Acromag XCOM-6400 User manual

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XCOM-6400
Intel®4th Generation Core
COM Express CPU Module
USER’S MANUAL
ACROMAG INCORPORATED
30765 South Wixom Road
Wixom, MI 48393-2417 U.S.A.
Tel: [phone]
Fax: [phone]
Copyright 2015, Acromag, Inc., Printed in the USA.
Data and specifications are subject to change without notice.
8501003L

XCOM-6400
USER’S MANUAL
Acromag, Inc. Tel: [phone] - 1 -
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Table of Contents
1.0 GENERAL INFORMATION............................................................................................5
1.1 Intended Audience .......................................................................................................5
1.2 Preface.........................................................................................................................5
1.2.1 Trademark, Trade Name and Copyright Information ....................................................................... 5
1.2.2 Class A Product Warning................................................................................................................... 5
1.2.3 Environmental Protection Statement ............................................................................................... 5
1.3 Product Summary.........................................................................................................6
1.4 Related Material...........................................................................................................7
1.5 Ordering Information ...................................................................................................7
1.6 Key Features and Benefits ............................................................................................8
Fig. 1.6.a: XCOM-6400 Block Diagram ........................................................................................... 8
1.6.1 Intel® 4th Gen (Haswell) Core CPU ................................................................................................... 8
1.6.2 Intel QM87 Chipset (Lynx Point) PCH................................................................................................ 9
1.6.3 Intel I217 PHY.................................................................................................................................. 10
1.6.4 Nuvoton NCT6776D Super-I/O........................................................................................................ 10
1.6.5 Atmel AT97SC3204 TPM ................................................................................................................. 10
2.0 PREPARATION FOR USE........................................................................................... 11
2.1 Unpacking and Inspecting...........................................................................................11
2.2 Carrier Board Considerations ......................................................................................12
2.3 Carrier Board Installation............................................................................................12
2.4 Default Hardware Configuration .................................................................................12
3.0 HARDWARE INFORMATION AND CONFIGURATION....................................... 13
3.1 Module Hardware Configuration ................................................................................13
Fig. 3.1.a: XCOM-6400 Without Heat Spreader Top View.......................................................... 13
Fig. 3.1.b: XCOM-6400 Bottom View........................................................................................... 14
Table 3.1.a: Configuration Switches ........................................................................................... 15
3.2 Power Supply and Management .................................................................................15

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3.2.1 Power Options ................................................................................................................................ 15
3.2.2 Programmable CPU Power Limits ................................................................................................... 16
3.2.3 Power Management ....................................................................................................................... 17
3.3 CPU ............................................................................................................................18
3.3.1 Active Processor Core Selection...................................................................................................... 19
3.3.2 Turbo Boost Configuration.............................................................................................................. 19
3.4 Platform Controller Hub (PCH)....................................................................................19
3.5 System Memory .........................................................................................................20
3.6 Video .........................................................................................................................20
3.6.1 Display Configuration and Resolution............................................................................................. 20
Table 3.6.1.a: Valid Three Display Configuration through the Processor.................................... 21
3.6.2 PCI Express Graphics (PEG) ............................................................................................................. 22
3.6.3 VGA ................................................................................................................................................. 22
3.6.4 Digital Display Interfaces................................................................................................................. 22
3.6.5 Embedded DisplayPort.................................................................................................................... 25
3.6.6 Configuring the Primary Display ..................................................................................................... 25
3.6.7 Configuring the Video Memory....................................................................................................... 25
3.6.8 Video Display Options..................................................................................................................... 25
3.7 Intel®High Definition Audio ........................................................................................25
3.8 Storage I/O.................................................................................................................25
3.8.1 SATA ................................................................................................................................................ 25
3.9 General I/O ................................................................................................................26
3.9.1 General Purpose I/O (GPIO) ............................................................................................................ 26
3.9.2 SMBus and I2C ................................................................................................................................ 26
Table 3.9.2.a: SMBus/I2C Address Table ................................................................................... 27
3.9.3 Low Pin Count (LPC) ........................................................................................................................ 27
3.9.4 PCI Express ...................................................................................................................................... 27
3.9.5 Serial Ports ...................................................................................................................................... 28
3.9.6 SPI Flash .......................................................................................................................................... 28
3.9.7 USB.................................................................................................................................................. 28
3.10 Ethernet ...................................................................................................................29
3.10.1 Configuring Wake On LAN............................................................................................................. 29
3.10.2 Configuring PXE Boot .................................................................................................................... 29
3.11 Real Time Clock (RTC) ...............................................................................................29
3.12 Security ....................................................................................................................30

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3.12.1 Trusted Platform Support ............................................................................................................. 30
3.12.2 Password Control .......................................................................................................................... 30
3.13 System Management................................................................................................30
3.13.1 Intel® Hyper-Threading Technology............................................................................................... 30
3.13.2 Enhanced Intel®SpeedStep Technology (EIST).............................................................................. 31
3.13.3 Intel®Virtualization Technology (Intel VT-x and VT-d).................................................................. 31
3.13.4 Intel®Trusted Execution Technology (TXT) ................................................................................... 31
3.13.5 Intel®Turbo Boost Technology...................................................................................................... 31
3.13.6 Intel®Active Management Technology......................................................................................... 32
3.13.7 Intel®Matrix Storage Technology.................................................................................................. 33
3.13.8 Intel®Configurable TDP Technology ............................................................................................. 33
3.14 Thermal Management ..............................................................................................33
3.14.1 Fan Speed...................................................................................................................................... 33
3.14.2 Thermal Monitoring ...................................................................................................................... 33
3.14.3 Thermal Throttling ........................................................................................................................ 34
3.14.4 Memory Throttling........................................................................................................................ 34
3.14.5 Thermal Management Hardware.................................................................................................. 34
Fig. 3.14.5.a: XCOM-6400 without Thermal Management Hardware ....................................... 34
Fig. 3.14.5.b: XCOM-6400 and Heat Spreader ........................................................................... 35
Fig. 3.14.5.c: Module Mounting Screw Locations...................................................................... 36
Fig. 3.14.5.d: SODIMM Assembly............................................................................................... 37
Fig. 3.14.5.e: XCOM-6400 with Heat Spreader and Active Heat Sink ........................................ 38
Fig. 3.14.5.f: XCOM-6400, ACEX-4620 Carrier Board, and Heat Spreader Assembly................. 39
3.15 Watchdog.................................................................................................................39
4.0 BIOS INFORMATION AND CONFIGURATION ..................................................... 40
4.1 XCOM-6400 Special BIOS Features ..............................................................................40
Fig. 4.1.a: Acromag BIOS Setup Menu ....................................................................................... 40
Fig. 4.1.b: Acromag BIOS Setup Menu - GPO2........................................................................... 40
Fig. 4.1.c: Acromag BIOS Setup Menu - GPO3 ........................................................................... 41
Fig. 4.1.d: Acromag BIOS Setup Menu - GPI3 ............................................................................ 41
Fig. 4.1.e: Advanced BIOS Setup Menu - i217 LAN Port Configuration ..................................... 42
Fig. 4.1.f: Advanced BIOS Setup Menu - i217 NIC Configuration............................................... 42
4.2 Drivers and Utilities ....................................................................................................42
5.0 SERVICE AND REPAIR............................................................................................... 43
5.1 Service and Repair Assistance .....................................................................................43

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5.2 Preliminary Service Procedure ....................................................................................43
5.3 Where to Get Help......................................................................................................43
6.0 SPECIFICATIONS......................................................................................................... 44
6.1 Physical ......................................................................................................................44
6.1.1 J3 Connector ................................................................................................................................... 44
6.1.2 J4 Connector ................................................................................................................................... 44
6.2 Power Requirements ..................................................................................................44
6.3 Environmental Considerations ....................................................................................45
6.4 Reliability Prediction ....................................................................................................46
Table 6.4.a: MTBF ...................................................................................................................... 46
6.5 Certificate of Volatility................................................................................................47
APPENDIX A: COM-EXPRESS CONNECTOR (J4) PINOUT TABLE .......................... 47
REVISION HISTORY ............................................................................................................ 50

XCOM-6400
USER’S MANUAL
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1.0 GENERAL INFORMATION
1.1 Intended Audience
This users’ manual was written for technically qualified personnel who will be
working with I/O devices using the XCOM-6400 CPU. It is not intended for a
general, non-technical audience that is unfamiliar with computer-on-module
(COM) devices and their application.
1.2 Preface
The information contained in this manual is subject to change without notice,
and Acromag, Inc. (Acromag) does not guarantee its accuracy. Acromag
makes no warranty of any kind with regard to this material, including, but not
limited to, the implied warranties of merchantability and fitness for a
particular purpose. Further, Acromag assumes no responsibility for any
errors that may appear in this manual and makes no commitment to update,
or keep current, the information contained in this manual. No part of this
manual may be copied or reproduced in any form, without the prior written
consent of Acromag,
1.2.1 Trademark, Trade Name and Copyright Information
© 2014 by Acromag Incorporated.
All rights reserved. Acromag and Xembedded are registered trademarks of
Acromag Incorporated. All other trademarks, registered trademarks, trade
names, and service marks are the property of their respective owners.
1.2.2 Class A Product Warning
This is a Class A product. In a domestic environment this product may cause
radio interference, in which case the user may find it necessary to take
adequate corrective measures.
1.2.3 Environmental Protection Statement
This product has been manufactured to satisfy environmental protection
requirements where possible. Many components used (structural parts,
circuit boards, connectors, batteries, etc.) are capable of being recycled. Final
disposition of this product after its service life must be conducted in
accordance with applicable country, state, or local laws or regulations.

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1.3 Product Summary
COM ExpressTM is an open-industry standard for computer-on-modules
(COMs). These are highly-integrated and compact PCs that can be used in a
design application much like an integrated circuit component. Each COM
Express module integrates core CPU and memory functionality, the common
I/O of a PC/AT, USB, audio, graphics (PEG), and Ethernet. All I/O signals are
mapped to two high density, low profile connectors on the bottom side of
the module.
The XCOM-6400 uses an Intel®4th Generation Core Processor (Haswell)
module in a Type 6 COM Express basic form factor (125mm x 95mm). It fully
conforms to Revision 2.1 of the COM Express Module Base Specification
except those signals noted in Appendix A.
The module can support either one or two DDR3L ECC SODIMMs, for a total
of up to 16GB. The SODIMMs are firmly attached to the module with screws
and surrounded by heat sink material to provide a mechanically and
thermally robust mechanism. Extended temperature models are available
for operating in a -40°C to +85°C range.
A large amount of I/O is available, as summarized in the “Key Features and
Benefits” section below.
A two digit LED display is available for Power ON Self-Test (POST) codes,
should a problem arise during the boot operation. This display is available
for application software user codes after POST to aid in software debugging.
A 26-pin XDP debug connector is also available for connecting compatible
emulator tools directly to the CPU. For more information see Intel
publication 479493, Shark Bay and Denlow Platforms Debug Port Design
Guide.
All functional I/O and input power are available on the COM-Express
Connector (J4). In order for this module to function and to gain access to
the I/O it must be installed in a Type 6 R2.0 or R2.1 Com Express carrier
board.
WARNING: The XCOM-6400 must be installed onto a Type 6 carrier board
conforming to R2.0 or R2.1 of the Com-Express Specification. Damage to
the module and/or carrier may result if used with another carrier.

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1.4 Related Material
The following manuals and part specifications provide the necessary
information for in-depth understanding of the XCOM-6400 module.
COM-Express Module Base Specification Rev. 2.1
http://www.picmg.org
The Acromag APTIO Haswell Core BIOS Manual For Acromag Products
–
Referred to hereafter as The APTIO Haswell Core BIOS Manual For
Acromag
Products.
Intel® document No. 328901, “Mobile 4th Generation Intel® Core™
Processor Family Datasheet –Volume 1 of 2”, Rev: 002; September,
2013.
http://www.intel.com/content/www/us/en/processors/core/CoreTechnicalResources.html
ACEX-4600-EDK User's Manual
ACEX-4605/4610/4620 User's Manual
1.5 Ordering Information
When ordering the XCOM-6400-ABBD-X COM Express module, please select
from and specify the available option choices (A, BB, D and X) as defined below
(such as XCOM-6400-304-LF, etc.):
Select the CPU option (A):
1: 47W, i7-4700EQ, 2.4GHz, quad core, 6MB Cache
3: 25W, i5-4402E, 1.6GHz, dual core, 3MB Cache
Select the memory option (B);
04: 4GB
08: 8GB
16: 16GB
Select the operating environment (temperature) option (D):
Blank: Standard temperature operation
E: Extended temperature operation
Select the solder option (X):
L: Leaded solder (not available –consult factory)
LF: Lead-free solder

XCOM-6400
USER’S MANUAL
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1.6 Key Features and Benefits
The XCOM-6400 block diagram shown in Fig. 1.6.1 illustrates the key
components and features that are summarized on the following pages.
Fig. 1.6.a: XCOM-6400 Block Diagram
1.6.1 Intel® 4th Gen (Haswell) Core CPU
Available as either a 2.4GHz quad-core i7 or a 1.6GHZ dual-core i5. This 64-
bit, 22-nanometer (Haswell) CPU with integrated GT2 graphics contains direct
interfaces for DDR3L, DDI, and PCIe x16, all of which are available on the
COM Express connector. In addition, the Direct Media Interface (DMI) is used
to connect to the QM87 Platform Control Hub (PCH).

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DDR3L SDRAM –Two SODIMM sockets support up to 16GB of
DDR3L ECC at 1600MHz. Dual-channel mode is used with the two
SODIMMs. The SODIMMs are attached to the module firmly with
screws and surrounded by heat sink material to provide a robust
mechanism both mechanically and thermally.
PCIe x16 –Traditionally used for external graphics, but supports
any PCIe device(s). Can also be split into two x8 interfaces or one
x8 and two x4 interfaces.
DDI (3) –These Digital Display Interfaces can be configured to be
DisplayPort 1.2, DVI, or HDMI.
eDP –Embedded DisplayPort allows direct connection to a display
panel using up to two lanes for communication. Backlight and
voltage enable lines are also available.
Programmable CPU power limits –By simply programming a lower
power limit in the BIOS setup, the CPU can be used in applications
where less power is available or heat removal is an issue. This is
accomplished by the CPU automatically underclocking its frequency
to maintain a power level at the set limit.
1.6.2 Intel QM87 Chipset (Lynx Point) PCH
The Intel 8 Series QM87 (Lynx Point) PCH provides extensive I/O support, all
of which is available on the COM-EXPRESS connector and is listed below:
PCIe (7) –There are seven lanes of PCIe available in addition to the
x16 from the CPU.
SATA III (4) –There are four SATA ports that operate up to
6Gb/sec.
USB 3.0 (4) –There are four ports available that support USB 3.0
speed. These ports are backwards compatible to USB 2.0 and USB
1.1.
USB 2.0 (4) –There are four additional ports that function at USB
2.0 or USB 1.1 speeds. Note: Currently, these USB 2.0 ports only
support a keyboard or mouse.
VGA –An analog VGA port is available, including DDC clock and
data.
GPIN (4) –There are four 3.3V general purpose inputs available.
Do not exceed 3.6V or the module may be damaged.
GPOUT (4) –There are up to four 3.3V general purpose outputs
available.
WDTO –This Watchdog Timer Output indicates a watchdog time-
out event has occurred. This output remains high until cleared by
module software.
LPC –Low Pin Count bus allows connection of slower devices on
the carrier, typically Super-I/O or TPM devices.
SPI –The Serial Peripheral Interface is used for the onboard boot
flash. This interface is available on the carrier for connection of

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other user flash devices. Note that booting from carrier SPI is not
supported by the module.
HDA Audio –The HDA audio port is available to compatible CODECs
on the carrier.
I2C –This I2C bus is available for general user devices. It also
contains an onboard EEPROM for module identification. Note that
to access this bus from the PCH the connection must first be
enabled in the PCA9540 (see below).
SMBUS –This I2C-compatible System Management Bus is available
to the carrier, but care should be taken not to interfere with any
devices on the module.
1.6.3 Intel I217 PHY
The Intel I217 is a single-port Gigabit Ethernet Physical Layer Transceiver
(PHY). It connects to the PCH’s integrated Media Access Controller (MAC)
through a dedicated interconnect. It supports 10/100/1000 Mb/s data rates
and is available on the COM-Express connector.
1.6.4 Nuvoton NCT6776D Super-I/O
The Nuvoton NCT6776D is an LPC device that provides temperature and
voltage monitoring, Port 80 debug via 2 digit 7-segment display, and the
following signals available on the COM-Express connector:
Serial Port (2) –2 16550-compatible serial ports (TX/RX only).
CPU Fan Tach/PWM –Supplies PWM signal for fan control and
receives tach output from fan for speed monitoring.
1.6.5 Atmel AT97SC3204 TPM
The Atmel AT97SC3204 is a fully integrated security module that implements
version 1.2 of the Trusted Computing Group (TCG) specification for Trusted
Platform Modules (TPM). The TPM includes a cryptographic accelerator
capable of computing a 2048-bit RSA signature in 200ms and a 1024-bit RSA
signature in 40ms. Performance of the SHA-1 accelerator is 20μs per 64-byte
block.

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2.0 PREPARATION FOR USE
IMPORTANT PERSONAL AND PRODUCT SAFETY CONSIDERATIONS
It is very important for the user to consider the possible safety implications of
power, wiring, component, sensor, or software failures in designing any type
of control or monitoring system. This is especially important where personal
injury or the loss of economic property or human life is possible. It is
important that the user employ satisfactory overall system design. It is
understood and agreed by the Buyer and Acromag that this is the Buyer's
responsibility.
WARNING: This board utilizes static sensitive components and should only
be handled at a static-safe workstation. This product is an electrostatic
sensitive device and is packaged accordingly. Do not open or handle this
product except at an electrostatic-free workstation. Additionally, do not ship
or store this product near strong electrostatic, electromagnetic, magnetic, or
radioactive fields unless the device is contained within its original
manufacturer’s packaging. Be aware that failure to comply with these
guidelines will void the Acromag Limited Warranty.
2.1 Unpacking and Inspecting
Upon receipt of this product, inspect the shipping carton for evidence of
mishandling during transit. If the shipping carton is badly damaged or water
stained, request that the carrier's agent be present when the carton is
opened. If the carrier's agent is absent when the carton is opened and the
contents of the carton are damaged, keep the carton and packing material for
the agent's inspection.
For repairs to a product damaged in shipment, refer to the Acromag Service
Policy to obtain return instructions. It is suggested that salvageable shipping
cartons and packing material be saved for future use in the event the product
must be shipped.
This board is physically protected with packing material and electrically
protected with an anti-static bag during shipment. However, it is
recommended that the board be visually inspected for evidence of
mishandling prior to applying power.

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2.2 Carrier Board Considerations
Refer to the specifications section for loading and power requirements. Be
sure that the system power supplies are able to accommodate the power
requirements of the system boards, plus the installed Acromag board, within
the voltage tolerances specified.
In an air cooled assembly, the optional active heatsink must be used and
adequate air circulation must be provided to prevent a temperature rise
above the maximum operating. If the installation is in an industrial
environment and the board is exposed to environmental air, careful
consideration should be given to air-filtering.
In a conduction cooled assembly, adequate thermo conduction must be
provided to prevent a temperature rise above the maximum operating
temperature.
2.3 Carrier Board Installation
Remove power from the system before installing the CPU module onto the
carrier board using the supplied M2.5x8 screws.
Note
2.4 Default Hardware Configuration
If necessary, the XCOM Express module may need to be configured
differently than as received, depending on the application. When the module
is shipped from the factory, it is configured as follows:
PEG port configuration: 2 x8 ports. For information on
reconfiguring the PEG port see Section 3.1, “Module Hardware
Configuration.”
PCIE port configuration: PCIE(0:3): x4, PCIE4: x1, PCIE5: x1, PCIE6:
x1; For information on reconfiguring the PCIE ports see Section
3.9.4, “BIOS Information and Configuration.”

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3.0 HARDWARE INFORMATION AND CONFIGURATION
3.1 Module Hardware Configuration
Fig. 3.1.a: XCOM-6400 Without Heat Spreader Top View

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Fig. 3.1.b: XCOM-6400 Bottom View

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Table 3.1.a: Configuration Switches
Table 3.1.a summarizes the functions, settings, and descriptions for dip
switches SW1-1 thru SW1-4.
Configuration Switches
Position
Function
Switch Setting
Description
1:2
PEG Port
OFF:OFF
PEG is 1 x 16
Bifurcation/
OFF:ON
PEG is 2 x 8
Trifurcation
ON:OFF
Reserved
ON:ON
PEG is 1 x8, 2 x4
3
ME RTC
OFF
Normal Operation
Reset
ON
Clears ME
4
BIOS/PCH RTC
OFF
Normal Operation
Reset
ON
Clears BIOS/RTC
SW1-1 and SW1-2 control PEG port Bifurcation: The PEG port can be
configured as:
a single x16 port, two x8 ports, or
1 x8 port and two x4 ports. In this last case the x8 port uses lanes
0-7, the first x4 port uses lanes 8-11, and the second x4 port uses
lanes 12-15.
SW1-3 is used to clear the PCH Management Engine (ME) settings. To clear
these settings, close the switch and then open it again.
Note: After clearing the ME settings, the RTC settings must also be cleared by
closing SW1-4 and opening it again. If SW1-4 is not closed and reopened
AFTER opening SW1-3, the module may not boot.
SW1-4 is used to clear the BIOS setup configuration as well as internal PCH
registers connected to the RTC voltage. To clear these settings, close the
switch and then open it again before use. Note that leaving the board
unplugged from a carrier that supplies the RTC voltage for several hours will
also clear these settings.
3.2 Power Supply and Management
3.2.1 Power Options
When using the Acromag ACEX-46XX carrier board, the carrier provides a 12V
plus 5V standby power supply to the system module.
When using a carrier board other than the ACEX-46XX, the module can be
powered from either the 12V only, or 12V plus 5V standby power source.

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WARNING: The XCOM-6400 must be installed onto a Type 6 carrier board
conforming to R2.0 or R2.1 of the Com-Express Specification. Damage to the
module and/or carrier may result if used with another carrier.
3.2.2 Programmable CPU Power Limits
The XCOM-6400 features programmable power limits, allowing the user to
'dial-down' the maximum power consumption of the CPU in systems where
power is a concern. The graph below shows that the i7-4700EQ CPU
outperforms other available embedded Intel CPU's at every power point
from 5W - 47W, even the i5-4402E, which can also use the programmable
power limits.
By simply programming a lower power limit in the BIOS setup, the CPU can
be used in applications where less power is available or heat removal is an
issue. This is accomplished by the CPU automatically underclocking its
frequency to maintain a power level at the set limit.
Note: Once the minimum frequency of 800MHz is reached the programmed
limit could be exceeded. Extremely large workloads have a realistic minimum
power of around 20W. However light to medium workloads can effectively
maintain a power limit as low as 5-10W.
There are two programmable CPU limits. These are the long-term average
Power Limit 1 (PL1) and the short-term Power Limit 2 (PL2). Depending on a
windowed Power Limit 1 Time 'constant', the CPU can spend a short time
above power level PL1 up to a maximum of PL2, allowing a significant
performance boost for short workloads. If the CPU power remains above PL1
at the end of this time the power is then limited back to PL1. The power must
drop below the PL1 limit before it allowed to increase back to PL2 again. For
time spent above PL1 an equivalent amount of time must be spent below PL1
CPU Mark
Power Rating or Throttle Setting (W)
i7-4700EQ (5-47W)
i5-4402E (5-25W)
i7-3612QE (35W)
i7-3615E (45W)
i7-3517UE (17W)
Atom E3845 (10W)

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in order for it to rise again to PL2. The maximum time could be as much 2.5x
the value of the PL1 Time.
The default values for each CPU are as follows:
CPU PL1 PL2 Tau
I7-4700EQ 47W 59W 28 seconds
I5-4402E 25W 31W 28 seconds
PL1 and PL2 can be programmed in watts to any value below the default.
Entering a value above the default will result in the default value being used.
Entering 0 also results in the default value being used.
PL1 Time can be programmed to any number of seconds up to 256, however
it is recommended by Intel to always use the default value of 28. This value
maximizes the effectiveness of the short-term performance boost while
ensuring that the life of the part is not jeopardized by spending too much
time above PL1.
More details about programming these power limits using the BIOS setup
utility are provided in The APTIO Haswell Core BIOS Manual For Acromag
Products.
3.2.3 Power Management
The XCOM-6400 module uses the Advanced Configuration and Power
Interface (ACPI) 3.0 standard to provide user-managed power via the
operating system, contingent upon the carrier board selected.
3.2.3.1 ACPI System States
The five ACPI “Supported Module States” are described as follows:
G0/S0: Fully operational; the main memory is being used for all
work.
S3: Standby; the main memory is still powered up, but the work is
suspended to RAM. Work will be resumed exactly where it was
stopped when standby was initiated.
S4 —Hibernate; all work and content residing in the main memory
is saved to a non‐volatile memory media, and the main memory is
then powered down.
S5: Soft off. Power is removed from all devices, including the main
memory, RAM, and all volatile memory devices. This results in all
memory content being lost.
G3: Unpowered. Power has been mechanically removed from the
system. Wake‐up is not possible in this state.
Note that all of these states are supported with the Acromag ACEX-46XX
carrier boards but may not be with other carriers. An ACPI-aware operating

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system must be installed and either 5V Standby or 12V must remain applied to
the module at all times for S3, S4, or S5 support.
3.2.3.2 ACPI Wake-Up Events
The XCOM-6400 module supports the following wake‐up events from the S3,
S4, and S5 power states if 12V operating power or 5V standby power are
provided by the power supply:
Power button
Wake On LAN (instructions can be found in Section 3.10.1,
“Configuring Wake On LAN”).
RTC alarm (instructions can be found in Section 3.11, “Real Time
Clock (RTC)”.
PCI and PCI Express power management event signaling; PME
wake‐up is enabled by default.
3.2.3.3 ACPI Processor States
The Advanced Configuration and Power Interface (ACPI) provides an open
standard for device configuration and power management by the operating
system. More details about this feature are provided in The APTIO Haswell
Core BIOS Manual For Acromag Products.
3.3 CPU
The Intel®Gen 4 (Haswell) CPU is available as either a 2.4GHz quad-core i7 or
a 1.6GHZ dual-core i5. This 64-bit, 22-nanometer CPU with integrated GT2
graphics contains direct interfaces for DDR3L, DDI, and PCIe x16, all of which
are available on the COM-Express connector. In addition, the Direct Media
Interface (DMI) is used to connect to the QM87 Platform Control Hub (PCH).
DDR3L SDRAM –2 SODIMM sockets support up to 16GB of DDR3L
ECC at 1600MHz. Dual-channel mode is used with 2 SODIMMs. The
SODIMMs are attached to the module firmly with screws and
surrounded by heat sink material to provide a robust mechanism
both mechanically and thermally.
PCIe x16 –This is traditionally used for external graphics, but
supports any PCIe device(s). It can also be split into 2 x8 interfaces
or 1 x8 and 2 x4 interfaces, as selected by SW1-1 and SW1-2. See
Section 3.2, “Module Hardware Configuration.”
DDI (3) –These Digital Display Interfaces can be configured to be
Displayport 1.2, DVI, or HDMI. Three simultaneous displays are
possible. See Section 3.7.1, “Display Configuration and Resolution”,
for a list of valid combinations.
eDP –The embedded DisplayPort allows direct connection to a
display panel using up to two lanes for communication. Backlight
and voltage enable lines are also available, and up to two other
simultaneous displays are possible. See Section 3.7.1, “Display
Configuration and Resolution”, for a list of valid combinations.