Via technologies Amos-3006 User manual

USER MANUAL

VIA AMOS-3006

Ultra-compact fanless system for

embedded transportaon applicaons

in demanding environments

1.00-01222020-144700

No part of this document may be reproduced, transmied, transcribed, stored in a retrieval system, or translated into any language, in any

form or by any means, electronic, mechanical, magnec, opcal, chemical, manual or otherwise without the prior wrien permission of

VIA Technologies, Incorporated.

Trademarks

All trademarks are the property of their respecve holders.

Disclaimer

No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranes,

implied or otherwise, in regard to this document and to the products described in this document. The informaon provided in this

document is believed to be accurate and reliable as of the publicaon date of this document. However, VIA Technologies assumes no

responsibility for the use or misuse of the informaon (including use or connecon of extra device/equipment/add-on card) in this

document and for any patent infringements that may arise from the use of this document. The informaon and product specicaons

within this document are subject to change at any me, without noce and without obligaon to nofy any person of such change.

VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any me without prior noce.

Regulatory Compliance

FCC-A Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC rules.

These limits are designed to provide reasonable protecon against harmful interference when the equipment is operated in a commercial

environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the

instrucon manual, may cause harmful interference to radio communicaons. Operaon of this equipment in a residenal area is likely to

cause harmful interference, in which case the user will be required to correct the interference at his personal expense.

Noce 1

The changes or modicaons not expressly approved by the party responsible for compliance could void the user's authority to operate

the equipment.

Noce 2

Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.

Noce 3

The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conicts or

damages arising from incompability of the product. Check compability issue with your local sales representaves before placing an

order.

Baery Recycling and Disposal

• Only use the appropriate baery specied for this product.

• Do not re-use, recharge, or reheat an old baery.

• Do not aempt to force open the baery.

• Do not discard used baeries with regular trash.

• Discard used baeries according to local regulaons.

Safety Precauons

• Always read the safety instrucons carefully.

• Keep this User’s Manual for future reference.

• All cauons and warnings on the equipment should be noted.

• Keep this equipment away from humidity.

• Put this equipment on a reliable at surface before seng it up.

• Check the voltage of the power source and adjust to 110/220V before connecng the equipment to

the power inlet.

• Do not place the power cord where people will step on it.

• Always unplug the power cord before inserng any add-on card or module.

• If any of the following situaons arise, get the equipment checked by authorized service personnel:

• The power cord or plug is damaged.

• Liquid has entered into the equipment.

• The equipment has been exposed to moisture.

• The equipment is faulty or you cannot get it work according to User’s Manual.

• The equipment has been dropped and damaged.

• The equipment has an obvious sign of breakage.

• Do not leave this equipment in extreme temperatures or in a storage temperature above 65°C (149°F). The

equipment may be damaged.

• Do not leave this equipment in direct sunlight.

• Never pour any liquid into the opening. Liquid can cause damage or electrical shock.

• Do not place anything over the power cord.

• Do not cover the venlaon holes. The openings on the enclosure protect the equipment from

overheang.

Box Contents

• 1 x VIA AMOS-3006 system

• 1 x 4-pole Phoenix plug connector

• 1 x Screw pack for miniPCIe and mSATA modules

• 2 x Thermal pads for mSATA module and heatsink

• 1 x Screw pack for mounng

• 1 x Rubber feet pack

Ordering Informaon

Oponal Accessories

VIA AMOS-3006 User Manual

Part Number Descripon

AMOS-3006-1Q12A1 1.2GHz VIA Eden® X4 CPU with fanless cooling and HDMI, VGA, 2 USB 3.0,

2 Lockable USB 2.0, 4 COM, 2 CAN, DIO, 2 Gigabit Ethernet, 2 miniPCIe, 9~30V

DC-in power

Wireless Accessories

Part Number Descripon

EMIO- 1542-00A1 DAUK-W8812 IEEE 802.11ac/a/b/g/n dual-band USB Wi-Fi module with

assembly kit and antenna

EMIO-2531-00A1 VAB-820-W-M IEEE 802.11b/g/n miniPCIe Wi-Fi & Bluetooth module with

assembly kit and antenna

EMIO-2550-00A1 3.75G HSPA/UMTS mobile broadband full size miniPCIe module with GPS, SIM

card slot, assembly kit and antenna

EMIO-2551-02A0 3.75G HSPA/UMTS mobile broadband full size miniPCIe module (Europe only)

EMIO-2551-03A0 3.75G HSPA/UMTS mobile broadband full size miniPCIe module with GPS

(Europe only)

EMIO-2573-00A0 4G LTE mobile broadband full size miniPCIe module with assembly kit and

antenna pack (USA only)

EMIO-2573-01A0 4G LTE mobile broadband full size miniPCIe module with assembly kit and

antenna pack (Europe only)

EMIO-2573-02A0 4G LTE mobile broadband full size miniPCIe module with assembly kit and

antenna pack (Japan only)

VIA AMOS-3006 User Manual

Table of Contents

1. Product Overview .............................................................................................................. 1

1.1 Key Features ......................................................................................................................................... 1

1.1.1 High-Performance.......................................................................................................................... 1

1.1.2 Fanless and Ruggedized Chassis .................................................................................................... 1

1.1.3 OpmizedIntegraonwithMulpleI/OAccess............................................................................ 1

1.1.4 Storage Expansion.......................................................................................................................... 1

1.1.5 Networking Support....................................................................................................................... 1

1.1.6 Support for a Wide Range of Power Sources................................................................................. 1

1.1.7 WideRangeofOperangTemperatures........................................................................................ 1

1.1.8 ShockandVibraonResistant ....................................................................................................... 2

1.1.9 MounngSoluon ......................................................................................................................... 2

1.1.10 EmbeddedOperangSystemReady.............................................................................................. 2

1.2 ProductSpecicaons .......................................................................................................................... 3

1.3 Layout Diagram .................................................................................................................................... 6

1.4 Product Dimensions ............................................................................................................................. 7

2. ExternalI/OPinDescriponsandFunconality ................................................................ 8

2.1 HDMI®Port ........................................................................................................................................... 8

2.2 USB 3.0 Ports........................................................................................................................................ 8

2.3 Lockable USB 2.0 Ports ......................................................................................................................... 9

2.4 Gigabit Ethernet Ports .......................................................................................................................... 9

2.5 AudioJacks ......................................................................................................................................... 10

2.6 LEDIndicators..................................................................................................................................... 10

2.7 VGAPort ............................................................................................................................................. 10

2.8 COMPorts .......................................................................................................................................... 11

2.9 DIOPort.............................................................................................................................................. 11

2.10 CANBusPorts..................................................................................................................................... 12

2.11 DC-inJack ........................................................................................................................................... 12

3. OnboardI/O..................................................................................................................... 13

3.1 MiniPCIeSlots..................................................................................................................................... 13

3.2 SIMCardSlots .................................................................................................................................... 13

3.3 USB Wi-Fi Connectors......................................................................................................................... 14

3.4 mSATASlot.......................................................................................................................................... 14

3.5 DDR3SODIMMSlot............................................................................................................................ 15

4. OnboardJumper.............................................................................................................. 16

4.1 USB2.0PowerTypeJumper............................................................................................................... 17

5. HardwareInstallaon ...................................................................................................... 18

5.1 InstallingtheDDR3SODIMMMemory............................................................................................... 18

5.2 InstallingthemSATAFlashDriveModule ........................................................................................... 23

5.3 Installingthe4GSIMCard .................................................................................................................. 26

5.4 InstallingtheRubberFeet .................................................................................................................. 27

6. BIOSSetup ....................................................................................................................... 28

6.1 EnteringtheBIOSSetupUlity........................................................................................................... 28

6.2 Control Keys........................................................................................................................................ 28

6.3 GengHelp ....................................................................................................................................... 28

6.4 MainMenu......................................................................................................................................... 29

6.4.1 BIOSInformaon ......................................................................................................................... 29

6.4.2 MemoryInformaon ................................................................................................................... 29

6.4.3 System Language ......................................................................................................................... 29

6.4.4 System Date ................................................................................................................................. 29

6.4.5 System Time................................................................................................................................. 29

6.5 AdvancedSengs .............................................................................................................................. 30