Internal active pull-up to the VCC enabled.
See section 1.6.1 for functional description.
See section 2.3.1 for external circuit design-in.
RESET_N
23
I
External reset input
Internal active pull-up to the VCC enabled.
Test-Point for diagnostic access is recommended.
See section 1.6.3 for functional description.
See section 2.3.2 for external circuit design-in.
HOST_SELECT0
26
I
Selection of module
configuration by the
host processor
Not supported by all the product versions.
See section 1.6.4 for functional description.
See section 2.3.3 for external circuit design-in.
HOST_SELECT1
62
I
Selection of module
configuration by the
host processor
Not supported by all the product versions.
See section 1.6.4 for functional description.
See section 2.3.3 for external circuit design-in.
Antennas
ANT1
81
I/O
Primary antenna
Main Tx / Rx antenna interface.
50 nominal characteristic impedance.
Antenna circuit affects RF performance and application
device compliance with required certification schemes.
See section 1.7 for functional description / requirements.
See section 2.4 for external circuit design-in.
ANT2
87
I
Secondary antenna
Rx only for MIMO 2x2 and Rx diversity.
50 nominal characteristic impedance.
Antenna circuit affects RF performance and application
device compliance with required certification schemes.
See section 1.7 for functional description / requirements
See section 2.4 for external circuit design-in.
ANT_DET
75
I
Antenna detection
Not supported by “00”, “01”, “60” product versions.
See section 1.7.2 for functional description.
See section 2.4.2 for external circuit design-in.

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Function
Pin name
Pin No
I/O
Description
Remarks
SIM
VSIM
59
O
SIM supply output
VSIM = 1.8 V / 3 V output as per connected SIM type.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_IO
57
I/O
SIM data
Data input/output for 1.8 V / 3 V SIM
Internal 4.7 kpull-up to VSIM.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_CLK
56
O
SIM clock
3.43 MHz clock output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_RST
58
O
SIM reset
Reset output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
USB
VUSB_DET
4
I
USB detect input
Leave unconnected: VUSB_DET functionality is not
supported.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
USB_D-
27
I/O
USB Data Line D-
USB interface for AT and data communication, FOAT,
FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and series resistors as
required by USB 2.0 specifications [7] are part of the
USB pad driver and need not be provided externally.
If the USB interface is not used by the Application
Processor, Test-Point for diagnostic / FW update
access is recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
USB_D+
28
I/O
USB Data Line D+
USB interface for AT and data communication, FOAT,
FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and series resistors as
required by the USB 2.0 specifications [7] are part of the
USB pad driver and need not be provided externally.
If the USB interface is not used by the Application
Processor, Test-Point for diagnostic / FW update access
is recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.

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Function
Pin name
Pin No
I/O
Description
Remarks
UART
RXD
17
O
UART data output
Not supported by “00” product versions.
1.8 V output, Circuit 104 (RXD) in ITU-T V.24,
for AT and data communication, FOAT, diagnostic.
Test-Point and series 0 recommended for diagnostic.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
TXD
16
I
UART data input
Not supported by “00” product versions.
1.8 V input, Circuit 103 (TXD) in ITU-T V.24,
for AT and data communication, FOAT, diagnostic.
Internal active pull-up to V_INT.
Test-Point and series 0 recommended for diagnostic.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
CTS
15
O
UART clear to send
output
Not supported by “00” product versions.
1.8 V output, Circuit 106 (CTS) in ITU-T V.24.
Test-Point and series 0 recommended for diagnostic.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
RTS
14
I
UART ready to send
input
Not supported by “00” product versions.
1.8 V input, Circuit 105 (RTS) in ITU-T V.24.
Internal active pull-up to V_INT.
Test-Point and series 0 recommended for diagnostic.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
DSR
10
O /
I/O
UART data set
ready output / GPIO
UART DSR not supported by “00” product versions;
GPIO not supported by “00”, “01”, “60” versions.
1.8 V, Circuit 107 in ITU-T V.24, configurable as GPIO.
Test-Point and series 0 recommended for diagnostic.
See section 1.9.2 and 1.11 for functional description.
See section 2.6.2 and 2.8 for external circuit design-in.
RI
11
O /
I/O
UART ring indicator
output / GPIO
RI not supported by “00” product versions;
GPIO not supported by “00”, “01”, “60” versions.
1.8 V, Circuit 125 in ITU-T V.24, configurable as GPIO.
Test-Point and series 0 recommended for diagnostic.
See section 1.9.2 and 1.11 for functional description.
See section 2.6.2 and 2.8 for external circuit design-in.
DTR
13
I /
I/O
UART data terminal
ready input / GPIO
UART DTR not supported by “00” product versions;
GPIO not supported by “00”, “01”, “60” versions.
1.8 V, Circuit 108/2 in ITU-T V.24, configurable as GPIO.
Internal active pull-up to V_INT when configured as DTR
Test-Point and series 0 recommended for diagnostic.
See section 1.9.2 and 1.11 for functional description.
See section 2.6.2 and 2.8 for external circuit design-in.
DCD
12
O /
I/O
UART data carrier
detect output / GPIO
UART DCD not supported by “00” product versions;
GPIO not supported by “00”, “01”, “60” versions.
1.8 V, Circuit 109 in ITU-T V.24, configurable as GPIO.
Test-Point and series 0 recommended for diagnostic.
See section 1.9.2 and 1.11 for functional description.
See section 2.6.2 and 2.8 for external circuit design-in.

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Function
Pin name
Pin No
I/O
Description
Remarks
DDC
SCL
54
O
I2C bus clock line
Not supported by versions ‘00’, ‘01’, ‘60’, TOBY-L201-02S.
1.8 V open drain, to communicate with I2C-slave devices.
External pull-up required.
See section 1.9.3 for functional description.
See section 2.6.3 for external circuit design-in.
SDA
55
I/O
I2C bus data line
Not supported by versions ‘00’, ‘01’, ‘60’, TOBY-L201-02S.
1.8 V open drain, to communicate with I2C-slave devices.
External pull-up required.
See section 1.9.3 for functional description.
See section 2.6.3 for external circuit design-in.
SDIO
SDIO_D0
66
I/O
SDIO serial data [0]
Not supported by “00”, “01”, “60” product versions.
Interface for communication with u-blox Wi-Fi module.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D1
68
I/O
SDIO serial data [1]
Not supported by “00”, “01”, “60” product versions.
Interface for communication with u-blox Wi-Fi module.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D2
63
I/O
SDIO serial data [2]
Not supported by “00”, “01”, “60” product versions.
Interface for communication with u-blox Wi-Fi module.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D3
67
I/O
SDIO serial data [3]
Not supported by “00”, “01”, “60” product versions.
Interface for communication with u-blox Wi-Fi module.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_CLK
64
O
SDIO serial clock
Not supported by “00”, “01”, “60” product versions.
Interface for communication with u-blox Wi-Fi module.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_CMD
65
I/O
SDIO command
Not supported by “00”, “01”, “60” product versions.
Interface for communication with u-blox Wi-Fi module.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
Audio
I2S_TXD
51
O /
I/O
I2S transmit data /
GPIO
I2S not supported by vers.‘00’,‘01’,‘60’,‘L201-02’,‘L220-62’
GPIO not supported by versions ‘00’, ‘01’, ‘60’.
I2S data output, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_RXD
53
I /
I/O
I2S receive data /
GPIO
I2S not supported by vers.‘00’,‘01’,‘60’,‘L201-02’,‘L220-62’
GPIO not supported by versions ‘00’, ‘01’, ‘60’.
I2S data input, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_CLK
52
I/O /
I/O
I2S clock /
GPIO
I2S not supported by vers.‘00’,‘01’,‘60’,‘L201-02’,‘L220-62’
GPIO not supported by versions ‘00’, ‘01’, ‘60’.
I2S serial clock, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_WA
50
I/O /
I/O
I2S word alignment /
GPIO
I2S not supported by vers.‘00’,‘01’,‘60’,‘L201-02’,‘L220-62’
GPIO not supported by versions ‘00’, ‘01’, ‘60’.
I2S word alignment, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.

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Function
Pin name
Pin No
I/O
Description
Remarks
GPIO
GPIO1
21
I/O
GPIO
Not supported by “00”, “01”, “60” product versions,
providing WWAN status indication on GPIO1 pin.
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO2
22
I/O
GPIO
Not supported by “00”, “01”, “60” product versions.
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO3
24
I/O
GPIO
Not supported by “00”, “01”, “60” product versions.
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO4
25
I/O
GPIO
Not supported by “00”, “01”, “60” product versions.
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO5
60
I/O
GPIO
Not supported by “00”, “01”, “60” product versions.
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO6
61
I/O
GPIO
Not supported by “00”, “01”, “60” product versions.
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
Reserved
RSVD
6
N/A
Reserved pin
This pin must be connected to ground.
See section 2.10
RSVD
1, 7-9, 18,
19, 29, 31,
33-43, 45,
47-49, 77,
84, 91
N/A
Reserved pin
Leave unconnected.
See section 2.10
Table 3: TOBY-L2 series module pin definition, grouped by function
1.3.2 MPCI-L2 series pin assignment
Table 4 lists the pin-out of the MPCI-L2 series modules, with pins grouped by function.
Function
Pin name
Pin No
I/O
Description
Remarks
Power
3.3Vaux
2, 24, 39,
41, 52
I
Module supply input
3.3Vaux pins are internally connected each other.
3.3Vaux supply circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.5.1 for functional description / requirements.
See section 2.2.1 for external circuit design-in.
GND
4, 9, 15, 18,
21, 26, 27,
29, 34, 35,
37, 40, 43,
50
N/A
Ground
GND pins are internally connected each other.
External ground connection affects the RF and thermal
performance of the device.
See section 1.5.1 for functional description.
See section 2.2.1 for external circuit design-in.
Auxiliary
Signals
PERST#
22
I
External reset input
Internal 45 kpull-up to 3.3 V supply.
See section 1.6.3 for functional description.
See section 2.3.2 for external circuit design-in.

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Function
Pin name
Pin No
I/O
Description
Remarks
Antennas
ANT1
U.FL
I/O
Primary antenna
Main Tx / Rx antenna interface.
50 nominal characteristic impedance.
Antenna circuit affects RF performance and integrating
device compliance with applicable certification schemes.
See section 1.7 for functional description / requirements.
See section 2.4 for external circuit design-in.
ANT2
U.FL
I
Secondary antenna
Rx only for MIMO 2x2 and Rx diversity.
50 nominal characteristic impedance.
Antenna circuit affects RF performance and integrating
device compliance with applicable certification schemes.
See section 1.7 for functional description / requirements
See section 2.4 for external circuit design-in.
SIM
UIM_PWR
8
O
SIM supply output
UIM_PWR = 1.8 V / 3 V automatically generated
according to the connected SIM type.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
UIM_DATA
10
I/O
SIM data
Data input/output for 1.8 V / 3 V SIM
Internal 4.7 kpull-up to UIM_PWR.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
UIM_CLK
12
O
SIM clock
3.43 MHz clock output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
UIM_RESET
14
O
SIM reset
Reset output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
USB
USB_D-
36
I/O
USB Data Line D-
USB interface for AT and data communication, FOAT,
FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and series resistors as
required by the USB 2.0 specifications [7] are part of the
USB pad driver and need not be provided externally.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
USB_D+
38
I/O
USB Data Line D+
USB interface for AT and data communication, FOAT,
FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and series resistors as
required by the USB 2.0 specifications [7] are part of the
USB pad driver and need not be provided externally.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
Specific
Signals
LED_WWAN#
42
O
LED indicator
output
Open drain active low output.
See section 1.12 for functional description.
See section 2.9 for external circuit design-in.
W_DISABLE#
20
I
Wireless radio
disable input
Internal 22 kpull-up to 3.3Vaux.
See section 1.12 for functional description.
See section 2.9 for external circuit design-in.
Not
Connected
NC
1, 3, 5-7, 11,
13,16,17,19,
23, 25, 28,
30-33, 44-
46,47-49,51
N/A
Not connected
Internally not connected.
See section 1.14 for the description.
Table 4: MPCI-L2 series module pin definition, grouped by function

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1.4 Operating modes
TOBY-L2 and MPCI-L2 series modules have several operating modes. The operating modes are
defined in Table 5 and described in detail in Table 6, providing general guidelines for operation.
General Status
Operating Mode
Definition
Power-down
Not-Powered Mode
VCC or 3.3Vaux supply not present or below operating range: module is switched off.
Power-Off Mode
VCC or 3.3Vaux supply within operating range and module is switched off.
Normal Operation
Idle-Mode
Module processor core runs with 32 kHz reference generated by the internal oscillator.
Active-Mode
Module processor core runs with 26 MHz reference generated by the internal oscillator.
Connected-Mode
RF Tx/Rx data connection enabled and processor core runs with 26 MHz reference.
Table 5: TOBY-L2 and MPCI-L2 series modules operating modes definition
Operating Mode
Description
Transition between operating modes
Not-Powered Mode
Module is switched off.
Application interfaces are not accessible.
When VCC or 3.3Vaux supply is removed, the module
enters not-powered mode.
When in not-powered mode, TOBY-L2 modules cannot be
switched on by PWR_ON, RESET_N or RTC alarm and enter
active-mode after applying VCC supply (see 1.6.1).
When in not-powered mode, MPCI-L2 modules cannot be
switched on by RTC alarm and enter active-mode after
applying 3.3Vaux supply (see 1.6.1).
Power-Off Mode
Module is switched off: normal shutdown by
an appropriate power-off event (see 1.6.2).
Application interfaces are not accessible.
MPCI-L2 modules do not support Power-Off
Mode but halt mode (see 1.6.2 and u-blox AT
Commands Manual [3], AT+CFUN=127
command).
When the module is switched off by an appropriate power-
off event (see 1.6.2), the module enters power-off mode
from active-mode.
When in power-off mode, TOBY-L2 modules can be
switched on by PWR_ON, RESET_N or an RTC alarm.
When in power-off mode, TOBY-L2 modules enter the
not-powered mode after removing VCC supply.
Idle-Mode
Module is switched on with application
interfaces temporarily disabled or
suspended: the module is temporarily not
ready to communicate with an external
device by means of the application
interfaces as configured to reduce the
current consumption.
The module enters the low power idle-mode
whenever possible if power saving is enabled
by AT+UPSV (see u-blox AT Commands
Manual [3]) reducing current consumption
(see 1.5.1.5).
With HW flow control enabled and
AT+UPSV=1 or AT+UPSV=3, the UART CTS
line indicates when the UART is enabled
(see 1.9.2.3, 1.9.2.4).
With HW flow control disabled, the UART
CTS line is fixed to ON state (see 1.9.2.3).
Power saving configuration is not enabled by
default: it can be enabled by the AT+UPSV
command (see the u-blox AT Commands
Manual [3]).
The modules automatically switch from active-mode to low
power idle-mode whenever possible if power saving is
enabled (see sections 1.5.1.5, 1.9.1.4, 1.9.2.4 and u-blox AT
Commands Manual [3], AT+UPSV).
The modules wake up from low power idle-mode to active-
mode in the following events:
Automatic periodic monitoring of the paging channel for
the paging block reception according to network conditions
(see 1.5.1.5)
The connected USB host forces a remote wakeup of the
module as USB device (see 1.9.1.4)
Automatic periodic enable of the UART interface to
receive / send data, with AT+UPSV=1 (see 1.9.2.4)
Data received over UART, with HW flow control disabled
and power saving enabled (see 1.9.2.4)
RTS input set ON by the host DTE, with HW flow control
disabled and AT+UPSV=2 (see 1.9.2.4)
DTR input set ON by the host DTE, with AT+UPSV=3
(see 1.9.2.4)
The connected SDIO device forces a wakeup of the
module as SDIO host (see 1.9.4)
A preset RTC alarm occurs (see u-blox AT Commands
Manual [3], AT+CALA)

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R28 System description Page 20 of 164
Operating Mode
Description
Transition between operating modes
Active-Mode
Module is switched on with application
interfaces enabled or not suspended: the
module is ready to communicate with an
external device by means of the application
interfaces unless power saving
configuration is enabled by AT+UPSV (see
1.9.1.4, 1.9.2.4 and u-blox AT Commands
Manual [3]).
When the module is switched on by an appropriate
power-on event (see 1.6.1), the module enters active-mode
from power-off mode.
If power saving configuration is enabled by the AT+UPSV
command, the module automatically switches from active
to idle-mode whenever possible and the module wakes up
from idle to active-mode in the events listed above (see
idle-mode to active-mode transition description above).
When a RF Tx/Rx data connection is initiated or when RF
Tx/Rx is required due to a connection previously initiated,
the module switches from active to connected-mode.
Connected-Mode
RF Tx/Rx data connection is in progress.
The module is prepared to accept data
signals from an external device unless
power saving configuration is enabled by
AT+UPSV (see sections 1.9.1.4, 1.9.2.4 and
u-blox AT Commands Manual [3]).
When a data connection is initiated, the module enters
connected-mode from active-mode.
Connected-mode is suspended if Tx/Rx data is not in
progress, due to connected discontinuous reception and
fast dormancy capabilities of the module and according to
network environment settings and scenario. In such case,
the module automatically switches from connected to
active mode and then, if power saving configuration is
enabled by the AT+UPSV command, the module
automatically switches to idle-mode whenever possible.
Vice-versa, the module wakes up from idle to active mode
and then connected mode if RF Tx/Rx is necessary.
When a data connection is terminated, the module returns
to the active-mode.
Table 6: TOBY-L2 and MPCI-L2 series modules operating modes description
Figure 3 describes the transition between the different operating modes.
TOBY-L2 Switch ON:
•Apply VCC
MPCI-L2 Switch ON:
•Apply 3.3Vaux
If power saving is enabled
and there is no activity for
a defined time interval
Any wake up event described
in the module operating
modes summary table above
Incoming/outgoing call or
other dedicated device
network communication
No RF Tx/Rx in progress,
Call terminated,
Communicationdropped
TOBY-L2
Switch ON:
•PWR_ON
•RESET_N
•RTC alarm
Not
powered
Power off
ActiveConnected Idle
TOBY-L2
Switch OFF:
•AT+CPWROFF
•RESET_N
MPCI-L2:
•AT+CFUN=127 and
then remove 3.3Vaux
TOBY-L2:
•Remove VCC
Figure 3: TOBY-L2 and MPCI-L2 series modules operating modes transition