Emerson FloBoss 107 User manual

Remote Automation Solutions
Form Number A6206
Part Number D301232X012
February 2007
FloBoss 107 Flow Manager
Instruction Manual

FloBoss 107 Instruction Manual
ii Issued Feb-07
Revision Tracking Sheet
February 2007
This manual may be revised periodically to incorporate new or updated information. The
revision date of each page appears at the bottom of the page opposite the page number. A change
in revision date to any page also changes the date of the manual that appears on the front cover.
Listed below is the revision date of each page (if applicable):
Page Revision
Initial issue Feb-07
ROCLINK and FloBoss are trademarks of one of the Emerson Process Management companies. The Emerson logo
is a trademark and service mark of Emerson Electric Co. All other marks are the property of their respective owners.
© 2007 Remote Automation Solutions, division of Emerson Process Management. All rights reserved.
Printed in the U.S.A.
www.EmersonProcess.com/flow
While this information is presented in good faith and believed to be accurate, Emerson Process Management does
not guarantee satisfactory results from reliance upon such information. Nothing contained herein is to be construed
as a warranty or guarantee, express or implied, regarding the performance, merchantability, fitness or any other
matter with respect to the products, nor as a recommendation to use any product or process in conflict with any
patent. Emerson Process Management reserves the right, without notice, to alter or improve the designs or
specifications of the products described herein.

Issued Feb-07 Contents iii
Contents
Chapter 1 – General Information 1-1
1.1 Scope of Manual...............................................................................................................1-2
1.2 FloBoss 107 Overview......................................................................................................1-2
1.3 Hardware..........................................................................................................................1-5
1.3.1 Processor and Memory......................................................................................1-6
1.3.2 Backplane...........................................................................................................1-6
1.3.3 Expansion Rack .................................................................................................1-6
1.3.4 Central Processing Unit (CPU)...........................................................................1-6
1.3.5 Battery and Super-capacitor...............................................................................1-8
1.3.6 Built-in Inputs and Outputs.................................................................................1-8
1.3.7 Built-in Communications.....................................................................................1-8
1.3.8 Built-in Resistance Thermal Device (RTD) ......................................................1-10
1.3.9 Built-in Loop Output Power ..............................................................................1-10
1.3.10 Optional Inputs and Outputs.............................................................................1-10
1.3.11 Optional Communication Module – COM3.......................................................1-11
1.3.12 Optional Multi-Variable Sensor (MVS).............................................................1-11
1.3.13 Optional License Key .......................................................................................1-12
1.4 Firmware.........................................................................................................................1-12
1.4.1 History Points ...................................................................................................1-13
1.4.2 Alarm Log.........................................................................................................1-15
1.4.3 Event Log .........................................................................................................1-15
1.4.4 Security.............................................................................................................1-16
1.4.5 I/O Database ....................................................................................................1-16
1.4.6 Function Sequence Tables (FST) ....................................................................1-16
1.4.7 PID Control.......................................................................................................1-16
1.4.8 Spontaneous-Report-By-Exception (SRBX) Alarming.....................................1-17
1.4.9 Softpoints..........................................................................................................1-17
1.4.10 Opcodes...........................................................................................................1-17
1.4.11 Pass Through Communications.......................................................................1-18
1.4.12 ROC and Modbus Protocols.............................................................................1-18
1.4.13 User C Programs..............................................................................................1-18
1.5 ROCLINK 800 Configuration Software...........................................................................1-19
1.6 Product Electronics.........................................................................................................1-20
1.6.1 Real-Time Clock...............................................................................................1-20
1.6.2 Diagnostic Monitoring.......................................................................................1-20
1.6.3 Automatic Self Tests ........................................................................................1-21
1.6.4 Low Power Mode..............................................................................................1-21
1.7 Flow Measurements.......................................................................................................1-21
1.8 Additional Information.....................................................................................................1-23
Chapter 2 – Installation and Use 2-1
2.1 Installation Requirements.................................................................................................2-1
2.1.1 Environmental Requirements.............................................................................2-1
2.1.2 Site Requirements..............................................................................................2-2
2.1.3 Compliance with Hazardous Area Standards ....................................................2-4
2.2 Power Installation Requirements......................................................................................2-5
2.3 Grounding Installation Requirements...............................................................................2-5
2.3.1 Installing Grounding for the FloBoss 107...........................................................2-6
2.3.2 I/O Wiring Requirements....................................................................................2-7

iv Contents Issued Feb-07
2.4 Installing the FloBoss 107 and Expansion Rack..............................................................2-7
2.4.1 Required Tools...................................................................................................2-7
2.4.2 Installing the FloBoss 107 without an Expansion Rack .....................................2-8
2.4.3 Installing the FloBoss with an Expansion Rack..................................................2-9
2.4.4 Removing an Expansion Rack.........................................................................2-11
2.4.5 Removing and Installing Module Covers..........................................................2-11
2.4.6 Removing and Installing Wire Channel Covers................................................2-12
2.5 Memory Backup Battery.................................................................................................2-12
2.5.1 Removing and Installing the Battery ................................................................2-13
2.6 Central Processor Unit (CPU) ........................................................................................2-13
2.6.1 Removing the CPU Module..............................................................................2-14
2.6.2 Installing the CPU Module................................................................................2-15
2.7 License Keys ..................................................................................................................2-16
2.8 Startup and Operation....................................................................................................2-16
2.8.1 Startup..............................................................................................................2-16
2.8.2 Operation..........................................................................................................2-17
Chapter 3 – Power Connections 3-1
3.1 Power Input Descriptions..................................................................................................3-1
3.2 Determining Power Consumption.....................................................................................3-3
3.3 Wiring Connections ..........................................................................................................3-8
3.4 Wiring Power to the CPU Module.....................................................................................3-9
Chapter 4 – Inputs/Outputs and RTD Inputs 4-1
4.1 I/O Description..................................................................................................................4-1
4.2 Installing a Module............................................................................................................4-5
4.3 Removing a Module..........................................................................................................4-6
4.4 Wiring a Module................................................................................................................4-6
4.5 Selecting the Type of I/O..................................................................................................4-7
4.6 Analog Inputs (AI).............................................................................................................4-9
4.6.1 Wiring the Analog Inputs....................................................................................4-9
4.7 Analog Outputs (AO)......................................................................................................4-11
4.7.1 Wiring the Analog Outputs ...............................................................................4-11
4.8 Discrete Inputs (DI).........................................................................................................4-12
4.8.1 Wiring the Discrete Inputs................................................................................4-13
4.9 Discrete Outputs (DO)....................................................................................................4-13
4.9.1 Wiring the Discrete Outputs .............................................................................4-14
4.10 Pulse Inputs (PI).............................................................................................................4-15
4.10.1 Wiring the Pulse Inputs ....................................................................................4-16
4.11 Resistance Temperature Detector (RTD) Input..............................................................4-16
4.11.1 Wiring the RTD Input........................................................................................4-17
Chapter 5 – Communications 5-1
5.1 Communications Overview...............................................................................................5-1
5.2 Installing/Removing a Communications Module ..............................................................5-4
5.3 Wiring the Local Operator Interface (LOI) Port.................................................................5-5
5.3.1 Using the LOI .....................................................................................................5-5
5.4 Wiring EIA-485 (RS-485) Communications......................................................................5-6
5.5 Wiring EIA-232 (RS-232) Communications......................................................................5-7
5.6 Wiring the Liquid Crystal Display (LCD)...........................................................................5-8

Issued Feb-07 Contents v
Chapter 6 – Multi-Variable Sensor (MVS) 6-1
6.1 MVS Overview..................................................................................................................6-1
6.2 Installing/Removing an MVS Module ...............................................................................6-3
6.3 Configuring a Multi-drop MVS Module Setup...................................................................6-3
6.4 MVS Lightning Protection.................................................................................................6-5
Chapter 7 – Troubleshooting 7-1
7.1 General Guidelines...........................................................................................................7-1
7.2 Graphical User Interface (GUI).........................................................................................7-2
7.3 Checklists .........................................................................................................................7-3
7.3.1 LEDs...................................................................................................................7-3
7.3.2 Serial Communications ......................................................................................7-3
7.3.3 Inputs/Outputs....................................................................................................7-4
7.3.4 Preserving Configuration and Log Data.............................................................7-5
7.3.5 ROCLINK 800 Configuration Software...............................................................7-5
7.3.6 Powering Up.......................................................................................................7-6
7.3.7 Multi-Variable Sensor (MVS)..............................................................................7-6
7.3.8 Resistance Thermal Device (RTD).....................................................................7-7
7.4 Procedures .......................................................................................................................7-7
7.4.1 Resetting the FB107...........................................................................................7-7
7.4.2 Restarting and Reconfiguring the FB107...........................................................7-8
7.4.3 Troubleshooting Analog Inputs ..........................................................................7-8
7.4.4 Troubleshooting Analog Outputs........................................................................7-9
7.4.5 Troubleshooting Discrete Inputs ......................................................................7-10
7.4.6 Troubleshooting Discrete Outputs....................................................................7-11
7.4.7 Troubleshooting Pulse Inputs...........................................................................7-11
7.4.8 Troubleshooting RTD Inputs ............................................................................7-12
7.4.9 Troubleshooting MVS.......................................................................................7-13
Appendix A – Glossary A-1
Index I-1

vi Contents Issued Feb-07

FloBoss 107 Instruction Manual
Issued Feb-07 General Information 1-1
Chapter 1 – General Information
This manual describes the FloBoss™107 Flow Manager (“FB107”), part
of the family of FloBoss flow computers manufactured by Remote
Automation Solutions, a division of Emerson Process Management. For
information about the software you use to configure the FB107, refer to
the ROCLINK™800, Configuration Software User Manual (for FloBoss
107) (Form A6217).
This chapter provides an overview of the FB107 and its components.
In This Chapter
1.1 Scope of Manual.................................................................................1-2
1.2 FloBoss 107 Overview........................................................................1-2
1.3 Hardware ............................................................................................1-5
1.3.1 Processor and Memory..........................................................1-6
1.3.2 Backplane..............................................................................1-6
1.3.3 Expansion Rack.....................................................................1-6
1.3.4 Central Processing Unit (CPU)..............................................1-6
1.3.5 Battery and Super-capacitor..................................................1-8
1.3.6 Built-in Inputs and Outputs ....................................................1-8
1.3.7 Built-in Communications........................................................1-8
1.3.8 Built-in Resistance Thermal Device (RTD)..........................1-10
1.3.9 Built-in Loop Output Power..................................................1-10
1.3.10 Optional Inputs and Outputs................................................1-10
1.3.11 Optional Communication Module – COM3..........................1-11
1.3.12 Optional Multi-Variable Sensor (MVS).................................1-11
1.3.13 Optional License Key...........................................................1-12
1.4 Firmware...........................................................................................1-12
1.4.1 History Points.......................................................................1-13
1.4.2 Alarm Log.............................................................................1-15
1.4.3 Event Log.............................................................................1-15
1.4.4 Security................................................................................1-16
1.4.5 I/O Database........................................................................1-16
1.4.6 Function Sequence Tables (FST)........................................1-16
1.4.7 PID Control ..........................................................................1-16
1.4.8 Spontaneous-Report-By-Exception (SRBX) Alarming ........1-17
1.4.9 Softpoints.............................................................................1-17
1.4.10 Opcodes...............................................................................1-17
1.4.11 Pass Through Communications ..........................................1-18
1.4.12 ROC and Modbus Protocols................................................1-18
1.4.13 User C Programs.................................................................1-18
1.5 ROCLINK 800 Configuration Software.............................................1-19
1.6 Product Electronics...........................................................................1-20
1.6.1 Real-Time Clock..................................................................1-20
1.6.2 Diagnostic Monitoring..........................................................1-20
1.6.3 Automatic Self Tests............................................................1-21
1.6.4 Low Power Mode.................................................................1-21
1.7 Flow Measurements .........................................................................1-21
1.8 Additional Information.......................................................................1-23

FloBoss 107 Instruction Manual
1-2 General Information Issued Feb-07
1.1 Scope of Manual
This manual contains the following chapters:
Chapter 1
General Information Provides an overview of the hardware and firmware for the FB107 base unit and the expansion rack.
Chapter 2
Installation and Use Provides information on installation, tools, wiring, and other essential elements of the FB107.
Chapter 3
Power Connections Provides information on determining power requirements for the FB107.
Chapter 4
Inputs/Outputs and
RTD Inputs
Provides information for the input/output (I/O)
modules, CPU I/O assembly, and the RTD input.
Chapter 5
Communications Provides information for the built-in communications and the optional communication modules.
Chapter 6
Multi-Variable
Sensor (MVS) Provides information for the optional MVS module.
Chapter 7
Troubleshooting Provides information on diagnosing and correcting problems.
Glossary Provides definitions of acronyms and terms.
Index Provides an alphabetic listing of items and topics
contained in this manual.
1.2 FloBoss 107 Overview
A 32-bit microprocessor-based electronic flow computer, the FB107
electronically measures, monitors, and manages flow. This economical
flow computer reliably and accurately performs flow calculations,
temperature measurements, and data archival.
Note: You configure the functionality of the FB107 and monitor its
operation using a personal computer (PC) running ROCLINK™
800 (“ROCLINK 800”) software.
The FB107 can measure up to four meter runs through a variety of
devices, such as an orifice plate, turbine meter, or other pulse-generating
devices. Meter inputs may also use analog transmitters. For multiple
differential pressure-run applications, you can add an optional Multiple-
Variable Sensor (MVS) module to provide an interface to remote MVS
transmitters.
The FB107 performs minute, hourly, daily, and minimum / maximum
historical data archival for standard history and a configurable time
interval archival for extended history. The solution to electronically
replace traditional paper charting, the FB107 records the corrected flow
for differential or pulse counts and stores the data.
The FB107 computes flow for both volume and energy. It provides on-
site functionality and supports remote monitoring, measurement, data
archival, communications, and control. It stores the results of the flow

FloBoss 107 Instruction Manual
calculations in memory and can be communicated to an external device
either on demand or periodically.
The FB107 design allows you to configure specific applications,
including those requiring logic and sequencing control using a Function
Sequence Table (FST).
Local (LOI)
Communication
Port
Slot 2 = I/O,
MVS module,
or COM
module
(COM2)
Slot 3 = I/O or
MVS module
Slot 0 = CPU
Module
CPU I/O
Assembly
Slot 1 = I/O,
MVS, or COM
module (COM3)
Wire Channel
Cover
Input Powe
r
Connecto
r
Display Connector
Dual-Variable
Se
n
so
r
Co
nn
ecto
r
Memory Backup
Battery Connecto
r
Figure 1-1. FloBoss 107 Base Unit
Issued Feb-07 General Information 1-3

FloBoss 107 Instruction Manual
Slot 7 = I/O or
MVS module
Slot 4 = I/O o
r
MVS module
Slot 5 = I/O o
r
MVS module Slot 6 = I/O or
MVS module
Wire Channel
Cover
Connects to
FloBoss 107
base unit
Figure 1-2. FloBoss 107 Expansion Rack
1-4 General Information Issued Feb-07

FloBoss 107 Instruction Manual
Figure 1-3. FloBoss 107 with Expansion Rack
The FB107 provides the following components and features:
32-bit processor board, inter-connect board, and backplane board.
Central processing unit (CPU).
Field upgradeable 2 MB flash ROM (read only memory).
2 MB battery backed-up RAM (random access memory) storage.
Two-, three-, or four-wire 100-ohm resistance thermal device (RTD)
input.
Battery and super-capacitor backed memory retention to provide
short and longer-term data, configuration, and operational integrity
when the FB107 is not in service or is in storage.
Three built-in communication ports.
Input power and output loop power.
Extensive applications firmware.
1.3 Hardware
The FB107 is available with four basic configurations:
Non-isolated CPU without I/O.
Non-isolated CPU with six points of I/O.
Isolated CPU without I/O.
Isolated CPU with six points of I/O.
Issued Feb-07 General Information 1-5

FloBoss 107 Instruction Manual
1-6 General Information Issued Feb-07
Note: Isolation occurs between the CPU and the field logic.
The FB107 base unit has four slots. Slot 0 is reserved for the CPU
module, which provides three communication ports, an RTD, power
input, loop power output, system variables, and optional 6 points of I/O.
Slots 1 and 2 can each contain one communication module. Slots 1, 2,
and 3 can contain input/outputs (I/O), MVS, and smart application
modules.
1.3.1 Processor and Memory
The FB107 derives processing power from a 32-bit CMOS
microprocessor. The microprocessor features a single 32-bit internal
data bus and a single 16-bit external data bus. The microprocessor has
low-power operating modes, including inactivity and low battery
condition. The FB107 has high-speed direct memory access.
The FB107 has 2 MB of static random access memory (SRAM) for
storing database, historical, configuration, alarms, and events data.
1.3.2 Backplane
The backplane board routes signals to and from the CPU to the I/O
modules, smart application modules, expansion rack, the Multi-Variable
Sensor, and communication modules.
1.3.3 Expansion Rack
The expansion rack enables the FB107 to expand its I/O capabilities to
meet your needs. You can add an optional expansion rack to increase
I/O by four slots. The FB107 can have up 42 points of I/O. The
expansion rack supports optional I/O, MVS, and smart application
modules.
1.3.4 Central Processing Unit (CPU)
The base unit on the FB107 has four slots. Slot 0 is for the CPU module.
The CPU provides connections to the field wiring including surge and
static discharge protection for the field wiring. Electronics include the
RTD circuits and the final I/O drivers/receivers.
The CPU components include:
RTD input.
Input power.
Loop power output.
Reset (RST) switch.
System variables.
Diagnostic monitoring.
Real-time clock.

FloBoss 107 Instruction Manual
Automatic self-tests.
Power saving modes.
Local operator interface (LOI) EIA-232 (RS-232).
EIA-485 (RS-485) communications (COM1).
EIA-232 (RS-232) communications (COM2).
Boot Flash – System initialization and diagnostics.
SRAM (static random access memory) with battery backup – Data
logs and configuration.
Flash ROM (Read-only memory) – Firmware image.
32-bit microprocessor and the real-time operating system (RTOS)
provide both hardware and software memory protection.
Optional CPU I/O assembly and terminations (see Figure 1-4).
Figure 1-4. CPU
Issued Feb-07 General Information 1-7

FloBoss 107 Instruction Manual
1-8 General Information Issued Feb-07
1.3.5 Battery and Super-capacitor
A super capacitor (“super-cap”) and a coin type battery work together
to provide backup power for the static RAM and the real-time clock.
This helps to ensure retention of short and longer-term data,
configuration, and operational integrity when the FB107 is not in
service or is in storage.
For information on replacing the battery, refer to Section 2.5.1,
Removing and Installing the Battery.
Note: The super-cap is not field-replaceable.
1.3.6 Built-in Inputs and Outputs
The built-in inputs and outputs (I/O) on the CPU consist of a 3- or 4-
wire 100-ohm resistance thermal detector (RTD) input interface and five
diagnostic analog inputs (AI) that monitor the:
Logical voltage.
Battery voltage from the backplane voltage input connector.
Charge in voltage originating from the CPU power input.
System milliamps originating from the power input from the CPU.
Board temperature originating at the CPU.
1.3.7 Built-in Communications
The FB107 supports up to four communication ports. The base CPU has
three built-in communication ports:
Local Operator Interface (RS-232C) – LOI for asynchronous serial
communication (Local Port).
EIA-485 (RS-485) – COM1 for asynchronous serial communication.
EIA-232 (RS-232) – COM2 for serial communication.
Local Operator
Interface Port The Local Operator Interface (LOI) port provides for a direct, local
link between the FB107 and a personal computer (PC) through an
optional Local Operator Interface Cable using EIA-232 (RS-232C)
communications.
The LOI local port allows you to access the FB107 for configuration
and transfer of stored data. The LOI port is capable of initiating a
message in support of Spontaneous-Report-by-Exception (SRBX)
alarming.
The LOI is software-configurable with baud rates from 300 to 115.2 K
and it uses a DB9 connection.
Note: You can purchase an LOI cable from your sales representative.

FloBoss 107 Instruction Manual
Issued Feb-07 General Information 1-9
The LOI supports ROC or Modbus slave protocol communications. The
LOI also supports the log-on security feature of the FB107, if you
enable the security on LOI using ROCLINK 800.
Default values for the LOI port are: 19,200 baud rate, 8 data bits, 1 stop
bit, no parity, group 1, and address 2.
EIA-485 (RS-485) Serial
Communications
COM1
COM1 provides EIA-485 (RS-485) serial communication protocols
with baud rates from 300 to 115.2 K. COM1 provides standard
differential data transmissions over distances of up to 1220 meter
(4000 feet).
The EIA-485 (RS-485) drivers are designed for true multi-point
applications with multiple devices on a single bus.
Note: COM1 is labeled 485 on the CPU.
Use COM1 to monitor or modify the FB107 from a remote site, using a
host or ROCLINK 800. COM1 also supports the log-on security feature
of the FB107 if you enable the security on COM1 using ROCLINK 800.
COM1 sends and receives messages using the ROC or Modbus slave
and host protocol. COM1 is capable of initiating a message in support of
Spontaneous-Report-by-Exception (SRBX) alarming.
Default values for the EIA-485 (RS-485) communications are: 19,200
baud rate, 8 data bits, 1 stop bit, no parity, 10 millisecond key-on delay,
and 10 millisecond key-off delay. The maximum baud rate is 115.2
Kbps.
EIA-232 (RS-232) Serial
Communications
COM2
COM2 allows for EIA-232 (RS-232) asynchronous serial
communication protocols with baud rates from 300 to 115.2 K, host
serial interface. COM2 provides standard single-ended data
transmission over distances of up to 15 meter (50 feet).
Use COM2 to monitor or alter the FB107 from a remote site, using
ROCLINK 800. COM2 also supports the log-on security feature of the
FB107 if the security on COM2 is enabled in ROCLINK 800.
COM2 sends and receives messages using the ROC or Modbus slave or
host protocol. COM2 is capable of initiating a message in support of
Spontaneous-Report-by-Exception (SRBX) alarming.
Default values for the EIA-232 (RS-232) communications module are:
19,200 baud rate, 8 data bits, 1 stop bit, no parity, 10 millisecond key-on
delay, and 10 millisecond key-off delay. The maximum baud rate is
115.2 Kbps.
Note: When you install a communications module in slot 2, the
firmware redirects communications port (COM2) on the CPU to
the type of module installed in slot 2. Configure COM2 based on
the type of communication module installed in slot 2.

FloBoss 107 Instruction Manual
1-10 General Information Issued Feb-07
1.3.8 Built-in Resistance Thermal Device (RTD)
The FB107 supports a direct input from a resistance thermal device
(RTD) sensor to measure flowing temperature. An RTD temperature
probe typically mounts in a thermowell on the meter run. The RTD has
a measurement range of −40 to 400°C (−40 to 752°F). The RTD is
located on the CPU.
1.3.9 Built-in Loop Output Power
Using ROCLINK 800, you can configure the I/O on the CPU module’s
optional I/O assembly to set the loop output power to 10 volts dc or 24
volts dc. The I/O module only supports 24 Volts dc loop output power.
Note: The CPU I/O assembly uses the CPU’s loop power output and
ground connections.
The intent of the loop output power is to power devices that require 24
volts dc to ground allowing the external device to send the FB107 a 4 to
20 mA signal based on pressure, temperature, level, and such.
The 10-volt loop output power is intended for low power transmitters.
The loop current is designed to deliver 80 mA to power two field
devices that connect back to the two analog inputs.
1.3.10 Optional Inputs and Outputs
The input/output (I/O) options for the FB107 provide terminals for
expanded monitoring and control applications. I/O can be used to drive
a sampler or odorizer, open a valve, or monitor an additional analog
input.
You can order the expanded 6-point I/O as an:
I/O assembly that mounts directly on the CPU module (optional I/O
assembly).
I/O modules that mount in the I/O slots.
Both configurations provide terminations for six points of I/O and both
provide the same selections for I/O. You can configure five of the six
points of I/O are configurable using ROCLINK 800 software.
The six points of I/O consists of:
Two analog inputs (AI) or discrete inputs (DI).
One analog output (AO) or discrete output (DO).
One discrete output (DO).
Two pulse inputs (PI) or discrete inputs (DI).
You can add an expansion rack to the FB107 base unit to increase I/O
by four slots for a total of six slots of I/O. The FB107 supports up to six

FloBoss 107 Instruction Manual
Issued Feb-07 General Information 1-11
I/O modules and one CPU I/O assembly, and can have up to 42 points
of I/O.
You can install I/O modules in slots 1 through 3 on the FB107 base unit
and in slots 4 through 6 on the expansion rack. If you install a
communications module in slot 1, you can install an I/O module in slot
7.
You can use current analog inputs of 4 to 20 mA when you select the
250-ohm resistor in the AI configuration using ROCLINK 800.
1.3.11 Optional Communication Module – COM3
One optional communication module provides the ability to send and
receive data through COM3. The COM3 port is capable of initiating a
message in support of Spontaneous-Report-by-Exception (SRBX)
alarming.
You can install communication modules in slots 1 or 2 on the base unit.
Installing a communications module in slot 1 on the base unit activates
the COM3 communications port. Installing a communications module in
slot 2 redirects the CPU’s communications port (COM2) to the type of
module installed in slot 2.
The FB107 accommodates one of the following communication
modules types:
EIA-485 (RS-485) serial communication protocols with baud rates
from 300 to 115.2 Kbps to provide standard differential data
transmissions over distances of up to 1220 meter (4000 feet).
EIA-232 (RS-232) serial communication protocols with baud rates
from 300 to 115.2 Kbps, host serial interface to provide standard
single-ended data transmission over distances of up to 15 meter (50
feet).
COM3 can communicate with other devices using ROC or Modbus host
and slave protocols. The firmware can automatically detect ROC or
Modbus slave protocols.
1.3.12 Optional Multi-Variable Sensor (MVS)
The optional Multi-Variable Sensor (MVS) module provides differential
pressure, static pressure, and temperature inputs to the FB107 for
differential pressure flow calculation.
You can install only one MVS module in the FB107. You can install the
MVS module in slots 1 through 3 on the base unit or in slots 4 through 7
on the expansion rack, regardless of the position of any other type of
module.

FloBoss 107 Instruction Manual
1-12 General Information Issued Feb-07
The MVS module provides current-limited power and EIA-485 (RS-
485) communications to external remote MVS transmitters. The FB107
supports six remote transmitters with up to four meter runs.
1.3.13 Optional License Key
The optional application license key provides extended functionality,
such as the use of various user programs. The FB107 supports up to
different six user programs. For example, you need to install a license
key with the proper license in the FB107 to run User C programs.
1.4 Firmware
The firmware makes extensive use of configuration parameters, which
you manage using ROCLINK 800 software. The firmware contained in
flash ROM on the processor board, determines the FB107’s
functionality.
The firmware provides a complete operating system for the FB107, and
is field-upgradeable using a serial connection such as the LOI port.
Firmware includes:
Input and output database.
Historical database.
Event and alarm log database.
Applications, such as PID, AGA, and FST.
Real-time clock.
Determining task execution.
1992 AGA-3 flow calculations (with user-selectable AGA8
compressibility Detail, Gross 1, or Gross 2).
1996 AGA-7 flow calculations (with user-selectable AGA8
compressibility).
ISO5167-2003 flow calculations.
ROC or Modbus host or slave (ASCII or RTU).
Memory logging of 240 alarms and 240 events.
Establishing and managing communications.
Communications based on the ROC protocol or Modbus slave and
host (ASCII or RTU) protocol for use with EFM applications.
Alarm call-in to host for Spontaneous-Report-By-Exception
(SRBX).
Standard and Extended History.
Self-test capability.
User level security.
The FB107 provides the functions required for a variety of field
automation applications. Designed for expandability, the FB107
monitors, measures, and controls equipment in a remote environment.
You can use the FB107 for:

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Applications requiring flow computation.
Logic and sequencing control using a user-defined Function
Sequence Table (FST).
Closed-loop (PID) control capabilities (requires optional I/O module
or CPU I/O assembly).
Custom User C application support.
Real-Time Operating
System (RTOS) The FB107 firmware uses a pre-emptive, multi-tasking, message-based
real-time operating system (RTOS). Tasks are assigned priorities and,
at any given time, the operating system determines which task will run.
For instance, if a lower priority task is executing and a higher priority
task needs to run, the operating system suspends the lower priority task,
allows the higher priority task to run to completion, then resumes the
lower priority task’s execution.
TLP The FB107 reads data from and writes data to data structures called
“points.” A “point” is a ROC protocol term for a grouping of
individual parameters (such as information about an I/O channel) or
some other function (such as a flow calculation). Points are defined by
a collection of parameters and have a numerical designation that
defines the type of point.
The logical number indicates the physical location for the I/O or the
logical instance for non-I/O points within the FB107. Parameters are
individual pieces of data that relate to the point type. The point type
attributes define the database point to be one of the possible types of
points available to the system.
A sample TLP might be analog input (T), rack location B1 (L), and
Engineering Units (P).
Together, these three components—the type (T), the logical (L), and the
parameters (P)—identify specific pieces of data that reside in an FB107
database. Collectively, this three-component address is often called a
TLP.
1.4.1 History Points
The FB107 saves history to either of two databases: Standard or
Extended History. You can configure the number of entries/logs
available to Standard (maximum of 100) and Extended History
(maximum of 25). History for meter runs includes the Averaging
Techniques as well as accumulation per second and accumulation per
minute.
You can select the number of history points to archive, the sample
interval in minutes (for Extended or Standard History) or seconds (for
Extended History only), the number of days to archive, and whether to
log history data at the beginning or the end of the period.
History is one block of memory divided into two areas, one for Standard
History and one for Extended History. Standard History uses all of the

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memory that it requires for the configured number of points. Extended
History only receives the surplus memory not used by the Standard
History.
Standard History archival properties include:
Up to 100 points of minute data from the last 60 minutes.
Up to 100 points of hourly data for 35 days.
Up to 100 points of daily data for 35 or 60 days.
Min / max historical data for today and yesterday.
Extended History archiving provides a monitoring resolution for the
FB107 that is similar to a chart recorder. You can configure Extended
History to archive up to 25 history points with archiving intervals at 1,
2, 3, 4, 5, 10, 12, 15, 20, 30, or 60 second or minute intervals.
Minute Historical
Log The FB107 has a 60-minute historical log for every history point. The
Minute Historical Log stores the last 60 minutes of data from the
current minute. Each history point has Minute Historical Log entries,
unless the history point is configured for FST-controlled logging.
Hourly Historical
Log The FB107 has a total of 35 days of hourly historical logs available for
every history point. The Hourly Historical Log is also called the
Periodic database. Normally, the Hourly Log is recorded at the
beginning of every hour, although you can configure it for either the
beginning or end of every hour. The exceptions are FST Minute and
FST Second logging.
The time stamp for periodic logging consists of the month, day, hour,
and minute. The exception is for FST Second logging, in which the time
stamp consists of the day, hour, minute, and second.
Daily Historical
Log The FB107 has a total of 35 or 60 daily historical logs for every history
point. The Daily Log is recorded at the configured contract hour every
day with a time stamp that is the same as the Hourly Log. Each history
point has daily historical log entries, unless the history point is
configured for FST-controlled logging.
Min / Max Historical
Log The Min / Max database displays the minimum and the maximum
values for the database points over a 24-hour period for today and
yesterday. You can view the Min / Max historical, but not save it to
disk.
Extended History Log The FB107 has configurable archive times that, in turn, determine the
number of entries. You can configure Extended History to archive up
to 25 history points with archiving intervals at 1, 2, 3, 4, 5, 10, 12, 15,
20, 30, or 60 second or minute intervals.