DT Research DT302RP Assembly instructions

Product End-of-Life Disassembly Instructions
Product Name / Model: Rugged Tablet / DT302RP
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of DT Research products to remove components and materials requiring selective treatment, as
defined by EU Directive 2012/19/EU of the European Parliament and of the Council of 4 July 2012 on waste electrical and
electronic equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes Quantity of items included
in product
Printed Circuit Boards Assemblies (PCBA)
With a surface greater than 10 sq cm
1
Mass storage device Permanently soldered to PCBA 0
Batteries All types including standard alkaline and
lithium coin or button style batteries
2
Mercury-containing components For example, mercury in lamps, display
backlights, scanner lamps, switches,
batteries
0
LCD Display a surface greater than 100 sq cm includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 0
External electrical cables and cords 1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads,
tubes, vent chambers, and service
stations.
0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0

2.0
Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Description #1 SCREW DRIVER(Plum flower head)
Description #2 HAIR DRYER
Description #3 KNIFE BLADE
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Dismantle the handle , corners, I/O doors and back cover.
2. Dismantle buttons cover and side frame
3. Dismantle bottom cover, top cover and buckles
4. Remove battery pack
5. Dismantle back-up battery
6. Dismantle rear enclosure
7. Dismantle mother board
8. Dismantle I/O board
9. Dismantle the LCD display
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
(1) Dismantle the handle, corners, I/O doors and back cover
Step 1: remove screws and dismantle the handle (red color line)
Step 2: remove screws and dismantle corners (red color line)
Step 3: remove screws and dismantle I/O doors (blue color line)
Step 4: remove screws and dismantle back cover (yellow color line)

(2) Dismantle buttons cover and side frame
Step 1: remove screws and dismantle buttons cover
Step 2: remove screws and dismantle side frame
(3) Dismantle bottom cover, top cover and buckles
Step 1: Dismantle bottom cover
Step 2: Dismantle top cover and buckles

(4) Remove battery pack
** Detailed steps for removing battery pack
(1) Slide the battery latch to the unlocked position.
(2) Lift the battery pack off the compartment.
(5) Dismantle back-up battery
Step 1: Remove screws and mylar
Step 2: Dismantle back-up battery

(6) Dismantle rear enclosure
**Remove the cables before the rear enclosure is dismantled.
(7) Dismantle mother board
**Remove the screws and cables before the mother board is dismantled.
(8) Dismantle I/O board

(9) Dismantle the LCD display
** Steps:
(i) Use hair dryer to soften the glue between LCD display and front frame.
(ii) Use knife blade to cut the glue and lift the LCD display off front frame slowly.