Avnet MSC Technologies COM Express C6C-BW User manual

User Manual
COM ExpressTM Compact Module
MSC C6C-BW
Type 6 Pinout
Intel®AtomTM / Celeron®/ Pentium®Series SOC
Rev. 1.6 2018-07-11

MSC C6C-BW MSC C6C-BW User Manual 2 / 107
Preface
Copyright Notice
Copyright © 2017 MSC Technologies GmbH. All rights
reserved.
Copying of this document, and providing to others and the
use or communication of the contents thereof, is forbidden
without express authority of MSC Technologies GmbH.
Offenders are liable to the payment of damages.
All rights are reserved in the event of the grant of a patent
or the registration of a utility model or design.
Important Information
This documentation is intended for qualified audiences
only. The product described herein is not an end user
product. It was developed and manufactured for further
processing by trained personnel.
Disclaimer
Although this document has been generated with the
utmost care no warranty or liability for correctness or
suitability for any particular purpose is implied. The
information in this document is provided “as is” and is
subject to change without notice.
EMC Rules
This unit has to be installed in a shielded housing. If not
installed in a properly shielded enclosure, and used in
accordance with the instruction manual, this product may
cause radio interference in which case the user may be
required to take adequate measures at his or her owns
expense.
Trademarks
All used product names, logos or trademarks are property
of their respective owners.
Certification
MSC Technologies GmbH is certified according to DIN EN
ISO 9001:2000 standards.
Life-Cycle-Management
MSC products are developed and manufactured according
to high quality standards. Our life-cycle management
assures long term availability through permanent product
maintenance. Technically necessary changes and
improvements are introduced if applicable. A product-
change-notification and end-of-life management process
assures early information of our customers.

MSC C6C-BW MSC C6C-BW User Manual 3 / 107
Product Support
MSC engineers and technicians are committed to provide
support to our customers whenever needed.
Before contacting Technical Support of MSC Technologies GmbH,
please consult the respective pages on our web site at www.msc-
technologies.eu/support/boards for the latest documentation, drivers
and software downloads.
If the information provided there does not solve your
problem, please contact our Technical Support:
Phone: +49 - 8165 906 - 200
Fax: +49 - 8165 906 - 201
Email: [e-mail]

MSC C6C-BW MSC C6C-BW User Manual 4 / 107
Contents
1USER INFORMATION................................................................8
1.1 About this Manual............................................................................ 8
1.2 Symbols and Signal Words.............................................................. 8
1.3 Table Cells with Gray Text............................................................... 8
1.4 Intended Use................................................................................... 9
1.5 Non-Intended Use........................................................................... 9
1.6 Electrostatic Sensitive Device.......................................................... 9
2TECHNICAL DESCRIPTION....................................................10
2.1 Introduction................................................................................... 10
2.2 Module Photos.............................................................................. 11
2.3 Key Features................................................................................. 13
2.4 Block Diagram............................................................................... 14
2.5 COM Express Implementation....................................................... 15
2.6 Functional Units ............................................................................ 17
2.7 Power Supply................................................................................ 18
2.8 Power Dissipation.......................................................................... 19
2.8.1 Running Mode.................................................................................19
2.8.2 Power Dissipation (Standby Modes).................................................20
2.9 System Memory............................................................................ 20
2.10 Mechanical Dimensions................................................................. 21
2.10.1 Compact Module..............................................................................21
2.11 Thermal Specifications.................................................................. 22
2.12 Signal Description ......................................................................... 23
2.12.1 High Definition Audio .......................................................................23
2.12.2 Ethernet ..........................................................................................24
2.12.3 Serial ATA.......................................................................................24
2.12.4 PCI Express Lanes..........................................................................25
2.12.5 Express Card Support......................................................................25
2.12.6 USB................................................................................................26
2.12.7 LPC Bus..........................................................................................27
2.12.8 LVDS / eDP.....................................................................................28
2.12.9 Digital Display Interfaces..................................................................30
2.12.10 Serial Interface Signals....................................................................33
2.12.11 Miscellaneous..................................................................................33
2.12.12 Power and System Management......................................................34
2.12.13 General Purpose I/O........................................................................36
2.12.14 SDIO...............................................................................................36
2.12.15 SPI Interface....................................................................................37
2.12.16 Module Type Definition.....................................................................38
2.12.17 Power and GND...............................................................................39
2.13 Pin List for MSC C6C-BW Module (Type 6)....................................39
3JUMPERS AND CONNECTORS..............................................45
3.1 Jumpers ........................................................................................45
3.2 Fan Connector...............................................................................46
4WATCHDOG............................................................................46
5SYSTEM RESOURCES........................................................... 47
5.1 PCI IRQ Routing............................................................................47
5.2 SMB Address Map.........................................................................48
6BIOS ........................................................................................49
6.1 Introduction....................................................................................49
6.2 Startup Screen Overview...............................................................49
6.3 Activity Detection Background........................................................49
6.4 Aptio Setup Utility ..........................................................................49
6.5 Configuring the System BIOS ........................................................49
6.6 BIOS Menu Structure.....................................................................50
6.6.1 Menu Bar.........................................................................................51
6.6.2 Legend Bar......................................................................................52
6.7 Main Menu.....................................................................................53
6.7.1 MSC Board Info...............................................................................54
6.7.2 Hardware Monitoring Measurement..................................................55
6.8 Advanced Menu.............................................................................56
6.8.1 Trusted Computing (TPM)................................................................57
6.8.2 ACPI Settings ..................................................................................57
6.8.3 Serial Port Console Redirection........................................................58
6.8.4 Console Redirection Submenu.........................................................58
6.8.5 CPU Configuration...........................................................................60
6.8.6 PPM Configuration...........................................................................60
6.8.7 IDE Configuration.............................................................................62
6.8.8 Miscellaneous Configuration.............................................................62
6.8.9 Internal Devices Configuration..........................................................63
6.8.10 AMI Graphic Output Policy ...............................................................64
6.8.11 PCI Subsystem Settings...................................................................64
6.8.12 Network Stack Configuration ............................................................68
6.8.13 CSM Configuration...........................................................................68
6.8.14 NVMe Configuration.........................................................................70

MSC C6C-BW MSC C6C-BW User Manual 5 / 107
6.8.15 SDIO Configuration..........................................................................71
6.8.16 USB Configuration...........................................................................71
6.8.17 Security Configuration......................................................................72
6.8.18 SIO WB627/ SMSC 3114 Configuration............................................73
6.8.19 EC Hardware Monitoring..................................................................75
6.8.20 Module-specific Initialization.............................................................80
6.9 Chipset.......................................................................................... 81
6.9.1 Flat Panel Configuration...................................................................81
6.9.2 Backlight Control..............................................................................82
6.9.3 North Bridge....................................................................................83
6.9.4 Intel®IGD Configuration...................................................................84
6.9.5 Memory Configuration Options.........................................................85
6.9.6 South Bridge....................................................................................87
6.9.7 Security Configration........................................................................87
6.9.8 Azalia HD Audio ..............................................................................88
6.9.9 USB Configuration...........................................................................89
6.9.10 PCI Express Configuration...............................................................90
6.9.11 PCIE Express Root Port 1-4.............................................................90
6.10 Security......................................................................................... 92
6.11 Boot.............................................................................................. 92
6.12 Save & Exit ................................................................................... 94
6.13 Blind Restoration of Bios default settings (no display available) ..... 98
6.14 Restore Bios settings from file........................................................99
6.15 Bios Recovery.............................................................................100
6.16 Jumpers ......................................................................................101
6.17 Post Codes..................................................................................101
7TECHNOTES......................................................................... 102
8EAPI....................................................................................... 104
9TROUBLESHOOTING ........................................................... 106

MSC C6C-BW MSC C6C-BW User Manual 6 / 107
Revision History
Rev.
Date
Description
1.0
2017-03-22
First release
1.1
2017-03-27
Bios chapter updated
1.2
2017-03-30
Additional review results added
1.3
2017-06-19
Bios updated
1.4
2017-07-13
Bios updated
1.5
2018-01-04
Jumper description changed, TPM_PP function removed
1.6
2018-07-11
TPM corrected from SLB9635 to SLB9660

MSC C6C-BW MSC C6C-BW User Manual 7 / 107
Reference Documents
[1] COM Express Module Base Specification
COM Express Revision 2.1
Last update: April 10th, 2012
[2] PCI Local Bus Specification Rev. 2.1
PCI21.PDF
Last update: June 1st, 1995
http://www.pcisig.com
[3] ATA/ATAPI-6 Specification
d1410r3b.pdf
http://www.t13.org/
[4] Serial ATA Specification
Serial ATA 1.0 gold.pdf
Last update: August 29th, 2002 Rev.1.0
http://www.sata-io.org/
[5] IEEE Std. 802.3-2002
802.3-2002.pdf
http://www.ieee.org
[6] VESA Embedded DisplayPort Standard
eDP_v1_3 mem.pdf
Last update: 13.01.2012
http://www.vesa.org/
[7] Universal Bus Specification
usb_20.pdf
Last update: April 27th, 2000
http://www.usb.org
[8] Universal Serial Bus Revision 3.0 Specification
usb_30_spec_xxxxxx.zip
Last update: 13.08.2012
http://www.usb.org

MSC C6C-BW MSC C6C-BW User Manual 8 / 107
1User Information
1.1 About this Manual
This user’s guide provides information about the components, features
and connectors available on the MSC C6C-BW COM ExpressTM
Compact Module.
1.2 Symbols and Signal Words
Safety Messages: Danger, Warning and Caution
No safety messages used in this manual, due to high compact module
security. The following paragraph shows the usual MSC standard.
Signal words call attention to a safety message and designate a
degree or level of hazard seriousness.
Signal word
Degree of hazard seriousness
Danger
Indicates a hazardous situation that, if not avoided,
will result in death or serious injury.
Warning
Indicates a hazardous situation that, if not avoided,
could result in death or serious injury.
Caution
Indicates a hazardous situation that, if not avoided,
could result in minor or moderate injury.
All safety messages have a safety alert symbol and are structured as
follows:
Danger, Warning or Caution
Type of hazard
Potential consequences of the hazard
Evasive or avoidance actions to be taken
Notice
Notices contain important information that should be observed. In case
of neglect the board can be damaged. All notices have the -symbol
and are structured as follows:
NOTE: Notice text.
1.3 Table Cells with Gray Text
Cells with gray text contain information that is not supported on this
board.
.

MSC C6C-BW MSC C6C-BW User Manual 9 / 107
1.4 Intended Use
High-performance embedded modules can perform various tasks in
infotainment systems, such as professional audio equipment for radio
and television, or sophisticated illumination engineering for theater
performances. The MSC C6C-BW module is based on Intel‘s multi-
core system-on-chip (SOC) Atom generation that integrates next
generation Intel processor core, graphics, memory, and I/O interfaces
into one solution. Do not use this Compact Module in any other
circumstances, as described herein.
1.5 Non-Intended Use
NOTE: Use the compact module in the specified temperature
ranges only!
NOTE: Use the compact module in the specified humidity ranges
only!
1.6 Electrostatic Sensitive Device
The MSC COM Express Compact Module is an
electrostatic sensitive device. It is packed accordingly.
NOTE: Handle the Compact Module at electrostatic-free
workstations only.
NOTE: Do not handle or store the Compact Module near strong
electrostatic, electromagnetic, magnetic or radioactive fields unless the
Compact Module is contained within its original packaging

MSC C6C-BW MSC C6C-BW User Manual 10 / 107
2Technical Description
2.1 Introduction
COM Express™ is an open specification from PICMG (PCI Industrial
Computer Manufacturer Group). It is a module concept to bring PCI
Express and other newer technologies like SATA, USB 3.0 and
different display interfaces onto a COM (Computer On Module).
A COM Express™ module is plugged onto an application-specific base
board and offers a migration path to future CPU technologies as they
become available. Utilizing different form factors, COM Express™ can
be used for deeply embedded solutions all the way up to high
performance platforms.
The design of the MSC C6C-BW module supports the Intel®
Celeron®/Pentium® N3000 Series System-on-Chip (SOC) platform
enabling the embedded application to provide high performance
processing with an excellent visual experience, together with power
efficiency.
For evaluation and design-in of the COM Express™ modules MSC
offers evaluation baseboards and development motherboards
providing the interface infrastructure for the COM Express™ module
using PC type connectors for external access.
Currently four module sizes are defined in the COM Express
Specification 2.1: the Mini Module, the Compact Module, the Basic
Module and the Extended Module. The main difference between them
is the over-all physical size and the performance envelope supported.
All module sizes of the same type use the same connectors and pin-
outs and utilize several common mounting hole positions. This level of
compatibility permits a carrier board designed to accommodate an
Extended Module to also support a Basic or Compact Module.
Up to 440 pins are available between COM Express™ modules and
the Carrier Board.
To enhance interoperability between COM Express™ modules and
Carrier Boards, seven common signaling configurations (Pin-out
Types) have been defined to ease system integration.

MSC C6C-BW MSC C6C-BW User Manual 11 / 107
2.2 Module Photos
Top Side View
1
Top side memory socket
2
MAC address label
3
Layout revision
4
Board Identification label
5
Fan connector
6
CPU
7
µSD-Card socket
8
BIOS label
6
7
8
0
1
2
5
4
3

MSC C6C-BW MSC C6C-BW User Manual 12 / 107
Bottom Side View
9
Bottom side memory socket
10
COM Express® connector
11
Board identification number (BID)
9
10
11

MSC C6C-BW MSC C6C-BW User Manual 13 / 107
2.3 Key Features
The MSC C6C-BW COM Express module is designed as a type 6 module according to COM Express® Module Base Specification Revision 2.1.
Key features include:
Module size: 95 mm x 95 mm
Intel® AtomTM / Celeron®/ Pentium®Series System-on-Chip
(SOC)
Dual 220 pin COM Express® connector (440 pins)
2x DDR3L SO-DIMM module up to 4 GB each one
Module topside socket should be filled first.
Eight USB 2.0 ports; 4 shared over-current lines
Four USB 3.0 ports
Two Serial ATA 6.0 Gbit/s ports (SATA Revision 3.x)
Micro SD card socket (max. speed UHS-I, bootable)
Up to 5 PCI Express 2.0 lanes on A-B (3 PCIe lanes without
PCIe Gen 2 switch)
Support pins for one Express Cards
Display interfaces
othree independent display controllers
oDigital Display Interface (DDI) configurable as HDMI,
DVI or Display Port
oDual 24-bit LVDS channel (shared with eDP)
High definition digital audio interface (external CODEC)
Single GBit Ethernet interface (Intel® Ethernet Controller I210-
AT)
LPC interface
Two UART ports (TX and RX only, SER0 configurable as
legacy PCU UART0 or as high speed UART1, SER1 only
HSUART2)
BIOS support for Super IO Winbond 83627 HF and SMSC
3114 NU (on carrier board via LPC interface)
Four GPI pins
Four GPO pins
+12V primary power supply input
+5V standby (optional) and 3.3V RTC power supply inputs
TPM module (optional TPM 1.2, SLB9660)
Automatic fan control
Watchdog timer

MSC C6C-BW MSC C6C-BW User Manual 14 / 107
2.4 Block Diagram

MSC C6C-BW MSC C6C-BW User Manual 15 / 107
2.5 COM Express Implementation
COM Express™ required and optional features for pin-out type 6 are summarized in the following table. The features identified as Minimum (Min.)
shall be implemented by all modules. Features identified up to Maximum (Max) may be additionally implemented by a module.
The column MSC C6C-BW shows the features implemented by the MSC module.
Type 6
MSC C6C-BW
Note
Min / Max
System I/O
A-B
PCI Express Lanes 0 - 5
1 / 6
5 / 3 (x1)
PCIe 2.0, x1 lanes, 3 PCIe x1 lanes without PCIe Gen 2 switch
A-B
LVDS Channels
0 / 2
2
1x dual channel, 2x24 Bit, Only available on modules with LVDS mounting option.
A-B
eDP on LVDS CH A pins
0 / 1
1
Only available on modules with eDP mounting option.
A-B
VGA Port
0 / 1
0
A-B
Serial Ports 1- 2
0 / 2
2
SER0 = PCU UART0 or HSUART1, SER1: HSUART2, (PCU UART: max. 115kbps, 16550 compliant)
A-B
CAN interface on SER1
0 / 1
0
A-B
SATA Ports
1 / 4
2
Serial ATA 6.0 Gbit/s (SATA Revision 3.x)
A-B
HDA Digital Interface
0 / 1
1
A-B
USB 2.0 Ports
4 / 8
8
A-B
USB Client
0 / 1
0
A-B
LAN Port 0
1 / 1
1
Intel® Ethernet Controller I210-AT
A-B
Express Card Support
1 / 2
1
A-B
LPC Bus
1 / 1
1
A-B
SPI
1 / 2
2
Fast SPI (50MHz) for SPI flash only.
C-D
PCI Express Lanes 16-31
0 / 16
0
C-D
PCI Express Graphics (PEG)
0 / 1
0
C-D
PCI Express Lanes 6-15
0 / 2
0
C-D
DDI 1-3
0 / 3
2
HDMI/DVI/DP
C-D
USB 3.0 Ports
0 / 4
4
System Management
A-B
SDIO (muxed on GPIO)
0 / 1
1
Max. UHS-I
A-B
General Purpose Inputs
4 / 4
4
A-B
General Purpose Outputs
4 / 4
4

MSC C6C-BW MSC C6C-BW User Manual 16 / 107
A-B
SMBus
1 / 1
1
A-B
I2C
1 / 1
1
From GPIO: standard mode up to 100kb/s, from controller: Fast Mode up to 400kb/s
A-B
Watchdog Timer
0 / 1
1
A-B
Speaker Out
1 / 1
1
A-B
External BIOS ROM support
0 / 2
1
A-B
Reset Functions
1 / 1
1
Power Management
A-B
Thermal Protection
0 / 1
0
A-B
Battery Low Alarm
0 / 1
1
A-B
Suspend
0 / 1
1
A-B
Wake
0 / 2
2
A-B
Power Button Support
1 / 1
1
A-B
Power Good
1 / 1
1
A-B
VCC_5V_SBY Contacts
4 / 4
4
A-B
Sleep Input
0 / 1
1
A-B
Lid Input
0 / 1
1
A-B
Fan Control Signals
0 / 2
2
A-B
Trusted Platform Modules
0 / 1
1
optional TPM 1.2 module

MSC C6C-BW MSC C6C-BW User Manual 17 / 107
2.6 Functional Units
CPUs
(FCBGA 1170
package)
Intel®AtomTM X5-E8000, QC, 1.04GHz, 2.00 GHz 2MB L2 Cache, 5W, 2ch DDR3L
Intel®Celeron®N3010, DC, 1.04GHz, 2.08GHz 2MB L2 Cache, 4W, 2ch DDR3L
Intel®Celeron®N3060, DC, 1.60GHz, 2.16GHz 2MB L2 Cache, 6W, 2ch DDR3L
Intel®Celeron®N3160, QC, 1.60GHz, 2.08GHz 2MB L2 Cache, 6W, 2ch DDR3L
Intel®Pentium®N3710, QC, 1.60GHz, 2.40GHz 2MB L2 Cache, 6W, 2ch DDR3L
TJUNCTION = 90°C
Memory
Two 204-pin DDR3L SO-DIMM sockets for up to two 4GB non-ECC unbuffered DDR3L
Maximal height 1250mil = 31.75mm
PC3L-12800, DDR3L SDRAM (DDR3L-1600)
(Module topside socket should be filled first.)
SATA
2 SATA channels up to 6.0 GBit/s
USB
8 x USB 2.0, 4 x USB 3.0/2.0
COM Express™
Type 6 interface, fully compliant to COM Express Base Specification R2.1
PCI Express™
Five channels PCIe x1. PCIe 2.0. (Three channels PCIe x1 without PCIe switch)
LPC
Low Pin Count Bus for legacy interfaces
SPI
Fast Serial Peripheral Interface for one 1.8 V SPI flash.
Graphics
Controller
Integrated Intel®HD Graphics Gen 8
LVDS
Dual channel 24-bit LVDS (dual channel, 1920 x 1200 @ 60Hz, only available on modules with LVDS mounting option)
Digital Display
Ports
2x Digital Display Interfaces (DDI)
DP 1.1a (2560 x 1600 @ 60Hz or 3840x2160 @ 30Hz, DP++)
HDMI 1.4b (2560 x 1600 @ 60Hz or 3840x2160 @ 30Hz)
Single-link DVI
eDP 1.4 (2560x1600@60Hz, only available on modules with eDP mounting option)
Ethernet
10/100/1000Base-TX (Intel® Ethernet Controller I210-AT)
Serial Interface
Two UART ports (TX and RX only, SER0 configurable as legacy PCU UART0 or as high speed UART1, SER1 only
HSUART2)
Watchdog Timer
Embedded controller creates watchdog alert and system reset

MSC C6C-BW MSC C6C-BW User Manual 18 / 107
TPM (option)
Optional TPM module, TPM 1.2, SLB9660
Fan Supply
4-pin header for support of a 12V PWM fan
Real Time Clock
RTC integrated in Intel®SOC
CMOS Battery
External
System Monitoring
Voltages, temperatures, fan
Core voltage
3.3V onboard voltage
12V input voltage
5V SBY input voltage
CPU temperature (0°C - 100°C)
System memory temperature
Board temperature
Fan speed and automatic fan speed control
Socket
Micro SD Card socket (max. UHS-I). This socket is designed for system internal use, so there is no ESD and EMI protection
implemented.
2.7 Power Supply
+12V primary power supply input
+5V standby
Option, is not required for module operation.
If not present, customer must ensure that the supply voltages which
are generated on the carrier board are switched off during suspend
states, so that no current from the carrier board’s signal lines can
flow to the CPU board.
3.3V RTC power supply
Option, is not required for module operation.
BIOS SETUP data is stored in a nonvolatile backup memory device,
therefore configuration data will not get lost after power removal
(except for time and date information)
Voltage
Input range
Power Consumption
+12V
+5.0V -17.0 V
Refer to chapter 2.8
+5V Standby
+4.75V - 5.25 V
+3V RTC power supply
+2.0V - 3.3V
Typ. 4.3 µA

MSC C6C-BW MSC C6C-BW User Manual 19 / 107
2.8 Power Dissipation
2.8.1 Running Mode
All measurements were made by plugging the MSC C6C-BW
module onto a MSC MB-EVA6 carrier. The module was equipped
with two 4GByte memory modules Hynix HMT451S6BFR8A-PB N0
AA, 4GB 1Rx8 PC3L-12800S-11-12-B4.1434 A, (8 chips each). The
table below shows typical values which refer to consumption of the
module itself without consumption of the base board and CPU fan.
The following applications have been tested:
1. DOS prompt.
2. Windows desktop (idle) under Microsoft Windows 7 Professional
64-bit SP1.
3. Running Intel® Thermal Analysis Tool (TAT) Ver. 5.x under
Microsoft Windows 7 Professional 64-bit SP1. TAT is running
with TDP Workload setting to CPU Power and Turbo ON.
Module / CPU
DOS
Win 7 Idle
Win 7 TAT
long term
max. 1)
C6C-BW-003 (Intel®Celeron®N3160, quad core, 2MB cache, 1.60 /
2.08 GHz, 6W, 2ch DDR3L)
4.2 W
4.2 W
10.7 W
14.2 W
C6C-BW-004 (Intel®Pentium®N3710, quad core, 2MB cache, 1.60 /
2.40 GHz, 6W, 2ch DDR3L)
3.6 W
4.4 W
10.5 W
14.2 W
C6C-BW-005 (Intel®AtomTM X5-E8000, quad core, 2MB cache, 1.04 /
2.00 GHz, 5W, 2ch DDR3L)
6.2 W
6.4 W
11.0 W
11.5 W
1) Turbo Mode Peak

MSC C6C-BW MSC C6C-BW User Manual 20 / 107
2.8.2 Power Dissipation (Standby Modes)
1. System is shut down into “Soft Off” (S5) or “Suspend to Disk”
(S4) by Windows 7 Professional 64-bit SP1.
2. System is shut down into “Soft Off” (S5) or “Suspend to Disk”
(S4) by Windows 7 Professional 64-bit SP1 with Wake on LAN
enabled.
3. System is shut down into “Suspend to RAM” (S3) by Windows 7
Professional 64-bit SP1.
4. System is shut down into “Suspend to RAM” (S3) by Windows 7
Professional 64-bit SP1 with Wake on LAN enabled.
Module / CPU
Input Power
S3
S4 / S5
No WOL
WOL enabled
No WOL
WOL enabled
C6C-BW-003 (Intel®Celeron®N3160, quad
core, 2MB cache, 1.60 / 2.08 GHz, 6W, 2ch
DDR3L)
12V/5V_SBY
0.6 W
0.6 W
0.5 W
0.5 W
12V only
0.4 W
0.4 W
0.3 W
0.3 W
C6C-BW-004 (Intel®Pentium®N3710, quad
core, 2MB cache, 1.60 / 2.40 GHz, 6W, 2ch
DDR3L)
12V/5V_SBY
0.5 W
0.5 W
0.4 W
0.5 W
12V only
0.4 W
0.4 W
0.3 W
0.3 W
C6C-BW-005 (Intel®AtomTM X5-E8000, quad
core, 2MB cache, 1.04 / 2.00 GHz, 5W, 2ch
DDR3L)
12V/5V_SBY
2.1 W
2.2 W
2.0 W
2.1 W
12V only
0.9 W
1.0 W
0.8 W
0.9 W
2.9 System Memory
The MSC C6C-BW CPU module provides two sockets for memory modules which have to meet the following demands:
204pin unbuffered non-ECC DDR3L SO-DIMM.
1.35V Supply Voltage
DDR3L-1600 / PC3L-12800
Maximum module height: 1250mil = 31.75mm.
SPD (Serial Presence Detect) EEPROM.
Max 4GB per socket
NOTE: When using only one memory module, insert it into the socket on the topside of the module.