
WAGO-I/O-SYSTEM 750 Table of Contents 3
750-564 4AO U/I
Manual
Version 1.0.0
Table of Contents
1Notes about this Documentation ..............................................................5
1.1 Validity of this Documentation..................................................................5
1.2 Copyright..................................................................................................5
1.3 Symbols ...................................................................................................6
1.4 Number Notation......................................................................................8
1.5 Font Conventions.....................................................................................8
2Important Notes ..........................................................................................9
2.1 Legal Bases .............................................................................................9
2.1.1 Subject to Changes.............................................................................9
2.1.2 Personnel Qualifications......................................................................9
2.1.3 Use of the 750 Series in Compliance with Underlying Provisions.......9
2.1.4 Technical Condition of Specified Devices .........................................10
2.1.5 Disposal ............................................................................................10
2.1.5.1 Electrical and Electronic Equipment .............................................10
2.1.5.2 Packaging.....................................................................................11
2.2 Safety Advice (Precautions)...................................................................12
3Device Description ...................................................................................15
3.1 View .......................................................................................................18
3.2 Connectors.............................................................................................19
3.2.1 Data Contacts/Local Bus...................................................................19
3.2.2 Power Jumper Contacts/Field Supply ...............................................20
3.2.3 Push-in CAGE CLAMP®Connectors ................................................21
3.3 Display Elements ...................................................................................22
3.4 Schematic Diagram................................................................................23
3.5 Technical Data.......................................................................................24
3.5.1 Device ...............................................................................................24
3.5.2 Power Supply ....................................................................................24
3.5.3 Communication .................................................................................24
3.5.4 Outputs..............................................................................................25
3.5.5 Climatic Environmental Conditions....................................................26
3.6 Approvals...............................................................................................27
3.7 Standards and Guidelines......................................................................28
4Process Image ..........................................................................................29
4.1 Overview................................................................................................29
4.2 Control and Status Bytes .......................................................................31
4.3 Prozess Data .........................................................................................33
4.3.1 Overview of Signal Types..................................................................33
4.3.2 Prozess Value (Voltage)....................................................................34
4.3.3 Process Values (Current)..................................................................39
5Mounting ...................................................................................................50
5.1 Mounting Sequence...............................................................................51
5.2 Inserting and Removing Devices ...........................................................52
5.2.1 Inserting the I/O Module....................................................................52
5.2.2 Removing the I/O Module..................................................................53