Avnet Reach Further MT3620 User manual

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Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Features
Microsoft Azure Sphere SoC based module
solution for advanced end-to-end IOT security
Based on MediaTek MT3620AN Wi-Fi SoC
-1x 500MHz Arm Cortex A7 application
processor with 4MB SRAM
-2x 200MHz Arm Cortex M4F cores,
each with 64KB SRAM
-4MB embedded RAM (shared)
-16MB QSPI flash memory
-Dual-band 2.4/5GHz 802.11 a/b/g/n Wi-Fi
Module I/O peripheral support
-3x ISU interfaces, pre-configured for
UART, SPI, I2C
-ADC/GPIO: 3x 12-bit ADC inputs (or GPIOs)
-PWM/GPIO: 9x PWM outputs
(or up to 24 GPIOs)
-RTC (requires VBAT supply)
-Programming & recovery interface
Microsoft Visual Studio IDE for accelerated
application software development & debug
OTA authentication & updates (device lifetime)
Dimensions: 33mm x 22mm x 3.5mm
Onboard dual-band 2.4/5GHz chip antenna
-(Pulse W3006)
Operating temperature:
--35C to +85°C
(Note: For industrial temperature range,
please use the U.FL version module)
Certifications:
-FCC, IC, CE, MIC, RoHS (pending)
Applications
IoT edge devices
Smart home appliances / security
Smart retail
Remote access
Building automation
Factory automation
For more info on Azure Sphere MT3620 modules,
visit: http://avnet.me/mt3620-modules
To purchase an Azure Sphere MT3620 Starter Kit
visit: http://avnet.me/mt3620-kit
Note: Support for some MT3620 features is still
pending. To check latest status, visit:
https://docs.microsoft.com/en-us/azure-
sphere/hardware/mt3620-product-status
AES-MS-MT3620-M-G
Azure Sphere
MT3620 module
(with chip antenna)

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Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Document Control
Document Version: 1.2
Document Date: 05/09/2019
Document Author: Peter Fenn
Document Classification: Public
Document Distribution: Public
Version History
Version
Date
Comment
1.0
05/07/2019
Initial release, new document scope, photos, pinout detail and content
1.1
05/07/2019
Added FCC Module Statement (USA)
1.2
05/09/2019
Link to Sphere status added. FTDI adaptor cable detail updated
Ordering Information
Part Number
Description
AES-MS-MT3620-M-G
Azure Sphere MT3620 Module (chip antenna)
Product Page: http://avnet.me/mt3620-modules
AES-MS-MT3620-SK-G
Azure Sphere MT3620 Starter Kit
Product Page: http://avnet.me/mt3620-kit

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AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Contents
Features...................................................................................................................... 1
Applications................................................................................................................. 1
Document Control.......................................................................................................2
Ordering Information...................................................................................................2
Overview.....................................................................................................................6
Module Block Diagram................................................................................................7
Module Application Development and Programming ..................................................8
Development Computer Software Installation......................................................................................8
Module Interfaces with the Development Computer............................................................................8
Module Integration onto an OEM Board......................................................................9
Module Power Interfaces .....................................................................................................................9
Wi-Fi Network Settings.........................................................................................................................9
Wi-Fi Subsystem................................................................................................................................10
Wi-Fi Antenna.....................................................................................................................................10
A7 Application Processor...................................................................................................................10
M4F IO Processors ............................................................................................................................10
Flash Memory.....................................................................................................................................10
Pluton Security Subsystem ................................................................................................................10
Real Time Clock (RTC)......................................................................................................................10
Peripheral Serial Interfaces................................................................................................................10
Other I/O Interfaces............................................................................................................................10
MT3620 Bootstrap Pins......................................................................................................................11
Module Placement and Ground plane requirements .........................................................................12
Module Pinout Locations....................................................................................................................13
Module Pinout Table ..........................................................................................................................14
Electrical Specifications ............................................................................................ 16
Absolute Maximum Ratings ...............................................................................................................16
Recommended Operating Conditions................................................................................................16
DC Characteristics .............................................................................................................................16
Current Consumption.........................................................................................................................17
RF Characteristics .................................................................................................... 18
Wi-Fi 2.4GHz Band RF Receiver Specifications................................................................................18
Wi-Fi 2.4GHz Band RF Transmitter Specifications............................................................................20
Wi-Fi 5GHz Band RF Receiver Specifications...................................................................................21
Wi-Fi 5GHz Band RF Transmitter Specifications...............................................................................22

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Data Sheet and User Manual
Wi-Fi RF Receiver Blocking Specifications........................................................................................23
Mechanical Specifications......................................................................................... 24
Module Dimension Details .................................................................................................................24
Tape and Reel Packaging..................................................................................................................25
Soldering and Cleaning Recommendations.............................................................. 26
Optimum Soldering Reflow Profile.....................................................................................................26
Cleaning .............................................................................................................................................26
Certifications and Compliance .................................................................................. 27
RoHS Compliance..............................................................................................................................27
Regulatory Compliance......................................................................................................................27
FCC and ISED Regulatory Notices (USA and Canada) ....................................................................27
Modification statement ...................................................................................................................27
Interference statement ...................................................................................................................27
RF Radiation Exposure Statement.................................................................................................27
FCC Class B Digital Device Notice (USA) .....................................................................................28
FCC Module Statement (USA).......................................................................................................28
CAN ICES-003 (B) .........................................................................................................................28
Labeling Requirements for the OEM Host Board...........................................................................28
FCC Requirements for User Manual of the OEM Host Board: ......................................................29
IC Requirements for User Manual of the OEM Host Board: ..........................................................30
FCC Host 15B and 15C Compliance Statement (USA).................................................................30
CE Statement (Europe)......................................................................................................................30
CE Labeling Requirements (Europe) .............................................................................................30
OEM Instructions................................................................................................................................31
Shipping, Handling and Storage ............................................................................... 32
Shipping .............................................................................................................................................32
Handling.............................................................................................................................................32
Moisture Sensitivity (MSL) .................................................................................................................32
Storage...............................................................................................................................................32
Contact Information...................................................................................................33
Legal Information...................................................................................................... 34
Limitations..........................................................................................................................................34
Avnet Module License and Product Warranty....................................................................................34

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Data Sheet and User Manual
Table of Figures
Figure 1 –Simplified MT3620 SoC Block Diagram...........................................................................................6
Figure 2 –AES-MS-MT3620-M-G Module Block Diagram...............................................................................7
Figure 3 –Module with dual-band Chip Antenna............................................................................................10
Figure 4 –OEM board Footprint for AES-MS-MT3620-M-G Module..............................................................12
Figure 5 –AES-MS-MT3620-M-G Module Pinout ..........................................................................................13
Figure 6 –AES-MS-MT3620-M-G Module Mechanical Details ......................................................................24
Figure 7 –Tape and Reel Details ...................................................................................................................26
Figure 8 –Recommended Soldering Profile for Lead-Free Solder.................................................................26

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AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Overview
The AES-MS-MT3620-M-G is a small form-factor, tri-core Wi-Fi SoC module, intended for use as a secure
Wi-Fi client, in internet-connected IoT applications. Avnet’s production-ready, certified module comes fitted
with a single dual-band chip antenna, for cost-optimized application in 2.4 GHz or 5GHz Wi-Fi networks
Based on the MediaTek MT3620AN SoC, this is a new class of connected SoC IoT device that facilitates
“end-to-end security”. User applications can target it’s 500 MHz ARM Cortex-A7 core as well as two general
purpose 200 MHz ARM Cortex-M4F I/O subsystem cores designed to support real-time requirements. The
on-chip peripherals (GPIO, UART, I2C, SPI, I2S, PWM and ADC) can be mapped to any of these three
user-accessible processor cores.
Figure 1 –Simplified MT3620 SoC Block Diagram
Further differentiators of the MT3620 device are its built-in Pluton security subsystem (with dedicated CM4F
core) for secure boot and secure system operation, its dual-band 802.11 a/b/g/n Wi-Fi connectivity, as well
as integration of on-chip PMU, RTC plus FLASH and SRAM memory. Wi-Fi based OTA firmware and user
application updates (using certificate-based authentication) are hosted by Microsoft for the device lifetime
The Cortex-A7 application processor runs Microsoft’s Azure Sphere Secure OS. Custom user applications
are developed in C using Microsoft’s Visual Studio IDE, which includes user-friendly debugging features
such as single-step execution, breakpoints and watch-points (supported via a dedicated service UART)
The module allows easy design migration and end-product enhancements. By integrating all necessary
support and RF front end circuitry onto a small 33 mm x 22 mm module, Avnet has reduced the design time
for implementing Sphere-based solutions. Developers can leverage the module’s wireless regulatory
certifications (pending) for their end product, saving considerable certification costs and testing time.
The Avnet Azure Sphere MT3620 chip module has a 33mm x 22mm form-factor, with 66 pad castellated
“stamp-hole” footprints. It has an on board chip antenna (Pulse W3006) with a 26MHz crystal oscillator.
Microsoft Visual Studio IDE is used for software development of applications that target this Azure Sphere
MT3620 Module. Instructions for installing this Integrated Development Environment, as well as it’s Azure
Sphere SDK companion application and necessary drivers, are detailed (with examples) in the User Guide
for Avnet’s Azure MT3620 Sphere Starter Kit

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Data Sheet and User Manual
Online authentication and firmware updates are supported for the MT3620 device lifetime.
Module Block Diagram
Figure 2 –AES-MS-MT3620-M-G Module Block Diagram

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Data Sheet and User Manual
Module Application Development and Programming
Development Computer Software Installation
In depth instructions are provided at the Microsoft Getting started with Azure Sphere webpage:
https://aka.ms/AzureSphereSDK
Microsoft’s Getting Started with Azure Sphere page details the download & install of two software items:
1) Azure Sphere SDK Preview for Visual Studio from the Visual Studio Marketplace
2) Visual Studio 2017 version 15.7 or later (free Community edition is sufficient)
as well as USB driver installation for a wired interface between a development computer and the module
Microsoft’s Azure Sphere SDK provides the following:
The azsphere command-line utility for managing devices, images, and deployments
Libraries for application development
Visual Studio extensions to support Azure Sphere development, debug and flash programming
Microsoft’s Visual Studio IDE provides a sophisticated development environment for editing, building and
debugging custom embedded C applications (a GCC cross-compiler and GDB debugger provide the
underlying build and debug tools)
For application development targeting this module, it is recommended that hardware and software
prototyping be done using the Avnet Azure Sphere MT3620 Starter Kit http://avnet.me/mt3620-kit )
Module Interfaces with the Development Computer
The module is designed to support up to four wired interfaces with the development computer.
Three 4-wire UART interfaces (SERVICE, RECOVERY and DEBUG) dedicated for connection with
the host development computer are pinned-out, each with hardware flow-control.
A 3-wire SWD interface is also pinned-out
RESET and RECOVERY (via DEBUG_RTS during boot) signals determine the module operating
mode

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Data Sheet and User Manual
Module Integration onto an OEM Board
Module Power Interfaces
To power this module, the OEM board must be able to supply a maximum of 2.5 Watts at 3.3V.
Prior to power-up of the module, the following interfaces need to be attended to:
Interface Pins
Description
Notes
3V3
Main input voltage to the module.
3.3V (+/- 10%)
Powered by an external PMU
or DC/DC convertor
3V3_RTC
Real Time Clock power input to module
Powered by external battery,
or connect this to the 3V3 rail
VREF_ADC
Reference voltage for on-chip A/D
convertor
Powered by external reference
voltage, or connect to the
MT3620 2.5V LDO output
EXT_PMU_EN
MT3630 output to enable / disable
external PMU or DC/DC convertor
May be left unconnected
PMU_EN
MT3630 input to enable / disable the
internal PMU
May be left unconnected
WAKEUP
MT3630 input to wake-up the A7
processor from power-saving sleep mode
May be left unconnected
Wi-Fi Network Settings
For Wi-Fi connected user applications, the module’s Wi-Fi network settings need to be configured by one of
the following methods:
a) In application software (#define statements), that is factory-programmed into module by the OEM
b) Via a companion BLE device integrated onto the OEM’s end-product board
(Microsoft provides an example based on the Nordic nRF52840 device)
c) Via the SERVICE UART interface with a Windows-10 development computer running the
azsphere command-line utility (See separate App Note that details suggested PCB footprint to
support temporary attachment of an FTDI FT4232HQ based USB to serial adaptor)
Upon power-up and connection to the designated Wi-Fi network, the module will communicate with the
Microsoft Azure Sphere Security Service, which authenticates and manages one or more of the following
downloads/uploads with the module:
Push of Azure Sphere OS firmware updates to the module
Deployment of custom application software to the module
Reporting of Sphere OS and application versions plus error information to the Azure Sphere Server
The Microsoft Azure Sphere Security Service will also authenticate data transfers between the custom user
application executing on the module and Microsoft Azure (or other) cloud services

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Data Sheet and User Manual
Wi-Fi Subsystem
Dual-band 2.4/5GHz 802.11 a/b/g/n Wi-Fi (20 MHz channels only)
Has an N968 Andes 32bit MCU
Uses an external 26 MHz crystal oscillator on the module
Has an integrated 5GHz Balun
Uses external 2.4GHz Balun and Diplexer devices on the module
Wi-Fi Antenna
The module is fitted with an on-board dual-band
chip antenna for 2.4GHz and 5GHz operation
(Pulse Electronics antenna p/n: W3006)
An inline switched RF probe connector
is provided to facilitated RF conducted measurements
A7 Application Processor
1x 500MHz Arm Cortex A7 application processor
core, with 4MB SRAM (shared)
M4F IO Processors
2x 200MHz Arm Cortex M4F IO processor cores,
each with 64KB SRAM
The module pins-out the IO0_TXD and IO1_TXD pins from their dedicated UARTs
SWD interface based debug and programming of M4F IO MCU cores may at later date be enabled
Flash Memory
16MB 100MHz (on-die) QSPI flash memory
Pluton Security Subsystem
1x Cortex M4F MCU, dedicated RAM, ROM and GP timers, system control outputs
Real Time Clock (RTC)
Low-power RTC with timer/time of day control over system power (32KHz crystal oscillator)
Peripheral Serial Interfaces
Three ISU serial interfaces are pinned-out. Their accessible pins are limited to that needed for support of:
ISU0: UART, max rate=3Mbps (4-wire)
ISU1: SPI , max rate=40 MHz (5-wire)
ISU2: I2C , max rate=1MHz (2-wire)
Other I/O Interfaces
All pinned-out I/O pins (including ISU interfaces listed above) can be individually configured as GPIO pins.
A subset of these can be configured as:
PWM outputs
ADC inputs
EXT INT inputs
Figure 3 –Module with
dual-band Chip Antenna

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Data Sheet and User Manual
MT3620 Bootstrap Pins
Note! Six of the seven bootstrap pins are already strapped on the module.
The DEBUG_RTS signal must however be strapped on the OEM board with a 2K2 pull-down resistor, to
ensure that RECOVERY mode remains disabled (This signal gets driven high to select RECOVERY via an
FTDI device based interface with the development computer when a Debug-Programmer cable is attached)
Function
Pin Name
Strapping
Recommendation
Normal/Test mode
DEBUG_TXD
Pull-Down
Pull-down resistor is on module
Mode = Normal
Recovery mode
DEBUG_RTS
Pull-Down
Pull-down resistor required on OEM board!
Controlled via PC interface, - if present
RTC mode
RECOVERY_TXD
Pull-Up
Pull-up resistor is on module
RTC oscillator = 32 kHz crystal
26MHz
IO0_RTS
Pull-Up
MT3620 internal pull-up on module
Oscillator frequency = 26 MHz
26MHz
IO0_TXD
Pull-Down
Pull-down resistor is on module
Oscillator frequency = 26 MHz
N9 JTAG
IO1_TXD
Pull-Down
Pull-down resistor is on module
N9 JTAG = OFF
A7 JTAG
RECOVERY_RTS
Pull-Down
Pull-down resistor is on module
A7 JTAG = OFF
See the MT3620 Product Brief at the Mediatek webpage
for more detail on the MT3620AN SoC device…
https://www.mediatek.com/products/azureSphere/mt3620

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Data Sheet and User Manual
Module Placement and Ground plane requirements
For optimum antenna performance the Ground plane of the OEM board (on which the module is fitted)
needs to be maximized
The GND pads in the antenna area of the module must be connected to this Ground plane
Placement of the module should be 6 mm or more from any corner of the OEM carrier board
A PCB cutout is recommended in the host carrier board beneath the chip antenna (17mm x 7mm)
Figure 4 –OEM board Footprint for AES-MS-MT3620-M-G Module

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Module Pinout Locations
Figure 5 –AES-MS-MT3620-M-G Module Pinout

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Data Sheet and User Manual
Module Pinout Table
Module
Pad
MT3620
Pad
MT3620
Net Name
I/O
Pin Function
Pre-Assigned
Starter Kit Function=BLUE
1
GND
GND
2
2,3
3V3
Power
3
2,3
3V3
Power
4
GND
5
13
GPIO0_PWM0
I/O
GPIO / INT in / PWM out
PWM CLICK1
6
14
GPIO1_PWM1
I/O
GPIO / INT in / PWM out
PWM CLICK2
7
15
GPIO2_PWM2
I/O
GPIO / INT in / PWM out
INT_CLICK
8
17
GPIO4_PWM4
I/O
GPIO / INT in / PWM out
GPIO4_LED_APP
9
18
GPIO5_PWM5
I/O
GPIO / INT in / PWM out
GPIO5_LED_WIFI
10
19
GPIO6_PWM6
I/O
GPIO / INT in / PWM out
INT_LSM6DSO
11
21
GPIO8_PWM8
I/O
GPIO / INT in / PWM out
GPIO8_LED_USER_RED
12
22
GPIO9_PWM9
I/O
GPIO / INT in / PWM out
GPIO9_LED_USER_GRN
13
25
GPIO10_PWM10
I/O
GPIO / INT in / PWM out
GPIO10_LED_USER_BLU
14
27
GPIO12
I/O
GPIO / INT in
GPIO12_SW_A
15
28
GPIO13
I/O
GPIO / INT in
GPIO13_SW_B
16
31
GPIO16
I/O
GPIO / INT in
RST CLICK1
17
32
GPIO17
I/O
GPIO / INT in
RST CLICK2
18
39
GPIO26_SCLK0_TXD0
I/O
GPIO / ISU0
UART TXD
19
40
GPIO27_MOSI0_RTS0_SCL0
I/O
GPIO / ISU0
UART RTS / I2C0
20
42
GPIO28_MISO0_RXD0_SDA0
I/O
GPIO / ISU0
UART RXD / I2C0
21
43
GPIO29_CSA0_CTS0
I/O
GPIO / ISU0
UART CTS
22
46
GPIO31_SCLK1_TXD1
I/O
GPIO / ISU1
SPI SCLK / UART1
23
47
GPIO32_MOSI1_RTS1_SCL1
I/O
GPIO / ISU1
SPI MOSI / UART1 / I2C1
24
48
GPIO33_MISO1_RXD1_SDA1
I/O
GPIO / ISU1
SPI MISO / UART1 / I2C1
25
49
GPIO34_CSA1_CTS1
I/O
GPIO / ISU1
SPI CS #1 / UART1
26
50
GPIO35_CSB1
I/O
GPIO / ISU1
SPI CS #2
27
52
GPIO37_MOSI2_RTS2_SCL2
I/O
GPIO / ISU2
I2C
28
53
GPIO38_MISO2_RXD2_SDA2
I/O
GPIO / ISU2
I2C
29
58
GPIO41_ADC0
I/O
GPIO / ADC in
AMBIENT LIGHT SENSOR
30
59
GPIO42_ADC1
I/O
GPIO / ADC in
AN CLICK1
31
60
GPIO43_ADC2
I/O
GPIO / ADC in
AN CLICK2
32
66
VOUT_2V5
AO
33
67
VREF_ADC
AI
min 1.8V, max 2.5V
34
81
PMU_EN
I
pull-up on module
35
70
WAKEUP
I
Ext. Wakeup Input
pull-up on module
36
69
EXT_PMU_EN
O
Ext. 3V3 regulator enable
37
GND
GND

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Data Sheet and User Manual
Module Pinout Table (continued)
Module
Pad
MT3620
Pad
MT3620
Net Name
I/O
Pin Function
Pre-Assigned
Starter Kit
Function=BLUE
38
GND
GND
39
71
3V3_RTC
Power
min 2.50 V, max 3.63V
40
GND
GND
41
GND
GND
42
88,89
3V3
Power
43
88,89
3V3
Power
44
94
DEBUG_RXD
I
Debug UART
DEBUG_RXD
45
96
DEBUG_RTS
O
Debug UART
(pulled-down / FTDI controlled
strapping state on Starter Kit)
DEBUG_RTS
46
95
DEBUG_TXD
O
Debug UART
(pulled-down on module)
DEBUG_TXD
47
97
DEBUG_CTS
I
Debug UART
DEBUG_CTS
48
98
SWD_DIO
I/O
CM4F SWD
SWD_DIO
49
99
SWD_CLK
I
CM4F SWD
SWD_CLK
50
100
SWO
O
CM4F SWD
SWO
51
125
SYSRST_N
I
SYSRST_N
52
127
SERVICE_TXD
O
Service UART
SERVICE_TXD
53
129
SERVICE_RXD
I
Service UART
SERVICE_RXD
54
128
SERVICE_RTS
O
Service UART
SERVICE_RTS
55
130
SERVICE_CTS
I
Service UART
SERVICE_CTS
56
134
RECOVERY_RXD
I
Recovery UART
RECOVERY_RXD
57
135
RECOVERY_TXD
O
Recovery UART
(PU on module)
RECOVERY_TXD
58
136
RECOVERY_RTS
O
Recovery UART
(pulled-down on module)
RECOVERY_RTS
59
137
RECOVERY_CTS
I
Recovery UART
RECOVERY_CTS
60
139
IO0_GPIO86/IO0_TXD
O
IO0_GPIO / IO0_TXD
(pulled-down on module)
IO0_TXD
61
143
IO1_GPIO90/IO1_TXD
O
IO1_GPIO / IO1_TXD
(pulled-down on module)
IO1_TXD
62 - 66
GND
GND
GND pour
67
PADGND
GND
Thermal pad for MT3620
Note! Azure Sphere OS support for some MT3620 features is still to be released by Microsoft.
eg. GPIO, UART, I2C and SPI peripherals are now supported, but support for the ARM Cortex-M4F cores,
ADC and PWM and functions is at this time still pending.

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Data Sheet and User Manual
Electrical Specifications
Note! The electrical characteristics documented here are for the MT3620AN SoC device only, as defined in
the Mediatek MT3620AN Datasheet and Product Brief documents
Absolute Maximum Ratings
Symbol
Parameter
Max
Unit
3V3
3.3V Supply Voltage
-0.3 to 3.63
V
TSTG
Storage Temperature
-40 to +125
°C
VESD
ESD protection (human body model)
2000
V
Recommended Operating Conditions
Symbol
Rating
Min
Typ
Max
Unit
3V3
3.3V supply
2.97
3.3
3.63
V
3V3_RTC
RTC supply
2.5
3.3
3.63
V
TAMBIENT
Ambient Temperature
-35
-
+85
°C
DC Characteristics
Symbol
Parameter
Conditions
Min
Max
Unit
VIL
Input Low Voltage
LVTTL
-0.28
0.8
V
VIH
Input High Voltage
2.0
3.63
V
VOL
Output Low Voltage
|IOL| = 4 to 16 mA
-0.28
0.4
V
VOH
Output High Voltage
|IOH| = 4 to 16 mA
2.4
VDD33+0.33
V
RPU
Input Pull-Up Resistance
PU=high, PD=low
40
190
kΩ
RPD
Input Pull-Down Resistance
PU=low, PD=high
40
190
kΩ

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Data Sheet and User Manual
Current Consumption
Power mode
Description
Details
Typical
current
consumption
Hardware
wake-up
latency
Subsystem
Power
State
RTC mode
Only RTC
domain is on.
Memory is not
retained.
Requires a cold
boot to resume
Pluton CM4 subsystem
Off
0.01mA or
0.02mA (*1)
24ms
(crystal and
PLL lock,
PMU time
CA7 subsystem
Off
CM4F I/O subsystems
Off
Wi-Fi subsystem
Off
Buses/peripherals
Off
Worst case
power
consumption
no Wi-Fi
All subsystems
apart from
Wi-Fi running
at full speed
Pluton CM4 subsystem
On
220mA
Worst case
380mA (*2)
N/A, 650us
WiFi
subsystem
resume
latency
CA7 subsystem
On
IO 0/1 CM4
subsystems
On
Wi-Fi subsystem
Light sleep
Buses/peripherals (*3)
On
Worst case
power
consumption
with Wi-Fi
(*2)
All subsystems
running at full
speed, Wi-Fi
very active
Pluton CM4 subsystem
On
520mA (*4)
Worst case
750mA (*2)
N/A
CA7 subsystem
On
IO 0/1 CM4
subsystems
On
Wi-Fi subsystem
On
Buses/peripherals (*3)
On
RF (A or G Band)
On
Flash (*5)
On
Note *1: 0.01mA/0.02mA with/without external 3.3v source PMIC control switch respectively.
Note *2: The current values are measured under typical case (TT silicon and 25C/1.15V) and
the TDP (max thermal design power) includes simulation worst case condition
(TT/125C/1.15V/MC99 ,MC99 is PTPX power simulation library).
Note *3: It depends on how busy the peripherals are and how they are configured.
Note *4: This data is based on 100% Wi-Fi transmission on the 5GHz band at 14dBm.
Note *5: It depends on the I/O loading and flash power consumption.

Page 18 of 35
May 09, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
RF Characteristics
Wi-Fi 2.4GHz Band RF Receiver Specifications
The specification in table below is measured at the antenna port, which includes the front-end loss.
Parameter
Description
Performance
Min
Typical
Max
Unit
Main
Aux
Frequency range
Center channel frequency
2412
2484
MHz
RX sensitivity
DBPSF, 1 Mbps DSSS
-
-94.6
-97.1
-90.0
dBm
DQPSF, 2 Mbps DSSS
-
-91.6
-94.1
-87.0
dBm
DQPSF, 5.5 Mbps CCK
-
-89.6
-92.1
-85.0
dBm
DQPSF, 11 Mbps CCK
-
-86.6
-89.1
-82.0
dBm
BPSK rate 1/2, 6 Mbps OFDM
-
-91.6
-94.1
-87.0
dBm
BPSK rate 3/4, 9 Mbps OFDM
-
-89.3
-91.8
-86.0
dBm
QPSK rate 1/2, 12 Mbps OFDM
-
-88.5
-91.0
-84.0
dBm
QPSK rate 3/4, 18 Mbps OFDM
-
-86.1
-88.6
-82.0
dBm
16QAM rate 1/2, 24 Mbps OFDM
-
-82.8
-85.3
-81.0
dBm
16QAM rate 3/4, 36 Mbps OFDM
-
-79.4
-81.9
-78.0
dBm
64QAM rate 1/2, 48 Mbps OFDM
-
-75.2
-77.7
-73.0
dBm
64QAM rate 3/4, 54 Mbps OFDM
-
-73.9
-76.4
-71.0
dBm
RX sensitivity
BW=20MHz, Mixed mode
800ns guard interval, Non-STBC
MCS 0, BPSK rate 1/2
-
-90.9
-93.4
-87.0
dBm
Maximum Receive Level
MCS 1, QPSK rate 1/2
-
-87.7
-90.2
-86.0
dBm
MCS 2, QPSK rate 3/4
-
-85.3
-87.8
-84.0
dBm
MCS 3, 16QAM rate 1/2
-
-82.3
-84.8
-81.0
dBm
MCS 4, 16QAM rate 3/4
-
-78.8
-81.3
-77.0
dBm
MCS 5, 64QAM rate 2/3
-
-74.4
-76.9
-74.0
dBm
MCS 6, 64QAM rate 3/4
-
-73.0
-75.5
-71.0
dBm
MCS 7, 64QAM rate 5/6
-
-71.8
-74.3
-69.0
dBm
1 Mbps DSSS
-20
-10
-
dBm
11 Mbps CCK
-20
-10
-
dBm
6 Mbps OFDM
-20
-10
-
dBm
54 Mbps OFDM
-20
-10
-
dBm
HT20 MCS0
-20
-10
-
dBm
HT20 MCS7
-20
-20
-
dBm

Page 19 of 35
May 09, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Wi-Fi 2.4GHz Band RF Receiver Specifications (continued)
Parameter
Description
Performance
Min
Typical
Max
Unit
Main
Aux
Receive adjacent channel
rejection
BPSK rate 1/2, 6 Mbps OFDM
16
34
-
dBm
BPSK rate 3/4, 9 Mbps OFDM
15
31
-
dBm
QPSK rate 1/2, 12 Mbps OFDM
13
30
-
dBm
QPSK rate 3/4, 18 Mbps OFDM
11
27
-
dBm
16QAM rate 1/2, 24 Mbps
OFDM
8
25
-
dBm
16QAM rate 3/4, 36 Mbps
OFDM
4
23
-
dBm
64QAM rate 1/2, 48 Mbps
OFDM
0
22
-
dBm
64QAM rate 3/4, 54 Mbps
OFDM
-1
22
-
dBm
MCS 0, BPSK rate 1/2
16
33
-
dBm
MCS 1, QPSK rate 1/2
13
29
-
dBm
MCS 2, QPSK rate 3/4
11
26
-
dBm
MCS 3, 16QAM rate 1/2
8
24
-
dBm
MCS 4, 16QAM rate 3/4
4
20
-
dBm
MCS 5, 64QAM rate 2/3
0
18
-
dBm
MCS 6, 64QAM rate 3/4
-1
17
-
dBm
MCS 7, 64QAM rate 5/6
-2
15
-
dBm
Receiver residual PER
All rates, -50dBm input power
-
-
0.005
%

Page 20 of 35
May 09, 2019
Data Sheet and User Manual
AES-MS-MT3620-M-G Module
Data Sheet and User Manual
Wi-Fi 2.4GHz Band RF Transmitter Specifications
The specification in table below is measured at the antenna port, which includes the front-end loss.
Parameter
Description
Performance
Min
Typical
Max
Unit
Frequency range
Center channel frequency
2412
-
2484
MHz
Output power with
spectral mask and EVM
compliance
1 Mbps DSSS
- x
16(1)
-
dBm
11 Mbps CCK
-
16(1)
-
dBm
6 Mbps OFDM
-
16(1)
-
dBm
54 Mbps OFDM
-
16(1)
-
dBm
HT20 MCS 0
-
16(1)
-
dBm
HT20 MCS 7
-
16(1)
-
dBm
Output power with
spectral mask and EVM
compliance
(at -40◦C and 85◦C)
1 Mbps DSSS
-
15(1)
-
dBm
11 Mbps CCK
-
15(1)
-
dBm
6 Mbps OFDM
-
15(1)
-
dBm
54 Mbps OFDM
-
15(1)
-
dBm
HT20 MCS 0
-
15(1)
-
dBm
HT20 MCS 7
-
15(1)
-
dBm
TX EVM
1 Mbps DSSS
-
-
-10
dB
11 Mbps CCK
-
-
-10
dB
6 Mbps OFDM
-
-
-5
dB
54 Mbps OFDM
-
-
-25
dB
HT20 MCS 0
-
-
-5
dB
HT20 MCS 7
-
-
-28
dB
Output power
variation(2)
TSSI closed-loop control across all
temperature range
and channels and VSWR ≦1.5:1.
-1.5
-
1.5
dB
Carrier suppression
-
-
-
-30
dBc
Harmonic output
power
2nd Harmonic
-
-45
-43
dBm/MHz
3rd Harmonic
-
-45
-43
dBm/MHz
Note 1: Low power PA.
Note 2: VDD33 voltage is within ±5% of typical value.