Avnet COM Express MSC C10M-BT User manual

COM ExpressTM Mini Module
MSC C10M-BT / MSC C10M-BTC
Type 10 Pin-out
Intel®AtomTM Series SOC
Rev. 1.0 2021-03-08
User Manual

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PREFACE
Copyright Notice
Copyright © 2021 MSC Technologies GmbH. All rights reserved.
Copying of this document, and giving it to others and the use or communication of the contents
thereof, is forbidden without express authority. Offenders are liable to the payment of damages.
All rights are reserved in the event of the grant of a patent or the registration of a utility model or
design.
Important Information
This documentation is intended for qualified audience only. The product described herein is not
an end user product. It was developed and manufactured for further processing by trained
personnel.
Disclaimer
Although this document has been generated with the utmost care no warranty or liability for
correctness or suitability for any particular purpose is implied. The information in this document
is provided “as is” and is subject to change without notice.
EMC Rules
This unit has to be installed in a shielded housing. If not installed in a properly shielded
enclosure, and used in accordance with the instruction manual, this product may cause radio
interference in which case the user may be required to take adequate measures at his or her
owns expense.
Trademarks
All used product names, logos or trademarks are property of their respective owners.
Certification
MSC Technologies GmbH is certified according to DIN EN ISO 9001:2015 standards.
Life-Cycle-Management
MSC products are developed and manufactured according to high quality standards. Our life-
cycle-management assures long term availability through permanent product maintenance.
Technically necessary changes and improvements are introduced if applicable. A product-
change-notification and end-of-life management process assures early information of our
customers.
Product Support
MSC engineers and technicians are committed to provide support to our customers whenever
needed.
Before contacting Avnet Integrated / MSC Technical Support, please consult the respective
pages on our web site at www.msc-technologies.eu for the latest documentation, drivers and
software downloads.
If the information provided there does not solve your problem, please contact our Avnet
Integrated / MSC Technical Support:
Email: [e-mail]
Phone: [phone]

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CONTENT
Copyright Notice..................................................................................................................................... 2
Important Information............................................................................................................................. 2
Disclaimer................................................................................................................................................ 2
EMC Rules ............................................................................................................................................... 2
Trademarks.............................................................................................................................................. 2
Certification............................................................................................................................................. 2
Life-Cycle-Management.......................................................................................................................... 2
Product Support...................................................................................................................................... 2
General Information............................................................................................................................... 6
Revision History............................................................................................................................. 6
Introduction .................................................................................................................................... 8
Technical Description............................................................................................................................ 9
Key features................................................................................................................................... 9
Block diagram .............................................................................................................................. 10
COM Express implementation ..................................................................................................... 12
Functional units............................................................................................................................ 14
Power Supply............................................................................................................................... 15
Power Dissipation ........................................................................................................................ 15
2.6.1 Running Mode....................................................................................................................... 15
2.6.2 Power Dissipation (Standby Modes) .................................................................................... 15
System Memory........................................................................................................................... 16
eMMC........................................................................................................................................... 16
Mechanical Dimensions............................................................................................................... 17
2.9.1 Compact module................................................................................................................... 17
Thermal Specifications............................................................................................................. 18
2.10.1 Operating Temperature Range............................................................................................. 18
Use Conditions......................................................................................................................... 19
Signal description..................................................................................................................... 19
2.12.1 High Definition Audio ............................................................................................................ 19
2.12.2 Ethernet ................................................................................................................................ 20
2.12.3 Serial ATA............................................................................................................................. 20
2.12.4 PCI Express Lanes............................................................................................................... 21
2.12.5 Express Card Support .......................................................................................................... 21
2.12.6 USB....................................................................................................................................... 22
2.12.7 LPC Bus................................................................................................................................ 23
2.12.8 LVDS / eDP........................................................................................................................... 23
2.12.9 Digital Display Interfaces ...................................................................................................... 25
2.12.10 Miscellaneous....................................................................................................................... 26
2.12.11 Power and System Management.......................................................................................... 26
2.12.12 General Purpose I/O............................................................................................................. 28
2.12.13 SDIO..................................................................................................................................... 29
2.12.14 SPI Interface......................................................................................................................... 30
2.12.15 Serial Ports ........................................................................................................................... 30
2.12.16 Module Type Definition......................................................................................................... 31
2.12.17 Power and GND.................................................................................................................... 31
Pin List for MSC C10M-BT / BTC module (Type 10) ............................................................... 32
Jumpers and Connectors.................................................................................................................... 35
Jumpers ....................................................................................................................................... 35

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Fan Connector ............................................................................................................................. 35
Watchdog............................................................................................................................................ 37
System resources................................................................................................................................ 38
PCI IRQ Routing .......................................................................................................................... 38
IRQ Lines in APIC Mode.............................................................................................................. 40
SMB Address Map....................................................................................................................... 40
BIOS.................................................................................................................................................... 41
Introduction .................................................................................................................................. 41
Startup Screen Overview............................................................................................................. 41
Activity Detection Background ..................................................................................................... 41
Aptio Setup Utility......................................................................................................................... 41
Configuring the System BIOS...................................................................................................... 41
The Main Menu............................................................................................................................ 44
6.6.1 MSC Board Info .................................................................................................................... 45
6.6.2 Hardware Monitoring Measurement ..................................................................................... 45
6.6.3 Firmware Update .................................................................................................................. 46
The Advanced Menu.................................................................................................................... 46
6.7.1 Trusted Computing ( TPM 1.2 ) ............................................................................................ 47
6.7.2 Trusted Computing ( TPM 2.0 ) ............................................................................................ 48
6.7.3 ACPI Settings........................................................................................................................ 48
6.7.4 Serial Port Console Redirection............................................................................................ 48
6.7.5 Console Redirection Submenu............................................................................................. 49
6.7.6 CPU Configuration................................................................................................................ 50
6.7.7 PPM Configuration................................................................................................................ 51
6.7.8 IDE Configuration ................................................................................................................. 52
6.7.9 Internal Devices Configuration.............................................................................................. 52
6.7.10 AMI Graphic Output Policy ................................................................................................... 53
6.7.11 Network stack Configuration................................................................................................. 53
6.7.12 CSM Configuration ............................................................................................................... 54
6.7.13 NVMe.................................................................................................................................... 55
6.7.14 SDIO Configuration............................................................................................................... 55
6.7.15 USB Configuration................................................................................................................ 55
6.7.16 Security Configuration .......................................................................................................... 56
6.7.17 SIO WB627 Configuration .................................................................................................... 58
6.7.18 EC Hardware Monitoring ...................................................................................................... 59
6.7.19 Legacy IRQ Reservation....................................................................................................... 62
6.7.20 Module-specific Initialization................................................................................................. 62
6.7.21 I210 Gigabit Connection Settings......................................................................................... 63
Chipset......................................................................................................................................... 63
6.8.1 Flat Panel Configuration ....................................................................................................... 64
6.8.2 Backlight Control................................................................................................................... 64
6.8.3 North Bridge.......................................................................................................................... 65
6.8.4 South Bridge......................................................................................................................... 67
Security ........................................................................................................................................ 69
6.9.1 Secure Boot.......................................................................................................................... 69
6.9.2 Key Management.................................................................................................................. 70
6.9.3 The Save & Exit Menu.......................................................................................................... 73
Bios and Firmware Update.................................................................................................................. 75
Setup Controlled Update.............................................................................................................. 75
Bios Update from EFI Shell.......................................................................................................... 76
Bios Update from Linux................................................................................................................ 76
Bios Update from Windows.......................................................................................................... 76

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Blind Restoration of Bios default settings (no display available) ................................................. 76
Bios Recovery.............................................................................................................................. 77
Bios Recovery (for BIOS version older than V1.50 ) ................................................................... 77
Clear CMOS and Recovery Jumper ............................................................................................ 78
Post Codes................................................................................................................................... 78
Technotes............................................................................................................................................ 79
EAPI .................................................................................................................................................... 82
BIOS Configurator Tool ................................................................................................................... 83
Troubleshooting............................................................................................................................... 84

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General Information
Revision History
Rev.
Date
Description
1.0
2021-03-08
First Release

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Reference Documents
[1] COM Express Module Base Specification
COM Express Revision 2.1
Last update: April 10th, 2012
[2] PCI Local Bus Specification Rev. 2.1
PCI21.PDF
Last update: June 1st, 1995
http://www.pcisig.com
[3] Serial ATA Specification
Serial ATA 1.0 gold.pdf
Last update: August 29th, 2002 Rev.1.0
http://www.sata-io.org/
[4] IEEE Std. 802.3-2002
802.3-2002.pdf
http://www.ieee.org
[5] VESA Embedded DisplayPort Standard
eDP_v1_3 mem.pdf
Last update: 13.01.2012
http://www.vesa.org/
[6] Universal Bus Specification
usb_20.pdf
Last update: April 27th, 2000
http://www.usb.org
[7] Universal Serial Bus Revision 3.0 Specification
usb_30_spec_xxxxxx.zip
Last update: 13.08.2012
http://www.usb.org

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Introduction
COM Express™ is an open specification from PICMG (PCI Industrial Computer Manufacturer
Group). It is a module concept to bring PCI Express and other newer technologies like SATA,
USB 3.0 and different display interfaces onto a COM (Computer On Module).
A COM Express™ module is plugged onto an application-specific base board and offers a
migration path to future CPU technologies as they become available. Utilizing different form
factors, COM Express™ can be used for deeply embedded solutions all the way up to high
performance platforms.
The design of the MSC C10M-BT(C) module supports the Intel® Atom-Series System-on-Chip
(SOC) platform enabling the embedded application to provide high performance processing with
an excellent visual experience, together with power efficiency.
For evaluation and design-in of the COM Express™ modules MSC offers evaluation
baseboards and development motherboards providing the interface infrastructure for the COM
Express™ module using PC type connectors for external access.
Currently four module sizes are defined in the COM Express Specification 2.1: the Mini Module,
the Compact Module, the Basic Module and the Extended Module. The main difference
between them is the over-all physical size and the performance envelope supported.
All module sizes of the same type use the same connectors and pin-outs and utilize several
common mounting hole positions. This level of compatibility permits a carrier board designed to
accommodate an Extended Module to also support a Basic or Compact Module.
Up to 440 pins are available between COM Express™ modules and the Carrier Board.
To enhance interoperability between COM Express™ modules and Carrier Boards, seven
common signaling configurations (Pin-out Types) have been defined to ease system integration.

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Technical Description
Key features
The MSC C10M-BT COM Express module is designed as a type 10 module according to COM
Express® Module Base Specification Revision 2.1.
Key features include:
Module size: 84 mm x 55 mm
Intel® Atom-Series System-on-Chip (SOC)
Single 220 pin connector
DDR3L on module up to 8 GB
Up to eight USB 2.0 ports; one can be used as USB 3.0 port; 4 shared over-current lines
(Four USB 2.0 ports are always available, additional four USB2.0 ports available with
HSIC USB Hub option.)
Two Serial ATA 3.0 Gbit/s ports
3 PCI Express lanes
Support pins for two Express Cards
Display interfaces
oTwo independent display controller
oDigital Display Interface (DDI) configurable as HDMI, DVI or Display Port
oSingle channel 24-bit LVDS (shared with eDP)
High definition digital audio interface (external CODEC)
Single Gbit Ethernet interface (Intel® Ethernet Controller I210-AT)
LPC interface
Two serial ports
BIOS support for Super IO Winbond 83627 (on carrier board via LPC interface)
Four GPI pins
Four GPO pins
+12V primary power supply input (Wide input range 4.75V –20.0V)
+5V standby (optional) and 3.3V RTC power supply inputs
TPM module (optional TPM 1.2, SLB9660)
Automatic fan control
Watchdog timer
Optional eMMC SSD on module
The MSC C10M-BTC COM Express module is also designed as a type 10 module according to
COM Express® Module Base Specification Revision 2.1. The distinction between the modules
is the USB 2.0 client interface at USB channel 7 at the MSC C10M-BTC. This feature is
implemented with a ULPI transceiver. Because of that the option for additional four USB 2.0
ports is not available.

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Block diagram

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COM Express implementation
COM Express™ required and optional features for pin-out type 10 are summarized in the
following table. The features identified as Minimum (Min.) shall be implemented by all modules.
Features identified up to Maximum (Max) may be additionally implemented by a module.
The column MSC C10M-BT / BTC shows the features implemented by the MSC module.
Type 10
MSC C10M-BT / BTC
Note
Min / Max
System I/O
A-B
PCI Express Lanes 0 - 4
1 / 4
3 (x1) / 3 (x1)
A-B
LVDS Channels
0 / 1
1 / 1
1x single channel, 24 Bit
A-B
eDP on LVDS CH A pins
0 / 1
1 / 1
A-B
VGA Port
NA
0 / 0
A-B
TV-Out
NA
0 / 0
A-B
DDI 0
0 / 1
1 / 1
HDMI/DVI/DP
A-B
Serial Ports 1- 2
0 / 2
2 / 2
A-B
CAN interface on SER1
0 / 1
0 / 0
A-B
SATA Ports
1 / 2
2 / 2
SATA 3.0 Gbit/s
A-B
HDA Digital Interface
0 / 1
1 / 1
A-B
USB 2.0 Ports
4 / 8
4(8) / 4
8 USB 2.0 ports at MSC C10M-BT are
only available with HSIC Hub option.
A-B
USB Client
0 / 1
0 / 1
A-B
USB 3.0 Ports
0 / 2
1 / 1
A-B
LAN Port 0
1 / 1
1 / 1
Intel® Ethernet Controller I210-AT
A-B
Express Card Support
1 / 2
2 / 2
A-B
LPC Bus
1 / 1
1 / 1
A-B
SPI
1 / 2
1 / 1
An external SPI BIOS Flash is not
supported.
System Management
A-B
SDIO (muxed on GPIO)
0 / 1
1 / 1
Max. UHS-I
A-B
General Purpose Inputs
4 / 4
4 / 4
A-B
General Purpose Outputs
4 / 4
4 / 4
A-B
SMBus
1 / 1
1 / 1
A-B
I2C
1 / 1
1 / 1
A-B
Watchdog Timer
0 / 1
1 / 1
A-B
Speaker Out
1 / 1
1 / 1
A-B
External BIOS ROM support
0 / 2
1 / 1
A-B
Reset Functions
1 / 1
1 / 1
Power Management
A-B
Thermal Protection
0 / 1
0 / 0
A-B
Battery Low Alarm
0 / 1
1 / 1
A-B
Suspend
0 / 1
1 / 1
A-B
Wake
0 / 2
2 / 2
A-B
Power Button Support
1 / 1
1 / 1
A-B
Power Good
1 / 1
1 / 1
A-B
VCC_5V_SBY Contacts
4 / 4
4 / 4
A-B
Sleep Input
0 / 1
1 / 1
A-B
Lid Input
0 / 1
1 / 1
A-B
Fan Control Signals
0 / 2
2 / 2

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A-B
Trusted Platform Modules
0 / 1
1 / 1
optional TPM 1.2 module

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Functional units
CPUs
(FCBGA 1170
package)
Intel® AtomTM E3815, SC, 1.46GHz, 512 KB L2 Cache, 5W, 1ch DDR3L.
Intel® AtomTM E3825, DC, 1.33GHz, 1 MB L2 Cache, 6W, 1ch DDR3L.
Intel® AtomTM E3826, DC, 1.45GHz, 1 MB L2 Cache, 7W, 2ch DDR3L.
Intel® AtomTM E3827, DC, 1.75GHz, 1 MB L2 Cache, 8W, 2ch DDR3L.
Intel® AtomTM E3845, QC, 1.91GHz, 2 MB L2 Cache, 10W, 2ch DDR3L.
Intel® CeleronTM J1900, QC, 2.00GHz, 2.41GHz Burst, 2 MB L2 Cache, 10W,
2ch DDR3L.
Intel® CeleronTM N2930, QC, 1.86GHz, 2.16GHz Burst, 2 MB L2 Cache, 7.5W,
2ch DDR3L.
E3815, E3825, E3826, E3827, E3845: TJUNCTION = - 40°C to 110°C,
J1900: TJUNCTION max. 105°C, N2930: TJUNCTION max. 100°C
Memory
DDR3L on module for up to 8GB non-ECC unbuffered. (optional ECC)
(E3815, E3825 support only 4GB)
PC3-8500 DDR3L SDRAM (DDR3L-1067).
PC3-10600 DDR3L SDRAM (DDR3L-1333).
E3815, E3825, E3826 support only DDR3L-1067.
SATA
2 SATA channels up to 3.0 Gbit/s.
USB
4 x USB 2.0. 1 x USB 3.0. (8 x USB 2.0 optional at MSC C10M-BT)
USB Client
1 x USB 2.0 client (only MSC C10M-BTC)
COM Express™
Type 10 interface, fully compliant to COM Express Base Specification
R2.1.
PCI Express™
Three channels PCIe x1.
LPC
Low Pin Count Bus for heritage interfaces.
SPI
Serial Peripheral Interface for one SPI flash device.
Graphics Controller
Integrated Intel®HD Graphics.
LVDS
Single channel 24-bit LVDS (shared with eDP)
Digital Display Ports
Two Digital Display Interface (DDI) (one is shared with LVDS)
DP up to 2560 x 1600
HDMI up to 1920 x 1080
Single-link DVI up to 1920 x 1080
Ethernet
10/100/1000Base-TX (Intel® Ethernet Controller I210-AT).
Sound Interface
Serial Ports
High Definition Audio Interface.
Support for up to two external codecs.
Integrated DisplayPort/HDMI Audio support.
Two serial ports.
Watchdog Timer
Embedded controller creates watchdog alert and system reset.
TPM (option)
Optional TPM module, TPM 1.2, SLB9660.
Fan Supply
4-pin header for support of a 12V PWM fan.
Real Time Clock
RTC integrated in Intel® Atom SOC.
CMOS Battery
External.
System Monitoring
Voltages, temperatures, fan
Core voltage
3.3V onboard voltage
12V input voltage
5V SBY input voltage
CPU temperature (0°C - 100°C)
System memory temperature
Board temperature
Fan speed and automatic fan speed control
SSD
Optional on module eMMC SSD

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Power Supply
+12V primary power supply input
+5V standby
Option, is not required for module operation.
If not present, customer must ensure that the supply voltages which are generated on the
carrier board are switched off during suspend states, so that no current from the carrier
board’s signal lines can flow to the CPU board.
3.3V RTC power supply
Option, is not required for module operation.
BIOS SETUP data is stored in a nonvolatile backup memory device, therefore configuration
data will not get lost after power removal (except for time and date information)
Voltage
Input range
Power Consumption
+12V
+4.75V –20.0 V
Refer to chapter 2.6
+5V Standby
+4.75V –5.25 V
+3V RTC power supply
+2.5V –3.3V
< 4 µA
Power Dissipation
2.6.1 Running Mode
All measurements were made by plugging the MSC C10M-BT module onto a MSC C10-MB-
EVA carrier. The modules were equipped with various memory quantities. The table below
shows typical values which refer to consumption of the module itself without consumption of
the base board and CPU fan.
The following applications have been tested.
1. DOS prompt.
2. Windows desktop (idle) under Microsoft Windows 7 Professional 64-bit SP1.
3. Running test tool to achieve 100% CPU workload on each processor core/thread and
Graphics workload under Microsoft Windows 7 Professional 64-bit SP1.
Module / CPU
DOS
Win 7 Idle
Thermnow Test tool
long term
max. 1)
C10M-BT-3311 (Intel® AtomTM E3815, single
core, 512 KB cache, 1.46GHz, 5W, 1ch DDR3L)
2GB ECC
3.0 W
2.9 W
6.2 W
6.9 W
C10M-BT-3324 (Intel® AtomTM E3827, dual core,
1 MB cache, 1.75GHz, 8W, 2ch DDR3L)
4GB ECC
3.7 W
3.4 W
7.3 W
10.5 W
C10M-BT-33E5 (Intel® AtomTM E3845, quad
core, 2 MB cache, 1.91GHz, 10W, 2ch DDR3L)
4GB ECC, 16GB eMMC
3.7 W
3.2 W
13.2 W
13.5 W
C10M-BT-0026 (CeleronTM N2930, quad core,
1.83 / 2.16 GHz, 2 MB cache, 7.5W, 2ch DDR3L)
4GB non ECC
3.2 W
2.9 W
11.9 W
13.5 W 1)
1) Burst
2.6.2 Power Dissipation (Standby Modes)
1. System is shut down into “Soft Off” (S5) or “Suspend to Disk” (S4) by Windows 7
Professional 64-bit SP1.
2. System is shut down into “Soft Off” (S5) or “Suspend to Disk” (S4) by Windows 7
Professional 64-bit SP1 with Wake On LAN enabled.

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3. System is shut down into “Suspend to RAM” (S3) by Windows 7 Professional 64-bit SP1.
4. System is shut down into “Suspend to RAM” (S3) by Windows 7 Professional 64-bit SP1
with Wake On LAN enabled.
Module / CPU
Input Power
S3
S4 / S5
no
WOL
WOL
enabled
no
WOL
WOL
enabled
C10M-BT-3311 (Intel® AtomTM
E3815, single core, 512 KB
cache, 1.46GHz, 5W, 1ch
DDR3L) 2GB ECC
12V/5V_SBY
0.34 W
0.38 W
0.28 W
0.32 W
12V only
0.42 W
0.45 W
0.33 W
0.37 W
C10M-BT-3324 (Intel® AtomTM
E3827, dual core, 1 MB cache,
1.75GHz, 8W, 2ch DDR3L) 4GB
ECC
12V/5V_SBY
0.38 W
0.42 W
0.28 W
0.32 W
12V only
0.50 W
0.53 W
0.35 W
0.39 W
C10M-BT-33E5 (Intel® AtomTM
E3845, quad core, 2 MB cache,
1.91GHz, 10W, 2ch DDR3L)
4GB ECC, 16GB eMMC
12V/5V_SBY
0.38 W
0.41 W
0.28 W
0.31 W
12V only
0.49 W
0.52 W
0.34 W
0.37 W
C10M-BT-0026 (CeleronTM
N2930, quad core, 1.83 /
2.16GHz, 2 MB cache, 7.5W,
2ch DDR3L) 4GB non ECC
12V/5V_SBY
0.36 W
0.40 W
0.27 W
0.31 W
12V only
0.47 W
0.50 W
0.32 W
0.36 W
System Memory
The MSC C10M-BT CPU module provides on board memory which have to meet the following
demands:
unbuffered non-ECC DDR3L
1.35V Supply Voltage
DDR3L-1067 / PC3-8500, DDR3L-1333 / PC3-10600
SPD (Serial Presence Detect) EEPROM.
At temperatures above +60°C the memory refresh rate must be doubled with BIOS
option DDR double Refresh Rate set to Enabled.
eMMC
When using the on-module eMMC storage device, it should be taken into consideration that the
lifetime of the device is affected by the number of read/write and erase cycles. It is not
recommended to use eMMC storage devices with applications which are continually storing
large amounts of data.
The eMMC device uses MLC (Multi Level Cell) technology.
Temperature Grade
Technology
Memory Size
Chip Identification
Extended (-25°C to +85°C)
MLC
4 GByte
Micron MTFC4GMDEA-1M WT
Micron MTFC4GACAJCN-1M WT
Extended (-25°C to +85°C)
MLC
8 GByte
Micron MTFC8GLDEA-1M WT
Extended (-25°C to +85°C)
MLC
16 GByte
Micron MTFC16GAKAECN-2M WT
Micron MTFC16GAKAEJP-4M IT
Extended (-25°C to +85°C)
MLC
32 GByte
Micron MTFC32GJDED-3M WT

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Temperature Grade
Technology
Memory Size
Chip Identification
Industrial (-40°C to +85°C)
MLC
4 GByte
Micron MTFC4GACAJCN-4M IT
Industrial (-40°C to +85°C)
MLC
8 GByte
Micron MTFC8GAKAJCN-4M IT
Industrial (-40°C to +85°C)
MLC
16 GByte
Micron MTFC16GAKAECN-4M IT
Micron MTFC16GAKAEJP-4M IT
Industrial (-40°C to +85°C)
MLC
32 GByte
Micron MTFC32GJDED-4M IT
SanDisk SDINBDG4-32G-XI1
Industrial (-40°C to +85°C)
MLC
64 GByte
SanDisk SDIN8CE4-64G-XI
Note: With Windows 7 eMMC is not supported.
Mechanical Dimensions
2.9.1 Compact module
There are two height options defined in the COM Express specification: 5mm and 8mm.
The height option is defined by the connectors on the baseboard.

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Thermal Specifications
The cooling solution of a COM Express module is based on a heat-spreader concept.
A heat-spreader is a metal plate (typically aluminium) mounted on the top of the module. The
connection between this plate and the module components is typically done by thermal interface
materials like phase change foils, gap pads and copper or aluminium blocks. A very good
thermal conductivity is required in order to conduct the heat from the CPU and the chipset to the
heat-spreader plate.
The heat-spreader of the MSC module is thermally attached using phase change materials and
small aluminium blocks filling the gap between CPU and chipset dies and the heat-spreader
plate.
The heat-spreader is not a heat-sink! It is a defined thermal interface for the system designer
with fixed mechanical dimensions, so it should be possible to interchange different module
types without problems. There must be a cooling solution for the system. The surface
temperature of the heat-spreader should not exceed 80°C.
Main issue for the thermal functionality of a system is that each device of the module is
operated within its specified thermal values. The max value for the SOC is listed in chapter 2.4.
So there may be system implementations where the heat-spreader temperature could be
higher.
Anyway, in this case it has to be validated that there are no thermal specification violations of
any assembled part or integrated circuit over the system temperature range even at worst case
conditions.
Additionally, MSC offers appropriate heat-sink solutions for the different C10M-BT modules
depending on the power dissipation of the implemented CPU. For more information please refer
to www.msc-technologies.eu/support/boards or contact your sales representative.
2.10.1 Operating Temperature Range
There are two operating temperature ranges specified for the MSC C10M-BT / MSC C10M-BTC
COM Express module:
The operating temperature range for commercial modules is defined from 0°C to +60°C.
The operating temperature range for industrial modules is defined from -40°C to +85°C.
At temperatures above +60°C the memory refresh rate must be doubled with BIOS option DDR
Double Refresh Rate set to Enabled.

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Use Conditions
The Use Conditions define run-time parameters such as the operating mode (eg. 24/7), activity factor, max frequency, temperature range etc. for the application being
used.
Certain Use Conditions may have an effect on the lifetime of the product.
Please consult Avnet Integrated / MSC Technical Support if there are questions concerning specific Use Conditions when using the selected MSC module for the
target application.
Signal description
Pins are listed in the following tables with the power rail associated with that pin, and for input and I/O pins, with the input voltage tolerance. The pin
power rail and the pin input voltage tolerance may be different.
An additional label, “Sus”, indicates that the pin is active during suspend states (S3, S4, S5). If suspend modes are used, then care must be taken to
avoid loading signals that are active during suspend to avoid excessive suspend mode current draw.
I = Input.
O = Output.
OD = Open Drain output.
I/OD = Bi-directional Input/Open Drain Output Pin.
I/O = Bi-directional Input/Output.
ePU = external pull-up resistor on COM Express module.
ePD = external pull-down resistor on COM Express module.
eSR = external series resistor on COM Express module.
iPU = integrated pull-up resistor inside PCH or other IC, real value may vary from nominal one.
iPD = integrated pull-down resistor inside PCH or other IC, real value may vary from nominal one.
2.12.1 High Definition Audio
Signal
Pin
Type
Signal
Level
Power
Rail
Remark /
Tolerance
PU/PD/SR
Description
Source / Target
HDA_RST#
O
CMOS
3.3V Sus
eSR = 33 Ω
Reset output to CODEC, active low.
BT SOC
HDA_SYNC
O
CMOS
3.3V Sus
eSR = 33 Ω
48kHz fixed-rate, sample-synchronization signal to the CODEC(s),
BT SOC
HDA_BITCLK
O
CMOS
3.3V Sus
eSR = 33 Ω
24.00 MHz serial data clock generated by the FCH
BT SOC
HDA_SDOUT
O
CMOS
3.3V Sus
eSR = 33 Ω
Serial TDM data output to the CODEC, functional strap option
BT SOC

MSC C10M-BT / MSC C10M-BTC User Manual
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HDA_SDIN[0:1]
I
CMOS
3.3V Sus
3.3V
Serial TDM data inputs from up to 2 CODECs.
BT SOC
Note: Do not use a multiplexer or any other signal switcher with the HDA Interface on the carrier.
2.12.2 Ethernet
Signal
Pin
Type
Signal
Level
Power
Rail
Remark /
Tolerance
PU/PD/SR
Description
Source / Target
GBE0_MDI[0:3]+
GBE0_MDI[0:3]-
I/O
Analog
3.3V Sus
3.3V
Gigabit Ethernet Controller 0: Media Dependent Interface Differential
Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec
modes.
MDI[0]+/- B1_DA+/-
MDI[1]+/- B1_DB+/-
MDI[2]+/- B1_DC+/-
MDI[3]+/- B1_DD+/-
Intel® I210-AT
GBE0_ACT#
OD
CMOS
3.3V Sus
5V / 20 mA
Gigabit Ethernet Controller 0 activity indicator, active low.
Intel® I210-AT
GBE0_LINK#
OD
CMOS
3.3V Sus
5V / 20 mA
Gigabit Ethernet Controller 0 link indicator, active low.
Intel® I210-AT
GBE0_LINK100#
OD
CMOS
3.3V Sus
5V / 20 mA
Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low.
Intel® I210-AT
GBE0_LINK1000#
OD
CMOS
3.3V Sus
5V / 20 mA
Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active
low.
Intel® I210-AT
GBE0_CTREF
REF
N/A. Center tab voltage not needed by Intel® I210-AT.
2.12.3 Serial ATA
Signal
Pin
Type
Signal
Level
Power
Rail
Remark /
Tolerance
PU/PD/SR
Description
Source / Target
SATA0_TX+
SATA0_TX-
O
SATA
1.0V
AC coupled
on module
Serial ATA Channel 0 transmit differential pair.
BT SOC
SATA0_RX+
SATA0_RX-
I
SATA
1.0V
AC coupled
on module
Serial ATA Channel 0 receive differential pair.
BT SOC
SATA1_TX+
SATA1_TX-
O
SATA
1.0V
AC coupled
on module
Serial ATA Channel 1transmit differential pair.
BT SOC
SATA1_RX+
SATA1_RX-
I
SATA
1.0V
AC coupled
on module
Serial ATA Channel 1 receive differential pair.
BT SOC
ATA_ACT#
O
CMOS
3.3V
5V / 7 mA
SATA activity indicator, active low.
BT SOC