
SARA-G3 and SARA-U2 series - System Integration Manual
UBX-13000995 - R26 Contents
Page 7 of 217
2.9 Reserved pins (RSVD) ........................................................................................................................ 160
2.10 Module placement........................................................................................................................ 160
2.11 Module footprint and paste mask ................................................................................................. 161
2.12 Thermal guidelines........................................................................................................................ 162
2.13 ESD guidelines .............................................................................................................................. 164
2.13.1 ESD immunity test overview ...................................................................................................... 164
2.13.2 ESD immunity test of u-blox SARA-G3 and SARA-U2 reference designs..................................... 164
2.13.3 ESD application circuits.............................................................................................................. 165
2.14 SARA-G3 / SARA-U2 ATEX modules integration in devices intended for use in potentially explosive
atmospheres................................................................................................................................................ 167
2.14.1 General guidelines..................................................................................................................... 167
2.14.2 Guidelines for VCC supply circuit design ................................................................................... 168
2.14.3 Guidelines for antenna RF interface design................................................................................ 170
2.15 Schematic for SARA-G3 and SARA-U2 series module integration .................................................. 171
2.15.1 Schematic for SARA-G300 / SARA-G310 modules integration ................................................... 171
2.15.2 Schematic for SARA-G340 / SARA-G350 modules integration ................................................... 172
2.15.3 Schematic for SARA-U2 series modules integration ................................................................... 173
2.16 Design-in checklist ........................................................................................................................ 174
2.16.1 Schematic checklist ................................................................................................................... 174
2.16.2 Layout checklist......................................................................................................................... 175
2.16.3 Antenna checklist...................................................................................................................... 175
3Handling and soldering ...........................................................................................176
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 176
3.2 Handling........................................................................................................................................... 176
3.3 Soldering .......................................................................................................................................... 177
3.3.1 Soldering paste ......................................................................................................................... 177
3.3.2 Reflow soldering ....................................................................................................................... 177
3.3.3 Optical inspection...................................................................................................................... 178
3.3.4 Cleaning.................................................................................................................................... 178
3.3.5 Repeated reflow soldering......................................................................................................... 179
3.3.6 Wave soldering ......................................................................................................................... 179
3.3.7 Hand soldering.......................................................................................................................... 179
3.3.8 Rework...................................................................................................................................... 179
3.3.9 Conformal coating .................................................................................................................... 179
3.3.10 Casting...................................................................................................................................... 179
3.3.11 Grounding metal covers ............................................................................................................ 179
3.3.12 Use of ultrasonic processes........................................................................................................ 179
4Approvals..................................................................................................................180
4.1 Product certification approval overview............................................................................................. 180
4.2 US Federal Communications Commission notice............................................................................... 181
4.2.1 Safety warnings review the structure......................................................................................... 181
4.2.2 Declaration of conformity.......................................................................................................... 181
4.2.3 Modifications ............................................................................................................................ 182