
Table of Contents
1 Overview 5
1.1 General ................................................... 5
1.1.1 Introduction ................................................ 5
1.1.2 Warranty .................................................. 5
1.1.3 RoHS .................................................... 5
1.1.4 DisposalandWEEE ............................................ 5
1.1.5 Safety Recommendations and Warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.6 ElectrostaticDischarge .......................................... 6
1.1.7 Electromagnetic Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Features................................................... 6
1.3 Deliverables ................................................ 6
1.4 Accessories................................................. 7
1.4.1 ReferenceDesign ............................................. 7
1.4.2 EnclustraHeatSink ............................................ 7
1.4.3 MarsPM3BaseBoard........................................... 7
1.4.4 MarsEB1BaseBoard ........................................... 7
1.4.5 MarsST3BaseBoard ........................................... 8
1.5 XilinxToolSupport ............................................ 8
2 Module Description 9
2.1 BlockDiagram............................................... 9
2.2 Module Configuration and Product Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Article Numbers and Article Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 TopandBottomViews .......................................... 12
2.4.1 TopView .................................................. 12
2.4.2 BottomView................................................ 12
2.5 Top and Bottom Assembly Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5.1 TopAssemblyDrawing .......................................... 13
2.5.2 BottomAssemblyDrawing........................................ 13
2.6 ModuleFootprint ............................................. 14
2.7 MechanicalData.............................................. 14
2.8 ModuleConnector ............................................ 14
2.9 UserI/O................................................... 15
2.9.1 Pinout.................................................... 15
2.9.2 DifferentialI/Os .............................................. 16
2.9.3 I/OBanks.................................................. 16
2.9.4 VREFUsage................................................. 17
2.9.5 VCC_IOUsage ............................................... 17
2.9.6 SignalTerminations ............................................ 18
2.9.7 AnalogInputs ............................................... 18
2.10 Power.................................................... 19
2.10.1 PowerGenerationOverview ....................................... 19
2.10.2 PowerEnable/PowerGood........................................ 20
2.10.3 VoltageSupplyInputs........................................... 20
2.10.4 VoltageSupplyOutputs ......................................... 21
2.10.5 PowerConsumption............................................ 21
2.10.6 HeatDissipation.............................................. 22
2.10.7 VoltageMonitoring ............................................ 22
2.11 ClockGeneration ............................................. 23
2.12 Reset .................................................... 23
2.13 LEDs..................................................... 23
2.14 DDR3SDRAM ............................................... 24
2.14.1 DDR3SDRAMType ............................................ 24
2.14.2 SignalDescription............................................. 24
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