Alcatel-lucent enterprise 8088 User manual

 
Table of Content 
Generalities 2 
1 Introduction......................................................................................................................2 
1.1 Overview..........................................................................................................................................................2
1.2 Aim of the document........................................................................................................................................2
2 Services provided by thefeature orequipment......................................................................2 
3 External Interfaces............................................................................................................2 
4 Terminology / Abbreviations ...............................................................................................7 
5 Related Documents...........................................................................................................7 
6 Features..........................................................................................................................8 
General Requirements 8 
1 Standards........................................................................................................................8 
1.1 BT related certification...................................................................................................................................8
2 Environmental requirements............................................................................................. 11 
General Description 11 
1 BluetoothWLAN daughter boardBT stack diagram.............................................................. 11 
2 BluetoothWLAN daughter board bloc diagram.................................................................... 12 
3 Mechanical aspects......................................................................................................... 12 
4 Specification.................................................................................................................. 15 
Detailed Technical Description 18 
1 Electronic...................................................................................................................... 18 
1.1 RF solution to be implemented....................................................................................................................18 
1.2 Schematic...................................................................................................................................................... 18 
1.3 BOM..............................................................................................................................................................19 
2 Radio frequency............................................................................................................. 21 
2.1 Antenna.........................................................................................................................................................21 
2.2 Immunity to external spurious and interferences.......................................................................................25 
3 Layout........................................................................................................................... 26 
3.1 BTWDB layout..............................................................................................................................................26 
3.2 Place requirementsof BTWDB on mainboard...........................................................................................26 
 

1 Generalities

1.1 Introduction

1.1.1 Overview

The main objectives for this board,discussed also with the marketing are:

Get lowest cost solution to enable BT and WLANfor a maximum of IP terminals

Enable new usages like

oThe phone is seen asa carkit for a smartphone

oThe phone can exchange phonebook with a smartphone

oThe phone can supporttagsthrough BT LowEnergy

oThe phone can supportWLAN

FromR&D point of view:

oThe board mustbe small enough to be integratedeasilyinto our ID.

oThe board mustintegrate the antenna to avoid a re-certification for eachphone

which would use it.

For this project, a pre-study has been done.

The choice is to do a daughter board with the module fromAMPAK, with an integrated antenna on

the layout (Printed antenna).

1.1.2 Aim of the document

A pre-studyhas been done, in orderto define the best choices for the whole solution, goingfrom

antenna to the BT and WLANmanagement software in the phone.

This documentis intended to give allthe technical inputsin orderto make a BTWDBdaughter

board which will be used on the Alcatel-Lucent EnterpriseIP Phones.

A firststep will be to use it on Pleiades phone, but we should care to make itpossible to be used

also on nextgen phones.

1.2 Services provided by the feature or equipment

The BTWDBwill give a BT5.0 and WIFI connectivity to the product where it is mounted into. The

main reasons of this daughterboard are to have:

A common function usable on several phones without the need of RF expertise and full

Bluetooth + WLANqualification

A cost-effective solution

1.3 External Interfaces

The interface signals are listedhereafter:

num

Pin Name

Type

Description

Voltage

GND

Ground connections

VBAT

Main power voltage source input

3.3V

WL_REG_ON

Power up/down internal regulators used by WiFi

section

WL_INT

WLAN to wake-up HOST

SDIO_DATA_2

I/O

SDIO data line 2

1.8V

SDIO_DATA_3

I/O

SDIO data line 3

1.8V

SDIO_DATA_CMD

I/O

SDIO command line

1.8V

GND

Ground connections

SDIO_DATA_CLK

I/O

SDIO clock line

1.8V

GND

Ground connections

SDIO_DATA_0

I/O

SDIO data line 0

1.8V

SDIO_DATA_1

I/O

SDIO data line 1

1.8V

GND

Ground connections

VDDIO

I/O Voltage supply input

1.8V

GND

Ground connections

BT_CLK

External Low Power Clock input (32.768KHz)

1.8V

GND

Ground connections

BT_REG_ON

Power up/down internal regulators used by BT

section

1.8V

BT_WAKE

HOST wake-up Bluetooth device

1.8V

BT_INT

Bluetooth device to wake-up HOST

1.8V

GND

Ground connections

GND

Ground connections

PCM_OUT

PCM Data output

1.8V

PCM_CLK

I/O

PCM clock

1.8V

GND

Ground connections

PCM_IN

PCM data input

1.8V

PCM_SYNC

I/O

PCM sync signal

1.8V

GND

Ground connections

UART_RTS_N

Bluetooth UART interface

1.8V

UART_TXD

Bluetooth UART interface

1.8V

UART_RXD

Bluetooth UART interface

1.8V

UART_CTS_N

Bluetooth UART interface

1.8V

GND

Ground connections

The VBAT pin can accept 3.3V +/- 5%. Typical value is 3.3V, but this depends on the motherboard.

Mainboard throughUART busto send HCI commands to activate Bluetooth function.

The UART is a standard 4-wire interface(RX, TX, RTS, and CTS) with adjustable baud rates from

9600 bpsto 4.0 Mbps. The interface features an automaticbaud rate detection capabilitythat

returns a baud rate selection. Alternatively, the baud ratemay be selected through a

vendor-specificUART HCI command

The UART has by default the following characteristics (can be reprogrammed to up to 4Mbps)

The PCM busis for audio data.

The PCM Interface on the AP6256 can connectto linear PCMCodecdevices in master or slave

mode. In master mode, the AP6256 generates the PCM_CLKand PCM_SYNC signals, and in

slave mode, these signalsare providedby anothermaster on the PCMinterface and are inputs to

the AP6256.

The configurationof the PCMinterface maybe adjusted bythe host through the use of

vendor-specificHCI commands.

SDIO interface is for WLAN function.

BTWDBmodule supports SDIO V3.0 for all 1.8V 4-bit UHSI speeds: SDR50(100Mbps),

SDR104(208MHz) and DDR50(50MHz, dualrates) in addition to the 3.3Vdefault

speed(25MHz) and high speed (50 MHz). It hasthe ability to stop the SDIO clock and map the

interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN

device wantsto turn on the SDIO interface. The ability to forcethe control of the gated clocks from

within the WLANchip is also provided.

Function 0 Standard SDIO function (MaxBlock Size / Byte Count = 32B)

Function 1 Backplane Function to access the internal SystemOn Chip (SOC) address

space (Max Block Size / Byte Count = 64B)

Function 2 WLANFunction for efficientWLANpacket transfer throughDMA(MaxBlock

Size/Byte Count=512B)

SDIO Pin Description

SDIO 4-Bit Mode

DATA0

Data Line 0

DATA1

Data Line 1 or Interrupt

DATA2

Data Line 2 or Read

Wait

DATA3

Data Line 3

CLK

Clock

CMD

Command Line

Check the AP6256 datasheet for more information.

The module has signalsthat allowthe host to control power consumptionby enablingor disabling

the Bluetooth, WLAN and internal regulator blocks. These signals are describedbelow.

Additionally,diagramsare providedto indicate proper sequencingof the signals for carious

operatingstates. The timingvalue indicatedare minimumrequiredvalues:longerdelays are also

acceptable.

WL_REG_ON: Used by the PMU to powerup or powerdown the internal regulators used

by the WLAN section.When this pinis high, the regulators are enabled and the WLAN

sectionis out of reset. When this pinis low the WLAN sectionis in reset

BT_REG_ON: Used by the PMU to power up or powerdown the internal regulatorsused

by the BT section. Low asserting reset for Bluetooth. This pin has no effect on WLAN and

does not control any PMU functions. This pinmust be drivenhigh or low (not left

floating)

1.4 Terminology / Abbreviations

BTWDB: BlueTooth WLANDaughter Board

BT: BlueTooth

1.5 Related Documents

Document

Reference number

Alcatel documents

[1]

PLEIADES HLA for the newrange .docx

OD-401314

[2]

External documents

[3]

AP6256 datasheet_V2.5_03022020.pdf

[4]

1.6 Features

The board must provide the following features:

WLAN:

TXand RX low-density parity check (LDPC) supportfor improved range andpower

efficiency.

Single-streamspatial multiplexing up to 433.3 Mbpsdata rate.

Supports 1 antenna with one for WLAN& Bluetooth shared port

20,40, 80 MHz channels with optionalSGI (256 QAMmodulation)

Supports standardSDIO v3.0 HOST interfaces.

Bluetooth:

Give dual mode BT connectivity (Classic & LowEnergy)

Complies with Bluetooth Core Specification Version5.0 with provisions for supporting

future, With Bluetooth Class2 transmitter operation.

Supports extended synchronous connections(eSCO), for enhanced voice quality by

allowing for retransmission of droppedpackets

Adaptive frequency hopping(AFH) for reducingradio frequency interference.

Interface to the motherboard with UART and PCM, UART up to 4Mbps.

Integrate PCBantenna, which will be shared Bluetoothand WLAN

2 GeneralRequirements

2.1 Standards

2.1.1 BT related certification

On the Bluetooth.org website,the existing certificationsof BT solutions arelisted.

The certification strategy willbe as

follows:

Make a certification for the board, with embedded lowpart of the BT stack,and antenna

Make BTWDB a module certification, where we can take benefit of the module

certification

Requested certifications:

GenericCertificationofBT&WLAN

Module

Standards

Radio/Modular

approval

Europe

ETSIEN 300 328 V2.2.2 (2019-07) - ( 2,4 GHz

ISM band )

ETSIEN 301 893 V2.1.1 ( 5 GHz RLAN )

ETSIEN 300 440 V2.2.1 ( 5.725-5.875 GHz

RLAN)

FCC

FCC 47 CFRPart 15 Subpart C ( 2,4 GHz ISM

band )

FCC 47 CFRPart 15 Subpart E ( 5 GHz RLAN )

FCCgrant of equipment authorization / FCC

Identifier ( TCB Service )

Canada

RSS-Gen issue 5 + RSS-247 issue 2

IC Registration - Record in Radio Equipment List

( REL )

Australia/NZ

AS/NZS 4268:2017

Bluetooth qualification

test report : Bluetooth ( Classicandlowenergy )

version 5.0

Profiles supported : To be difined

product listed at Bluetooth SIG under ALE

International company

Wi-Fi compliance

Connectivity a/b/g/n/ac/ax

Security WPA2/WPA3 (TBC)

WMM - Wi-fi Multimedia (TBC)

Japan Radiomodule certification

GITEKI

China Radio module certification

CMIIT

Brazil Radiomodule certification

Anatel

Korea Radio module certification

KCC

Mexico Radio module certification

IFETEL

TaiwanRadio module certification

NCC

Human

exposure for

Bluetooth

FCC47CFR2.1091 ( at least 20cm between

transmitterand the body )

Refer to FCC KDB Publication 447498 D01 : SAR

test exclusion

EUROPE/AUS/NZ

EN 62311:2008

Canada

RSS-102 Issue 5

Australia/NZ

ARPPANSA: Maximum ExposureLevels to

Radiofrequency Fields —3 kHz to 300 GHz

Human

exposure for

WLAN

FCC47CFR2.1091 ( at least 20 cm between

transmitterand the body )

Refer to FCC KDB Publication 447498 D01

EUROPE/AUS/NZ

EN62311:2008

Canada

RSS-102 Issue 5

Australia/NZ

ARPPANSA: Maximum ExposureLevels to

Radiofrequency Fields —3 kHz to 300 GHz

ECO-DESIGN

Persistent Organic Pollutants

European Regulation : N° 2019/1021

EU ROHS

EU Directive 2011/65/EU including Commission

delegated directive 2015/863

REACH

European regulation : N° 1907/2006 - Certificate +

list ofSVHC

This will qualify:

The hardware, radio parts(included Bluetooth and WLAN)

The Lower part of the BT stack(belowHCI interface) located in the BT chip

The Upper part of the BT stack, which runs on the Host processor.

RF exposure

This is why, if we re-use thisboard, a big part of the certificationdoes not needto be done.

2.2 Environmental requirements

These are the same as for the terminalfor which this board is intended. The testsaremade on the

daughter boardassembled or mounted in a finalproduct,so theyare part of the product

qualification.

For detailsseefor example PLEIADES HLA for the newrange

3 GeneralDescription

3.1 Bluetooth WLAN daughter board BT stack diagram

Broadcom’s Bluetooth Simple API (BSA) is a host software stack solution designed to simplify

Bluetooth applicationsdevelopment for a wide range of embedded platforms. Based on a

client/server model, the BSABluetooth daemon (server)runs the BroadcomBluetooth stack

(protocols and profiles) and drives the UART/USBHCI-supported Bluetooth module. Client

applicationsconnect to the server for Bluetooth services and profiles such as FTP, AG, A2DP, etc.

AP6256 usesBSA Stack, and communicates with a HCI through the UART interface.

3.2 Bluetooth WLAN daughter board bloc diagram

3.3 Mechanical aspects

This board will be mounted on other boards. So we can make itwith a dongle or directly mounted

on board.

For radiofrequencypropagation reasons,the antenna areamustnot cover any copper plane.

For industrial reasons, the board must lay on the CPU board on at least 2/3 of it’s surface.

Examples of implementation follow:

= +

Another alternative, best is:

= +

Copper

No copper

underantenna

L/3

max

Connections:

To reduce cost, we want to avoid a board to board connector.

The daughter board will use the technique of the cut metal holes on the board edge (top view):

Before milling During milling Resulting connections

The connections numberis33, spread overthree sides of the board asfollowing:

Mounting onboards

The daughter board is mounted flat directly on the other boards.

This means that:

There isno component on the bottomside of the BTWDB

oAlso signalvias shall be prohibited to avoid risks of short-circuitwith main board

GND.

There isno component on top of the mainboard

PCB

Metal holes

Gold plating

Care must be taken in order to equilibrate the layout, to avoid that the PCBbecomes curved during

soldering process (due to differentialthermalexpansion of the copper layers).

The cut-hole size must be defined big enough in order to get a solid solder area, and to avoid that

the copper of the hole is snatched duringmilling process.

The solder is

put here

Mainboard

Daughter board

On Main board, the recommendedfootprint is as follows:

The GND pins must be connected to the GND plane as shortas possible, withenough vias. Dotted line is

the board outline.

3.4 Specification

Model Name

BTWDB01

Product Description

1Tx/1Rx 802.11 ac/a/b/g/n Wi-Fi

+ BT 5.0 Module

Dimension

L x W: 29 x 17.5(Typ.)mm、H :

2.45 (Max.) mm

WiFi Interface

SDIO V3.0

BT Interface

UART / PCM

Operating temperature

-5°C to 45°C

VBAT t ype

3.3 Volts

VDDIO type

1.8 Volts

Bluetooth specification:

Feature

Description

General Specification

Bluetooth Standard

BDR(1Mbps)、EDR(2、

3Mbps)、LE(1Mbps、2Mbps)

Host Interface

UART

Frequency Band

2402 MHz ~ 2480 MHz

Number of Channels

79 channels for classic、40

channels for BLE

Modulation

GFSK, π/4-DQPSK, 8DPSK

RF Specification

MAX (dBm)

BDR Output EIPR Power

EDR Output EIPR Power

LE Output EIPR Power

WLAN RF specification

4 DetailedTechnicalDescription

4.1 Electronic

4.1.1 RF solution to be implemented

The chosen AMPAK AP6256 Module which is a totalsolution for a combination of Wi-Fi +BT

technologies.

For WI-FI, it supports 802.11a/b/g/n/ac

For Bluetooth, it complies with Bluetooth core specificationV5.0

Bluetooth power levelis class 2:

BDR output power is 6dBm

EDR output power is 6dBm

LE output power is 6dBm

This module integrates the baseband, the RF amplifier, and power regulator.

It needs externally:

a bandpass filter + antenna

an accurate 37.4MHz source (crystalwith less than 20ppminitial+temperature + aging)

A standard slowclock at 32.768 KHz for low power modes (+/-30ppm), which will be

provided by the CPU. This clock MUST stay active continuously, even in SLEEPmode,

where it is mandatoryto wake up.

Some passive components.

We implement the reference design from AMPAKInstrument, and with minor adaptation to our

needs (test probe headers,some filter capacitor…)

4.1.2 Schematic

4.1.3 BOM

Name

Concatenated Description

CRN

3ML22008AAA

PLEIADES BT_WLANMODULE PCB__

PB1

1AB144890041

RES-CHIP_THICK-FILM_0Ohm_0%_0402

1AB088200009