Acromag VPX6600 User manual

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VPX6600
Intel®6th Generation Core
3U VPX CPU Module
USER’S MANUAL
ACROMAG INCORPORATED
30765 South Wixom Road
Wixom, MI 48393-2417 U.S.A.
Tel: [phone]
Email: [e-mail]
Copyright 2019, Acromag, Inc., Printed in the USA.
Data and specifications are subject to change without notice.
8501096E

VPX6600
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Table of Contents
1.0 GENERAL INFORMATION............................................................................................6
1.1 Intended Audience .......................................................................................................6
1.2 Preface.........................................................................................................................6
1.2.1 Trademark, Trade Name and Copyright Information ....................................................................... 6
1.2.2 Class A Product Warning................................................................................................................... 6
1.2.3 Environmental Protection Statement ............................................................................................... 6
1.3 Product Summary.........................................................................................................7
1.4 Related Material...........................................................................................................8
1.5 Ordering Information ...................................................................................................8
1.6 Key Components and Features......................................................................................9
1.6.1 Intel® 6th Gen (Skylake) Xeon CPU ................................................................................................... 9
1.6.2 Intel CM236 PCH ............................................................................................................................. 10
1.6.3 Intel I350 Quad Gigabit Ethernet Controller................................................................................... 11
1.6.4 Nuvoton NCT6106 Super-I/O .......................................................................................................... 11
1.6.5 Atmel AT97SC3204 TPM ................................................................................................................. 11
1.6.6 Avago PEX8714 PCIe Switch............................................................................................................ 11
1.6.7 M.2 Expansion Site.......................................................................................................................... 11
2.0 PREPARATION FOR USE........................................................................................... 12
2.1 Unpacking and Inspecting...........................................................................................12
2.2 Installing into a VPX Backplane ...................................................................................13
3.0 HARDWARE INFORMATION AND CONFIGURATION....................................... 14
3.1 Module Hardware Switch Configuration .....................................................................15
3.1.1 Core Configuration Switch SW1...................................................................................................... 15
3.1.2 Core Configuration Switch SW2 ...................................................................................................... 17
3.1.3 Core Configuration Switch SW3 ...................................................................................................... 18
3.2 Power Supply and Management .................................................................................19
3.2.1 Power Supply Requirements........................................................................................................... 19
3.2.2 Programmable CPU Power Limits ................................................................................................... 19
3.2.3 Power Management ....................................................................................................................... 20

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3.3 CPU............................................................................................................................20
3.3.1 Active Processor Core Selection...................................................................................................... 21
3.3.2 Turbo Boost Configuration.............................................................................................................. 21
3.4 Platform Controller Hub (PCH)....................................................................................21
3.5 System Memory .........................................................................................................22
3.6 Video .........................................................................................................................22
3.6.1 Digital Display Interfaces................................................................................................................. 22
3.6.1.1 DisplayPort..................................................................................................................... 23
3.6.1.2 HDMI.............................................................................................................................. 23
3.6.1.3 Integrated Audio............................................................................................................ 24
3.6.2 Configuring the Primary Display ..................................................................................................... 24
3.6.3 Configuring the Video Memory....................................................................................................... 24
3.6.4 Video Display Options..................................................................................................................... 24
3.6.5 Multi-Stream Transport .................................................................................................................. 24
3.7 Intel®High Definition Audio........................................................................................25
3.8 Storage I/O.................................................................................................................25
3.8.1 SATA................................................................................................................................................ 25
3.8.2 PCIe ................................................................................................................................................. 25
3.9 Flexible I/O.................................................................................................................25
3.10 General I/O ..............................................................................................................26
3.10.1 General Purpose I/O (GPIO).......................................................................................................... 26
3.10.2 SMBus ........................................................................................................................................... 26
3.10.3 Low Pin Count (LPC) ...................................................................................................................... 26
3.10.4 Serial Ports .................................................................................................................................... 27
3.10.5 USB................................................................................................................................................ 27
3.11 Gigabit Ethernet .......................................................................................................28
3.11.1 Configuring PXE Boot .................................................................................................................... 28
3.12 Real Time Clock (RTC) ...............................................................................................28
3.13 Security....................................................................................................................28
3.13.1 Trusted Platform Support ............................................................................................................. 28
3.13.2 Password Control .......................................................................................................................... 29
3.14 System Management................................................................................................29
3.14.1 Intel® Hyper-Threading Technology............................................................................................... 29
3.14.2 Enhanced Intel®SpeedStep Technology (EIST).............................................................................. 29

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3.14.3 Intel®Virtualization Technology (Intel VT-x and VT-d).................................................................. 29
3.14.4 Intel®Trusted Execution Technology (TXT) ................................................................................... 30
3.14.5 Intel®Turbo Boost Technology...................................................................................................... 30
3.14.6 Intel®Active Management Technology......................................................................................... 31
3.14.7 Intel®Matrix Storage Technology.................................................................................................. 31
3.14.8 Intel®Configurable TDP Technology ............................................................................................. 31
3.15 Thermal Management ..............................................................................................31
3.15.1 Thermal Monitoring ...................................................................................................................... 32
3.15.2 Thermal Throttling ........................................................................................................................ 32
3.15.2.1 CPU Throttling (Hardware Controlled) ........................................................................ 32
3.15.2.2 Thermal Management (OSPM Controlled) .................................................................. 32
3.15.3 Memory Throttling........................................................................................................................ 32
3.16 Watchdog.................................................................................................................33
3.17 VPX Profile ...............................................................................................................33
3.17.1 Data Plane..................................................................................................................................... 34
3.17.2 Expansion Plane ............................................................................................................................ 34
3.17.3 Control Plane................................................................................................................................. 34
4.0 BIOS INFORMATION AND CONFIGURATION ..................................................... 35
4.1 VPX6600 Special BIOS Features...................................................................................35
4.2 Drivers and Utilities....................................................................................................35
5.0 SERVICE AND REPAIR............................................................................................... 36
5.1 Service and Repair Assistance.....................................................................................36
5.2 Preliminary Service Procedure ....................................................................................36
5.3 Where to Get Help......................................................................................................36
6.0 SPECIFICATIONS......................................................................................................... 37
6.1 Physical......................................................................................................................37
6.2 Connector Information ...............................................................................................37
6.2.1 VPX Backplane Connectors ............................................................................................................. 37
6.2.1.1 P0 VPX Connector.......................................................................................................... 37
6.2.1.2 P1 VPX Connector.......................................................................................................... 37
6.2.1.3 P2 VPX Connector.......................................................................................................... 38
6.2.2 I/O Connectors................................................................................................................................ 38

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6.2.2.1 J6 USB 3.0 Connector..................................................................................................... 38
6.2.2.2 J7 USB 3.0 Connector..................................................................................................... 39
6.2.2.3 J8 Mini-DisplayPort Connector ...................................................................................... 39
6.3 Power Requirements..................................................................................................40
6.4 Environmental Considerations....................................................................................40
6.4.1 Operating Temperature .................................................................................................................. 40
6.4.2 Relative Humidity............................................................................................................................ 41
6.4.3 Vibration and Shock Standards ....................................................................................................... 41
6.4.4 EMC Directives ................................................................................................................................ 41
6.5 Reliability Prediction ..................................................................................................42
6.6 Installation of M.2 Expansion Card and Battery Replacement......................................42
6.6.1 VPX6600-LF (Air-Cooled) M.2 Expansion Card Installation............................................................. 42
6.6.2 VPX6600-LF (Air-Cooled) Battery Replacement.............................................................................. 45
6.6.3 VPX6600-CC-LF (Conduction-Cooled) M.2 Expansion Card Installation.......................................... 47
6.6.4 VPX6600-CC-LF (Conduction-Cooled) Battery Replacement........................................................... 52
6.7 Certificate of Volatility................................................................................................56
7.0 VPX6600-RTM REAR-TRANSITION ACCESSORY MODULE ........................... 57
7.1 Ordering Information .................................................................................................57
7.2 Connector Information ...............................................................................................57
7.2.1 VPX Backplane Connectors ............................................................................................................. 57
7.2.1.1 RP0 VPX Connector........................................................................................................ 57
7.2.1.2 RP1 VPX Connector........................................................................................................ 58
7.2.1.3 RP2 VPX Connector........................................................................................................ 58
7.2.2 I/O Connectors................................................................................................................................ 58
7.2.2.1 J3 Mini-DisplayPort Connector ...................................................................................... 58
7.2.2.2 J4 Mini-DisplayPort Connector ...................................................................................... 59
7.2.2.3 J5 USB 3.0 Connector..................................................................................................... 60
7.2.2.4 J6 USB 3.0 Connector..................................................................................................... 60
7.2.2.5 J9 SATA Connector......................................................................................................... 60
7.2.2.6 J10 SATA Connector....................................................................................................... 61
7.2.2.7 J11 USB 2.0 Connector................................................................................................... 61
7.2.2.8 J12 USB 2.0 Connector................................................................................................... 61
7.2.2.9 J13 Ethernet Connector ................................................................................................. 61
7.2.2.10 P1 Serial Port Connector.............................................................................................. 62
7.2.2.11 P2 Serial Port Connector.............................................................................................. 62
7.2.2.12 P3 GPIO Connector ...................................................................................................... 62
7.2.2.13 P4 Audio Connector..................................................................................................... 62

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7.3 Power Requirements..................................................................................................63
7.4 Environmental Considerations....................................................................................63
7.4.1 Operating Temperature .................................................................................................................. 63
7.4.2 Relative Humidity............................................................................................................................ 63
7.4.3 Vibration and Shock Standards ....................................................................................................... 63
7.4.4 EMC Directives ................................................................................................................................ 63
7.5 Reliability Prediction ..................................................................................................64
7.6 Certificate of Volatility................................................................................................65
REVISION HISTORY ............................................................................................................ 66

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1.0 GENERAL INFORMATION
1.1 Intended Audience
This users’ manual was written for technically qualified personnel who will be
working with I/O devices using the VPX6600 CPU. It is not intended for a
general, non-technical audience that is unfamiliar with computer-on-module
(COM) devices and their application.
1.2 Preface
The information contained in this manual is subject to change without notice,
and Acromag, Inc. (Acromag) does not guarantee its accuracy. Acromag
makes no warranty of any kind with regard to this material, including, but not
limited to, the implied warranties of merchantability and fitness for a
particular purpose. Further, Acromag assumes no responsibility for any
errors that may appear in this manual and makes no commitment to update,
or keep current, the information contained in this manual. No part of this
manual may be copied or reproduced in any form, without the prior written
consent of Acromag,
1.2.1 Trademark, Trade Name and Copyright Information
© 2019 by Acromag Incorporated.
All rights reserved. Acromag and Xembedded are registered trademarks of
Acromag Incorporated. All other trademarks, registered trademarks, trade
names, and service marks are the property of their respective owners.
1.2.2 Class A Product Warning
This is a Class A product. In a domestic environment this product may cause
radio interference, in which case the user may find it necessary to take
adequate corrective measures.
1.2.3 Environmental Protection Statement
This product has been manufactured to satisfy environmental protection
requirements where possible. Many components used (structural parts,
circuit boards, connectors, batteries, etc.) are capable of being recycled. Final
disposition of this product after its service life must be conducted in
accordance with applicable country, state, or local laws or regulations.

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1.3 Product Summary
The VPX6600 is a CPU module that uses an Intel 6th Generation Core
Processor (Skylake) with a 3U VPX form factor. It is available in both air and
conduction-cooled varieties.
The module can support either one or two DDR4 ECC SODIMMs, for a total
of up to 32GB. The SODIMMs are firmly attached to the module with screws
and surrounded by heat sink material to provide a mechanically and
thermally robust mechanism. Extended temperature models are available
for operating in a -40°C to +85°C range.
A large amount of I/O is available, as summarized in Section 6.2 below.
The VPX6600 contains an M.2 expansion card slot to provide on-board
storage capabilities. The M.2 slot supports the use of SATA III and PCIe Gen.
3 storage drives.
A two digit LED display is available for Power ON Self-Test (POST) codes,
should a problem arise during the boot operation. This display is available
for application software user codes after POST to aid in software debugging.
The optional VPX6600-RTM Rear-Transition Module is available to provide
easy access to all of the P2 connector’s I/O signals.

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1.4 Related Material
The following manuals and part specifications provide the necessary
information for in-depth understanding of the VPX6600 module.
•The APTIO Skylake Core BIOS Manual For Acromag Products using
the Skylake Processor - Referred to hereafter as Aptio Skylake
Core BIOS Manual.
•Intel® “6th Generation Intel® Processor Datasheet for
H-Platforms –Volume 1 of 2”, May 2016.
http://www.intel.com/content/www/us/en/processors/core/6th-
gen-core-family-mobile-h-processor-lines-datasheet-vol-1.html
1.5 Ordering Information
The VPX6600 ordering options are given in the following table.
Model Number
Description
Temp Range
VPX6600-LF
Air-cooled 3U VPX CPU Module
0°C to 70°C
VPX6601-LF
Air-cooled 3U VPX CPU Module
(No Battery)
0°C to 70°C
VPX6600-CC-LF
Conduction-cooled 3U VPX CPU Module
-40°C to 85°C
VPX6601-CC-LF
Conduction-cooled 3U VPX CPU Module
(No Battery)
-40°C to 85°C
VPX6600-RTM-LF
VPX6600 Rear Transition Module
-40°C to 85°C
Note: All VPX6600 CPU modules contain 32GB of DDR4 SDRAM memory.

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1.6 Key Components and Features
The VPX6600 block diagram shown in Fig. 1.6.1 illustrates the key components
and features that are summarized on the following pages.
Figure 1.6.1: VPX6600 Block Diagram
1.6.1 Intel® 6th Gen (Skylake) Xeon CPU
The VPX6600 uses the 2.8GHz (3.7GHz max Turbo) quad-core Intel 6th Gen
Xeon E3-1505Mv5 CPU. This is a 64-bit CPU using a 14-nanometer process
with integrated GT2 graphics and contains direct interfaces for DDR4, DDI,
and PCIe x16. In addition, the Direct Media Interface (DMI) is used to
connect to the CM236 Platform Control Hub (PCH).
•DDR4 SDRAM –Two SODIMM sockets support up to 32GB of DDR4
ECC at 2133MHz. Dual-channel mode is used with the two
SODIMMs. The SODIMMs are attached to the module firmly with
screws and surrounded by heat sink material to provide a robust
mechanism both mechanically and thermally.
•PCIe Gen3 x4 (1) –Traditionally used for external graphics, but
supports any PCIe device(s). On the VPX6600, this x4 PCIe interface
is connected to an expansion plane fat pipe on the VPX backplane
allowing for direct board-to-board communication with an adjacent
slot.

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•DDI (3) –These Digital Display Interfaces can be configured to be
DisplayPort 1.2, DVI, or HDMI. On the VPX6600, two display
interfaces are routed to the P2 connector with the third available
on a front I/O Mini-DisplayPort connector (Air-cooled only).
•Programmable CPU power limits –By simply programming a lower
power limit in the BIOS setup, the CPU can be used in applications
where less power is available or heat removal is an issue. This is
accomplished by the CPU automatically underclocking its frequency
to maintain a power level at the set limit.
1.6.2 Intel CM236 PCH
The Intel C230 Series CM236 PCH provides extensive I/O support, as listed
below:
•PCIe Gen3 x4 (4) –There are four PCIe Gen3 ports of x4 width. The
first is connected to the Intel I350 Quad Gigabit Ethernet
Controller. The second is connected to the PEX8714 PCIe switch.
The third is connected to an expansion plane fat pipe on the VPX
backplane allowing for direct board-to-board communication with
an adjacent slot. The fourth is connected to the M.2 expansion slot.
•SATA Gen3 (7) –There are seven SATA III ports on the VPX6600. All
the ports are configurable as SATA ports or PCIe lanes. Two are
connected to the P2 backplane connector. One is connected to the
M.2 expansion site. The remaining 4 are connected to the
expansion plane fat pipe on the VPX backplane.
•USB 3.0 (4) –There are four USB 3.0 ports on the VPX6600. Two
ports are connected to the P2 backplane connector. The other two
are available on front I/O USB connectors (Air-cooled only)
•USB 2.0 (2) –There are two additional ports that function at USB
2.0 or USB 1.1 speeds that are connected to the P2 backplane
connector.
•GPIO (6) –There are six 3.3V general purpose inputs/outputs
available on the P2 backplane connector. These have software-
configurable direction control.
•LPC –The Low Pin Count bus is connected to the NCT6106 Super
I/O for serial ports and debug port 80 connections, in addition to
the AT97SC3204 TPM device.
•Line-Level Audio In/Out –Stereo audio input and output from
onboard HDA audio codec are available on the P2 backplane
connector.
•SMBUS –This I2C-compatible System Management Bus has
connections to the memory DIMMs, the VPX backplane, the
Ethernet controller, and an on-board EEPROM that can be used for
module identification.

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1.6.3 Intel I350 Quad Gigabit Ethernet Controller
The Intel I350 Ethernet Controller contains four ports that can be individually
configured to be either a fully-integrated gigabit Ethernet media access
control (MAC), physical layer (PHY) port or a SGMII/SerDes port. The VPX6600
uses three of the four ports: two ports are configured to be 1000BASE-BX
connections for a board-to-board control plane interface across the VPX
backplane. The third port is configured to be a 1000BASE-T Gigabit Ethernet
connection available on the P1 backplane connector.
1.6.4 Nuvoton NCT6106 Super-I/O
The Nuvoton NCT6106D is an LPC device that provides temperature and
voltage monitoring, Port 80 debug via 2 digit 7-segment display, and when
connected to UART transceivers, two RS-232/RS-422/RS-485 (software
selectable) serial ports.
1.6.5 Atmel AT97SC3204 TPM
The Atmel AT97SC3204 is a fully integrated security module that implements
version 1.2 of the Trusted Computing Group (TCG) specification for Trusted
Platform Modules (TPM). The TPM includes a cryptographic accelerator
capable of computing a 2048-bit RSA signature in 200ms and a 1024-bit RSA
signature in 40ms. Performance of the SHA-1 accelerator is 20μs per 64-byte
block.
1.6.6 Avago PEX8714 PCIe Switch
The Avago PEX8714 is a 12-lane, 5-port PCI Express Gen 3 switch. The
VPX6600 uses the switch to interface with the PCIe x4 Data Plane fat pipe
connection on the VPX backplane. The switch is used on the VPX6600 to
allow it to be used in multi-processor systems that do not contain a dedicated
PCIe switch card.
1.6.7 M.2 Expansion Site
The VPX6600 contains one M.2 expansion site that can be used as a high-
speed, high-bandwidth storage interface. The M.2 site uses an M-keyed
connector which, according to the M.2 PCI-SIG specification, supports storage
devices that use either a SATA III interface or a PCIe x4 interface. M.2 storage
modules that use the PCIe x4 interface can achieve throughput speeds over
4x faster than traditional SATA III. Module lengths of 42, 60, and 80mm can
be utilized on the VPX6600.

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2.0 PREPARATION FOR USE
IMPORTANT PERSONAL AND PRODUCT SAFETY CONSIDERATIONS
It is very important for the user to consider the possible safety implications of
power, wiring, component, sensor, or software failures in designing any type
of control or monitoring system. This is especially important where personal
injury or the loss of economic property or human life is possible. It is
important that the user employ satisfactory overall system design. It is
understood and agreed by the Buyer and Acromag that this is the Buyer's
responsibility.
WARNING: This board utilizes static sensitive components and should only
be handled at a static-safe workstation. This product is an electrostatic
sensitive device and is packaged accordingly. Do not open or handle this
product except at an electrostatic-free workstation. Additionally, do not ship
or store this product near strong electrostatic, electromagnetic, magnetic, or
radioactive fields unless the device is contained within its original
manufacturer’s packaging. Be aware that failure to comply with these
guidelines will void the Acromag Limited Warranty.
2.1 Unpacking and Inspecting
Upon receipt of this product, inspect the shipping carton for evidence of
mishandling during transit. If the shipping carton is badly damaged or water
stained, request that the carrier's agent be present when the carton is
opened. If the carrier's agent is absent when the carton is opened and the
contents of the carton are damaged, keep the carton and packing material for
the agent's inspection.
For repairs to a product damaged in shipment, refer to the Acromag Service
Policy to obtain return instructions. It is suggested that salvageable shipping
cartons and packing material be saved for future use in the event the product
must be shipped.
This board is physically protected with packing material and electrically
protected with an anti-static bag during shipment. However, it is
recommended that the board be visually inspected for evidence of
mishandling prior to applying power.

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2.2 Installing into a VPX Backplane
The VPX6600 is a 3U, single-slot VPX module. For proper cooling, the air-
cooled model must only be installed into an air-cooled VPX chassis and the
conduction-cooled model must only be plugged into a conduction-cooled VPX
chassis.
The VPX6600 module is designed to comply with all physical and electrical
specifications of the VITA 46 VPX Base Specification and the VITA 65 OpenVPX
Specification.
WARNING: Never install or remove any boards before turning off power to
the bus and all related external power supplies.
1. Disconnect all power supplies to the backplane and the VPX chassis.
Disconnect the power cable.
2. Verify that all DIP switch settings are correct.
3. Verify that the card cage slot is clear and accessible.
4. Install the VPX6600 in the card cage by centering the unit on the guides
in the slots (P0 connector facing up). Push the board slowly toward the
rear of the chassis until the VPX connectors engage. The board should
slide freely in the guides.
WARNING: Do not use excessive force or pressure to engage the connectors.
If the boards do not properly connect with the backplane, remove the
module and inspect all connectors and guide slots for damage or
obstructions.
1. Secure the module to the chassis by tightening the machine screws at
the top and bottom of the board.
Connect all remaining peripherals by attaching each interface cable into the
appropriate connector on the front of the VPX6600 board (air-cooled only),
or on the VPX6600-RTM Rear Transition Module.

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3.0 HARDWARE INFORMATION AND CONFIGURATION
Figure 3.1.1: VPX6600 Top View (right) Bottom View (left)

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3.1 Module Hardware Switch Configuration
3.1.1 Core Configuration Switch SW1
The configuration switch settings for SW1 depends on the revision of the
board. If the revision of the VPX6600 product is Rev G or earlier, use the SW1
switch settings shown in Table 3.1.a. If the revision of the VPX6600 product is
Rev H or later, use the SW1 switch settings shown in Table 3.1.b.
Table 3.1.a:
Core
Configuration
Switch SW1
Table 3.1.a summarizes the functions, settings, and descriptions for dip
switches SW1-1 thru SW1-4 for Rev G or earlier VPX6600 products.
Core Configuration Switch SW1
Position
Function
Switch Setting
Description
1
Reserved
OFF
Reserved
ON
Reserved
2
Expansion
Plane Interface
OFF
PCIe Interface
ON
SATA Interface
3
RTC Voltage
OFF
Coin-cell battery not used
ON
Coin-cell battery used as
RTC voltage
4
Not Used
OFF
Reserved
ON
Reserved
SW1-1 is reserved.
SW1-2 is used to select the interface on one of the expansion planes. The
expansion plane interface can either be one x4 PCIe connection or four
individual SATA III interfaces.
SW1-3 is used to configure the source of the CPU’s RTC voltage. With a coin-
cell battery installed, the CPU will use the coin-cell battery as the RTC voltage.
Turning SW1-3 on will use the VPX Battery input on Pin P1-G3 for the RTC
voltage.
WARNING: If SW1-3 is closed with a coin-cell battery installed, it will connect
the coin-cell to any voltage present on the VPX Battery pin on the VPX
connector P1-G3. The coin-cell battery must be removed before closing switch
SW1-3 if a voltage is supplied by the VPX backplane!
SW1-4 is unused.

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Table 3.1.b:
Core
Configuration
Switch SW1
Table 3.1.b summarizes the functions, settings, and descriptions for dip switches
SW1-1 thru SW1-4 for Rev H or later VPX6600 products.
Core Configuration Switch SW1
Position
Function
Switch Setting
Description
1 - 2
NT Mode
SW1-1
SW1-2
ON
ON
NT Mode Disabled
OFF
OFF
NT Mode Enabled
3
Expansion
Plane Interface
OFF
PCIe Interface
ON
SATA Interface
4
RTC Voltage
OFF
Coin-cell battery not used
ON
Coin-cell battery used as
RTC voltage
SW1-1 and SW1-2 are used to enable/disable non-transparent mode on the
PEX8714 PCIe switch. Non-transparent mode provides the ability to use multiple
processors in the same system.
SW1-3 is used to select the interface on one of the expansion planes. The
expansion plane interface can either be one x4 PCIe connection or four individual
SATA III interfaces.
SW1-4 is used to configure the source of the CPU’s RTC voltage. With a coin-cell
battery installed, the CPU will use the coin-cell battery as the RTC voltage. Turning
SW1-4 on will use the VPX Battery input on Pin P1-G3 for the RTC voltage.
WARNING: If SW1-4 is closed with a coin-cell battery installed, it will connect the
coin-cell to any voltage present on the VPX Battery pin on the VPX connector P1-
G3. The coin-cell battery must be removed before closing switch SW1-4 if a
voltage is supplied by the VPX backplane!

VPX6600
USER’S MANUAL
Acromag, Inc. Tel: [phone] - 17 -
http://www.acromag.com
- 17 -
https://www.acromag.com
3.1.2 Core Configuration Switch SW2
Table 3.1.c:
Core
Configuration
Switch SW2
Table 3.1.c summarizes the functions, settings, and descriptions for dip switch
SW2.
Core Configuration Switch SW2
Function
Switch Setting
Description
FRU Voltage
Select
1-2
FRU uses +3.3V
2-3
FRU uses +3.3V_AUX
Not Used
4-5
Reserved
5-6
Reserved
SW2-1 is a single-pole, dual-throw switch used to select the voltage source for
the following devices:
FRU EEPROM
FRU Temperature Sensor
When configured to use the auxiliary +3.3V supply, these devices can still be
operated while the rest of the system is unpowered.

VPX6600
USER’S MANUAL
Acromag, Inc. Tel: [phone] - 18 -
http://www.acromag.com
- 18 -
https://www.acromag.com
3.1.3 Core Configuration Switch SW3
Table 3.1.d:
Core
Configuration
Switch SW3
Table 3.1.d summarizes the functions, settings, and descriptions for dip
switches SW3-1 thru SW3-4. The factory default settings for all SW3 switches is
OFF.
Core Configuration Switch SW3
Position
Function
Switch Setting
Description
1
RTC CMOS
Reset
OFF
Normal Operation
ON
Clear RTC CMOS
2
Reserved
OFF
Normal Operation
ON
Reserved
3
Reserved
OFF
Normal Operation
ON
Reserved
4
Reserved
OFF
Normal Operation
ON
Reserved
SW3-1 is used to clear the Battery-backed RTC CMOS Battery-backed SRAM. To
clear the CMOS SRAM, close SW3-1 momentarily and then open it again. The
switch must be in the open position for normal operation.
SW3-2 is reserved and should be left in the OFF position for normal operation.
SW3-3 is reserved and should be left in the OFF position for normal operation.
SW3-4 is reserved and should be left in the OFF position for normal operation.