Avnet COM Express MSC C6B-SLH User manual

COM Express®Basic Module MSC C6B-SLH
Type 6 Pinout
6th Generation Intel®CoreTM Processor Family
Intel®100 Series Chipset
Rev. 1.1 2021-04-29
User Manual

MSC C6B-SLH MSC C6B-SLH User Manual 2 / 144
Preface
Copyright Notice
Copyright © 2021 MSC Technologies GmbH. All rights
reserved.
Copying of this document, and providing to others and the
use or communication of the contents thereof, is forbidden
without express authority of MSC Technologies GmbH.
Offenders are liable to the payment of damages.
All rights are reserved in the event of the grant of a patent or
the registration of a utility model or design.
Important Information
This documentation is intended for qualified audiences only.
The product described herein is not an end user product. It
was developed and manufactured for further processing by
trained personnel.
Disclaimer
Although this document has been generated with the utmost
care no warranty or liability for correctness or suitability for
any particular purpose is implied. The information in this
document is provided “as is” and is subject to change without
notice.
EMC Rules
This unit has to be installed in a shielded housing. If not
installed in a properly shielded enclosure, and used in
accordance with the instruction manual, this product may
cause radio interference in which case the user may be
required to take adequate measures at his or her owns
expense.
Trademarks
All used product names, logos or trademarks are property of
their respective owners.
Certification
MSC Technologies GmbH is certified according to DIN EN
ISO 9001:2015 standards.
Life-Cycle-Management
MSC products are developed and manufactured according
to high quality standards. Our life-cycle management
assures long term availability through permanent product
maintenance. Technically necessary changes and
improvements are introduced if applicable. A product-
change-notification and end-of-life management process
assures early information of our customers.

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Product Support
MSC engineers and technicians are committed to provide
support to our customers whenever needed.
Before contacting Avnet Integrated /MSC Technical Support
please consult the respective pages on our web site at
www.msc-technologies.eu for the latest documentation,
drivers and software downloads.
If the information provided there does not solve your
problem, please contact our Avnet Integrated /MSC
Technical Support:
Phone: +49 - 8165 906 - 200
Email: [e-mail]

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Contents
1User Information............................................................. 8
1.1 About this Manual .............................. 8
1.2 Symbols and Signal Words........................ 8
1.3 Table Cells with Gray Text ........................ 8
1.4 Intended Use.................................. 9
1.5 Non-Intended Use .............................. 9
1.6 Electrostatic Sensitive Device...................... 9
2Technical Description.................................................... 10
2.1 Introduction .................................. 10
2.2 Module Photos ............................... 11
2.3 Key Features................................. 13
2.4 Block Diagram................................ 14
2.5 COM Express®Implementation.................... 15
2.6 Functional Units............................... 17
2.7 Power Supply ................................ 19
2.8 Power Dissipation ............................. 19
2.8.1 Running Mode.......................................................................19
2.8.2 Power Dissipation (Standby Modes) .....................................21
2.9 System Memory............................... 22
2.10 Mechanical Dimensions ......................... 23
2.10.1 Basic Module.........................................................................23
2.11 Thermal Specifications.......................... 24
2.12 Use Conditions ............................... 25
2.13 Signal Description ............................. 25
2.13.1 High Definition Audio.............................................................26
2.13.2 Ethernet.................................................................................26
2.13.3 Serial ATA.............................................................................27
2.13.4 PCI Express Lanes................................................................28
2.13.5 PCI Express x16 Graphic Lanes ...........................................28
2.13.6 Express Card Support...........................................................29
2.13.7 USB.......................................................................................30
2.13.8 LPC Bus................................................................................31
2.13.9 LVDS / eDP...........................................................................32
2.13.10 Digital Display Interfaces.......................................................35
2.13.11 Serial Interface Signals..........................................................38
2.13.12 Miscellaneous........................................................................38
2.13.13 Power and System Management.......................................... 39
2.13.14 General Purpose I/O............................................................. 40
2.13.15 SPI Interface......................................................................... 41
2.13.16 Module Type Definition......................................................... 42
2.13.17 Power and GND.................................................................... 43
2.14 Pin List..................................... 44
3Jumpers and Connectors.............................................. 50
3.1 Jumpers.................................... 50
3.2 Fan Connector ............................... 51
4Watchdog...................................................................... 51
5System Resources........................................................ 52
5.1 PCI IRQ Routing.............................. 52
5.2 SMB Address Map ............................ 53
6BIOS............................................................................. 54
6.1 Introduction.................................. 54
6.2 Startup Screen Overview........................ 54
6.3 Activity Detection Background .................... 54
6.4 Aptio Setup Utility ............................. 54
6.5 Configuring the System BIOS .................... 54
6.6 BIOS Menu Structure .......................... 55
6.6.1 Menu Bar .............................................................................. 56
6.6.2 Legend Bar ........................................................................... 57
6.7 Main Menu .................................. 58
6.7.1 MSC Board Info .................................................................... 59
6.7.2 Hardware Monitoring Measurement...................................... 60
6.7.3 System Information............................................................... 61
6.7.4 Firmware Update .................................................................. 61
6.8 Advanced Menu .............................. 62
6.8.1 CPU Configuration................................................................ 63
6.8.2 CPU SMM Enancement........................................................ 64
6.8.3 Power & Performance........................................................... 65
6.8.4 CPU - Power Management Control....................................... 65
6.8.5 View/Configure Turbo Options.............................................. 67
6.8.6 TDP Configurations............................................................... 69
6.8.7 Custom P-state Table........................................................... 71
6.8.8 Power Limit 3 Settings.......................................................... 71

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6.8.9 View/Configure CPU Lock Options........................................72
6.8.10 GT - Power Management Control..........................................72
6.8.11 PCH FW Configuration..........................................................72
6.8.12 AMT Configuration ................................................................73
6.8.13 CIRA Configuration ...............................................................73
6.8.14 ASF Configuration.................................................................74
6.8.15 Secure Erase Configuration ..................................................74
6.8.16 OEM Flags Settings ..............................................................75
6.8.17 MEBx Resolution Settings.....................................................76
6.8.18 Firmware Update Configuration.............................................76
6.8.19 Thermal Configuration...........................................................76
6.8.20 CPU Thermal Configuration ..................................................77
6.8.21 Platform Thermal Configuration.............................................78
6.8.22 Intel ICC ................................................................................78
6.8.23 Intel Rapid Storage Technology............................................79
6.8.24 Trusted Computing................................................................79
6.8.25 ACPI Settings........................................................................80
6.8.26 Smart Settings.......................................................................80
6.8.27 Serial Port Console Redirection ............................................80
6.8.28 Console Redirection Submenu..............................................81
6.8.29 Intel TXT Information.............................................................82
6.8.30 AMI Graphic Output Protocol Policy......................................83
6.8.31 Network Stack Configuration.................................................83
6.8.32 CSM Configuration................................................................84
6.8.33 NVMe Configuration..............................................................85
6.8.34 SDIO Configuration...............................................................85
6.8.35 USB Configuration.................................................................85
6.8.36 SIO WB 627 / SIO SMSC311X Configuration .......................87
6.8.37 EC Hardware Monitoring.......................................................88
6.8.38 Module-specific Initialization..................................................92
6.8.39 Onboard GPIO Initialization...................................................93
6.9 Chipset ..................................... 95
6.9.1 System Agent Configuration..................................................95
6.9.2 Memory Configuration...........................................................96
6.9.3 Graphics Configuration..........................................................98
6.9.4 PEG Port Configuration.........................................................99
6.9.5 PCH-IO Configuration .........................................................101
6.9.6 PCI Express Configuration..................................................103
6.9.7 PCIE GEN3 Eq Parameters ................................................104
6.9.8 PCIe Root Port x................................................................. 104
6.9.9 SATA & Intel RST (RAID) Configuration............................. 106
6.9.10 Software Feature Mask Selection....................................... 107
6.9.11 USB Configuration.............................................................. 109
6.9.12 Security............................................................................... 109
6.9.13 HD Audio Configuration...................................................... 110
6.9.14 Flat Panel Configuration ..................................................... 110
6.9.15 Chipset LCD Control........................................................... 111
6.9.16 Backlight Control................................................................. 111
6.10 Security ................................... 112
6.10.1 Secure Boot........................................................................ 113
6.10.2 Key Management................................................................ 113
6.11 Boot...................................... 114
6.12 Save & Exit................................. 117
6.13 Setup Controlled Update ....................... 119
6.14 Bios Update from EFI Shell ..................... 121
6.15 Bios Update from Linux ........................ 121
6.16 Bios Update from Windows ..................... 121
6.17 Blind Restoration of Bios default settings (no display available) 122
6.18 Bios Recovery .............................. 122
6.19 MSC Bios Editor ............................. 123
6.20 Trusted Update.............................. 124
6.21 Jumpers................................... 128
6.22 Post Codes................................. 128
7Technotes................................................................... 129
8EAPI ........................................................................... 133
9MSC Password Configuration Tool ............................. 133
10 MSC DMI Edit Tool..................................................... 133
11 Troubleshooting.......................................................... 134

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Revision History
Rev.
Date
Description
1.0
2021-03-09
First Release
1.1
2021-04-29
Updated Bios chapter / legacy Raid not supported anymore )

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Reference Documents
[1] COM Express®Module Base Specification
COM Express®Revision 2.1
Last update: April 10th, 2012
[2] PCI Local Bus Specification Rev. 2.1
PCI21.PDF
Last update: June 1st, 1995
http://www.pcisig.com
[3] ATA/ATAPI-6 Specification
d1410r3b.pdf
http://www.t13.org/
[4] Serial ATA Specification
Serial ATA 1.0 gold.pdf
Last update: August 29th, 2002 Rev.1.0
http://www.sata-io.org/
[5] IEEE Std. 802.3-2002
802.3-2002.pdf
http://www.ieee.org
[6] VESA Embedded DisplayPort Standard
eDP_v1_3 mem.pdf
Last update: 13.01.2012
http://www.vesa.org/
[7] Universal Bus Specification
usb_20.pdf
Last update: April 27th, 2000
http://www.usb.org
[8] Universal Serial Bus Revision 3.0 Specification
usb_30_spec_xxxxxx.zip
Last update: 13.08.2012
http://www.usb.org

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1 User Information
1.1 About this Manual
This user’s guide provides information about the components, features
and connectors available on the MSC C6B-SLH COM Express®
Compact Module.
1.2 Symbols and Signal Words
Safety Messages: Danger, Warning and Caution
No safety messages used in this manual, due to high compact module
security. The following paragraph shows the usual MSC standard.
Signal words call attention to a safety message and designate a degree
or level of hazard seriousness.
Signal word
Degree of hazard seriousness
Danger
Indicates a hazardous situation that, if not avoided,
will result in death or serious injury.
Warning
Indicates a hazardous situation that, if not avoided,
could result in death or serious injury.
Caution
Indicates a hazardous situation that, if not avoided,
could result in minor or moderate injury.
All safety messages have a safety alert symbol and are structured as
follows:
Danger, Warning or Caution
Type of hazard
Potential consequences of the hazard
Evasive or avoidance actions to be taken
Notice
Notices contain important information that should be observed. In case
of neglect the board can be damaged. All notices have the -symbol
and are structured as follows:
NOTE: Notice text.
1.3 Table Cells with Gray Text
Cells with gray text contain information that is not supported on this
board.

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1.4 Intended Use
The MSC high performance modules can be used in a variety of
applications such as industrial control, robotics, HMI, transport and
passenger information terminals. The MSC C6B-SLH module is based
on 6th Generation Intel®Processor Families multi-core platform that
integrates processor core, graphics, memory, and I/O interfaces into
one package. Do not use this Compact Module in any other
circumstances, as described herein.
1.5 Non-Intended Use
NOTE: Use the COM Express®module in the specified
temperature ranges only!
NOTE: Use the COM Express®module in the specified
humidity ranges only!
NOTE: Use the COM Express®module under Intel®specified
use conditions only!
1.6 Electrostatic Sensitive Device
The MSC COM Express®module is an electrostatic
sensitive device. It is packed accordingly.
NOTE: Handle the COM Express®module at electrostatic-free
workstations only.
NOTE: Do not handle or store the COM Express®Module near
strong electrostatic, electromagnetic, magnetic or radioactive
fields unless the Compact Module is contained within its original
packaging

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2 Technical Description
2.1 Introduction
COM Express®is an open specification from PICMG (PCI Industrial
Computer Manufacturer Group). It is a module concept to bring PCI
Express®and other newer technologies like SATA, USB 3.0 and
different display interfaces onto a COM (Computer On Module).
A COM Express®module is plugged onto an application-specific base
board and offers a migration path to future CPU technologies as they
become available. Utilizing different form factors, COM Express®can
be used for deeply embedded solutions all the way up to high
performance platforms.
The design of the MSC C6B-SLH module supports the 6th Generation
Intel®CoreTM Processor Family enabling you to boost your embedded
application to highest performance levels.
For evaluation and design-in of the COM Express®modules MSC
offers evaluation baseboards and development motherboards
providing the interface infrastructure for the COM Express®module
using PC type connectors for external access.
Currently four module sizes are defined in the COM Express®
Specification 2.1: the Mini Module, the Compact Module, the Basic
Module and the Extended Module. The main difference between them
is the over-all physical size and the performance envelope supported.
All module sizes of the same type use the same connectors and pin-
outs and utilize several common mounting hole positions. This level of
compatibility permits a carrier board designed to accommodate an
Extended Module to also support a Basic or Compact Module.
Up to 440 pins of connectivity are available between COM Express®
modules and the Carrier Board. Legacy buses such as PCI, parallel
ATA, LPC, HDA are supported as well as new high speed serial
interconnects such as PCI Express, Serial ATA and Gigabit Ethernet.
To enhance interoperability between COM Express®modules and
Carrier Boards, seven common signaling configurations (Pin-out Types)
have been defined to ease system integration.

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2.2 Module Photos
Top Side View
1
Top side memory socket
2
MAC address label
3
Layout revision
4
Board Identification number (BID)
5
Fan connector
6
CPU
7
PCH
6
7
1
2
5
4
3

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Bottom Side View
8
Bottom side memory socket
9
COM Express®connector
10
BIOS label
11
Board identification label
8
10
9
11

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2.3 Key Features
The MSC C6B-SLH COM Express®module is designed as a type 6 module according to COM Express®Module Base Specification Revision 2.1.
Key features include:
▪Module size: 125 mm x 95 mm
▪Various 6th Generation Intel®Core Processors
▪Dual 220 pin COM Express®connector (440 pins)
▪2x DDR4/ -RS (Reduced Standby) SO-DIMM module up to 16
GB each one, optional ECC (ECC support is SKU dependent)
▪Eight USB 2.0 ports; 4 shared over-current lines
▪Four USB 3.0 ports
▪Four Serial ATA 6.0 Gbit/s ports (SATA Revision 3.x)
▪Eight PCI Express 3.0 lanes
▪PEG x16 port
▪Support pins for two Express Cards
▪Display interfaces
othree independent display controllers
oDigital Display Interface (DDI) configurable as HDMI, DVI
or Display Port
oDual 24-bit LVDS channel (shared with eDP)
▪High definition digital audio interface (external CODEC)
▪Single GBit Ethernet interface (Intel®Ethernet Controller I219-
LM)
▪LPC interface
▪Two high speed UART ports (TX and RX only, functionality
based on the 16550 industry standards)
▪BIOS support for Super IO Winbond 83627 HF and SMSC 3114
NU (on carrier board via LPC interface)
▪Four GPI pins
▪Four GPO pins
▪+12V primary power supply input
▪+5V standby (optional) and 3.3V RTC power supply inputs
▪TPM module (TPM 1.2, SLB9660)
▪Automatic fan control
▪Watchdog timer

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2.4 Block Diagram

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2.5 COM Express®Implementation
COM Express®required and optional features for pin-out type 6 are summarized in the following table. The features identified as Minimum (Min.)
shall be implemented by all modules. Features identified up to Maximum (Max) may be additionally implemented by a module.
The column MSC C6B-SLH shows the features implemented by the MSC module.
Row
Function
Type 6
MSC C6B-SLH
Note
Min / Max
System I/O
A-B
PCI Express Lanes 0 - 5
1 / 6
6 (x1)
PCIe 3.0, configurable x1, x2, x4
A-B
LVDS Channels
0 / 2
2
1x dual channel, 2x24 Bit. Only available on modules with LVDS mounting option.
A-B
eDP on LVDS CH A pins
0 / 1
1
Only available on modules with eDP mounting option.
A-B
VGA Port
0 / 1
0
A-B
Serial Ports 1- 2
0 / 2
2
HSUART. Functionality based on the 16550 industry standards. SIR mode, dual clock and external read
enable signal for RAM wake up when using external RAMs is not supported. The UART 16550 8-bit
Legacy mode only operates with PIO transactions. DMA transactions are not supported in this mode.
A-B
CAN interface on SER1
0 / 1
0
A-B
SATA Ports
1 / 4
4
SATA 6.0 GBit/s (SATA Revision 3.x)
A-B
HDA Digital Interface
0 / 1
1
A-B
USB 2.0 Ports
4 / 8
8
A-B
USB Client
0 / 1
0
A-B
LAN Port 0
1 / 1
1
Intel®Ethernet Controller I219-LM
A-B
Express Card Support
1 / 2
2
(Currently no BIOS support)
A-B
LPC Bus
1 / 1
1
A-B
SPI
1 / 2
2
48MHz. Slave mode is not supported.
C-D
PCI Express Lanes 16-31
0 / 16
0
C-D
PCI Express Graphics (PEG)
0 / 1
1
(1x16 with HM170, 1x16 or 2x8 or 1x8+2x4 with QM170 and CM236)
C-D
PCI Express Lanes 6-15
0 / 2
2
C-D
DDI 1-3
0 / 3
3
HDMI/DVI/DP
C-D
USB 3.0 Ports
0 / 4
4
System Management
A-B
SDIO (muxed on GPIO)
0 / 1
0
A-B
General Purpose Inputs
4 / 4
4

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A-B
General Purpose Outputs
4 / 4
4
A-B
SMBus
1 / 1
1
A-B
I2C
1 / 1
1
Standard mode up to 100kb/s, Fast Mode up to 400kb/s
A-B
Watchdog Timer
0 / 1
1
A-B
Speaker Out
1 / 1
1
A-B
External BIOS ROM support
0 / 2
1
A-B
Reset Functions
1 / 1
1
Power Management
A-B
Thermal Protection
0 / 1
0
A-B
Battery Low Alarm
0 / 1
1
A-B
Suspend
0 / 1
1
A-B
Wake
0 / 2
2
A-B
Power Button Support
1 / 1
1
A-B
Power Good
1 / 1
1
A-B
VCC_5V_SBY Contacts
4 / 4
4
A-B
Sleep Input
0 / 1
1
A-B
Lid Input
0 / 1
1
A-B
Fan Control Signals
0 / 2
2
A-B
Trusted Platform Modules
0 / 1
1
TPM 1.2 module

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2.6 Functional Units
CPUs
(SKL-H BGA 1440
package)
Intel®Celeron®G3902E, DC, 1.60GHz, 25W, 2ch DDR4
Intel®Celeron®G3900E, DC, 1.90GHz, 35W, 2ch DDR4
Intel®CoreTM i3-6102E, DC, 1.90GHz, 3MB Intel®Smart Cache, 25W, 2ch DDR4
Intel®CoreTM i3-6100E, DC, 2.70GHz, 3MB Intel®Smart Cache, 35W, 2ch DDR4
Intel®CoreTM i5-6442EQ, QC, 1.90GHz, 2.70GHz, 25W, 6MB Intel®Smart Cache, 2ch DDR4 (no ECC support)
Intel®CoreTM i5-6440EQ, QC, 2.70GHz, 3.40GHz, 45W, 6MB Intel®Smart Cache, 2ch DDR4 (no ECC support)
Intel®CoreTM i7-6822EQ, QC, 2.00GHz, 2.80GHz, 25W, 8MB Intel®Smart Cache, 2ch DDR4 (no ECC support)
Intel®CoreTM i7-6820EQ, QC, 2.80GHz, 3.50GHz, 45W, 8MB Intel®Smart Cache, 2ch DDR4 (no ECC support)
Intel®Xeon®Processor E3-1505L v5, QC, 2.00GHz, 2.80GHz, 8MB Intel®Smart Cache, 2ch DDR4
Intel®Xeon®Processor E3-1505M v5, QC, 2.80GHz, 3.70GHz, 8MB Intel®Smart Cache, 2ch DDR4
Intel®Xeon®Processor E3-1535M v5, QC, 2.90GHz, 3.80GHz, 8MB Intel®Smart Cache, 2ch DDR4
TJUNCTION = 100°C
Chipset
Mobile Intel®HM170, QM170 or CM236 Chipset, (optional ECC only with CM236)
Memory
Two 260-pin DDR4 SO-DIMM sockets for up to two 16GB DDR4 modules
Maximal height 1250mil = 31.75mm
PC4-1866/2133, DDR4/ -RS SDRAM (DDR4 1866/2133)
SATA
4 SATA channels up to 6.0 Gbit/s, SATA Revision 3.x (SATA III, SATA-600)
USB
8 x USB 2.0, 4 x USB 3.0/2.0
COM Express®
Type 6 interface, fully compliant to COM Express®Base Specification R2.1
PCI Express®
Eight channels PCIe x1. (Configurable x1, x2, x4)
LPC
Low Pin Count Bus for heritage interfaces
SPI
Serial Peripheral Interface for one 3.3 V SPI flash device
Graphics
Controller
Integrated Intel® HD Graphics at Intel®Celeron® CPUs
Integrated Intel®HD Graphics 530 at Intel®CoreTM i3, i5, i7 CPUs
Integrated Intel®HD Graphics P530 at Xeon®Processors
PEG
PCIe x16 graphics port (PEG) supports external graphics cards
LVDS
Dual channel 24-bit LVDS (Only available on modules with LVDS mounting option.)

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Digital Display
Ports
Digital Display Interfaces (DDI)
DP 1.2 (4096x2304@60Hz)
HDMI 1.4 (4096x2304@24Hz)
DVI (1920x1200@60Hz)
eDP 1.3 (4096x2304@60Hz) (Only available on modules with eDP mounting option.)
Ethernet
10/100/1000Base-TX (Intel®Ethernet Controller I219-LM)
Serial Interface
Two High Speed UARTs. (Functionality based on the 16550 industry standards. SIR mode, dual clock and external read
enable signal for RAM wake up when using external RAMs is not supported. The UART 16550 8-bit Legacy mode only
operates with PIO transactions. DMA transactions are not supported in this mode.)
Watchdog Timer
Embedded controller creates watchdog alert and system reset
TPM
TPM module, TPM 1.2, SLB9660
Fan Supply
4-pin header for support of a 12V PWM fan
Real Time Clock
RTC integrated in CPU package
CMOS Battery
External
System Monitoring
Voltages, temperatures, fan
▪Core voltage
▪3.3V onboard voltage
▪12V input voltage
▪5V SBY input voltage
▪CPU temperature (0°C - 100°C)
▪System memory temperature
▪Board temperature
▪Fan speed and automatic fan speed control

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2.7 Power Supply
▪+12V primary power supply input
▪+5V standby
Option, is not required for module operation.
If not present, customer must ensure that the supply voltages which
are generated on the carrier board are switched off during suspend
states, so that no current from the carrier board’s signal lines can
flow to the CPU board.
▪3.3V RTC power supply
Option, is not required for module operation.
BIOS SETUP data is stored in a nonvolatile backup memory device,
therefore configuration data will not get lost after power removal
(except for time and date information)
2.8 Power Dissipation
2.8.1 Running Mode
All measurements were made by plugging the MSC C6B-SLH
module onto a MSC C6-MB-EVA carrier. The module was equipped
with two 8GByte memory modules (8GB DDR4 2133 SODIMM,
M4SR-8GSSOC0G-E). The table below shows typical values which
refer to consumption of the module itself without consumption of the
base board and CPU fan.
The following applications have been tested with minimum 15
minutes measurement time:
•Windows desktop (idle) under Microsoft Windows 10 Enterprise
64-bit.
•Running Intel®Thermal Analysis Tool (TAT!) Ver. 6.x to achieve
TDP workload under Microsoft Windows 10 Enterprise 64-bit.
•BurnInTest V7.1 Pro with test settings 100% CPU, 100% RAM,
100% 2D Graphics and 100% 3D Graphics.
Voltage
Input range
Power Consumption
+12V
+11.4V - 12.6 V
Refer to chapter 2.8
+5V Standby
+4.75V - 5.25 V
+3V RTC power supply
+2.0V - 3.2V
Typ. 1.6 µA

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Module / CPU
Win 10 Idle
Win 10 TAT!
BurnInTest
average
peak
C6B-SLH-102 (Intel®Celeron®G3900E, DC, 1.90GHz, 35W, 2ch
DDR4, PCH: CM236) TAT package power 21W when workload set
to 100% CPU-All 100% Gfx
5.3 W
23.4 W1)
24.2 W1)
14.1 W
C6B-SLH-001 (Intel®Celeron®G3902E, DC, 1.60GHz, 25W, 2ch
DDR4, PCH: HM170) TAT package power 17W when workload set
to 100% CPU-All 100% Gfx
5.6 W
19.9 W2)
20.6 W2)
11.7 W
C6B-SLH-003 (Intel®CoreTM i3-6102E, DC, 1.90GHz, 25W, 3MB
Intel®Smart Cache, 2ch DDR4, PCH: HM170), TAT package power
24W when workload set to 80% CPU-All 100% Gfx
5.6 W
29.3 W3)
33.9 W3)
14.9 W
C6B-SLH-104 (Intel®CoreTM i3-6100E, DC, 2.70GHz, 35W, 3MB
Intel®Smart Cache, 2ch DDR4, PCH: CM236) TAT package power
33W when workload set to 70% CPU-All 100% Gfx
5.6 W
36.1 W
37.1 W
20.6 W
C6B-SLH-025 (Intel®CoreTM i5-6442EQ, QC, 1.90GHz, 2.70GHz,
25W, 6MB Intel®Smart Cache, 2ch DDR4, PCH: QM170)
5.5 W
29.5 W
42.1 W
25.2 W
C6B-SLH-006 (Intel®CoreTM i5-6440EQ, QC, 2.70GHz, 3.40GHz,
45W, 6MB Intel®Smart Cache, 2ch DDR4, PCH: QM170)
5.5 W
51.5 W
65.4 W
32.8 W
C6B-SLH-008 (Intel®CoreTM i7-6820EQ, QC, 2.80GHz, 3.50GHz,
45W, 8MB Intel®Smart Cache, 2ch DDR4, PCH: QM170)
5.7 W
50.3 W
66.5 W
40.8 W
C6B-SLH-009 (Intel®Xeon®Processor E3-1505L v5, QC, 2.00GHz,
2.80GHz, 25W, 8MB Intel®Smart Cache, 2ch DDR4, PCH: CM236)
5.5 W
29.7 W
36.4 W
28.8 W
1) TAT workload setting: CPU-All 100%, Gfx 100%, 21W TAT package power, because Celeron®3900E TDPis not defined in Intel®Thermal Analysis Tool Ver. 6.0.1013
2) TAT workload setting: CPU-All 100%, Gfx 100%, 17W TAT package power, because Celeron®3902E TDP is not defined in Intel®Thermal Analysis Tool Ver. 6.0.1013
3) TAT workload setting: CPU-All 80%, Gfx 100%, 24W TAT package power, because i3-6102E TDPis set to 15W in Intel®Thermal Analysis Tool Ver. 6.0.1013