
WAGO-I/O-SYSTEM 750 XTR Table of Contents 3
750-431/040-000 8DI 24 VDC 0.2ms XTR
Manual
Version 1.1.0
Table of Contents
1Notes about this Documentation .............................................................5
1.1 Validity of this Documentation.................................................................5
1.2 Copyright................................................................................................5
1.3 Symbols .................................................................................................6
1.4 Number Notation ....................................................................................7
1.5 Font Conventions ...................................................................................7
2Important Notes ........................................................................................8
2.1 Legal Bases............................................................................................8
2.1.1 Subject to Changes............................................................................8
2.1.2 Personnel Qualifications ....................................................................8
2.1.3 Use of the 750 Series in Compliance with Underlying Provisions.......8
2.1.4 Technical Condition of Specified Devices...........................................9
2.1.4.1 Disposal ........................................................................................9
2.1.4.1.1 Electrical and Electronic Equipment ..........................................9
2.1.4.1.2 Packaging ...............................................................................10
2.2 Safety Advice (Precautions) .................................................................11
3Device Description..................................................................................14
3.1 View .....................................................................................................16
3.2 Connectors ...........................................................................................17
3.2.1 Data Contacts/Local Bus..................................................................17
3.2.2 Power Jumper Contacts/Field Supply ..............................................18
3.2.3 CAGE CLAMP®Connectors.............................................................19
3.3 Display Elements..................................................................................20
3.4 Schematic Diagram ..............................................................................21
3.5 Technical Data .....................................................................................22
3.5.1 Device Data .....................................................................................22
3.5.2 Power Supply...................................................................................22
3.5.3 Communication................................................................................22
3.5.4 Inputs...............................................................................................23
3.5.5 Connection Type..............................................................................23
3.5.6 Mechanical Conditions .....................................................................23
3.5.7 Climatic Environmental Conditions...................................................24
3.6 Approvals .............................................................................................25
3.7 Standards and Guidelines ....................................................................26
4Process Image.........................................................................................32
5Mounting..................................................................................................33
5.1 Mounting Sequence..............................................................................33
5.2 Inserting and Removing Devices ..........................................................34
5.2.1 Inserting the I/O Module...................................................................34
5.2.2 Removing the I/O Module ................................................................35